TW200419000A - Silver alloy for reflective film for optical recording medium - Google Patents
Silver alloy for reflective film for optical recording medium Download PDFInfo
- Publication number
- TW200419000A TW200419000A TW092134136A TW92134136A TW200419000A TW 200419000 A TW200419000 A TW 200419000A TW 092134136 A TW092134136 A TW 092134136A TW 92134136 A TW92134136 A TW 92134136A TW 200419000 A TW200419000 A TW 200419000A
- Authority
- TW
- Taiwan
- Prior art keywords
- silver
- weight
- reflectance
- silver alloy
- optical recording
- Prior art date
Links
- 229910001316 Ag alloy Inorganic materials 0.000 title claims abstract description 37
- 230000003287 optical effect Effects 0.000 title claims abstract description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052709 silver Inorganic materials 0.000 claims abstract description 24
- 239000004332 silver Substances 0.000 claims abstract description 24
- 239000000654 additive Substances 0.000 claims abstract description 20
- 230000000996 additive effect Effects 0.000 claims abstract description 20
- 229910052738 indium Inorganic materials 0.000 claims abstract description 17
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000010408 film Substances 0.000 description 40
- 239000010410 layer Substances 0.000 description 38
- 238000012360 testing method Methods 0.000 description 25
- 230000007797 corrosion Effects 0.000 description 20
- 238000005260 corrosion Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 17
- 238000007654 immersion Methods 0.000 description 16
- 239000010409 thin film Substances 0.000 description 16
- 229910045601 alloy Inorganic materials 0.000 description 15
- 239000000956 alloy Substances 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 14
- 230000007423 decrease Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 238000005470 impregnation Methods 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 10
- 238000007254 oxidation reaction Methods 0.000 description 10
- 238000002310 reflectometry Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000003513 alkali Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- OGFYIDCVDSATDC-UHFFFAOYSA-N silver silver Chemical compound [Ag].[Ag] OGFYIDCVDSATDC-UHFFFAOYSA-N 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241001674048 Phthiraptera Species 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- PICOUKGVAGTEEW-UHFFFAOYSA-N [In][Ag][Sn] Chemical compound [In][Ag][Sn] PICOUKGVAGTEEW-UHFFFAOYSA-N 0.000 description 1
- JCLOGSKIMBJQAA-UHFFFAOYSA-N [Mo].[Sn] Chemical compound [Mo].[Sn] JCLOGSKIMBJQAA-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- QOGLYAWBNATGQE-UHFFFAOYSA-N copper;gold;silver Chemical compound [Cu].[Au][Ag] QOGLYAWBNATGQE-UHFFFAOYSA-N 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- YZASAXHKAQYPEH-UHFFFAOYSA-N indium silver Chemical compound [Ag].[In] YZASAXHKAQYPEH-UHFFFAOYSA-N 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
- G11B7/258—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of reflective layers
- G11B7/259—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of reflective layers based on silver
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
- G11B7/258—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of reflective layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002358040A JP2004192702A (ja) | 2002-12-10 | 2002-12-10 | 光記録媒体の反射膜用の銀合金 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200419000A true TW200419000A (en) | 2004-10-01 |
Family
ID=32500889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092134136A TW200419000A (en) | 2002-12-10 | 2003-12-04 | Silver alloy for reflective film for optical recording medium |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20050089439A1 (enExample) |
| EP (1) | EP1569215A4 (enExample) |
| JP (1) | JP2004192702A (enExample) |
| KR (1) | KR20050086366A (enExample) |
| CN (1) | CN1323397C (enExample) |
| AU (1) | AU2003289251A1 (enExample) |
| TW (1) | TW200419000A (enExample) |
| WO (1) | WO2004053861A1 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7572517B2 (en) | 2002-07-08 | 2009-08-11 | Target Technology Company, Llc | Reflective or semi-reflective metal alloy coatings |
| JP4379602B2 (ja) * | 2003-08-20 | 2009-12-09 | 三菱マテリアル株式会社 | 半透明反射膜または反射膜を構成層とする光記録媒体および前記反射膜の形成に用いられるＡｇ合金スパッタリングターゲット |
| JP4309227B2 (ja) * | 2003-10-16 | 2009-08-05 | 石福金属興業株式会社 | スパッタリングターゲット材 |
| CN101260484A (zh) * | 2005-02-07 | 2008-09-10 | 株式会社神户制钢所 | 记录膜、光学信息记录介质以及溅射靶 |
| JP2006240289A (ja) * | 2005-02-07 | 2006-09-14 | Kobe Steel Ltd | 光情報記録媒体用記録膜および光情報記録媒体ならびにスパッタリングターゲット |
| JP4575211B2 (ja) * | 2005-03-31 | 2010-11-04 | 株式会社東芝 | 記憶媒体、再生方法及び記録方法 |
| JP2007035104A (ja) * | 2005-07-22 | 2007-02-08 | Kobe Steel Ltd | 光情報記録媒体用Ａｇ合金反射膜、光情報記録媒体および光情報記録媒体用Ａｇ合金反射膜の形成用のＡｇ合金スパッタリングターゲット |
| FR2893632B1 (fr) * | 2005-11-18 | 2008-01-25 | Commissariat Energie Atomique | Revetement a base d'argent resistant a la sulfuration, procede de depot et utilisation |
| JP2008004151A (ja) * | 2006-06-21 | 2008-01-10 | Toshiba Corp | 片面多層光ディスク、ｂｃａ記録装置、ｂｃａ記録方法及び光ディスク装置 |
| CN101449184B (zh) * | 2006-11-17 | 2012-04-04 | 田中贵金属工业株式会社 | 反射膜或半透反射膜用的薄膜及溅射靶材以及光记录介质 |
| US7910190B2 (en) * | 2006-11-17 | 2011-03-22 | Tanaka Kinkinzoku Kogyo K.K. | Thin film for reflection film or for semi-transparent reflection film, sputtering target and optical recording medium |
| US20110151276A1 (en) * | 2008-07-07 | 2011-06-23 | Sandvik Intellectual Property Ab | Anti tarnish silver alloy |
| SE536911C2 (sv) * | 2011-02-09 | 2014-10-28 | Impact Coatings Ab | Material för att åstadkomma ett elektriskt ledande kontaktskikt, ett kontaktelement med sådant skikt, metod för att åstadkomma kontaktelementet, samt användning av materialet |
| KR20140015432A (ko) * | 2011-04-06 | 2014-02-06 | 미쓰비시 마테리알 가부시키가이샤 | 도전성 막 형성용 은 합금 스퍼터링 타깃 및 그 제조 방법 |
| JP5830907B2 (ja) * | 2011-04-06 | 2015-12-09 | 三菱マテリアル株式会社 | 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法 |
| JP5830908B2 (ja) * | 2011-04-06 | 2015-12-09 | 三菱マテリアル株式会社 | 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法 |
| JP2013077547A (ja) * | 2011-09-15 | 2013-04-25 | Mitsubishi Materials Corp | 導電性膜及びその製造方法並びに導電性膜形成用銀合金スパッタリングターゲット及びその製造方法 |
| JP5159962B1 (ja) * | 2012-01-10 | 2013-03-13 | 三菱マテリアル株式会社 | 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法 |
| JP5850077B2 (ja) * | 2014-04-09 | 2016-02-03 | 三菱マテリアル株式会社 | Ａｇ合金膜及びＡｇ合金膜形成用スパッタリングターゲット |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2011002C3 (de) * | 1970-03-09 | 1978-10-05 | Fa. Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim | Schmelzmetallurgisch hergestellter innenoxidierter Kontaktwerkstoff auf Silber-Kadmiumoxid-Basis |
| JPS616220A (ja) * | 1984-06-21 | 1986-01-11 | Tanaka Kikinzoku Kogyo Kk | 装飾品用銀材料 |
| JPS616223A (ja) * | 1984-06-21 | 1986-01-11 | Tanaka Kikinzoku Kogyo Kk | 装飾品用銀材料 |
| JPS6173847A (ja) * | 1984-09-18 | 1986-04-16 | Tanaka Kikinzoku Kogyo Kk | 耐硫化性銀合金 |
| US4636270A (en) * | 1985-09-23 | 1987-01-13 | Chugai Denki Kogyo K.K. | Internal oxidized Ag-Sn system alloy contact materials |
| JPS62130245A (ja) * | 1985-11-29 | 1987-06-12 | Tanaka Kikinzoku Kogyo Kk | 装飾品用銀材料 |
| JPS62243725A (ja) * | 1986-04-16 | 1987-10-24 | Seiko Epson Corp | 耐硫化性銀合金 |
| JP2727729B2 (ja) * | 1989-03-24 | 1998-03-18 | 三菱マテリアル株式会社 | 太陽電池のインターコネクタ用Ａｇ合金箔材 |
| JPH06243509A (ja) * | 1993-02-19 | 1994-09-02 | Ricoh Co Ltd | 光反射膜及び該膜を用いた光記録情報媒体 |
| JPH081374A (ja) * | 1994-06-17 | 1996-01-09 | Tanaka Kikinzoku Kogyo Kk | 白金装飾品用ろう付合金 |
| TW446637B (en) * | 1996-05-28 | 2001-07-21 | Mitsui Chemicals Inc | Transparent laminates and optical filters for displays using the same |
| JPH10143917A (ja) * | 1996-11-08 | 1998-05-29 | Kao Corp | 光記録媒体 |
| US6139652A (en) * | 1997-01-23 | 2000-10-31 | Stern-Leach | Tarnish-resistant hardenable fine silver alloys |
| JP3570607B2 (ja) * | 1998-03-13 | 2004-09-29 | トヨタ自動車株式会社 | 摺動部材 |
| US6544616B2 (en) * | 2000-07-21 | 2003-04-08 | Target Technology Company, Llc | Metal alloys for the reflective or the semi-reflective layer of an optical storage medium |
| JP3840345B2 (ja) * | 1999-03-19 | 2006-11-01 | 富士写真フイルム株式会社 | 光情報記録媒体 |
| JP2001035014A (ja) * | 1999-07-19 | 2001-02-09 | Ricoh Co Ltd | 光情報記録媒体及びその製造方法並びにその製造に用いるスパッタ装置 |
| CN1217028C (zh) * | 2001-03-16 | 2005-08-31 | 石福金属兴业株式会社 | 溅射靶材 |
| JP3915114B2 (ja) * | 2001-11-26 | 2007-05-16 | 三菱マテリアル株式会社 | 光記録媒体の反射膜形成用銀合金スパッタリングターゲット |
-
2002
- 2002-12-10 JP JP2002358040A patent/JP2004192702A/ja active Pending
-
2003
- 2003-12-04 TW TW092134136A patent/TW200419000A/zh unknown
- 2003-12-09 AU AU2003289251A patent/AU2003289251A1/en not_active Abandoned
- 2003-12-09 WO PCT/JP2003/015696 patent/WO2004053861A1/ja not_active Ceased
- 2003-12-09 US US10/501,751 patent/US20050089439A1/en not_active Abandoned
- 2003-12-09 CN CNB2003801002061A patent/CN1323397C/zh not_active Expired - Lifetime
- 2003-12-09 EP EP03777368A patent/EP1569215A4/en not_active Withdrawn
- 2003-12-09 KR KR1020047012143A patent/KR20050086366A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20050089439A1 (en) | 2005-04-28 |
| JP2004192702A (ja) | 2004-07-08 |
| CN1703746A (zh) | 2005-11-30 |
| EP1569215A1 (en) | 2005-08-31 |
| WO2004053861A1 (ja) | 2004-06-24 |
| KR20050086366A (ko) | 2005-08-30 |
| EP1569215A4 (en) | 2009-03-18 |
| AU2003289251A1 (en) | 2004-06-30 |
| CN1323397C (zh) | 2007-06-27 |
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