WO2003038158A2 - Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices - Google Patents

Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices Download PDF

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Publication number
WO2003038158A2
WO2003038158A2 PCT/DE2002/003916 DE0203916W WO03038158A2 WO 2003038158 A2 WO2003038158 A2 WO 2003038158A2 DE 0203916 W DE0203916 W DE 0203916W WO 03038158 A2 WO03038158 A2 WO 03038158A2
Authority
WO
WIPO (PCT)
Prior art keywords
electroplating
electrically conductive
substrate
contacting unit
electroplating device
Prior art date
Application number
PCT/DE2002/003916
Other languages
German (de)
English (en)
Other versions
WO2003038158A3 (fr
Inventor
Andreas MÜLLER-HIPPER
Ewald Simmerlein-Erlbacher
Andreas Karl
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10234705A external-priority patent/DE10234705B4/de
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2003038158A2 publication Critical patent/WO2003038158A2/fr
Priority to US10/916,308 priority Critical patent/US20050061661A1/en
Publication of WO2003038158A3 publication Critical patent/WO2003038158A3/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Definitions

  • Electroplating device and electroplating system for coating structures that are already conductive are already conductive.
  • the invention relates to an electroplating device and an electroplating system for the electroplating of an electrically conductive layer on a substrate.
  • Electroplating devices or electroplating systems are used to produce conductor structures or full-surface conductor layers. For example, antenna coils, printed circuit boards, chip card modules or the like are manufactured with such devices. So far, such conductor structures have been produced using subtractive processes.
  • a metal cylinder continuously switched as a cathode is at least partially immersed in an electrolyte bath in which an electrolyte is located and rotated.
  • An anode device is located in the electrolyte bath.
  • a metal layer is deposited on the slowly rotating cathode, which is laminated outside the electrolyte onto a non-conductive film called a substrate
  • the method in which a single-sided metal layer can be produced on the carrier substrate is limited in terms of the metal thickness that can be achieved downwards, since the metal foil, which is generally made of copper, is peeled off from the cathode and onto that of plastic existing film is applied.
  • the film thickness is limited to about 17 ⁇ m by the subsequent further processing because of possible crack formation.
  • the invention is therefore based on the object of providing a galvanizing device and an electroplating system which, compared with the prior art, permits faster, simpler and more cost-effective production of an electrically conductive layer on a substrate.
  • the electrically conductive layer is produced by means of the electroplating device according to the invention on a substrate that has structures that are already conductive.
  • the conductive structures preferably consist of conductive particles applied to a surface of the substrate and fixed to the substrate.
  • the conductive particles are "exposed", that is to say without an embedding material surrounding them, applied to the surface of the substrate.
  • the conductive particles are applied, for example, by inflation, spraying, spraying, rolling up or brushing on.
  • the particles can have been applied to the carrier body thermally and / or statically and / or magnetically and / or by means of an adhesive layer.
  • the conductive particles can consist, for example, of metal, preferably of copper, iron, nickel, gold, silver, aluminum, brass or an alloy, of graphite or of conductive polymer particles.
  • the particles are preferably in powder form when applied to the substrate.
  • the substrate preferably consists of a non-conductive material, the surface of the substrate having adhesive properties.
  • the adhesive properties of the surface can be activated, for example, by softening the surface or by applying an adhesive.
  • the softening of the surface can be done by means of thermal radiation,
  • the surface can be treated with a solvent beforehand, ie before the conductive particles are applied.
  • the conductive particles can also be pretreated with a solvent before they are applied to the carrier body.
  • the conductive particles are applied to the substrate, that is to say before the actual electroplating process, the desired conductor structure, which of course can also be full-surface, is already established.
  • the pretreatment of the substrate ensures that the conductive particles only adhere to the substrate at those points at which an adhesion promoter is provided.
  • the electroplating device or the electroplating system thus serves to galvanically reinforce the conductive particles.
  • Electroplating device on a supply belt - the film described in the introduction - can be dispensed with, since only the actually desired layout, that is e.g. B. a conductor structure is galvanized.
  • the galvanizing device according to the invention for the electrodeposition of an electrically conductive layer on the substrate has an electrolyte bath, in which an anode device and at least one contacting unit is arranged, o- each contacting unit has a plurality of electrically conductive areas, at least one of which is cathodically or respectively is switched anodically.
  • the galvanizing device In contrast to the prior art, in which the contacting device consists of an exclusively cathodically connected element (metal cylinder), the galvanizing device according to the invention has a contacting unit which can be switched both cathodically and anodically.
  • the galvanizing device defined thereby is therefore self-regenerating. This means that the galvanizing device no longer has any downtimes that are necessary in conventional devices for the anodic cleaning of the cathodically connected roller. As a result, significantly higher throughput rates can be achieved, which also reduces the unit costs of the conductor structures to be manufactured.
  • the conductive particles attached to a cathodically connected electrically conductive area can only be used partially for the galvanic reinforcement of the conductive particles on the substrate, the electrically conductive areas become contaminated over time. Since each of the electrically conductive areas is anodically switched at least once after the cathodic circuit, the contacting unit is self-cleaning.
  • the object to be electroplated serves as the auxiliary cathode.
  • each electrically conductive region of a contacting device can be switched both as a cathode or anode.
  • the conductive areas are connected cathodically or anodically depending on their position. In particular, various of the electrically conductive areas can be switched cathodically or anodically at the same time.
  • the electroplating device can run continuously.
  • the conductor structures are, for example, the antenna coils or chip modules mentioned at the beginning.
  • the cost-effective production is also made possible by the fact that after the galvanic reinforcement with the electroplating device, no further processing steps are necessary, apart from the separation of respective conductor structures.
  • the procedure according to the invention is therefore an additive or semi-additive method for producing a conductor structure.
  • the qualitative metal structure of the electrically conductive layer also achieves precisely controllable and extremely homogeneous thickness.
  • the electroplating device according to the invention it is possible to use the electroplating device according to the invention to produce metallization on the substrate. For this it is necessary that the substrate has been provided with the conductive particles in a structured manner on both sides before processing with the electroplating device.
  • the self-generating formation of electrical plated-through holes is also possible. Together with the associated conductor structures on the opposite main sides of the substrate, these form a metallic unit with more or less the same layer thickness.
  • Another advantage is that different layer thicknesses can be produced in one operation in the electroplating device by varying the current strength of the electroplating device and / or the throughput speed of the substrate in the electroplating device.
  • an electrically conductive area is connected cathodically or anodically.
  • the galvanic amplification of the substrate to be galvanized can be accelerated.
  • a plurality of electrically conductive regions which are not necessarily arranged next to one another, can also be connected anodically at the same time.
  • the or the electrically conductive areas of the contacting unit connected as anode are preferably arranged in the vicinity of the electrically conductive area connected as the cathode.
  • the electrically conductive areas connected as anode then represent an auxiliary anode.
  • the contacting unit can in principle have any shape and in particular be adapted to the substrates to be electroplated. Not only can two-dimensionally designed substrates be galvanically reinforced, but also substrates in three-dimensional form. In a further development of the invention, the contacting unit can moreover be switched using the pulse method.
  • the contacting unit is preferably cylindrical. staltet.
  • the electrically conductive areas then extend on the jacket of the cylindrical contacting unit from one base area in the direction of the other base area.
  • the electrically conductive regions are designed to be wave-shaped, zigzag-shaped or inclined at a distance from one another.
  • the electrically conductive areas can also be straight.
  • the wave-shaped, zigzag-shaped or inclined shape has the advantage that the areas of the substrate to be galvanized can be reached uniformly with a high degree of certainty, which ensures a uniform growth of the conductive layer.
  • the cathodically connected electrically conductive areas are opposite the anode device, e.g. with a shielding device, are shielded. Those sections are to be shielded which are not in the immediate vicinity of the substrate and are therefore not necessary for power transmission.
  • the shielding device can be designed in the form of wing-like profiles above the cathodically switched areas and avoids deposits directly on the cathodically switched electrical area.
  • a device is preferably provided which presses the substrate onto the at least one contacting unit.
  • the device can be a non-conductive roller.
  • the device can also be designed as a further contacting unit.
  • the substrate to be electroplated is applied to the cathode by the device. switched electrically conductive areas of a respective contact unit pressed.
  • the contacting can have slides that are provided for contacting areas of the substrate that are to be galvanized.
  • poorly accessible, for. B. undercut areas of a three-dimensionally formed substrate can be achieved.
  • the slides can be removed from the object to be electroplated and replaced again using pneumatic or hydraulic control devices. Depending on the position of a respective slide, it is then connected cathodically or anodically.
  • the contacting unit has pins which can be controlled differently and are movable relative to a base plate, the pins being connected cathodically or anodically depending on their position.
  • the contacting unit described is particularly suitable for the galvanic reinforcement of printed circuit boards.
  • the pins are spaced from one another in a grid. According to the conductor structure to be electroplated, the pins are "extended" from the base plate, so that cathodic switching is possible at the locations of the conductor structures. By moving the pins into the base plate, they are switched anodically, so that the previously cathodically switched pins are cleaned.
  • the base plate is constructed in two layers and the first layer is connected anodically and the second layer is connected cathodically. Depending on the end position in which the pins are straight, they are therefore connected anodically or cathodically.
  • the retraction and extension of the pins can be done using common techniques, e.g. B. Pneumatics, hydraulics or electrical control.
  • the electroplating system according to the invention has at least one electroplating device of the type described above, a feed device which feeds the substrate to be electroplated to the at least one electroplating device and a receiving device which receives the finished electroplated substrate.
  • the substrate can be fed to the at least one electroplating unit in an endless form. This enables efficient, inexpensive and reliable production, especially since the electroplating device does not have any downtimes.
  • the electroplating unit is preferably arranged in a collecting container into which an electrolyte displaced in the electrolyte bath by a filtered electrolyte can overflow, so that a self-regenerating electrolyte is present in the electrolyte bath.
  • the collecting container is equipped with an electrolyte bath of the electroplating device via an overflow.
  • the collecting container has a pump and a filter that pumps the processed electrolyte back into the electrolyte bath.
  • the electroplating system according to the invention has at least two electroplating units which are connected in series and which are operated with the same or a different electrolyte.
  • the electroplating system according to the invention can thus have a modular structure.
  • the working or throughput speed is then solely due to the number of modules.
  • Another advantage of the electroplating device according to the invention is that it can be operated with different current intensities in the same electrolyte, in particular the anode device and the Auxiliary anodes can be operated with different currents.
  • FIG. 1 shows a basic exemplary embodiment of an electroplating device according to the invention in cross section
  • FIG. 2 shows the structure and mode of operation of the contacting unit used in the galvanizing device
  • FIG. 3 shows a section through the first exemplary embodiment of the galvanizing device according to the invention
  • FIG. 4 shows an electroplating system which comprises the electroplating device described in FIGS. 1 to 3,
  • FIGS. 5 and 6 different arrangements of contacting units for galvanizing an endless substrate
  • FIG. 7 shows a perspective view of a second exemplary embodiment of an electroplating device
  • FIG. 8 shows a section through the electroplating device of FIG. 7,
  • FIGS. 9 and 10 each show a detail which shows the configuration of the electrically conductive areas of the second exemplary embodiment
  • FIG. 11 shows a third exemplary embodiment of an electroplating device in which the electrically conductive
  • FIG. 12 shows the arrangement of shielding devices above the cathodically switched areas of a contacting unit according to FIG. 2.
  • FIG. 1 shows a first exemplary embodiment of an electroplating device 10 according to the invention.
  • an electrolyte bath 14 in which a trough 26 is filled with an electrolyte, there are merely, by way of example, five contacting units 16 arranged next to one another. These are circular in cross section.
  • Electrodes 28 of an anode device 30 are also shown by way of example only between or next to a respective contacting unit 16.
  • the arrangement of the anodes 28 of the anode device 30 can in principle be of any type.
  • a roller 18 made of non-conductive material is arranged above each contact unit 16 and represents the device for pressing the substrate onto the contact unit.
  • the substrate to be electroplated (and not shown in FIG. 1) would each be transported between a roller 18 and a contact unit 16. The substrate could be in endless form and introduced into the electrolyte bath 14 from above and carried out again on the other side.
  • the structure of the contacting unit 16 can be seen better from FIG. 2. It is clear from this figure that the jacket of the cylindrical contact unit is provided with electrically conductive regions 20 spaced apart from one another along its entire circumference.
  • the contact unit - either driven by a motor or moved by the substrate itself - is set in rotation.
  • the electrically conductive regions 20 which are brought into contact with a cathode device 22 and which are denoted by 20k in FIG. 2 are then connected cathodically, while the electrically conductive regions 20 (which are brought into contact with the two anode devices 24 shown by way of example) than 20a) are anodically connected for cleaning the contacting unit.
  • each conductive region 20 is switched at least once as a cathode and twice as an anode.
  • the cathode device 22 and the anode devices 24 can be designed, for example, in the form of wheels or rollers which are placed on the contacting device 16.
  • the cathode device and the anode devices 24 are arranged opposite one another.
  • the anode devices 24 can be arranged at any desired location and, in contrast to the drawing, are preferably connected shortly after the cathode as a supporting anode (auxiliary anode). “Shortly after the cathode” is to be understood as an angular offset of at most 90 °. The preferred offset is approximately 90 ° offset compared to cathode 22.
  • the galvanizing device can be operated continuously.
  • the conductive particles deposited on the cathodically connected electrically conductive regions 20k are automatically cleaned by the anodic circuit by means of the anode device 24. This procedure enables the galvanizing device to be operated continuously without interruption or standstill.
  • FIG. 12 shows the contacting unit 18 of FIG. 2 in a modification, an anode device 28 and the substrate 12 to be metallized first being shown by way of example.
  • the main difference from FIG. 2 are the shielding devices 25 arranged above the cathodically switched regions 20 k. These are intended to avoid metallic deposits on the sections of the regions 20 k which are not required for current transmission. These sections are identified by the reference symbol 21 and face away from the point of contact of the regions 20 k and the substrate 12.
  • the shielding devices 25 are particularly expedient when the electrically conductive regions 20 have a strongly pronounced wave-shaped or zigzag-shaped profile or these are strongly inclined.
  • the shielding devices 25 have, for example, the wing-like profile shown in FIG. 12 and force an ion flow, indicated by the arrows, between the substrate 12 to be metallized (the conductive structures previously formed on the substrate are denoted by 13 a, the layer formed after the galvanization with 13 b) and the shielding device 25.
  • the arrangement of the cathode and anode devices 22, 24 with respect to the electrolyte bath 14 and the contact unit 16 is again illustrated in FIG.
  • Both the cathode device 22 and the anode devices 24 are, for example, arranged outside the electrolyte bath 14.
  • Different conductive regions 20 are switched anodically or cathodically by the rotation.
  • the non-conductive roller 18 is arranged above the contacting unit 16.
  • the substrate to be electroplated is guided through the slot which is formed and clearly recognizable between the roller 18 and the contacting unit 16, the roller 18 ensuring the necessary contact pressure of the already preconfigured substrate on the cathodically connected electrically conductive areas.
  • the electroplating device can only consist of a single contacting unit 16.
  • the arrangement of a plurality of contacting units 16 in an electrolyte bath increases the speed of the galvanic growth of an electrically conductive layer on the substrate already provided with conductive particles.
  • FIG. 4 shows an electroplating system according to the invention, which is constructed using the electroplating device described in FIGS. 1 to 3.
  • the electroplating device 10 is arranged in a collecting container 46.
  • An overflow 48 protruding into the electrolyte bath 14 transports overflowing electrolytes into the collecting container 46.
  • the collecting container 46 has a pump with a filter 50 which pumps processed electrolytes back into the electrolytic bath 14.
  • the electroplating system shown in FIG. 4 is particularly suitable for processing a substrate which is in endless form.
  • the substrate which is already in structured form with conductive particles, is wound on a drum-shaped feed device 42.
  • the substrate is guided in the direction of the arrow from the feed device 42 into the electroplating device 10 between the respective contacting devices 16 and rollers 18 and is then guided out of the electroplating device 10 again on the left-hand side.
  • the galvanically reinforced substrate is dried on a doctor blade 52 in order to prevent electrolyte carryover.
  • the substrate, which is still in endless form is introduced into a flushing device 56 via a deflection roller 54.
  • FIG. 5 shows an embodiment in which the roller 18 generating the contact pressure is replaced by a further contacting device 16.
  • two contacting units 16 are arranged opposite each other, so that the substrate can again be guided in between.
  • the electrolyte bath and the anode device 30 have been omitted in FIG. 5.
  • contacting units 16 are arranged offset from one another in four rows.
  • the substrate 12 is thus guided in a meandering manner between the contacting units 16.
  • the necessary contact pressure is guaranteed by the offset arrangement.
  • double-sided metallized substrates can be produced, even if they have no through-plating. If the substrate has a plated-through hole and has been provided with electrically conductive structures in the form described above before the treatment in the galvanizing device according to the invention, it is sufficient to connect only one side of the substrate to a contacting unit 16. Nevertheless, it is ensured that two-sided metallization is possible, since plated-through holes are automatically enriched with electrically conductive material, as a result of which they form a metallic unit with the associated conductor structures on the side facing away from the contacting unit 16. This creates a line structure with more or less the same layer thickness.
  • Extramotoun- conditions and associated conductors then form a metallic unit.
  • FIG. 7 shows a further exemplary embodiment of a contacting unit 16 according to the invention. This is now flat. It has a multiplicity of pins 36 which are arranged spaced apart from one another and can be countersunk in the base plate 34. The pins 36 can be moved from the base plate 34 into an end position by means of control mechanisms (not shown in FIG. 7), in which a substrate is galvanized can.
  • the base plate 34 consists of two layers 38, 40, the first layer 38 being connected as the anode and the second layer 40 as the cathode.
  • the first and second layers 38, 40 are of course electrically separated from one another. The position of a pin 36 alone determines whether it is connected cathodically or anodically.
  • FIGS. 9 and 10 This can be seen better from FIGS. 9 and 10, in which a pin 36 is shown once in its end position outside the base plate 34 (FIG. 9) and once in its end position inside the base plate 34 (FIG. 10).
  • the pin 36 has a length, which is greater than the thickness of the second layer 40, via an insulation 82.
  • a conductive region 80 which corresponds to the diameter of the pin 36, is in contact with the walls of the recess in which he is moved. If the pin 36 is in its end position according to FIG. 9, it is connected cathodically. However, if the pin 36 is completely sunk into the base plate 34, it is connected anodically.
  • the contacting unit 16 shown in FIGS. 7 to 10 is particularly suitable for the galvanic amplification of a PCB with any conductor structure. Since the pins 36 are arranged at regular intervals from one another, in principle any conductor structure can be simulated by moving the steps 36 into their end position according to FIG. 9. Regular movement into its end position according to FIG. 10 ensures that the electrically conductive region 80 connected to the substrate to be electroplated is regularly anodically cleaned.
  • FIG. 11 shows a further exemplary embodiment of a contacting unit 16.
  • the contacting unit 16 is constructed in the form of a conveyor belt, along which a plurality of lamellae 90 are arranged.
  • the slats 90 are connected to the conveyor belt via a joint 96.
  • the slats only have an electrically conductive region 94 in their end facing away from the joint 96. Otherwise, they have insulation 92.
  • the electrically conductive areas 94 are alternately connected cathodically or anodically by setting the conveyor belt in rotation.
  • the fins 90 are in contact with the substrate 12 to be electroplated, they are connected cathodically, which is to be indicated by the designation K.
  • the contacting unit can in particular be adapted to the shape of the substrate to be galvanized, so that galvanizing of undercut areas is also possible.
  • the electroplating device described can also be operated in the known pulse method.
  • the device can be used with all known, customary electrolytes.
  • the electroplating device according to the invention is extremely cost-effective Manufacturing enables the highest possible, constant quality and with high throughput speeds.
  • One advantage is that only that which is required to produce the desired conductor structure has to be galvanized.
  • Another advantage lies in the simple manufacture and maintenance of the electroplating device described, since all the control-relevant devices can be arranged outside the electrolyte bath.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

La présente invention concerne un dispositif de galvanisation (10) conçu pour réaliser un dépôt galvanoplastique d'une couche électro-conductrice sur un substrat (12). Ce dispositif comprend un bain électrolytique (14) dans lequel se trouvent un dispositif d'anode (30) et au moins une unité de mise en contact (16). Chaque unité de mise en contact (16) présente une pluralité de zones électro-conductrices (20) dont au moins une est connectée à la cathode ou à l'anode.
PCT/DE2002/003916 2001-10-25 2002-10-16 Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices WO2003038158A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/916,308 US20050061661A1 (en) 2001-10-25 2004-08-11 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10153056.0 2001-10-25
DE10153056 2001-10-25
DE10234705.0 2002-07-30
DE10234705A DE10234705B4 (de) 2001-10-25 2002-07-30 Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen

Related Child Applications (1)

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US10/916,308 Continuation US20050061661A1 (en) 2001-10-25 2004-08-11 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive

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WO2003038158A2 true WO2003038158A2 (fr) 2003-05-08
WO2003038158A3 WO2003038158A3 (fr) 2004-09-16

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* Cited by examiner, † Cited by third party
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DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
WO2004101865A2 (fr) * 2003-05-15 2004-11-25 Gebr. Schmid Gmbh & Co. Dispositif pour traiter des objets, en particulier pour realiser un depot electrolytique sur des cartes de circuits imprimes
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
WO2005123990A1 (fr) * 2004-06-17 2005-12-29 Atotech Deutschland Gmbh Dispositif et procede de traitement electrolytique de pieces a travailler plates
DE102008004592A1 (de) 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes
US8253035B2 (en) 2005-03-15 2012-08-28 Fujifilm Corporation Plating processing method, light transmitting conductive film and electromagnetic wave shielding film
CN112663119A (zh) * 2020-12-04 2021-04-16 重庆金美新材料科技有限公司 一种防止导电辊镀铜的装置及方法

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CN101426962A (zh) * 2006-04-18 2009-05-06 巴斯夫欧洲公司 电解涂覆的装置和方法
RU2420616C2 (ru) * 2006-04-18 2011-06-10 Басф Се Устройство и способ для гальванического покрытия
ATE446393T1 (de) * 2006-06-08 2009-11-15 Bct Coating Technologies Ag Vorrichtung zur galvanischen abscheidung von oberflächen und galvanisierungssystem
US8815073B2 (en) * 2007-03-28 2014-08-26 Toray Industries, Inc. Web pressure welding method, pressure welding device, power supply method, power supply device, continuous electrolytic plating apparatus and method for manufacturing web with plated coating film
US9725817B2 (en) * 2011-12-30 2017-08-08 Ashworth Bros., Inc. System and method for electropolishing or electroplating conveyor belts
CN114207190A (zh) * 2019-08-05 2022-03-18 Sms集团有限公司 用于借助于脉冲技术电解涂覆导电的带材和/或织物的方法和设备
CN114790565A (zh) * 2022-05-26 2022-07-26 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
DE3325316A1 (de) * 1983-07-13 1985-01-31 Maschinenfabrik Kaspar Walter GmbH & Co KG, 8000 München Verfahren und vorrichtung zum metallbeschichten, insbesondere zum verkupfern von zylindrischen koerpern
EP0677599A1 (fr) * 1994-04-15 1995-10-18 Gebr. Schmid GmbH & Co. Dispositif de traitement d'articles en particulier de revêtement par électrodéposition de plaques de circuits
WO2001061079A1 (fr) * 2000-02-18 2001-08-23 Enthone Inc. Procede de plaquage electrolytique d'une piece enduite d'un polymere electro-conducteur

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5135636A (en) * 1990-10-12 1992-08-04 Microelectronics And Computer Technology Corporation Electroplating method
DE4229403C2 (de) * 1992-09-03 1995-04-13 Hoellmueller Maschbau H Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
US6471848B1 (en) * 1998-02-17 2002-10-29 Canon Kabushiki Kaisha Electrodeposition method of forming an oxide film
US6294060B1 (en) * 1999-10-21 2001-09-25 Ati Properties, Inc. Conveyorized electroplating device
DE10013339C1 (de) * 2000-03-17 2001-06-13 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Regulieren der Konzentration von Metallionen in einer Elektrolytflüssigkeit sowie Anwendung des Verfahrens und Verwendung der Vorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909387A (en) * 1971-04-01 1975-09-30 Sigmund Bereday Apparatus for producing polymer-coated aluminum products
DE3325316A1 (de) * 1983-07-13 1985-01-31 Maschinenfabrik Kaspar Walter GmbH & Co KG, 8000 München Verfahren und vorrichtung zum metallbeschichten, insbesondere zum verkupfern von zylindrischen koerpern
EP0677599A1 (fr) * 1994-04-15 1995-10-18 Gebr. Schmid GmbH & Co. Dispositif de traitement d'articles en particulier de revêtement par électrodéposition de plaques de circuits
WO2001061079A1 (fr) * 2000-02-18 2001-08-23 Enthone Inc. Procede de plaquage electrolytique d'une piece enduite d'un polymere electro-conducteur

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004101865A2 (fr) * 2003-05-15 2004-11-25 Gebr. Schmid Gmbh & Co. Dispositif pour traiter des objets, en particulier pour realiser un depot electrolytique sur des cartes de circuits imprimes
WO2004101865A3 (fr) * 2003-05-15 2005-02-10 Schmid Gmbh & Co Geb Dispositif pour traiter des objets, en particulier pour realiser un depot electrolytique sur des cartes de circuits imprimes
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
US7501048B2 (en) 2004-02-09 2009-03-10 Meco Equipment Engineers B.V. Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
WO2005076680A2 (fr) * 2004-02-09 2005-08-18 Meco Equipment Engineers B.V. Procede et dispositif pour augmenter electrolytiquement l'epaisseur d'un motif electroconducteur sur un substrat dielectrique, et substrat dielectrique
EP1562412A3 (fr) * 2004-02-09 2005-11-30 Besi Plating B.V. Méthode et dispositif pour augmenter électrolytiquement l'épaisseur d'une modèle conductrice sur un substrat diélectrique
WO2005076680A3 (fr) * 2004-02-09 2006-01-05 Besi Plating B V Procede et dispositif pour augmenter electrolytiquement l'epaisseur d'un motif electroconducteur sur un substrat dielectrique, et substrat dielectrique
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
WO2005123990A1 (fr) * 2004-06-17 2005-12-29 Atotech Deutschland Gmbh Dispositif et procede de traitement electrolytique de pieces a travailler plates
US8253035B2 (en) 2005-03-15 2012-08-28 Fujifilm Corporation Plating processing method, light transmitting conductive film and electromagnetic wave shielding film
TWI386522B (zh) * 2005-03-15 2013-02-21 Fujifilm Corp 連續電解鍍敷方法及導電性膜的製造方法
DE102008004592A1 (de) 2008-01-16 2009-07-23 Danziger, Manfred, Dr. Bandgalvanikanlage zur elektrochemischen Verstärkung einer elektrisch leitfähigen äußeren Schicht eines Bandes
WO2009089820A2 (fr) * 2008-01-16 2009-07-23 Manfred Danziger Installation de galvanisation de bande pour le renforcement électrochimique d'une couche extérieure électroconductrice d'une bande
WO2009089820A3 (fr) * 2008-01-16 2009-10-15 Manfred Danziger Installation de galvanisation de bande pour le renforcement électrochimique d'une couche extérieure électroconductrice d'une bande
CN112663119A (zh) * 2020-12-04 2021-04-16 重庆金美新材料科技有限公司 一种防止导电辊镀铜的装置及方法
CN112663119B (zh) * 2020-12-04 2022-05-31 重庆金美新材料科技有限公司 一种防止导电辊镀铜的装置及方法

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