ATE455879T1 - Vorrichtung und verfahren zur galvanischen beschichtung - Google Patents
Vorrichtung und verfahren zur galvanischen beschichtungInfo
- Publication number
- ATE455879T1 ATE455879T1 AT07727869T AT07727869T ATE455879T1 AT E455879 T1 ATE455879 T1 AT E455879T1 AT 07727869 T AT07727869 T AT 07727869T AT 07727869 T AT07727869 T AT 07727869T AT E455879 T1 ATE455879 T1 AT E455879T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- electrically conductive
- cathode
- bath
- electrolytic coating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06112724 | 2006-04-18 | ||
| PCT/EP2007/053401 WO2007118810A2 (de) | 2006-04-18 | 2007-04-05 | Vorrichtung und verfahren zur galvanischen beschichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE455879T1 true ATE455879T1 (de) | 2010-02-15 |
Family
ID=38236501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07727869T ATE455879T1 (de) | 2006-04-18 | 2007-04-05 | Vorrichtung und verfahren zur galvanischen beschichtung |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US20090178930A1 (de) |
| EP (1) | EP2010700B1 (de) |
| JP (1) | JP2009534525A (de) |
| KR (1) | KR20080110658A (de) |
| CN (1) | CN101426962A (de) |
| AT (1) | ATE455879T1 (de) |
| BR (1) | BRPI0710662A2 (de) |
| CA (1) | CA2647969A1 (de) |
| DE (1) | DE502007002680D1 (de) |
| IL (1) | IL194505A0 (de) |
| RU (1) | RU2008145105A (de) |
| TW (1) | TW200813263A (de) |
| WO (1) | WO2007118810A2 (de) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
| US20110014492A1 (en) * | 2008-03-13 | 2011-01-20 | Basf Se | Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound |
| DE102010000211A1 (de) * | 2010-01-26 | 2011-07-28 | Atotech Deutschland GmbH, 90537 | Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung |
| KR101103450B1 (ko) * | 2010-07-27 | 2012-01-09 | 주식회사 케이씨텍 | 기판 도금 장치 |
| EP2799939A1 (de) * | 2013-04-30 | 2014-11-05 | Universo S.A. | Träger für die Behandlung von mikromechanischen Bauteilen |
| CN103343371A (zh) * | 2013-07-09 | 2013-10-09 | 中国铝业股份有限公司 | 一种聚合物薄膜的连续电沉积方法 |
| JP5967034B2 (ja) * | 2013-08-20 | 2016-08-10 | トヨタ自動車株式会社 | 金属被膜の成膜装置および成膜方法 |
| US9847576B2 (en) * | 2013-11-11 | 2017-12-19 | Nxp B.V. | UHF-RFID antenna for point of sales application |
| JP6197813B2 (ja) * | 2015-03-11 | 2017-09-20 | トヨタ自動車株式会社 | 金属皮膜の成膜装置およびその成膜方法 |
| RU2643050C2 (ru) * | 2015-11-09 | 2018-01-30 | Фарит Фазитович Мухамедьянов | Кислотный поверхностно-активный состав для обработки призабойной зоны нефтяных и газовых скважин |
| EP3884084A4 (de) * | 2018-11-22 | 2022-08-24 | A-Plas Genel Otomotiv Mamulleri Sanayi Ve Ticaret Anonim Sirketi | Plattierbügel zum erzielen einer homogenen plattierung |
| CN114790565B (zh) * | 2022-05-26 | 2024-06-18 | 江苏启威星装备科技有限公司 | 导电装置及水平电镀设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1437003A (en) * | 1921-10-08 | 1922-11-28 | American Nickeloid Company | Electroplating apparatus and process |
| DE10234705B4 (de) * | 2001-10-25 | 2008-01-17 | Infineon Technologies Ag | Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen |
| WO2003038158A2 (de) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen |
| DE10342512B3 (de) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
-
2007
- 2007-04-05 AT AT07727869T patent/ATE455879T1/de active
- 2007-04-05 RU RU2008145105/02A patent/RU2008145105A/ru not_active Application Discontinuation
- 2007-04-05 DE DE502007002680T patent/DE502007002680D1/de active Active
- 2007-04-05 JP JP2009505839A patent/JP2009534525A/ja not_active Withdrawn
- 2007-04-05 KR KR1020087026807A patent/KR20080110658A/ko not_active Withdrawn
- 2007-04-05 CA CA002647969A patent/CA2647969A1/en not_active Abandoned
- 2007-04-05 EP EP07727869A patent/EP2010700B1/de active Active
- 2007-04-05 US US12/297,330 patent/US20090178930A1/en not_active Abandoned
- 2007-04-05 CN CNA2007800141440A patent/CN101426962A/zh active Pending
- 2007-04-05 BR BRPI0710662-9A patent/BRPI0710662A2/pt not_active IP Right Cessation
- 2007-04-05 WO PCT/EP2007/053401 patent/WO2007118810A2/de not_active Ceased
- 2007-04-18 TW TW096113680A patent/TW200813263A/zh unknown
-
2008
- 2008-10-02 IL IL194505A patent/IL194505A0/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| RU2008145105A (ru) | 2010-05-27 |
| EP2010700B1 (de) | 2010-01-20 |
| DE502007002680D1 (de) | 2010-03-11 |
| WO2007118810A2 (de) | 2007-10-25 |
| IL194505A0 (en) | 2009-08-03 |
| WO2007118810A3 (de) | 2008-05-22 |
| CA2647969A1 (en) | 2007-10-25 |
| CN101426962A (zh) | 2009-05-06 |
| TW200813263A (en) | 2008-03-16 |
| US20090178930A1 (en) | 2009-07-16 |
| KR20080110658A (ko) | 2008-12-18 |
| BRPI0710662A2 (pt) | 2011-08-16 |
| JP2009534525A (ja) | 2009-09-24 |
| EP2010700A2 (de) | 2009-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE455879T1 (de) | Vorrichtung und verfahren zur galvanischen beschichtung | |
| WO2007118875A3 (de) | Vorrichtung und verfahren zur galvanischen beschichtung | |
| JP6176234B2 (ja) | 金属皮膜の成膜装置およびその成膜方法 | |
| WO2007111676A3 (en) | Method of direct plating of copper on a substrate structure | |
| ATE462025T1 (de) | Lösung und verfahren zur elektrochemischen abscheidung eines metalls auf ein substrat | |
| PL2171131T3 (pl) | Sposób elektroosadzania metali przy użyciu cieczy jonowych w obecności dodatku | |
| DE59801021D1 (de) | Wässriges bad und verfahren zum elektrolytischen abscheiden von kupferschichten | |
| ATE329083T1 (de) | Rakel und verfahren bei deren herstellung | |
| CL2003002095A1 (es) | Proceso para el tratamiento galvanoplastico de un metal desde una solucion de electrolito en una celda electrolitica que tiene por lo menos un anodo que comprende formar un revestimiento superior poroso sobre toda la superficie de un revestimiento de | |
| CN103882492B (zh) | 金属基体化学镀前处理方法 | |
| Ibrahim et al. | New non-cyanide acidic copper electroplating bath based on glutamate complexing agent | |
| EP1703001A3 (de) | Anode für die Elektrolyse und elektrolytische Methode zur Herstellung einer fluorhaltigen Substanz | |
| WO2007034117A3 (fr) | Procede d'electrodeposition destine au revetement d'une surface d'un substrat par un metal | |
| JP2017520684A5 (de) | ||
| EP1562412A3 (de) | Verfahren und Vorrichtung zur elektrolytishen Erhöhung der Stärke einer elektrisch leitfähigen Struktur auf einem dielektrischen Substrat | |
| Pecequilo et al. | Study of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1, 1-diphosphonic acid through cyclic voltammetry technique | |
| TW200714714A (en) | Method for manufacturing an electrochemical-based analytical test strip with hydrophilicity enhanced metal electrodes | |
| JP2005536643A (ja) | フォーム状の金属構造物、金属フォーム、およびキャリア基板と金属フォームとを含む構造物を製造する方法 | |
| Bao et al. | EIS analysis of hydrophobic and hydrophilicTiO2 film | |
| NO20052570L (no) | Fremgangsmate for a frembringe en god kontaktflate pa en elektrolysecelleskinne og stromskinne | |
| JPH11209898A5 (de) | ||
| CN105418166A (zh) | 一种陶瓷表面脉冲电镀致密金薄膜的无氰镀金电镀液及电镀方法 | |
| Shang et al. | Corrosion resistance and molecular dynamics behavior of the MAO/SAM composite coatings on magnesium alloy | |
| TH92090A (th) | อุปกรณ์และวิธีการสำหรับการเคลือบแบบใช้อิเล็กโทรไลต์ | |
| KR101420995B1 (ko) | 플레이트 펀칭 홀의 전기아연도금방법 |