EP2010700B1 - Procédé et dispositif de revêtement galvanique - Google Patents

Procédé et dispositif de revêtement galvanique Download PDF

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Publication number
EP2010700B1
EP2010700B1 EP07727869A EP07727869A EP2010700B1 EP 2010700 B1 EP2010700 B1 EP 2010700B1 EP 07727869 A EP07727869 A EP 07727869A EP 07727869 A EP07727869 A EP 07727869A EP 2010700 B1 EP2010700 B1 EP 2010700B1
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EP
European Patent Office
Prior art keywords
substrate
disks
electrically conductive
shaft
shafts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP07727869A
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German (de)
English (en)
Other versions
EP2010700A2 (fr
Inventor
Rene Lochtman
Jürgen Kaczun
Norbert Schneider
Jürgen PFISTER
Gert Pohl
Norbert Wagner
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BASF SE
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BASF SE
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Publication of EP2010700A2 publication Critical patent/EP2010700A2/fr
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls

Definitions

  • the invention relates to a device for electroplating at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a non-conductive substrate, which comprises at least one bath, an anode and a cathode, wherein the bath contains an electrolyte solution containing at least one metal salt, are deposited from the metal ions on electrically conductive surfaces of the substrate to form a metal layer.
  • the invention further relates to a process for the galvanic coating of at least one substrate, which is carried out in a device designed according to the invention.
  • Galvanic coating methods are used, for example, to coat electrically conductive substrates or structured or full-area electrically conductive surfaces on non-conductive substrates. With these methods, it is possible, for example, to produce conductor tracks on printed circuit boards, RFID antennas, flat cables, thin metal foils, conductor tracks on solar cells, and to galvanically coat other products, such as two- or three-dimensional objects, for example plastic molded parts.
  • an apparatus and a method for the electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of strip-shaped material to be treated are known.
  • the material to be treated is conveyed continuously on a transport path and in a transport direction, wherein the material to be treated is contacted with a contact electrode arranged outside of an electrolysis region, whereby the electrically conductive structures are subjected to negative voltage.
  • metal ions are deposited on the electrically conductive structures from the treatment liquid to form a metal layer.
  • An electroplating apparatus in which the contacting unit is arranged in the electrolyte bath is, for example, in DE-A 102 34 705 disclosed.
  • the electroplating device described here is suitable for coating already conductive structures which are arranged on a band-shaped carrier.
  • the contacting takes place via rollers which are in contact with the conductive structures. Since the rollers are in the electrolyte bath, metal also separates out from the electrolyte bath.
  • the rollers are made up of individual segments which are switched cathodically, as long as they are in contact with the structures to be coated and are switched anodically, if there is no contact of roller and electrically conductive structure.
  • the object of the invention is to provide a device which ensures a sufficiently long contact time even for short structures, so that even short structures are provided with a sufficiently thick and homogeneous metal layer. Furthermore, the device should require less space.
  • a device for electroplating at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a non-conductive substrate which comprises at least one bath, an anode and a cathode, wherein the bath is an electrolyte solution containing at least one metal salt contains, are deposited from the metal ions on electrically conductive surfaces of the substrate to form a metal layer, while the cathode is brought into contact with the surface to be coated of the substrate and the substrate is conveyed through the bath.
  • the cathode comprises at least two disks rotatably mounted on a respective shaft, wherein the disks mesh with one another.
  • the device according to the invention with intermeshing disks as a cathode, that even substrates with short electrically conductive structures, especially in the transport direction of the substrate, with a sufficient thick and homogeneous coating can be provided.
  • This is made possible by the fact that a smaller distance of the contact points of the discs with the electrically conductive structures can be realized by the intermeshing discs than is the case with successively arranged rollers.
  • the disks are designed in a cross-section matched to the respective substrate.
  • the disks preferably have a circular cross section.
  • the waves can have any cross section.
  • the waves are cylindrical.
  • the distance between two disks on a shaft corresponds at least to the width of a disk. This makes it possible that in the distance between two discs on a shaft, a disc can engage another shaft.
  • At least four shafts with disks can be arranged in pairs one behind the other.
  • the arrangement is preferably such that the second pair of shafts arranged offset relative to the first pair of shafts contacts the electrically conductive structure in the region on which the metal was deposited during the contacting with the first pair of shafts.
  • preferably more than two pairs of waves are connected in series.
  • the Einrithmmabshadow can be varied as desired. It is also possible to vary the distances of the individual pairs of waves as desired.
  • the number of juxtaposed slices on the at least one shaft is dependent on the width of the substrate. The wider the substrate to be coated, the more discs must be placed side by side. It is important to ensure that between the discs each have a free gap in which the metal can be deposited on the electrically conductive substrate or the structured or full-surface electrically conductive surface of the substrate and can comb a disk of the underlying wave.
  • the size of the disks used as the cathode depends on the size of the structures to be electroplated. So for example Structures whose length, viewed in the transport direction, is greater than or equal to the distance with which successive discs touch the substrate, coated sufficiently, when their width and position on the substrate is such that it also touches the offset successive roles becomes.
  • To coat the smallest possible electrically conductive structures therefore narrow discs are used with a small diameter.
  • An advantage of narrow disks with small distances from one another is that the contact probability of the smallest structures is thereby greater than with a smaller number of wide disks. Since the contact surface of the disc by covering the structures directly under the disc inhibits the deposition, it is advantageous to minimize this coverage effect through narrow slices.
  • the electrolyte purging of the surface to be coated is more uniform by a multiplicity of smaller surface accesses than with vain surface accesses such as are present with a small number of wide disks.
  • the lowest possible disk width and the smallest possible diameter with which the disks can be manufactured depend, on the one hand, on the manufacturing methods available and, on the other hand, on the fact that the disk is mechanically stable during operation, i. that the disc does not buckle or bend during operation.
  • the distance between two intermeshing discs depends on whether the discs have the same or different polarity. For example, with the same polarity, it is possible for the intermeshing disks to touch each other, while at different polarities a distance must be provided between the disks in order to avoid a short circuit. Furthermore, sufficient flushing of the interspaces between the panes and the space delimited by the surface of the substrate to be coated with the electrolyte solution must also be ensured.
  • the discs are powered by the shaft.
  • a voltage source for example, to connect the shaft outside the bath to a voltage source.
  • This connection is generally made via a slip ring.
  • any other connection is possible with which a voltage transfer from a stationary voltage source is transmitted to a rotating element.
  • the contact disks on their outer circumference with power.
  • sliding contacts such as brushes, may be in contact with the contact disks on the side facing away from the substrate.
  • the shafts and the disks are at least partially made of an electrically conductive material.
  • the shafts and the disks are at least partially made of an electrically conductive material.
  • the discs are made of an electrically conductive material only at their outer periphery, then it is necessary to provide an electrical conductor which connects the shaft to the outer periphery of the disc.
  • an electrical conductor can be accommodated inside the pane.
  • the power supply can also be realized via a fastening means, for example a screw, with which the disc is mounted on the shaft.
  • openings are formed in the disks in a preferred embodiment.
  • the electrolyte solution can be transported to the substrate.
  • the mixing of the electrolyte solution is improved over a closed-disk embodiment.
  • the perforated disks can deliver faster electrolyte solution to the substrate than would be possible if the electrolyte solution could only flow through the gaps between the individual disks.
  • discs in which a ring with spokes is mounted on the shaft.
  • the ring In order to enable a galvanic coating, it is necessary that the ring is made on its outer circumference of an electrically conductive material. In a preferred embodiment, the entire ring is made of an electrically conductive material.
  • the spokes with which the ring is fastened to the shaft can be made, for example, of an electrically conductive material or of an electrically insulating material. If the spokes are made of an electrically conductive material, it is preferred that the voltage supply of the ring via the shaft and the spokes takes place.
  • spokes are made of an electrically insulating material
  • a spoke which is electrically conductive so that the voltage from the shaft can be transmitted to the ring.
  • spokes made of an electrically insulating material to connect the ring via a current conductor, for example a cable to the current-carrying shaft.
  • the voltage apply directly to the ring surface.
  • the ring surface is contacted, for example, with a sliding contact, such as a brush.
  • the disks are in each case connected cathodically. Due to the cathodic circuit of the discs also separates on this metal. Therefore, it is necessary to remove the disks to remove the deposited metal, i. for demetallizing, to switch anodically. This can be done, for example, in production stoppages. In order to be able to carry out a demetallization during operation, in a preferred embodiment the disks can be lifted by the substrate and lowered onto the latter.
  • the slices lowered onto the substrate may be switched cathodically while the slices lifted from the substrate are anodically connected. Due to the cathodically connected disks, which are lowered onto the substrate, the electrically conductive structures on the substrate are cathodically contacted and thus coated. At the same time, the anodic circuit of the disks, which do not touch the substrate, removes the metal previously deposited thereon.
  • the discs distributed over the circumference individual, electrically isolated from each other sections.
  • the sections which are electrically insulated from one another are preferably switchable both cathodically and anodically. This makes it possible that a portion which is in contact with the substrate, is switched cathodically and as soon as it is no longer in contact with the substrate, is connected anodically. As a result, deposited metal is removed during the cathodic circuit on the portion during the anodic circuit.
  • the voltage supply of the individual segments generally takes place via the shaft.
  • the material from which the electrically conductive parts of the disks are made is preferably an electrically conductive material which does not change into the electrolyte solution during operation of the device.
  • Suitable materials include metals, graphite, conductive polymers such as polythiophene or metal / plastic composites.
  • Preferred materials are stainless steel and / or titanium.
  • the discs do not dissolve when they are switched anodic to remove the metal deposited on it again, the usual for insoluble anodes and the skilled person known material is used for the discs and the waves.
  • a suitable material is, for example, titanium coated with a conductive mixture of metal oxides.
  • the device for electroplating further comprises a device with which the substrate can be rotated.
  • a device with which the substrate can be rotated By rotating electrically conductive structures, which are initially seen in the transport direction of the substrate, wide and short, aligned so that they are narrow and long after turning - seen in the transport direction. By turning different coating times are compensated, which result from the fact that a coating of the electrically conductive structure already takes place with the first contact with the cathodically connected disc.
  • the substrate either passes through the device a second time or a second corresponding device.
  • the angle through which the substrate is rotated is preferably in the range of 10 ° to 170 °, more preferably in the range of 50 ° to 140 °, in particular in the range of 80 ° to 100 °, and most preferably the angle is the substrate is rotated, substantially 90 °.
  • 90 ° means that the angle through which the substrate is rotated does not deviate more than 5 ° from 90 °.
  • the device for rotating the substrate can be arranged inside or outside the bath. In order to further coat the same side of the substrate in order, for example, to achieve a greater layer thickness of the metal layer, the axis of rotation is oriented perpendicular to the surface to be coated.
  • the rotation axis is arranged so that after rotation, the substrate is positioned so that the surface to be coated next faces the cathode.
  • the layer thickness of the metal layer deposited on the electrically conductive structure by the method according to the invention depends on the contact time, which results from the passage speed of the substrate through the device and the number of waves positioned one behind the other with intermeshing disks arranged thereon, and the current intensity with which the device is operated.
  • a higher contact time can be achieved, for example, by connecting several devices according to the invention in series in at least one bath.
  • a plurality of devices according to the invention are connected in series in each case in individual baths. This makes it possible to hold in each bath a different electrolyte solution to sequentially deposit different metals on the electrically conductive structures. This is advantageous, for example, in decorative applications or in the production of gold contacts.
  • the respective layer thicknesses are adjustable by the choice of the flow rate and the number of devices with the same electrolyte solution.
  • two shafts each with the discs mounted thereon are arranged so that the substrate to be coated can be passed between them.
  • two shafts are then provided with disks received thereon and intermeshing both on the upper side and on the lower side of the substrate.
  • the structure is then such that the plane in which the substrate is guided, as a mirror plane serves.
  • films are to be coated whose length exceeds the length of the bath - so-called endless films, which are initially unwound from a roll, passed through the device for electroplating and then wound up again - this can, for example, also zig-zag or in shape a meander to several inventive devices for electroplating, which can then be arranged, for example, one above the other or next to each other, are passed through the bath.
  • the coating takes place in that the metal layers deposited on the upper side and on the lower side grow together in the hole.
  • a conductive hole wall is at least partially provided, which is coated by the inventive method.
  • the entire wall of the hole can be coated. If not the entire hole wall is electrically conductive, the coating of the entire hole wall is carried out here by growing together of the metal layers.
  • the substrate can either rest on the intermeshing disks, the underside of the substrate being coated or guided along the underside of the disks, coating the top of the substrate.
  • the discs can simultaneously serve to transport the substrate.
  • a sufficient contact of the intermeshing discs with the substrate is achieved by the fact that the substrate is preferably pressed with a pressing device to the intermeshing discs.
  • pressing device are, for example, pressure rollers or belts, which are guided around waves and pressed against the substrate.
  • a transport device with which the substrate is brought into contact with the discs.
  • a transport device is, for example, a belt or rollers on which the substrate runs.
  • the substrate can then either be pressed by means of the device for galvanic coating with a predetermined contact force against the transport device or by means of the transport device against the device for galvanic coating.
  • the intermeshing disks connected to the cathode that contact the substrate can be used simultaneously to transport the substrate through the bath.
  • the drive is preferably outside the bath.
  • the shafts and the disks mounted thereon can be rotated by the substrate, so that the peripheral speed of the disks corresponds to the speed with which the substrate is transported.
  • all shafts are driven by a common drive unit.
  • the drive unit is preferably an electric motor.
  • the shafts are preferably connected to the drive unit via a chain or belt transmission. But it is also possible to provide the shafts with gears that mesh and over which the waves are driven. In addition to the possibilities described here, any further, known to those skilled, suitable drive for driving the waves can be used.
  • anodes can be used on the one hand at different polarity of waves, slices or electrically isolated sections of the slices, the anodic waves, slices or electrically insulated sections of the discs, on the other hand, it is also possible to provide additional anodes in the bathroom. If only cathodically connected shafts and disks are provided, it is necessary to additionally arrange anodes in the bath.
  • the anodes are preferably arranged as close as possible to the structure to be coated.
  • the anodes can each be arranged in front of the first and behind the last of the shafts with intermeshing disks.
  • Suitable material for the anodes is on the one hand any material known to those skilled in the art for insoluble anodes. Preference is given here, for example, stainless steel, graphite, platinum, titanium or metal / plastic composites. On the other hand, soluble anodes can also be provided. These then preferably contain the metal, which is deposited galvanically on the electrically conductive structures.
  • the anodes can take any known form to those skilled in the art. For example, flat rods can be used as anodes during operation of the device have a minimum distance to the substrate surface. It is also possible to use flat sheets or elastic wires, such as spiral wires, as anodes.
  • a flexible circuit substrate which is preferably in the form of a tape
  • this is unwound from a roll lying in front of the bath and wound after passing through the bath on a new roll.
  • all electrically conductive surfaces can be coated, regardless of whether electrically insulated structures insulated from one another are to be coated on a nonconductive substrate or a full surface area.
  • the device is used for coating electrically conductive structures on a non-electrically conductive support, for example reinforced or unreinforced polymers, as they are commonly used for printed circuit boards, ceramic materials, glass, silicon, textiles, etc.
  • the thus produced, electroplated electrically conductive structures are, for example, conductor tracks.
  • the electrically conductive structures to be coated can be printed on the printed circuit board, for example, from an electrically conductive material.
  • the electrically conductive structure preferably contains either particles of any geometry made of an electrically conductive material in a suitable matrix or consists essentially of the electrically conductive material.
  • Suitable electrically conductive materials are, for example, carbon or graphite, metals, preferably aluminum, iron, gold, copper, nickel, silver and / or alloys or metal mixtures containing at least one of these metals, electrically conductive metal complexes, conductive organic compounds or conductive polymers.
  • a pretreatment is first required to make the structures electrically conductive.
  • This may be, for example, a chemical or a mechanical pretreatment such as a suitable cleaning.
  • a suitable cleaning for example, the oxide layer of metals which disturbs the electroplating is removed beforehand.
  • the electrically conductive structures to be coated can also be applied to the printed circuit boards by any other methods known to those skilled in the art.
  • Such printed circuit boards are for example installed in products such as computers, telephones, televisions, automotive electrical components, keyboards, radios, video, CD, CD-ROM and DVD players, game consoles, measuring and control devices, sensors, electrical kitchen appliances, electric toys, etc ,
  • electrically conductive structures can be coated on flexible circuit carriers.
  • flexible circuit carriers are, for example, polymer films, such as polyimide films, PET films or polyolefin films, on which electrically conductive structures are printed.
  • the device according to the invention and the method according to the invention are suitable for the production of RFID antennas, transponder antennas or other antenna forms, chip card modules, flat cables, seat heaters, foil conductors, printed conductors in solar cells or in LCD or plasma picture screens or for the production of electroplated products in any desired form , such as thin metal foils, one- or two-sided metal-clad polymer carrier with a defined layer thickness, 3D-molded interconnect devices or even for the production of decorative or functional surfaces on products that are used, for example, to shield electromagnetic radiation, for heat conduction or as packaging , Furthermore, the production of contact points or contact pads or wiring on an integrated electronic component is possible.
  • the substrate After leaving the device for galvanic coating, the substrate can be further processed according to all steps known to the person skilled in the art. For example, existing electrolyte residues can be removed from the substrate by rinsing and / or the substrate can be dried.
  • the device according to the invention for the galvanic coating of electrically conductive substrates or of electrically conductive structures on electrically non-conductive substrates can be equipped as required with any additional device known to the person skilled in the art.
  • ancillary devices include, for example, pumps, filters, chemical feeders, roll-up and roll-down devices, etc.
  • the device according to the invention can, for example, also in the Werner Jillek, Gustl Keller, Manual of Printed Circuit Board Technology, Eugen G. Leuze Verlag, 2003, Volume 4, pages 192, 260, 349, 351, 352, 359 operated pulse methods are operated.
  • the galvanic coating device can be used for any conventional metal coating.
  • the composition of the electrolyte solution used for the coating depends on which metal the electrically conductive structures are to be coated on the substrate.
  • Usual metals deposited by electroplating on electrically conductive surfaces are, for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium.
  • Suitable electrolyte solutions which can be used for the electroplating of electrically conductive structures are known to the person skilled in the art, for example Werner Jillek, Gustl Keller, Manual of Printed Circuit Board Technology, Eugen G. Leuze Verlag, 2003, Volume 4, pages 332-352 known.
  • the advantage of the device according to the invention and of the method according to the invention is that the intermeshing disks provide a larger contact surface and thus a longer contact time per unit area than is the case with rollers known from the prior art. As a result, shorter distances can be realized with more metal structure and more homogeneous layer thicknesses. In addition, the plants can be built shorter, enabling higher throughput and lower operating costs. Another significant advantage is that now even very short structures, as they are desired for example in the production of printed circuit boards, faster, more targeted and above all reproducible and can be realized with homogeneous layer thicknesses than with the roll systems known from the prior art is possible.
  • FIG. 1 is a plan view of an inventively designed device shown.
  • a number of first discs 2 is arranged on a first shaft 1.
  • the discs 2 are each mounted with a distance 3 on the shaft 1.
  • the distance 3 is chosen so that can engage in these second discs 4, which are mounted on a second shaft 5.
  • the distance 6 of the second disks 4 is chosen so that in each case between two second disks 4, a first disk 2 can engage.
  • the first discs 2 mounted on the first shaft 1 and the second discs 4 mounted on the second shaft 5 are each the same width.
  • disks with different widths disks of the same width can each be provided on a shaft, while disks with a width which deviates from the width of the disks on the first shaft are provided on the second shaft, or disks of different width are mounted on a shaft. If disks of different widths are mounted on a shaft, it is necessary that the distances between two disks on the second shaft, which engage between two disks on the first shaft, be selected accordingly, that the discs of different widths can intervene in the distances.
  • At least two pairs of shafts with intermeshing discs can be connected in series.
  • the wave pairs can then be offset from each other. It is also possible that the disks of the front shaft of the rear pair meshes with the spaces between the disks of the rear shaft of the front pair.
  • the distance 3 between two first disks 2 is at least as great as the width of a second disk 4.
  • the distance 6 of the second disks 4 is at least as great as the width of a first disk 2.
  • the distance 3, 6 between two disks 2, 4 larger than the width of each engaging in this distance discs 2, 4, so that electrolyte solution can flow through this distance in the direction of the substrate to be coated.
  • the engagement depth 7, with which the second disks 4 engage in the first disks 2 is dependent on the distance at which the first disks 2 and the second disks 4 are to contact the substrate. It is thus possible for the disks 2, 4 to engage with one another in the edge region or for the first disks 2 to engage between the second disks 4 so far that the first disks 2 just touch the second shaft 5.
  • the second disks 4 also touch the first shaft 1.
  • the first disks 2 and the second disks 4 it is not necessary for the first disks 2 and the second disks 4 to be in the same Diameter are executed. Just as well, it is also possible that the diameters of the first disks 2 and the second disks 4 are different.
  • FIG. 2 shows a side view of an inventive device.
  • FIG. 2 it can be seen how the first disks 2 engage in the second disks 4.
  • the contact of the disks 2, 4 to be coated with electrically conductive structures 30 on a substrate 31 is carried out with the distance of the axial centers of the first shaft 1 and the second shaft 5.
  • the denser the axis centers of the first shaft 1 and the second shaft 5 are together
  • the contact points of the first disks 2 and the second disks 4 are also closer to the substrate.
  • the distance at which the first disks 2 and the second disks 4 touch the substrate is designated by reference numeral 8.
  • the transport of the substrate 31 through the bath with the electrolyte solution takes place in the embodiment shown here by means of a transport device 32.
  • the transport device 32 comprises an endless belt 33, which rotates two shafts 34, 35.
  • the distance between the band 33 and the discs 2, 4 is selected so that the substrate 31 is pressed with the electrically conductive structures 30 with a defined contact force against the discs 2, 4.
  • the pressing of the electrically conductive structures 30 to the discs 2, 4 can either be done by the transport device 32 is fixedly mounted and, for example, the discs 2, 4 is pressed with a predetermined contact force on the substrate 31 with the electrically conductive structures 30, Why the waves 1, 5 of the discs 2, 4 may be resiliently mounted.
  • the axes 1, 5 of the discs 2, 4 may be fixedly mounted and predetermined contact pressure is exerted by the transport device 32 to the substrate 31.
  • the shafts 34, 35 of the transport device 32 are resiliently mounted.
  • a transport device 32 as in FIG. 2 is shown, a plurality of juxtaposed individual waves can be used as a transport device. It is also possible, instead of the transport device 32, to provide a second device according to the invention which comprises at least two axles with intermeshing disks arranged thereon.
  • both the axes 1, 5 with to drive the discs arranged thereon 2, 4 and the shafts 34, 35.
  • the drive of the shafts 1, 5 and 34, 35 is preferably arranged outside the bath.
  • each shaft 1, 5, 34, 35 can be driven individually, the shafts 1 and 5 are preferred from a first drive and the shafts 34 and 35 driven by a second drive or all shafts 1, 5, 34, 35 are driven by a common drive.
  • the individual shafts 1, 5 and / or 34, 35 are then connected to each other, for example via gears or chain or belt transmission.
  • anodes 36 are provided in the bath.
  • the anodes 36 may be in the form of flat bars, as shown here.
  • the anodes 36 are arranged in the vicinity of the electrically conductive structure 30 to be coated. In this case, care must be taken that the anodes 36 do not touch the electrically conductive structure 30, since otherwise the metal already deposited thereon would be removed again.
  • the anodes 36 may also be designed as flat sheets or as elastic wires, for example spiral wires.
  • any further, known in the art form of anodes can be used.
  • the anodes can be both insoluble and soluble.
  • insoluble anodes 36 The material for insoluble anodes 36 is known to those skilled in the art.
  • the metal is preferably used, which is deposited on the electrically conductive structures 30.
  • FIG. 3 shows a device designed according to the invention in a further embodiment.
  • FIG. 3 it is with the in FIG. 3 As shown, it is possible to simultaneously coat electrically conductive structures 30 on the upper side and on the underside of the substrate 31. It is also possible to galvanically coat holes 37 in the substrate and thus to obtain an electrically conductive connection of the electrically conductive structure 30 on the upper side and the electrically conductive structure 30 on the underside of the substrate 31.
  • a device comprising at least two shafts 1, 5 with intermeshing discs 2, 4 arranged thereon on the upper side of the substrate 31 and a device having at least two shafts 1, 5 with intermeshing discs 2, 4 arranged thereon Bottom of the substrate 31 is arranged. The substrate is passed between the devices.
  • the transport of the substrate is preferably carried out by the discs 2, 4, which contact the electrically conductive structures 30.
  • the discs 2, 4 which contact the electrically conductive structures 30.
  • FIG. 4 shows a shaft formed according to the invention with a disc mounted thereon.
  • a slice of 10, as in FIG. 4 shown, comprises individual sections 11.
  • the sections 11 are each electrically insulated from each other by an insulation 12. This makes it possible, for example, to switch adjacent sections 11 different.
  • a portion 11 may be cathodically connected while the adjacent portion 11 is anodically connected.
  • the advantage of this embodiment is that metal which deposits on a portion 11 while it is cathodically connected is removed again from this portion 11 while it is connected anodically. This removal of the deposited on the individual sections 11 metal is possible during operation of the coating device.
  • a continuous Power supply 13 is provided, with which each adjacent sections 11 of the adjacent discs 10 are contacted.
  • a power supply 13 is for example an insulated cable, which is attached to the outer circumference of the roller.
  • the insulated cable can also run in the interior of the shaft 14.
  • the shaft 14 is formed as a hollow shaft.
  • power can also be supplied directly via the shaft.
  • the power supply can then take place in each case via the individual electrically conductive sections of the shaft 14.
  • the sections 11 of the disc 10 are each connected to an electrically conductive portion of the shaft 14.
  • the individual sections 11 of the disc 10 are connected to the power supply 13 with cable connections 15, for example.
  • the cable connection 15 can - as in FIG. 4
  • FIG. 5 shows a side view of a disc according to FIG. 4 .
  • 11 recesses 16 may be formed in the segments. In this case, the electrolyte solution can flow through the recesses 16.
  • the recesses 16 may each be formed only in individual segments 11 of the disc 10 or in all segments 11 of the disc 10. Furthermore, it is also possible, instead of the recesses 16 in the disc 10 to make the disc 10 in the form of a wheel, in which an electrically conductive ring with individual spokes is mounted on the shaft 14. In order to enable a galvanic coating of a substrate, it is necessary that the disc 10 is electrically conductive on its outer periphery.
  • the disk 10 with an annular contacting area 18 which is provided on the outer circumference of the disk 10.
  • annular contacting region 18 for example, the known in the art, currently used for insoluble anodes conventional material is. These are, for example, titanium coated with a conductive mixture of metal oxides.
  • the individual segments 11 can be made of an electrically insulating material in the region between the annular contacting region 18 and the shaft 14. In this case, it is only necessary to provide either through the electrically conductive material or on the surface of the individual segments, a conductor through which the voltage from the power supply 13, which in the embodiment shown here as a cable 17, on the outer circumference Resting wave, is executed, lead to the annular contact area 18. If only the annular contacting region 18 is made electrically conductive, it is sufficient to alternately enable anodic and cathodic switching, if in each case between individual segments 19 of the annular contacting region 18, the insulation 12 is provided. Already hereby, the segments 19 of the annular contacting region 18 are sufficiently electrically insulated from one another in order to avoid a short circuit between an anodically connected segment 19 and a cathodically connected segment 19.
  • FIG. 6 shows an embodiment for a power supply of an inventively designed device.
  • the power supply to a shaft 14 with disks 10 arranged thereon can be effected, for example, via a further disk 20 arranged outside the bath with the electrolyte solution.
  • the further disc 20 is constructed, for example, like a disc 10, with which the substrate to be coated is contacted.
  • the further disk 20 also comprises an annular contacting region 18, which is divided into individual segments 19. Instead of an annular contacting region 18, it is also possible in each case to manufacture the individual segments 11 of the further disk 20 completely from an electrically conductive material. For mass reduction, it is also possible in the other disc 20 to provide 11 recesses 16 in the individual segments.
  • the recesses 16 may be formed in each segment 11 or only in individual segments 11.
  • the individual segments 19 of the annular contacting region 18 are electrically connected to the power supply 13, which in the in FIG. 6 embodiment shown also in the form of cables 17 is formed, which are arranged on the outer circumference of the shaft 14 connected.
  • the further pane 20 is provided with electrical insulation at its end faces, so that only an electrically conductive surface is present on the outer circumference. In this way it can be avoided that injuries occur by accidental contact with the disk 20.
  • a cathodic sliding contact 21 connected to a cathodic power supply 22 and an anodic sliding contact 23 connected to an anodic power supply 24 are provided.
  • cathodic sliding contact 21 and as anodic sliding contact 23 any sliding contact known to the person skilled in the art can be used.
  • the shaft is made up of individual electrically conductive segments, which are separated by insulation, the power supply can also over Sliding contacts are made directly on the shaft. In this case, another disc 20 is not required.
  • the anodic contact area is preferably larger than the cathodic contact area. This means that preferably more segments are connected anodically than are connected cathodically.
  • the maximum number of cathodically connected segments 19 corresponds to the number of anodically connected segments 19.
  • the substrate When running radially on the shaft 14 cables 17 is connected to the in FIG. 5 illustrated embodiment, the substrate to be coated along the underside of the discs 10 along. If the substrate is to be guided along the upper side of the disks 10, so that the underside of the substrate is coated, the cathodic sliding contact must be arranged on the upper side of the further disk 20 and the anodic sliding contact on the underside of the further disk 20.
  • the substrate can be guided along the individual devices at any angle. It is not necessary that the substrate is transported horizontally, ie parallel to the liquid surface through the bath. Thus, for example, it is even possible if the substrate to be coated is held sufficiently firmly that it is guided perpendicular to the liquid surface on the disks 10 for contacting.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Claims (24)

  1. Dispositif d'application par galvanisation d'au moins un substrat électriquement conducteur ou d'une surface électriquement conductrice structurée ou de pleine surface sur un substrat non conducteur, lequel dispositif présente au moins un bain, une anode et une cathode, le bain contenant au moins une solution d'électrolyte contenant un sel métallique depuis laquelle des ions métalliques sont déposés sur la surface électriquement conductrice du substrat en formant une couche métallique, tandis que la cathode est mise en contact avec la surface du substrat à revêtir et que le substrat est transporté dans le bain, caractérisé en ce que
    la cathode comprend au moins deux disques (2, 4, 10) montés à rotation, chacun sur un arbre (1, 5, 14) respectif, les disques (2, 4, 10) étant intercalés les uns entre les autres.
  2. Dispositif selon la revendication 1, caractérisé en ce que plusieurs disques (2, 4, 10) sont disposés les uns à côté des autres sur chaque arbre (1, 5, 14).
  3. Dispositif selon la revendication 2, caractérisé en ce que la distance entre deux disques (2, 4, 10) placés sur un arbre (1, 5, 14) correspond au moins à la largeur d'un disque (2, 4, 10).
  4. Dispositif selon l'une des revendications 1 à 3, caractérisé en ce que les disques (2, 4, 10) sont alimentés en tension par l'intermédiaire de l'arbre (1, 5, 14).
  5. Dispositif selon la revendication 4, caractérisé en ce que l'arbre (1, 5, 14) et les disques (2, 4, 10) sont réalisés au moins en partie en un matériau électriquement conducteur qui ne passe pas dans la solution d'électrolyte lorsque le dispositif fonctionne.
  6. Dispositif selon l'une des revendications 1 à 5, caractérisé en ce que des découpes (16) sont formées dans les disques (2, 4, 10).
  7. Dispositif selon la revendication 6, caractérisé en ce que les disques (2, 4, 10) présentent un anneau fixé sur l'axe par des rayons.
  8. Dispositif selon l'une des revendications 1 à 7, caractérisé en ce que les disques (2, 4, 10) présentent des parties (11) séparées, isolées électriquement les unes des autres et réparties à leur périphérie.
  9. Dispositif selon la revendication 8, caractérisé en ce que les parties (11) isolées électriquement les unes des autres peuvent être raccordées aussi bien cathodiquement qu'anodiquement.
  10. Dispositif selon la revendications 8 ou 9, caractérisé en ce que les arbres (1, 5) sont constitués de plusieurs segments électriquement conducteurs qui sont tous séparés les uns des autres par des segments non conducteurs, les segments électriquement conducteurs pouvant être raccordés aussi bien cathodiquement qu'anodiquement et les segments conducteurs de l'arbre assurant chaque fois le contact avec une partie électriquement conductrice (11) d'un disque.
  11. Dispositif selon l'une des revendications 1 à 10, caractérisé en ce que les disques (2, 4, 10) peuvent être relevés du substrat (31) ou abaissés sur ce dernier.
  12. Dispositif selon l'une des revendications 1 à 11, caractérisé en ce que le dispositif présente en outre un dispositif qui permet de faire tourner le substrat (31), le dispositif pouvant être disposé à l'intérieur ou à l'extérieur du bain.
  13. Dispositif selon l'une des revendications 1 à 12, caractérisé en ce que les deux dispositifs qui présentent chacun au moins deux arbres (1, 5) sur lesquels des disques (2, 4, 10) intercalés les uns entre les autres sont disposés les uns en face des autres de telle sorte que le substrat (31) à revêtir est passé entre eux et que chaque fois au moins deux arbres (1, 5) sur lesquels des disques (2, 4, 10) sont intercalés les uns entre les autres sont en contact avec le côté supérieur ou le côté inférieur du substrat (31).
  14. Dispositif selon l'une des revendications 1 à 13, caractérisé en ce que pour revêtir des supports flexibles qui sont déroulés d'un premier rouleau et enroulés sur un deuxième rouleau, plusieurs dispositifs qui présentent tous au moins deux arbres (1, 5) sur lesquels sont disposés des disques (2, 4, 10) intercalés les uns entre les autres sont disposés l'un au-dessus de l'autre ou l'un à côté de l'autre, le support flexible traversant les dispositifs en méandres.
  15. Dispositif d'application par galvanisation d'au moins un substrat électriquement conducteur ou d'une surface électriquement conductrice structurée ou de pleine surface sur un substrat non conducteur, caractérisé en ce que le dispositif présente plusieurs dispositifs selon l'une des revendications 1 à 14 raccordés les uns à la suite des autres.
  16. Dispositif d'application par galvanisation d'un substrat électriquement conducteur ou d'une surface électriquement conductrice structurée ou de pleine surface sur un substrat non conducteur, réalisé dans un dispositif selon l'une des revendications 1 à 15.
  17. Dispositif selon la revendication 16, caractérisé en ce que les disques en contact avec le substrat sont raccordés cathodiquement et les disques qui ne sont pas en contact avec le substrat peuvent être raccordés anodiquement.
  18. Procédé selon la revendication 16, caractérisé en ce que les parties des disques qui sont en contact avec le substrat sont raccordées et les parties des disques qui ne sont pas en contact avec le substrat peuvent être raccordées anodiquement.
  19. Procédé selon l'une des revendications 16 à 18, caractérisé en ce que les disques sont alimentés en tension par l'intermédiaire des arbres.
  20. Procédé selon la revendications 16 ou 17, caractérisé en ce que les arbres sont raccordés anodiquement pour être démétallisés pendant une interruption de production.
  21. Utilisation du dispositif selon l'une des revendications 15 à 20, pour appliquer par galvanisation un substrat électriquement conducteur ou une surface électriquement conductrice structurée ou de pleine surface sur un substrat non conducteur.
  22. Utilisation du dispositif selon l'une des revendications 1 à 15, pour la fabrication de pistes conductrices sur des cartes de circuit, des antennes RFID, des antennes de transpondeur ou d'autres structures d'antenne, des modules de carte à puce, des câbles plats, des chauffages de siège, des conducteurs en film, des pistes conductrices de cellules solaires ou de moniteurs LCD ou à plasma, ou pour la fabrication de produits de forme quelconque revêtus par galvanisation.
  23. Utilisation du dispositif selon l'une des revendications 1 à 15 pour la fabrication de surfaces décoratives ou fonctionnelles sur des produits qui sont utilisés pour le blindage vis-à-vis du rayonnement électromagnétique, pour la conduction de chaleur ou comme emballage.
  24. Utilisation du dispositif selon l'une des revendications 1 à 15 pour la fabrication de minces feuilles métalliques ou de supports en polymère à placage métallique sur une ou deux faces.
EP07727869A 2006-04-18 2007-04-05 Procédé et dispositif de revêtement galvanique Active EP2010700B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07727869A EP2010700B1 (fr) 2006-04-18 2007-04-05 Procédé et dispositif de revêtement galvanique

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06112724 2006-04-18
EP07727869A EP2010700B1 (fr) 2006-04-18 2007-04-05 Procédé et dispositif de revêtement galvanique
PCT/EP2007/053401 WO2007118810A2 (fr) 2006-04-18 2007-04-05 Procédé et dispositif de revêtement galvanique

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EP2010700B1 true EP2010700B1 (fr) 2010-01-20

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AT (1) ATE455879T1 (fr)
BR (1) BRPI0710662A2 (fr)
CA (1) CA2647969A1 (fr)
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TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
JP5575669B2 (ja) * 2008-03-13 2014-08-20 ビーエーエスエフ ソシエタス・ヨーロピア 基板上に金属層を形成するための方法及び分散液、並びに金属化可能な熱可塑性成形用化合物
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
EP2799939A1 (fr) * 2013-04-30 2014-11-05 Universo S.A. Support pour le traitement de pièces de micromécanique
CN103343371A (zh) * 2013-07-09 2013-10-09 中国铝业股份有限公司 一种聚合物薄膜的连续电沉积方法
JP5967034B2 (ja) * 2013-08-20 2016-08-10 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
US9847576B2 (en) 2013-11-11 2017-12-19 Nxp B.V. UHF-RFID antenna for point of sales application
JP6197813B2 (ja) * 2015-03-11 2017-09-20 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
RU2643050C2 (ru) * 2015-11-09 2018-01-30 Фарит Фазитович Мухамедьянов Кислотный поверхностно-активный состав для обработки призабойной зоны нефтяных и газовых скважин
MX2021005524A (es) * 2018-11-22 2021-11-04 A Plas Genel Otomotiv Mamulleri Sanayi Ve Ticaret Anonim Sirketi Un colgadero de galvanoplastia para obtener un chapeado homogeneo.
CN114790565B (zh) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 导电装置及水平电镀设备

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US1437003A (en) * 1921-10-08 1922-11-28 American Nickeloid Company Electroplating apparatus and process
WO2003038158A2 (fr) * 2001-10-25 2003-05-08 Infineon Technologies Ag Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

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CA2647969A1 (fr) 2007-10-25
WO2007118810A3 (fr) 2008-05-22
BRPI0710662A2 (pt) 2011-08-16
RU2008145105A (ru) 2010-05-27
US20090178930A1 (en) 2009-07-16
DE502007002680D1 (de) 2010-03-11
KR20080110658A (ko) 2008-12-18
CN101426962A (zh) 2009-05-06
TW200813263A (en) 2008-03-16
ATE455879T1 (de) 2010-02-15
IL194505A0 (en) 2009-08-03
EP2010700A2 (fr) 2009-01-07
WO2007118810A2 (fr) 2007-10-25
JP2009534525A (ja) 2009-09-24

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