TW200417620A - Silver alloy sputtering target for forming a reflective layer of an optical recording media - Google Patents

Silver alloy sputtering target for forming a reflective layer of an optical recording media Download PDF

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TW200417620A
TW200417620A TW092105676A TW92105676A TW200417620A TW 200417620 A TW200417620 A TW 200417620A TW 092105676 A TW092105676 A TW 092105676A TW 92105676 A TW92105676 A TW 92105676A TW 200417620 A TW200417620 A TW 200417620A
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reflective layer
weight
optical recording
silver alloy
sputtering target
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TW092105676A
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TWI256418B (en
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Akifumi Mishima
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Mitsubishi Materials Corp
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Abstract

To provide a silver alloy sputtering target for forming an Ag alloy reflective layer of an optical recording media, such as a magneto-optical recording disc (MD, MO) and an optical recording disc (CD-RW, DVD-RAM). It comprises a silver alloy having a composition of (1) 0.5-3 mass% of Cu, a total of 0.1-3 mass% of one or more selected from Dy, La, Nd, Tb, and Gd, and the remainder of Ag; (2) 0.5-3 mass% of Cu, a total of 0.005-0.05 mass% of one or more selected from Ca, Be, and Si, and the remainder of Ag; or (3) 0.5-3 mass% of Cu, a total of 0.1-3 mass% of one or more selected from Dy, La, Nd, Tb, and Gd, a total of 0.005-0.05 mass% of one or more selected from Ca, Be, and Si, and the remainder of Ag.

Description

200417620 (1) 玖、發明說明 【發明所屬之技術領域】 本發明是濺鍍法中用來形成利用半導體雷射等雷射光 束播放聲音、影像、文字等資訊訊號或執行寫入·讀取· 抹除的光學記錄碟片(CD-RW、DVD-RW )內,被稱爲結 構層之半透明反射層或者反射層(以下統稱爲反射層)的 銀合金濺射靶。 【先前技術】 光磁性記錄碟片(MD、MO )、光學記錄碟片(〇1)_ RW、DVD-RW )等光記錄媒體的反射層,傳統上是採用 銀或銀合金的反射層,這些銀或銀合金反射層於 4〇0〜83〇nm之廣域波長範圍內的反射率極高,特別是對光 記錄媒體進行高密度寫入時所採用之短波長雷射光具有良 好的反射率,故非常適合用於上述的領域中。 前述的銀或銀合金反射層,可藉由對銀或銀合金製的 濺射靶進行濺鍍後獲得(請參考日本特開平1 1 -2 1 344 8號 公報、特開2〇〇〇·1〇9943號公報、特開2000-57627號等 公報)。 但是,即使在重複執行寫入·讀取·抹除的光記錄媒 體中採用相變化(phase change)記錄材料,隨著寫入· 讀取·抹除的次數增加,將使銀或銀合金反射層的反射率 下降,故不具長時間讀寫的特性。 - 5- (2) (2)200417620 【發明內容】 xa成上述結果的其中一個原因,是當光記錄媒體執行 寫入·讀取·抹除時,因爲雷射光的照射使銀反射層不斷 地加熱冷卻導致銀反射層產生再結晶化,並由於結晶粒的 粗大化而導致反射率下降。 有鑑於此,本發明團隊乃著手對:即使寫入·讀取· 抹除的次數大增,反射層之反射率下降程度微小的銀合金 反射層進行硏究。 所獲得的硏究成果如下: (Ο採用由:0.5〜3重量%的 Cu;和合計0.1〜3重 量%之由Dy、La、Nd、Tb、Gd中選出1種或2種以上; 及剩餘部分爲銀所組成的銀合金濺鍍靶,利用濺鍍所獲得 的銀合金反射層,由於該銀合金反射層因雷射光重複照射 後加熱冷卻所造成的結晶粒粗大現象甚少,因此即使長時 間使用,所造成反射率下降的現象極爲有限。 (b) 採用由:0.5〜3 重量% 的 Cu;和合計 0.005〜0.05重量%之由Ca、Be、Si中選出1種或2種以 上;及剩餘部分爲銀所組成的銀合金濺鍍靶,利用濺鍍所 獲得的銀合金反射層,由於該銀合金反射層因雷射光重複 照射後加熱冷卻所造成的結晶粒粗大現象甚少,因此即使 長時間使用,所造成反射率下降的現象極爲有限。 (c)即使同時含有上述合計0.1〜3重量%之由Dy、 La、Nd、Tb、Gd中選出 1種或 2種以上;及合計 0.005〜0.05重量%之由Ca、Be、Si中選出1種或2種以 (3) 200417620 上,所獲得的效果相同。 本發明,便是根據相關的硏究結果,加 的發明, (1 )由0.5〜3重量%的Cu ;和合計〇 由Dy、La、Nd、Tb、Gd中選出1種或2種 部分爲銀所組成,用來形成光記錄媒體之反 濺射靶。 (2 )由0.5〜3重量%的Cu ;和合計〇. %之由Ca、Be、Si中選出1種或2種以上 爲銀所組成,用來形成光記錄媒體之反射層 靶。 (3)由0.5〜3重量%的Cu;和合計〇 由Dy、La、Nd、Tb、Gd中選出1種或2種 〇·〇〇5〜〇·〇5重量%之由Ca、Be、Si中選出 上;及剩餘部分爲銀所組成,用來形成光記 層的銀合金濺射靶。 本發明中用來形成銀合金反射層的濺射 方式獲得:採用純度高達99.99重量%以上 局達99.99重量%以上的Cu、Dy、La、Nd 爲原料’並在尚真空(high vacuum)或者 前述原料熔解後,同樣在高真空或者鈍氣環 解所得的熔融原料鑄造成鑄錠,在對前述鑄 (hot work)後利用機械加工製造。 而幾乎不固熔於Ag的Ca、Be及Si, 以硏發所獲得 .1〜3重量%之 以上;及剩餘 射層的銀合金 0 0 5 〜0.0 5 ;及剩餘部分 的銀合金濺射 .1〜3重量%之 以上;和合計 1種或2種以 錄媒體之反射 靶可由以下的 的銀;和純度 、Tb及Gd作 鈍氣環境下將 境下將前述熔 錠進行熱加工 是分別使該元 (4) (4)200417620 素形成0.20重量%與Ag混合後利用高周波真空熔解的方 式加以熔解’並將Ar氣體注入熔解爐內直到爐內壓力恢 復至大氣壓力的狀態後,利用石墨製的鑄模將其鑄造成含 有Ca、Be及Si的母合金,再將前述母合金與Cu同時熔 解ί尋造成鑄錠’並在對前述鑄錠進行熱加工(hot work ) 後利用機械加工製造。 接下來’對由本發明之Ag合金所形成的反射層、及 用來形成本發明中銀合金所構成之反射層的濺射靶,說明 其組成成分採取前述限制的理由。200417620 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention is used in the sputtering method to form information signals such as playing sound, video, and text using laser beams such as semiconductor lasers or to perform writing and reading. Inside the erased optical recording disc (CD-RW, DVD-RW), a silver alloy sputtering target called a translucent reflective layer or a reflective layer (hereinafter collectively referred to as a reflective layer) of a structural layer. [Prior art] The reflective layer of optical recording media such as magneto-optical recording discs (MD, MO), optical recording discs (〇1) _RW, DVD-RW) has traditionally used a reflective layer of silver or a silver alloy. These silver or silver alloy reflective layers have extremely high reflectance in a wide wavelength range of 4,000 to 830 nm, especially the short-wavelength laser light used in high-density writing of optical recording media has good reflection Rate, so it is very suitable for the above fields. The foregoing silver or silver alloy reflective layer can be obtained by sputtering a silver or silver alloy sputtering target (refer to Japanese Patent Application Laid-Open No. 1 1-2 1 344 8, Japanese Patent Application Laid-Open No. 2000 ·· Publication No. 109943, Japanese Patent Laid-Open No. 2000-57627, etc.). However, even if a phase change recording material is used in an optical recording medium that repeatedly performs writing, reading, and erasing, as the number of writing, reading, and erasing increases, the silver or silver alloy is reflected. The reflectivity of the layer decreases, so it does not have the characteristics of long-term reading and writing. -5- (2) (2) 200417620 [Summary of the Invention] One of the reasons why xa has the above result is that when the optical recording medium performs writing, reading, and erasing, the silver reflective layer is continuously caused by the irradiation of laser light. Heating and cooling cause recrystallization of the silver reflective layer, and decrease in reflectance due to coarsening of crystal grains. In view of this, the team of the present invention set about investigating a silver alloy reflective layer having a small degree of decrease in the reflectance of the reflective layer even if the number of writes, reads, and erases is greatly increased. The obtained research results are as follows: (0 uses: 0.5 to 3% by weight of Cu; and a total of 0.1 to 3% by weight of one or more selected from Dy, La, Nd, Tb, Gd; and the remaining A silver alloy sputtering target composed of silver is used. The silver alloy reflection layer obtained by sputtering is used. Since the silver alloy reflection layer is seldom coarse in crystal grains caused by heating and cooling after repeated irradiation with laser light, even if it is long, The phenomenon of decreasing the reflectance caused by time use is extremely limited. (B) One or two or more selected from Ca, Be, and Si in a total of 0.005 to 0.05% by weight; And the remaining part is a silver alloy sputtering target composed of silver. The silver alloy reflective layer obtained by sputtering is used. Since the silver alloy reflective layer is seldom coarse in crystal grains caused by heating and cooling after repeated irradiation with laser light, Even if it is used for a long time, the phenomenon of the decrease in reflectance is extremely limited. (C) Even if it contains at least 0.1 to 3% by weight of the above, one or two or more selected from Dy, La, Nd, Tb, and Gd; and total 0.005 ~ 0.05% by weight One or two of Ca, Be, and Si are selected as above (3) 200417620, and the same effect is obtained. The present invention is based on related research results, and (1) is 0.5 to 3% by weight Cu; and a total of 0 consisting of one or two selected from Dy, La, Nd, Tb, and Gd as silver, and used to form an anti-sputter target for an optical recording medium. (2) 0.5 to 3% by weight Cu; and a total of 0.% of Ca, Be, and Si selected from one or more of silver is used to form a reflective layer target for optical recording media. (3) 0.5 to 3% by weight of Cu ; And a total of 0 or 1 or 2 from Dy, La, Nd, Tb, or Gd; 0.005 to 0.05% by weight; selected from Ca, Be, or Si; and the remainder is silver The composition is used to form a silver alloy sputtering target for forming an optical memory layer. The sputtering method used to form a silver alloy reflection layer in the present invention is obtained by using Cu, Dy, La having a purity of more than 99.99% by weight and up to 99.99% by weight. Nd is the raw material 'and after the high vacuum or the aforementioned raw material is melted, the molten raw material obtained by the high vacuum or the passivation gas ring casting is also cast into an ingot, Manufactured by mechanical processing after the aforementioned hot work. Ca, Be, and Si that are hardly solid-solved in Ag are obtained by bursting. 1-3% by weight or more; and silver alloy with remaining shots. 0 5 to 0.0 5; and the rest of the silver alloy sputtering. 1 to 3% by weight or more; and a total of 1 or 2 types of reflective targets for recording media can be made of the following silver; and purity, Tb and Gd are blunt Under the gas environment, the aforementioned molten ingot is thermally processed in the environment so that the element (4) (4) 200417620 is formed into 0.20% by weight and mixed with Ag and then melted by means of high-frequency vacuum melting. Inject Ar gas into the melting furnace After the pressure in the furnace returns to the atmospheric pressure, it is cast into a master alloy containing Ca, Be and Si using a graphite mold, and the aforementioned master alloy and Cu are simultaneously melted to find an ingot. The ingot is hot-worked and manufactured by machining. Next, the reason why the aforementioned composition is restricted for the reflective layer formed of the Ag alloy of the present invention and the sputtering target for forming the reflective layer formed of the silver alloy of the present invention will be described below.

Cu : 雖然Cu具有:固熔於Ag後可提高結晶粒強度、可 防止結晶粒的再結晶化、及抑制反射率下降的效果,但倘 若Cu的含量未滿〇.5重量%時,將無法充分地防止結晶 粒的再結晶化’連帶地也將無法抑制反射率的下降,此外 ’一旦Cu的含量超過3重量%將導致Ag合金反射層的 初期反射率變低,故不適用。由於上述原因,故Ag合金 反射層、及用來形成本發明中銀合金所構成之反射層的濺 射靶中Cu含量被限制爲〇. 5〜3重量% (其中又以0.5〜1.5 重量%更合適)。Cu: Although Cu has the effects of increasing the strength of crystal grains, preventing the recrystallization of crystal grains, and suppressing the decrease in reflectance after solid solution in Ag, it will not be possible if the Cu content is less than 0.5% by weight. Even if the recrystallization of crystal grains is sufficiently prevented, the decrease in reflectance cannot be suppressed together, and further, if the Cu content exceeds 3% by weight, the initial reflectance of the Ag alloy reflective layer will be lowered, which is not suitable. Due to the above reasons, the Cu content in the Ag alloy reflective layer and the sputtering target used to form the reflective layer composed of the silver alloy in the present invention is limited to 0.5 to 3% by weight (among which 0.5 to 1.5% by weight is more Suitable).

Dy、La、Nd、Tb、Gd : 雖然上述各成分可藉由與Ag所產生反應,在結晶粒 界內形成金屬間的化合物以防止結晶粒之間的結合,是能 -8 - (5) (5)200417620 更進一步防止Ag合金反射層形成再結晶化的成分,但倘 、 若由上述成分中所選出之1種或2種以上的總含量不足 〇. 1重量%時,將無法獲得顯著的效果,此外,一旦由上 述成分中所選出1種或2種以上的總含量超過3重量% , 將導致濺射靶明顯地變硬而難以製作,故不適用。由於上 ~ 述原因,故Ag合金反射層、及用來形成本發明中銀合金 - 所構成之反射層的濺射靶中上述成分的含量被限制爲 0.1〜3重量% (其中又以0.2〜1.5重量%更合適)。 _Dy, La, Nd, Tb, Gd: Although each of the above components can react with Ag to form intermetallic compounds in the crystal grain boundary to prevent the bonding between crystal grains, it is capable of -8-(5) (5) 200417620 A component that further prevents the recrystallization of the Ag alloy reflection layer, but if the total content of one or two or more selected from the above components is less than 0.1% by weight, significant results will not be obtained. In addition, once the total content of one or two or more selected from the above-mentioned ingredients exceeds 3% by weight, the sputtering target is significantly hardened and it is difficult to manufacture, so it is not applicable. Due to the reasons mentioned above, the content of the above components in the Ag alloy reflective layer and the sputtering target used to form the silver alloy-based reflective layer in the present invention is limited to 0.1 to 3% by weight (among which 0.2 to 1.5 % By weight is more suitable). _

Ca、Be、Si : 上述的成分幾乎不固熔於Ag,雖然可藉由從結晶粒 界中析出的方式防止結晶粒之間的結合,是能更進一步防 止Ag合金反射層形成再結晶化的成分,但倘若由上述成 分中所選出之1種或2種以上的總含量不足0.005重量% 時,將無法獲得顯著的效果,此外,一旦由上述成分中所 選出1種或2種以上的總含量超過〇. 〇 5重量% ,將導致 濺射靶明顯地變硬而難以製作,故不適用。由於上述原因 ,故Ag合金反射層' 及用來形成本發明中銀合金所構成 之反射層的濺射靶中上述成分的含量被限制爲〇.〇〇5〜〇.〇5 重里% (其中又以0.010〜0.035重量%更合適)。 【實施方式】 實施例1 準備純度高達9 9.9 9重量%以上的銀;和純度高達 -9 - (6) 200417620 99.99 重量 % 以上的 Cu、Dy、La、Nd、Tb 及 Gd 作 料,利用高真空熔解爐將前述原料熔解後,在Ar ^ 環境下將前述熔解所得的熔融原料鑄造成鑄錠,並以 °C的溫度對前述鑄錠執行2小時的加熱後進行壓延, 來在利用機械加工形成直徑1 2 5麵,厚度5 mm,具有* 1〜2所示成分之本發明的濺射靶1〜2 2,同時也製作對 濺射靶1〜7及習知濺射靶。 利用錫銲分別將上述本發明之濺射靶1〜22、對 濺射靶1〜7及習知濺射靶銲接於無氧高導電銅製的底 後,將其裝入直流磁性濺鍍裝置內,並於真空排氣裝 進行排氣使直流磁性濺鍍裝置內部形成1 X 1 0_4P a後 入Ar氣體使其形成1 . OPa的濺鍍氣壓,接下來利用 電源對濺射靶通以100W的直流濺鍍電力,並在前述 靶、及配置成與前述濺射靶形成對峙,且隔著70 mm 保持平行之直徑3 0 mm、厚度5 min的玻璃基板之間形 生電漿,最後形成厚度lOOnm的銀合金反射膜。 如上述方式所形成的各銀合金反射膜,利用分光 計於薄膜成形後測量其反射率。稍後,將前述各銀合 射膜置於溫度80°C、相對溼度85%的恆溫恆濕槽內 小時後,在以相同的條件測量其反射率。根據所測得 射率資料,推算出400nm及65〇nm時的反射率,其 如表1〜2所示並據此對光記錄媒體之反射膜的耐讀寫 行評比。 爲原 體的 600 接下 如表 照組 照組 板上 置內 ,導 直流 濺射 間隔 成產 光度 金反 200 的反 結果 性進 200417620 \)/ (5if^Ms盤 muos9^^ 0 #h/「/oo(ns 96 96 96 ε6 (N6 06 96 96 (N6 $6 Z6 J^, 1^1 &ISM- L6 L6 96 S6 寸6 rn6 L6 96 寸6 L6 寸6 1^1 1^, (%) 10^ 0 #Θ,Γ、00(N_ 0000 L% 寸00Ca, Be, Si: The above components are hardly solid-solved in Ag. Although it can prevent the bonding between crystal grains by precipitating from the crystal grain boundaries, it can further prevent the recrystallization of the Ag alloy reflection layer. Ingredients, but if the total content of one or more selected from the above ingredients is less than 0.005% by weight, significant effects will not be obtained. In addition, once one or two or more selected from the above ingredients are combined, If the content exceeds 0.05% by weight, the sputtering target will be significantly hardened and it will be difficult to manufacture, so it is not suitable. Due to the above reasons, the content of the above components in the Ag alloy reflective layer and the sputtering target used to form the reflective layer composed of the silver alloy in the present invention are limited to 0.005% ~ 0.05% by weight (wherein 0.010 ~ 0.035% by weight is more suitable). [Embodiment] Example 1 Prepare silver with a purity of up to 99.9% by weight or more; and a purity of up to -9-(6) 200417620 99.99% by weight or more of Cu, Dy, La, Nd, Tb, and Gd, using high vacuum The melting furnace melts the aforementioned raw materials, casts the molten raw materials obtained by the aforementioned melting into an ingot under an Ar ^ environment, and heats the aforementioned ingots at a temperature of ° C for 2 hours and then performs rolling to form them by mechanical processing. Sputtering targets 1 to 2 of the present invention having a diameter of 1 2 5 faces and a thickness of 5 mm and having the components shown in * 1 to 2 are also produced. At the same time, sputtering targets 1 to 7 and conventional sputtering targets are also produced. The sputtering targets 1 to 22, the pair of sputtering targets 1 to 7, and the conventional sputtering targets of the present invention are respectively soldered to a bottom made of oxygen-free high-conductivity copper by soldering, and then installed in a DC magnetic sputtering device. Then, the gas was evacuated in a vacuum exhaust device to form 1 X 1 0_4P a inside the DC magnetic sputtering device, and then Ar gas was formed to form a sputtering pressure of OPa. Next, a sputtering target was passed through a power source with a power of 100 W. The DC sputtering power is used to form a plasma between the aforementioned target and a glass substrate with a diameter of 30 mm and a thickness of 5 min, which are arranged to form a confrontation with the aforementioned sputtering target, and are parallel to each other through 70 mm. 100nm silver alloy reflective film. The reflectance of each silver alloy reflective film formed as described above was measured by a spectrometer after the film was formed. Later, after each of the foregoing silver-coated films was placed in a constant temperature and humidity bath at a temperature of 80 ° C and a relative humidity of 85%, the reflectance was measured under the same conditions. Based on the measured emissivity data, the reflectances at 400nm and 65nm are calculated, as shown in Tables 1 and 2, and the reading and writing resistance of the reflective film of the optical recording medium is evaluated based on this. The original 600 is connected as shown below. The surface of the photo group is placed inside the plate, and the direct current sputtering interval is the opposite result of the photometric gold reverse 200 200417620 \) / (5if ^ Ms 盘 muos9 ^^ 0 # h / `` / Oo (ns 96 96 96 ε6 (N6 06 96 96 (N6 $ 6 Z6 J ^, 1 ^ 1 & ISM- L6 L6 96 S6 inch 6 rn6 L6 96 inch 6 L6 inch 6 1 ^ 1 1 ^, (% ) 10 ^ 0 # Θ, Γ, 00 (N_ 0000 L% inch 00

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-12- 200417620 Ο) 根據表1所示的結果可淸楚得知,在溫度8 0 °C、相 對溼度8 5%之恆溫恆濕槽內放置200小時後,採用本發 明之濺射靶1〜22執行濺鍍所獲得的反射層之反射率的下 降,遠低於使用對照組濺射靶及習知濺射靶進行濺鍍所得 的反射層之反射率的下降。 實施例2 準備純度高達99.99重量%以上的Ag、Cu、Ca、Be 及Si。由於Ca、Be及Si幾乎不固熔於Ag,故分別使該 元素形成0.20重量%與Ag混合後利用高周波真空熔解的 方式加以熔解,並將At*氣體注入熔解爐內直到爐內壓力 恢復至大氣壓力的狀態後,利用石墨製的鑄模將其鑄造成 含有Ca、Be及Si的母合金。 藉由將前述母合金與Cu同時摻入Ag中後加以熔解 鑄造成鑄錠,並以6 0 0 □的溫度對前述鑄錠執行2小時的 加熱後進行壓延,接下來在利用機械加工形成直徑1 2 5 mm ,厚度5腿,具有如表3〜4所示成分之本發明的濺射靶 2 3〜3 6,同時也製作對照組濺射靶8〜13。 根據上述方式所獲得之本發明的濺射靶23〜36及對照 組濺射靶8〜1 3,乃進行與實施例1相同的處理後,於玻 璃基板上形成厚度l〇〇nm的銀合金反射膜,並利用分光 光度計於薄膜成形後測量其反射率。稍後,將前述各銀合 金反射膜置於溫度 80 □、相對溼度 85%的恆溫恆濕槽內 2 0 0小時後,在以相同的條件測量其反射率。根據所測得 -13- (10) 200417620 的反射率資料,推算出400nm及650nm時的反射率,其 結果如表3〜4所示並據此對光記錄媒體之反射膜的耐讀寫 性進行評比。-12- 200417620 〇) According to the results shown in Table 1, it can be clearly understood that the sputtering target 1 of the present invention is used after being left in a constant temperature and humidity tank at a temperature of 80 ° C and a relative humidity of 8 5% for 200 hours. ~ 22 The decrease in the reflectance of the reflective layer obtained by performing sputtering is much lower than the decrease in the reflectance of the reflective layer obtained by sputtering using a control group sputtering target and a conventional sputtering target. Example 2 Ag, Cu, Ca, Be, and Si having a purity of 99.99% by weight or more were prepared. Ca, Be, and Si are hardly solid-solved in Ag. Therefore, 0.20% by weight of the element is mixed with Ag and melted by high-frequency vacuum melting. At * gas is injected into the melting furnace until the pressure in the furnace is restored. After the state of atmospheric pressure, it was cast into a master alloy containing Ca, Be, and Si using a graphite mold. The aforesaid master alloy and Cu are simultaneously mixed into Ag and then melted and cast into an ingot, and the ingot is heated at a temperature of 600 □ for 2 hours and then rolled, and then the diameter is formed by machining. The sputtering target 2 3 to 36 of the present invention having a thickness of 5 legs and a thickness of 5 legs and having the composition shown in Tables 3 to 4 was also manufactured, and a control group sputtering target 8 to 13 was also produced. The sputtering targets 23 to 36 of the present invention and the control group sputtering targets 8 to 13 obtained in the above manner were subjected to the same treatment as in Example 1 to form a silver alloy with a thickness of 100 nm on a glass substrate. Reflective film, and use a spectrophotometer to measure its reflectance after film formation. Later, after each of the foregoing silver alloy reflection films were placed in a constant temperature and humidity bath at a temperature of 80 □ and a relative humidity of 85%, the reflectance was measured under the same conditions for 200 hours. Based on the measured reflectance data of -13- (10) 200417620, the reflectances at 400nm and 650nm are calculated. The results are shown in Tables 3 to 4, and the reading and writing resistance of the reflective film of the optical recording medium is calculated accordingly. Make a comparison.

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On cn 〇〇 固 驟 un c<i cs cn m m m cn ^o cn 讲粼 3 -15- 200417620 備註 1 1 1 無法成形 無法成形 無法成形 波長650nm時的反射率(% ) 經200小時後 s S CN 00 1 1 1 膜剛形成時 On ON 1 1 1 波長400nm時的反射率 (% ) 經200小時 後 cn r-H 1 1 1 膜剛形成 時 00 00 00 00 00 00 1 1 1 成分組成(重量% ) 剩餘部分 剩餘部分 剩餘部分 剩餘部分 剩餘部分 剩餘部分 1 1 0.002* 1 I 0.06* <υ 1 0.004* 1 1 0.06* 1 0.003* 1 1 0.006* 1 1 r-H r-H S r-H r-H τ-Η S r-H 〇 τ—Η 類別 00 c\ o τ—Η cnOn cn 〇〇Solid un c < i cs cn mmm cn ^ o cn Speaking 3 -15- 200417620 Note 1 1 1 Unformable Unformable Unreformable at 650nm Wavelength (%) S CN after 200 hours 00 1 1 1 On ON 1 1 1 Reflectance at 400 nm (%) at the time of film formation 200 hours later cn rH 1 1 1 When the film was formed at 00 00 00 00 00 00 1 1 1 Composition (wt.%) Remainder remainder remainder remainder remainder remainder remainder 1 1 0.002 * 1 I 0.06 * < υ 1 0.004 * 1 1 0.06 * 1 0.003 * 1 1 0.006 * 1 1 rH rH S rH rH τ-Η S rH 〇 τ—Η category 00 c \ o τ—Η cn

-16- (13) (13)200417620 根據表3〜4所示的結果可淸楚得知,在溫度80°C、 相對溼度8 5 %之恆溫恆濕槽內放置2 0 0小時後,採用本 發明之濺射靶23〜36執行濺鍍所獲得的反射層之反射率的 下降,遠低於表4所示之對照組濺射靶8〜1 3、及表2所 示之習知濺射靶進行濺鍍所得的反射層之反射率的下降。 實施例3 採用實施例1中所準備的原料、及含有實施例2中 Ca、Be與Si之母合金,製作成具有表5所示之成分組成 的本發明濺射靶37〜50,對上述各濺射靶進行與實施例1 相同的處理後,於玻璃基板上形成厚度1 〇〇nm的銀合金 反射膜,並利用分光光度計於薄膜成形後測量其反射率。 稍後,將前述各銀合金反射膜置於溫度8 0 □、相對溼度 8 5 %的恆溫恆濕槽內2 0 0小時後,在以相同的條件測量其 反射率。根據所測得的反射率資料,推算出400nm及 6 5 Onm時的反射率,其結果如表5所示並據此對光記錄媒 體之反射膜的耐讀寫性進行評比。 200417620 \1/ )sss· muos9¥^ s£',r、oo(N_ L6 96 S6 S6 寸6 S6 96 16 <n6 S6 寸6 Z6 16 盤链辁匿鲣 L6 96 56 S6 寸6 96 L6 S6 Γη6 rn6 L6 56 寸6 Ζ6 )«f^Ms#0 SU0017¾¾ 0#0,1/ 00<Niy &堪染匿鲣 gy 900 L% soo (Noo εοο 100 soo L% (Noo 98 18-16- (13) (13) 200417620 According to the results shown in Tables 3 to 4, it can be clearly known that after being placed in a constant temperature and humidity tank at a temperature of 80 ° C and a relative humidity of 85% for 200 hours, use The decrease in the reflectance of the reflective layer obtained by performing sputtering of the sputtering targets 23 to 36 of the present invention is much lower than that of the control sputtering targets 8 to 13 shown in Table 4 and the conventional sputtering shown in Table 2. The reflectance of the reflective layer obtained by sputtering the target decreases. Example 3 Using the raw materials prepared in Example 1 and the master alloy containing Ca, Be, and Si in Example 2, a sputtering target 37 to 50 of the present invention having the composition shown in Table 5 was prepared. After each sputtering target was treated in the same manner as in Example 1, a silver alloy reflective film having a thickness of 1000 nm was formed on a glass substrate, and the reflectance was measured after the film was formed using a spectrophotometer. Later, after each of the foregoing silver alloy reflective films was placed in a constant temperature and humidity tank at a temperature of 80 □ and a relative humidity of 85% for 200 hours, the reflectance was measured under the same conditions. Based on the measured reflectance data, the reflectances at 400 nm and 65 Onm were calculated. The results are shown in Table 5 and the read / write resistance of the reflective film of the optical recording medium was evaluated accordingly. 200417620 \ 1 /) sssmuos9 ¥ ^ s £ ', r, oo (N_ L6 96 S6 S6 inch 6 S6 96 16 < n6 S6 inch 6 Z6 16 disc chain 辁 L6 96 56 S6 inch 6 96 L6 S6 Γη6 rn6 L6 56 inch 6 Zn6) `` f ^ Ms # 0 SU0017¾¾ 0 # 0,1 / 00 < Niy & Can dye 鲣 gy 900 L% soo (Noo εοο 100 soo L% (Noo 98 18

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O -18- (15) (15)200417620 根據表5所示的結果可淸楚得知,在溫度8 0 °C、相 對溼度8 5%之恆溫恆濕槽內放置200小時後,採用本發 明之濺射靶37〜50執行濺鍍所獲得的反射層之反射率的下 降,遠低於使用表2所示之習知濺射靶、及表4所示之對 照組濺射靶8〜1 3進行濺鍍所得的反射層之反射率的下降 【產業上的可利用性】 如上所述,相較於傳統上用來製作光記錄媒體反射層 之銀合金濺射靶所製成的反射層,採用本發明之用來形成 光記錄媒體反射層的銀合金濺射IG所製成的反射層,不會 因時間的變化而造成反射率的下降,可製造出適合長時間 使用的光記錄媒體,對於媒體產業的發展具有重大的貢獻 19-O -18- (15) (15) 200417620 According to the results shown in Table 5, it can be clearly understood that the present invention is applied after being left in a constant temperature and humidity tank at a temperature of 80 ° C and a relative humidity of 8 5% for 200 hours. The decrease in the reflectance of the reflective layer obtained by performing sputtering on the sputtering targets 37 to 50 is much lower than using the conventional sputtering targets shown in Table 2 and the control group sputtering targets 8 to 1 shown in Table 4. 3 Decrease in reflectance of the reflective layer obtained by sputtering [Industrial Applicability] As described above, compared with the reflective layer made of a silver alloy sputtering target that is conventionally used to make a reflective layer of an optical recording medium The reflection layer made of the silver alloy sputtered IG used for forming the reflection layer of the optical recording medium of the present invention does not cause a decrease in reflectance due to time change, and can manufacture an optical recording medium suitable for long-term use. Has made a significant contribution to the development of the media industry 19-

Claims (1)

200417620 ⑴ 拾、申請專利範圍 1. 一種光記錄媒體的反射層形成用銀合金濺射靶,是 由: Cu: 0.5〜3重量% ;和 由Dy、La、Nd、Tb、Gd中選出1種或2種以上,合 計0 . 1〜3重量% ;及剩餘部分爲銀所組成。 2·—種光記錄媒體的反射層形成用銀合金濺射靶,是 由: Cu : 〇. 5〜3重量% :和 由Ca、Be、Si中選出1種或2種以上,合計 0·005 〜0.05 重量 % ; 及剩餘部分爲銀所組成。 3 · —種光記錄媒體的反射層形成用銀合金濺射靶,是 由: Cu: 0.5〜3重量% ;和200417620 ⑴ Pickup, patent application scope 1. A silver alloy sputtering target for forming a reflective layer of an optical recording medium, made of: Cu: 0.5 to 3% by weight; and one selected from Dy, La, Nd, Tb, and Gd Or two or more kinds, totaling 0.1 to 3% by weight; and the remainder is composed of silver. 2 · —A silver alloy sputtering target for forming a reflective layer of an optical recording medium is composed of: Cu: 0.5 to 3% by weight: and one or two or more selected from Ca, Be, and Si, for a total of 0 · 005 to 0.05% by weight; and the remainder is composed of silver. 3. A silver alloy sputtering target for forming a reflective layer of an optical recording medium, consisting of: Cu: 0.5 to 3% by weight; and 由Dy、La、Nd、Tb、Gd中選出l種或2種以上,合 計0 . 1〜3重量% ;和 由 Ca、Be、Si中選出1種或 2種以上,合計 〇·⑽5〜〇·〇5重量% ;及剩餘部分爲銀所組成。 4. 一種光記錄媒體的反射層,是採用申請專利範圍第 1、2或3項所記載之光記錄媒體的反射層形成用銀合金 濺射靶所製成。 -20 - 200417620 陸、(一)、本案指定代表圖為:無 (二)、本代表圓之元件代表符號簡單說明:無One or two or more selected from Dy, La, Nd, Tb, or Gd, totaling 0.1 to 3% by weight; and one or two or more selected from Ca, Be, and Si, totaling 0.5 to 5. · 5% by weight; and the remainder is composed of silver. 4. A reflective layer for an optical recording medium is made by using a silver alloy sputtering target for forming a reflective layer of an optical recording medium as described in item 1, 2 or 3 of the scope of patent application. -20-200417620 Lu, (1), the designated representative of the case is: None (2), the representative symbol of the component of the circle is simply explained: None 柒、本案若有化學式時,請揭示最能顯示發明特徵的化學 式·· —3柒 、 If there is a chemical formula in this case, please disclose the chemical formula that can best show the characteristics of the invention ... 3
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EP1734139A4 (en) 2003-12-10 2009-03-18 Tanaka Precious Metal Ind Silver alloy excelling in performance of reflectance maintenance
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