SK286829B6 - Spôsob rezania monokryštálu a zariadenie na vykonávanie tohto spôsobu - Google Patents

Spôsob rezania monokryštálu a zariadenie na vykonávanie tohto spôsobu Download PDF

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Publication number
SK286829B6
SK286829B6 SK1493-2003A SK14932003A SK286829B6 SK 286829 B6 SK286829 B6 SK 286829B6 SK 14932003 A SK14932003 A SK 14932003A SK 286829 B6 SK286829 B6 SK 286829B6
Authority
SK
Slovakia
Prior art keywords
single crystal
cutting
plane
orientation
angle
Prior art date
Application number
SK1493-2003A
Other languages
English (en)
Slovak (sk)
Other versions
SK14932003A3 (sk
Inventor
Ralf Hammer
Ralf Gruszynsky
Andr Kleinwechter
Tilo Flade
Original Assignee
Freiberger Compound Materials Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freiberger Compound Materials Gmbh filed Critical Freiberger Compound Materials Gmbh
Publication of SK14932003A3 publication Critical patent/SK14932003A3/sk
Publication of SK286829B6 publication Critical patent/SK286829B6/sk

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20008—Constructional details of analysers, e.g. characterised by X-ray source, detector or optical system; Accessories therefor; Preparing specimens therefor
    • G01N23/20016—Goniometers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
SK1493-2003A 2001-06-13 2002-06-11 Spôsob rezania monokryštálu a zariadenie na vykonávanie tohto spôsobu SK286829B6 (sk)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10128630A DE10128630A1 (de) 2001-06-13 2001-06-13 Vorrichtung und Verfahren zur Bestimmung der Orientierung einer kristallografischen Ebene relativ zu einer Kristalloberfläche sowie Vorrichtung und Verfahren zum Trennen eines Einkristalls in einer Trennmaschine
PCT/EP2002/006407 WO2002100619A1 (de) 2001-06-13 2002-06-11 Vorrichtung und verfahren zur bestimmung der orientierung einer kristallografischen ebene relativ zu einer kristalloberfläche sowie vorrichtung und verfahren zum trennen eines einkristalls in einer trennmaschine

Publications (2)

Publication Number Publication Date
SK14932003A3 SK14932003A3 (sk) 2004-06-08
SK286829B6 true SK286829B6 (sk) 2009-06-05

Family

ID=7688120

Family Applications (1)

Application Number Title Priority Date Filing Date
SK1493-2003A SK286829B6 (sk) 2001-06-13 2002-06-11 Spôsob rezania monokryštálu a zariadenie na vykonávanie tohto spôsobu

Country Status (11)

Country Link
US (1) US6923171B2 (cs)
EP (2) EP1568457B1 (cs)
JP (2) JP4716652B2 (cs)
CN (2) CN100569475C (cs)
AT (1) ATE369956T1 (cs)
CZ (1) CZ304828B6 (cs)
DE (3) DE10128630A1 (cs)
RU (1) RU2296671C2 (cs)
SK (1) SK286829B6 (cs)
TW (1) TWI224670B (cs)
WO (1) WO2002100619A1 (cs)

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JP5007706B2 (ja) * 2008-06-30 2012-08-22 信越半導体株式会社 ワークの切断方法
KR100995877B1 (ko) * 2008-07-23 2010-11-22 한국기계연구원 투과전자현미경의 고니오미터를 이용한 이웃하는 결정립의결정학적 방위관계 측정장치 및 그에 의한 결정립계 특성규명 방법
CN101486231B (zh) * 2009-01-22 2011-12-07 四川大学 黄铜矿类负单轴晶体制备红外非线性光学元件的定向切割方法
CN101486232B (zh) * 2009-01-22 2011-09-07 四川大学 黄铜矿类正单轴晶体制备红外非线性光学元件的定向切割方法
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CN102490278B (zh) * 2011-11-30 2014-07-16 峨嵋半导体材料研究所 线切割晶体激光仪定向切割方法
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JP6132621B2 (ja) * 2013-03-29 2017-05-24 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体単結晶インゴットのスライス方法
CN105684125A (zh) * 2013-09-24 2016-06-15 硅电子股份公司 半导体晶片以及制造该半导体晶片的方法
US9682495B2 (en) * 2013-09-30 2017-06-20 Gtat Corporation Method and apparatus for processing sapphire
JP6459524B2 (ja) * 2015-01-08 2019-01-30 株式会社ジェイテクト 複合研削盤および研削方法
CN104985709B (zh) * 2015-06-16 2017-01-11 浙江海纳半导体有限公司 调整单晶棒晶向的方法及测量方法
JP6610026B2 (ja) * 2015-06-23 2019-11-27 三星ダイヤモンド工業株式会社 スクライブ装置
JP6272801B2 (ja) * 2015-07-27 2018-01-31 信越半導体株式会社 ワークホルダー及びワークの切断方法
JP6349290B2 (ja) * 2015-09-03 2018-06-27 信越半導体株式会社 単結晶ウェーハの表裏判定方法
CN105269696B (zh) * 2015-10-30 2017-04-05 江苏吉星新材料有限公司 一种蓝宝石晶体的复合定向方法
WO2017091945A1 (en) * 2015-11-30 2017-06-08 Rhodia Operations Wafering process for water based slurries
CN105842263A (zh) * 2016-03-18 2016-08-10 中锗科技有限公司 一种偏晶向太阳能锗单晶定向仪及其检测方法
JP6690983B2 (ja) * 2016-04-11 2020-04-28 株式会社ディスコ ウエーハ生成方法及び実第２のオリエンテーションフラット検出方法
JP6222393B1 (ja) * 2017-03-21 2017-11-01 信越半導体株式会社 インゴットの切断方法
CN108312370B (zh) * 2017-12-20 2020-05-01 天通控股股份有限公司 一种基于水平传感器定位晶体的定向加工方法
JP6923067B2 (ja) * 2018-02-27 2021-08-18 株式会社Sumco 半導体単結晶インゴットのスライス方法
CN108621316B (zh) * 2018-05-03 2020-02-18 大连理工大学 一种易潮解光学晶体的水溶解辅助精密高效切割方法
DE102018221922A1 (de) * 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
JP7148437B2 (ja) * 2019-03-01 2022-10-05 信越半導体株式会社 ワークの切断加工方法及びワークの切断加工装置
EP4024036A4 (en) * 2019-08-30 2023-09-13 National Institute Of Advanced Industrial Science and Technology METHOD FOR COMPUTING THE ORIENTATION DISTRIBUTION, APPARATUS FOR ANALYZING THE ORIENTATION DISTRIBUTION AND PROGRAM FOR ANALYZING THE ORIENTATION DISTRIBUTION
CN111745305B (zh) * 2020-05-23 2022-03-04 山东大学 一种实现金刚石单晶衬底表面取向的方法
CN112590032B (zh) * 2020-12-03 2022-12-02 天津市环智新能源技术有限公司 一种太阳能硅片及其粗糙度控制方法
CN113787636B (zh) * 2021-07-09 2022-05-27 麦斯克电子材料股份有限公司 一种用于12寸半导体晶圆的手动粘棒方法
CN117415966A (zh) * 2023-11-16 2024-01-19 深圳平湖实验室 碳化硅晶体的定向治具、定向方法和切割方法

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Also Published As

Publication number Publication date
TWI224670B (en) 2004-12-01
DE50210785D1 (de) 2007-10-04
RU2004100543A (ru) 2005-06-10
EP1399306B1 (de) 2007-08-15
SK14932003A3 (sk) 2004-06-08
DE50210714D1 (de) 2007-09-27
US20040168682A1 (en) 2004-09-02
CZ20033395A3 (cs) 2004-05-12
WO2002100619A1 (de) 2002-12-19
JP4716652B2 (ja) 2011-07-06
CN100569475C (zh) 2009-12-16
US6923171B2 (en) 2005-08-02
CN1529647A (zh) 2004-09-15
JP2011003929A (ja) 2011-01-06
JP2004533347A (ja) 2004-11-04
DE10128630A1 (de) 2003-01-02
CN1736681A (zh) 2006-02-22
EP1568457B1 (de) 2007-08-22
EP1399306A1 (de) 2004-03-24
JP5357122B2 (ja) 2013-12-04
RU2296671C2 (ru) 2007-04-10
CZ304828B6 (cs) 2014-11-26
ATE369956T1 (de) 2007-09-15
CN100546793C (zh) 2009-10-07
EP1568457A1 (de) 2005-08-31

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