SG52609A1 - Method of electrolytic precipitation of metallic layers with predetermined physical properties and apparatus for carrying out the method - Google Patents

Method of electrolytic precipitation of metallic layers with predetermined physical properties and apparatus for carrying out the method

Info

Publication number
SG52609A1
SG52609A1 SG1996006707A SG1996006707A SG52609A1 SG 52609 A1 SG52609 A1 SG 52609A1 SG 1996006707 A SG1996006707 A SG 1996006707A SG 1996006707 A SG1996006707 A SG 1996006707A SG 52609 A1 SG52609 A1 SG 52609A1
Authority
SG
Singapore
Prior art keywords
metal
workpiece
pct
plating solution
anode
Prior art date
Application number
SG1996006707A
Other languages
English (en)
Inventor
Petra Dr Fromme
Silke Kaftanski
Helga Meyer
Walter Meyer
Rolf Dr Schumacher
Wolfgang Dahms
Reinhard Schneider
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SG52609A1 publication Critical patent/SG52609A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Physical Vapour Deposition (AREA)
SG1996006707A 1993-12-24 1994-12-23 Method of electrolytic precipitation of metallic layers with predetermined physical properties and apparatus for carrying out the method SG52609A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4344387A DE4344387C2 (de) 1993-12-24 1993-12-24 Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens

Publications (1)

Publication Number Publication Date
SG52609A1 true SG52609A1 (en) 1998-09-28

Family

ID=6506149

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996006707A SG52609A1 (en) 1993-12-24 1994-12-23 Method of electrolytic precipitation of metallic layers with predetermined physical properties and apparatus for carrying out the method

Country Status (10)

Country Link
US (1) US5976341A (fr)
EP (1) EP0690934B1 (fr)
JP (1) JP3436936B2 (fr)
AT (1) ATE167532T1 (fr)
CA (1) CA2156407C (fr)
DE (2) DE4344387C2 (fr)
ES (1) ES2118549T3 (fr)
SG (1) SG52609A1 (fr)
TW (1) TW418263B (fr)
WO (1) WO1995018251A1 (fr)

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DE19736350C1 (de) 1997-08-21 1999-08-05 Atotech Deutschland Gmbh Verfahren zur Konzentrationsregulierung von Stoffen in Elektrolyten und Vorrichtung zur Durchführung des Verfahrens
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DE10325101A1 (de) * 2003-06-03 2004-12-30 Atotech Deutschland Gmbh Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs)
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DE102012206800B3 (de) * 2012-04-25 2013-09-05 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Abscheiden eines Abscheidemetalls auf einem Werkstück
JP5876767B2 (ja) * 2012-05-15 2016-03-02 株式会社荏原製作所 めっき装置及びめっき液管理方法
KR20140034529A (ko) * 2012-09-12 2014-03-20 삼성전기주식회사 전기 동도금 장치
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JP2015021154A (ja) * 2013-07-18 2015-02-02 ペルメレック電極株式会社 電解金属箔の連続製造方法及び電解金属箔連続製造装置
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CN107923060B (zh) 2015-08-31 2020-03-10 埃托特克德国有限公司 含水铜镀浴和用于将铜或铜合金沉积到基底上的方法
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CN106591932B (zh) * 2016-12-30 2023-09-29 宁波工程学院 用于深孔电镀的电镀制具及电镀方法
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EP3470552B1 (fr) 2017-10-13 2020-12-30 ATOTECH Deutschland GmbH Composition aqueuse acide pour déposer électrolytiquement un dépôt de cuivre
ES2800292T3 (es) 2017-11-09 2020-12-29 Atotech Deutschland Gmbh Composiciones de electrodeposición para deposición electrolítica de cobre, su uso y un método para depositar electrolíticamente una capa de cobre o aleación de cobre sobre al menos una superficie de un sustrato
EP3508620B1 (fr) 2018-01-09 2021-05-19 ATOTECH Deutschland GmbH Additif d'uréylène, son utilisation et un procédé de préparation associé
EP3511444B1 (fr) 2018-01-16 2020-07-22 ATOTECH Deutschland GmbH Composition de dépôt de métal ou d'alliage métallique et composé de placage
WO2021032776A1 (fr) 2019-08-19 2021-02-25 Atotech Deutschland Gmbh Procédé de préparation d'une carte de circuit imprimé d'interconnexion haute densité comprenant des microtrous d'interconnexion remplis de cuivre
CN114342569A (zh) 2019-08-19 2022-04-12 德国艾托特克有限两合公司 高密度互连印刷电路板的制造顺序及高密度互连印刷电路板
EP3901331A1 (fr) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Composition aqueuse acide pour déposer électrolytiquement un dépôt de cuivre
EP3933073B1 (fr) 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Bain d'électrodéposition de cuivre
CN112888169B (zh) * 2020-12-30 2022-11-08 深圳市迅捷兴科技股份有限公司 图形电镀电流分流方法
EP4032930B1 (fr) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Polymères quaternisés à base de biuret et leur utilisation dans des bains de placage de métal ou d'alliage métallique
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
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Also Published As

Publication number Publication date
EP0690934A1 (fr) 1996-01-10
EP0690934B1 (fr) 1998-06-17
CA2156407C (fr) 2003-09-02
CA2156407A1 (fr) 1995-07-06
DE4344387A1 (de) 1995-06-29
WO1995018251A1 (fr) 1995-07-06
DE4344387C2 (de) 1996-09-05
ATE167532T1 (de) 1998-07-15
ES2118549T3 (es) 1998-09-16
TW418263B (en) 2001-01-11
DE59406281D1 (de) 1998-07-23
US5976341A (en) 1999-11-02
JPH08507106A (ja) 1996-07-30
JP3436936B2 (ja) 2003-08-18

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