KR20080110658A - 전해 도금 장치 및 방법 - Google Patents

전해 도금 장치 및 방법 Download PDF

Info

Publication number
KR20080110658A
KR20080110658A KR1020087026807A KR20087026807A KR20080110658A KR 20080110658 A KR20080110658 A KR 20080110658A KR 1020087026807 A KR1020087026807 A KR 1020087026807A KR 20087026807 A KR20087026807 A KR 20087026807A KR 20080110658 A KR20080110658 A KR 20080110658A
Authority
KR
South Korea
Prior art keywords
substrate
disk
shaft
disks
electrically conductive
Prior art date
Application number
KR1020087026807A
Other languages
English (en)
Korean (ko)
Inventor
레네 로흐트만
죄르겐 카크춘
노르베르트 슈나이더
죄르겐 피스터
게르트 폴
노르베르트 바그너
Original Assignee
바스프 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20080110658A publication Critical patent/KR20080110658A/ko

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005Contacting devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0657Conducting rolls

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1020087026807A 2006-04-18 2007-04-05 전해 도금 장치 및 방법 KR20080110658A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112724.7 2006-04-18
EP06112724 2006-04-18

Publications (1)

Publication Number Publication Date
KR20080110658A true KR20080110658A (ko) 2008-12-18

Family

ID=38236501

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087026807A KR20080110658A (ko) 2006-04-18 2007-04-05 전해 도금 장치 및 방법

Country Status (13)

Country Link
US (1) US20090178930A1 (de)
EP (1) EP2010700B1 (de)
JP (1) JP2009534525A (de)
KR (1) KR20080110658A (de)
CN (1) CN101426962A (de)
AT (1) ATE455879T1 (de)
BR (1) BRPI0710662A2 (de)
CA (1) CA2647969A1 (de)
DE (1) DE502007002680D1 (de)
IL (1) IL194505A0 (de)
RU (1) RU2008145105A (de)
TW (1) TW200813263A (de)
WO (1) WO2007118810A2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
KR20120128615A (ko) * 2010-01-26 2012-11-27 아토테크더치랜드게엠베하 화학적 및/또는 전기화학적 처리용 시스템에서 플레이트형상 기판을 운반하는 장치

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
CN101970720B (zh) * 2008-03-13 2014-10-15 巴斯夫欧洲公司 施加金属层至基质的方法和分散体及可金属化热塑性模塑组合物
EP2799939A1 (de) * 2013-04-30 2014-11-05 Universo S.A. Träger für die Behandlung von mikromechanischen Bauteilen
CN103343371A (zh) * 2013-07-09 2013-10-09 中国铝业股份有限公司 一种聚合物薄膜的连续电沉积方法
JP5967034B2 (ja) * 2013-08-20 2016-08-10 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
US9847576B2 (en) * 2013-11-11 2017-12-19 Nxp B.V. UHF-RFID antenna for point of sales application
JP6197813B2 (ja) * 2015-03-11 2017-09-20 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
RU2643050C2 (ru) * 2015-11-09 2018-01-30 Фарит Фазитович Мухамедьянов Кислотный поверхностно-активный состав для обработки призабойной зоны нефтяных и газовых скважин
CN113166967A (zh) * 2018-11-22 2021-07-23 A-Plas通用汽车产品工贸股份公司 用于获得均匀镀层的镀覆挂架
CN114790565B (zh) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1437003A (en) * 1921-10-08 1922-11-28 American Nickeloid Company Electroplating apparatus and process
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120128615A (ko) * 2010-01-26 2012-11-27 아토테크더치랜드게엠베하 화학적 및/또는 전기화학적 처리용 시스템에서 플레이트형상 기판을 운반하는 장치
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치

Also Published As

Publication number Publication date
EP2010700B1 (de) 2010-01-20
US20090178930A1 (en) 2009-07-16
IL194505A0 (en) 2009-08-03
CN101426962A (zh) 2009-05-06
CA2647969A1 (en) 2007-10-25
WO2007118810A2 (de) 2007-10-25
EP2010700A2 (de) 2009-01-07
ATE455879T1 (de) 2010-02-15
TW200813263A (en) 2008-03-16
BRPI0710662A2 (pt) 2011-08-16
RU2008145105A (ru) 2010-05-27
JP2009534525A (ja) 2009-09-24
WO2007118810A3 (de) 2008-05-22
DE502007002680D1 (de) 2010-03-11

Similar Documents

Publication Publication Date Title
KR20080110658A (ko) 전해 도금 장치 및 방법
US20090101511A1 (en) Electroplating device and method
JP2009534527A5 (de)
EP0458863B1 (de) Verfahren und vorrichtung zur herstellung von feinen leiterbahnen mit kleinen abständen
US7501048B2 (en) Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric substrate, as well as a dielectric substrate
WO2006127320A2 (en) Electroplating apparatus based on an array of anodes
JP2009534525A5 (de)
JP2010511103A5 (de)
EP3101517B1 (de) Leitfähiges substrat, leitfähiges substratlaminat, verfahren zur herstellung eines leitfähigen substrats und verfahren zur herstellung eines leitenden substratlaminats
RU2009124293A (ru) Устройство и способ для гальванического покрытия
CA2532451A1 (en) Device and method for electrolytically treating electrically insulated structures
JP4681789B2 (ja) 弾性接触要素
US20050061661A1 (en) Electrodeposition device and electrodeposition system for coating structures which have already been made conductive
EP1756336B1 (de) Vorrichtung und verfahren zur elektrolytischen behandlung von flachen werkstücken
CN101473071B (zh) 用于以连续方式电镀衬底的设备和方法
KR20020021629A (ko) 전기전도성 중합체로 코팅된 공작물의 전기도금 공정
KR100877605B1 (ko) Pcb용 전해도금장치
CN201525897U (zh) 一种电镀ffc的装置
JP3043318B2 (ja) 連続メッキ装置の給電方法及びその装置
CN101476124B (zh) 绝缘材料镀膜方法及其结构
KR101290310B1 (ko) 도전성 필름 제조 방법
JP2001127400A (ja) 表面処理用ラック

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid