KR20080110658A - Device and method for electrolytic coating - Google Patents

Abstract

The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least one bath, an anode and a cathode. The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least two discs (2, 4, 10) that are rotatably mounted on a respective shaft (1, 5, 14), said discs (2, 4, 10) intermeshing. The invention also relates to a method for electroplating at least one substrate, said method being carried out in a device according to the invention. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support. ® KIPO & WIPO 2009

Description

Electroplating Apparatus and Method {DEVICE AND METHOD FOR ELECTROLYTIC COATING}

The present invention is an electroplating apparatus for at least one electrically conductive substrate, or a surface structured on a non-conductive substrate or a surface that is entirely electrically conductive, comprising at least one bathtub, one anode, and one cathode, wherein the bathtub Is for receiving at least one electrolyte solution containing a metal salt, wherein metal ions from the electrolyte solution are deposited on an electrically conductive surface of the substrate to form a metal layer.

The invention also relates to a method for electroplating at least one substrate carried out in an apparatus constructed according to the invention.

Electrolytic plating methods are used, for example, for the plating of electrically conductive substrates, or surfaces structured on a non-conductive substrate, or of which the entire surface is electrically conductive. For example, these methods can form conductor tracks on printed circuit boards, RFID antennas, flat cables, thin metal foils, conductor tracks on solar cells, for example two-dimensional objects or three-dimensional objects that are molded plastic parts. Other products such as objects can be electroplated.

German patent B 103 42 512 discloses an electrolytic treatment apparatus and an electrolytic treatment method of electrically conductive structures which are electrically insulated from each other on the surface of a strip-shaped object to be treated. In this German patent, the object to be treated is continuously conveyed in the conveying direction on the conveyor belt, and the object to be treated is in contact with a contact electrode disposed outside the electrolysis region and thus a negative voltage is applied to the electrically conductive structure. In the electrolysis region, metal ions from the treatment liquid are subsequently deposited on the electrically conductive structure to form a metal layer. Since the metal is deposited on the electrically conductive structure only when the electrically conductive structure is contacted by the contact electrode, the plating of the structure dimensioned so large that the electrically conductive structure to be plated is in the electrolysis area and at the same time contacted outside the electrolysis area. It is only possible.

A zinc plating apparatus in which a contact unit is arranged in an electrolyte bath is disclosed, for example, in German patent A 102 34 705. The zinc plating apparatus described in the German patent is suitable for plating a structure which is disposed on a strip-shaped support and is already formed to be conductive. In this case, the contact is made via a roll in contact with the structure formed to be conductive. Since the roll is in an electrolyte bath, metal from the electrolyte bath is deposited on the structure in a similar manner. In order to be able to remove the metal again, the roll is composed of individual segments which are connected to the cathode as long as they are in contact with the structure to be plated and are connected to the anode when the roll and the electrically conductive structure are not in contact. However, a disadvantage of this device is that voltage is only applied for a short time on the short structure in the transport direction, whereas voltage is applied over a substantially longer time on the long structure in the transport direction in a similar manner. Is the point. The layer deposited on the long structure is thus substantially larger than the layer deposited on the short structure.

A disadvantage of the methods known from the prior art is that these methods cannot be used to plate very short structures, especially in the direction of transport of the substrate. Another disadvantage is the need for multiple rolls connected in series to achieve a sufficiently long contact time, thus requiring a very long device.

It is an object of the present invention to provide a device which ensures a sufficiently long contact time even for short structures, so that even a short structure can be provided with a sufficiently thick and uniform metal layer. Such a device is also intended to require less space.

The object is an electroplating apparatus of at least one electrically conductive substrate, or a surface structured on a non-conductive substrate or of an entire surface that is electrically conductive, comprising at least one bath, one anode, and one cathode, The bath contains an electrolyte solution containing at least one metal salt, and metal ions from the electrolyte solution are deposited on the electrically conductive surface of the substrate to form a metal layer while the cathode contacts the surface of the substrate to be plated, The substrate is carried by a bath, the cathode comprising at least two disks mounted on each shaft so as to be rotatable, which disks are achieved by an electroplating apparatus in which they are joined together.

Compared with the electrolytic plating apparatus known from the prior art, the apparatus according to the invention with the disks bonded to each other as a cathode provides a sufficiently thick and uniform plating even for a substrate having a short electrically conductive structure, especially in the transport direction of the substrate. Makes it possible to provide. This is made possible by the fact that the spacing between the electrically conductive structure and the contact point of the disk can be made narrower with the disks joined together rather than with the rolls arranged in series.

The disk is configured to have a cross section that matches each substrate. The disk preferably has a circular cross section. The shaft can have any cross section. The shaft is preferably of cylindrical shape.

In order to be able to plate a structure wider than two neighboring disks, a plurality of disks are arranged next to each other on each shaft as a function of the width of the substrate. Sufficient spacing is formed between each of the disks, and the disks of the subsequent shafts can be coupled within this spacing. In a preferred embodiment, the spacing between two disks on the shaft corresponds at least to the width of the disk. This allows the disks of the additional shaft to be coupled within the gap between the two disks on the given shaft.

At least four shafts with disks are paired in series in order to be able to also plate areas of the electrically conductive structure in which the cathodes configured as disks or disc sections bear for contact on the electrically conductive structures. ) May be arranged to be offset. Such a device is preferred such that the second shaft pair disposed offset relative to the first shaft pair is in contact with the electrically conductive structure in the region where the metal was deposited when in contact with the first shaft pair. In order to achieve thicker plating thicknesses, preferably two or more shaft pairs are connected in series. The coupling distance can also vary as needed. It is also possible to change the spacing of each shaft pair as needed.

The number of disks arranged next to each other on at least one shaft depends on the width of the structure. If the substrate to be plated is wider, proportionally more disks must be placed next to each other. At this time, it should be noted that the empty gaps must remain between the disks, respectively, and the metal can be deposited on the electrically conductive substrate, or the structured surface or the substrate whose entire surface is the electrically conductive surface, at the rear gap, The disk of the shaft can be coupled.

The size of the disk used as the cathode depends on the size of the structure to be electroplated. For example, a structure in which the length in the conveying direction is offset in series and equal to or greater than the spacing of the disks touching the substrate may be such that the width and position of the disk on the substrate is such that the disk is also touched by a continuously offset roll. When set, it is sufficiently plated. In order to plate as small an electrically conductive structure as possible, a narrow disk of small diameter is thus used. The advantage of narrow discs, where the spacing between them is small, is that the contact probability of very small structures is thus large compared to a smaller number of wide discs. Since the contact area of the disc interferes with the deposition by covering the structure directly under the disc, it is advantageous to minimize this covering effect with narrow discs. At the same time, the throughput of the electrolyte over the surface to be plated is more uniform than when there is less surface access, such as when using a smaller number of wide disks, thanks to the many smaller surface accesses.

The smallest possible width of the disc and the smallest diameter of the disc that can be produced, on the one hand, depend on the manufacturing methods available, on the other hand, depending on the disc that is mechanically stable during operation, i.e. it does not warp or bend during operation. Depends.

The distance between two disks that are coupled to each other depends on whether the disks have the same polarity or different polarities. In the case of having the same polarity, for example, the discs that are joined to each other may be in contact, while in the case of having the different polarity, it is necessary to form a certain distance between the discs in order to prevent a short circuit. Moreover, it is also necessary to ensure that the electrolyte solution flows sufficiently through the intermediate space between the disks and the space defined by the substrate surface to be plated.

In a preferred embodiment, the disk is supplied with voltage via the shaft. For this purpose, for example, the shaft can be connected to a voltage source outside the bath. This connection is usually made via slipring. However, any other connection is also possible to allow voltage transfer from a fixed power source to the rotating element. In addition to the voltage supply via the shaft, it is also possible to supply current to the contact disk via the outer periphery of the disk. For example, a sliding contact, such as a brush, may be positioned to contact a contact disk on another side of the substrate.

In order to supply current to the disk via the shaft, for example, in a preferred embodiment the shaft and the disk are at least partly made of an electrically conductive material. In addition, however, it is also possible to manufacture the shaft from an electrically insulating material and to supply current to each disk, for example, via electrical leads such as wires. In this case, each wire is now individually connected to the contact disk so that a voltage is supplied to the contact disk.

If the disc is made of electrically conductive material only on the outer periphery of the disc, then it is necessary to provide an electrical conductor connecting the shaft to the outer periphery of the disc. For this purpose, for example, electrical leads can be received in the disc. In addition, the current supply can be effected via fastening means, for example screws, which fix the disk on the shaft.

For a uniform electrolyte supply, in a preferred embodiment, the disc is formed with an opening. The electrolyte solution can be conveyed to the substrate through this opening. At the same time, the mixing of the electrolyte is improved compared to the embodiment with the solid disk because of the rotation of the disk. In addition, the electrolyte solution can be transported to the substrate more quickly through the perforated disc than is possible when the electrolyte solution must flow only through the gaps between the respective discs.

Solid discs may provide discs in which the ring is fixed on the shaft by means of spokes instead of openings. To enable electroplating, the ring needs to be made of an electrically conductive material at the outer perimeter of the ring. In a preferred embodiment, the entire ring is made of an electrically conductive material. The spokes for securing the ring on the shaft can be made of an electrically conductive material or an electrically insulating material, for example. When the spokes are made of an electrically conductive material, the voltage supply of the ring is preferably via the shaft and the spokes. When the spokes are made of an electrically insulating material, certain spokes may be provided to be electrically conductive, for example to allow voltage to be transferred from the shaft to the ring. In addition, when the spokes are made of an electrically insulating material, it is also possible to connect the ring to the shaft for current transmission, for example via a current conductor, which is a cable. In the case of electrically insulating spokes, it is also possible to apply a voltage directly to the ring surface. For this purpose, for example, the ring surface is in contact with a sliding contact such as a brush.

In order to be able to electroplate the substrate with metal ions from the electrolyte solution to form a metal layer, the disks are each connected to the cathode in the above-described exemplary embodiment. Thanks to the cathode connection of the disk, metal is also deposited on the disk. Thus, it is necessary to connect the disk to the anode in order to remove the deposited metal, i.e. to peel off the metal foil layer. This can be done, for example, during production stops. In order to be able to perform metal foil layer removal during operation, in a preferred embodiment the disk can be lifted off the substrate and lowered onto the substrate. The disks laid down on the substrate can in this case be connected to the cathode, while the disks lifted from the substrate are connected to the anode. Through a cathode connected to the substrate and connected to the cathode, the electrically conductive structure on the substrate contacts the cathode and is thus plated. At the same time, the metal already deposited on the disk is removed again by the anode connection of the disk which is not in contact with the substrate.

For example, it may be possible for each of the shafts with disks to remain lowered on the substrate, or alternatively the shafts with disks may be lifted from the substrate. Preferably, however, at least two successive shafts with disks joined to each other are lowered onto the substrate, in order to prevent the plating of the electrically conductive substrate which is not in contact with the cathode and passes through the gap between the two disks. You lose. As soon as two successive shafts with disks joined to each other touch the substrate, these substrates that pass through the gap between the two disks are contacted by subsequent disks joined at the gap. Thus, the plating of these structures which are electrically conductive is also ensured.

In a preferred embodiment, the discs are provided with separate sections which are electrically insulated from one another and distributed over the circumference. These sections which are electrically insulated from each other can preferably be connected to the cathode and to the anode. Thus, sections in contact with the substrate can be connected to the cathode and can be connected to the anode as long as the sections are no longer in contact with the substrate. In this way, the metal deposited in the section during the cathode connection is removed again during the anode connection. The voltage supply of the individual segments is usually via the shaft. When a plurality of disks are arranged next to each other on the shaft, these disks are preferably arranged such that individual sections electrically insulated from one another are arranged at the same height in the axial direction. In this way, separate sections at the same height in the axial direction and electrically insulated from each other are in contact with the common line. It is also possible to configure the shaft in a manner similar to the individual segments electrically insulated from one another so as to correspond with the segments of each disc. In this case, the individual segments can now be used for current supply to the disk. The shaft is preferably in contact with the outside of the bath. For example, contact is possible through polling of the contact disk or inverted disk which is in contact with the shaft. When each line is provided in contact with a separate section of the disk, which is electrically insulated from each other, these lines can be positioned around the outside of the shaft or inside the outside of the shaft.

In addition to removing the metal deposited on the shaft and disk by reversing the polarity of the shaft, other modified cleaning methods are also possible, for example chemical cleaning or mechanical cleaning.

The material from which the electrically conductive portion of the disc is made is preferably an electrically conductive material which is not transferred to the electrolyte solution during operation of the device. Suitable materials are, for example, metals, graphite, conductive polymers such as polythiophenes, or metal / plastic composite materials. Stainless steel and / or titanium are the preferred materials.

In order to prevent the disk from degrading when the disk is connected to the anode to remove metal deposited on the disk, it is usually preferred to use materials known to those skilled in the art as the material for the insoluble anode, for the disk and the shaft. For example, titanium plated with a conductive mixture of metal oxides is such a suitable material.

In yet another embodiment, the electroplating apparatus further includes an apparatus to allow the substrate to rotate. By rotation, the initially wide and short electrically conductive structure in the transport direction of the substrate can be aligned to be narrow and long in the transport direction after rotation. This rotation compensates for different plating times due to the fact that the plating of the electrically conductive structure takes place at the first contact with the already connected cathodes.

After rotation, the substrate passes through the device for the second time or through the second corresponding device. The angle at which the substrate is rotated is preferably in the range of 10 ° to 170 °, more preferably 50 ° to 140 °, in particular 80 ° to 100 °, and most preferably the angle at which the substrate is rotated is substantially 90 °. Substantially 90 ° means that the angle of rotation of the substrate does not differ by more than 5 ° from 90 °. The device for rotating the substrate may be disposed inside or outside the bath. To replat the same side of the substrate, for example to make the thickness of the metal layer thicker, the axis of rotation is aligned perpendicular to the surface to be plated.

If another surface of the substrate is to be plated, then the axis of rotation is arranged so that the substrate can be positioned in such a way that the surface to be plated points to the cathode direction after rotation.

The thickness of the metal layer deposited on the electrically conductive structure by the method according to the invention depends not only on the contact time, which is determined by the speed of the substrate passing through the device, but also on the number of shafts in which the disks are joined and positioned in series. It depends on the current strength to operate the device. Longer contact times can be obtained, for example, by connecting a plurality of devices according to the invention in series in at least one bath.

In one embodiment, the plurality of devices according to the invention are each connected in series in each bath. Thus, it is possible to have different electrolyte solutions in each bath to deposit different metals continuously on the electrically conductive structure. This is advantageous, for example, in decorative applications or when forming gold contacts. In addition, each layer thickness can be adjusted by selecting the number and processing speed of the apparatus using the same electrolyte solution.

In order to enable simultaneous plating of the upper side and the lower side of the substrate, in one embodiment of the present invention, the two shafts on which the disk is mounted are arranged respectively so that the substrate to be plated can be moved between these shafts. According to the present invention, two shafts holding the disks coupled to each other are provided on both the upper side and the lower side of the substrate, respectively. In general, the structure now functions as a mirror plane in the plane in which the substrate is guided. As a so-called endless foil which is initially guided through an electroplating apparatus in a state unwound from the roll and then rewound, when it is desired to plate a foil having a length exceeding the length of the bath, these foils are, for example, plural It may be guided through the bath in a curved or zigzag shape around the two electroplating apparatuses, and for example later may be arranged on top of one another or next to each other.

Using the apparatus according to the invention and the method according to the invention, it is also possible to plate indentations such as bore or slots or even blind holes contained in the substrate. In the case of through-holes of shallow depth, plating is performed in that the metal layers deposited on the upper and lower portions grow together in the holes. In holes that are too deep for the metal layers to grow together, at least partially provided with conductive hole walls plated by the method according to the invention. In this way it is now also possible to plate the entire wall of the hole. Although not all hole walls are electrically conductive, here also the entire hole walls are plated by the metal layer growing together.

If only one side of the substrate is to be plated, the substrate is placed on the disks which are joined together or guided along the lower side of the disk, in the former case the lower side of the substrate is plated and in the latter case the upper side of the substrate is plated. When the substrate is placed on the disk, the disks can be used simultaneously to carry the substrate. Sufficient contact of the substrate and the disk to be bonded to each other is achieved by pressing the substrates onto the disk to be bonded to each other, preferably by a pressure device. Pressure rolls or pressure belts guided around the shaft and pressed against the substrate are suitable, for example, as pressure devices.

When the substrate is guided along the underside of the disk, there is a need to provide a conveying device for bringing the substrate into contact with the disk. Such a conveying device is, for example, a belt or a roll, on which the substrate moves. The substrate may then be pressed towards the conveying device by the electroplating apparatus by applying a predetermined force or may be pressed towards the electroplating apparatus by the conveying device.

When the substrate is plated simultaneously on the upper side and the lower side, disks that contact the substrate, are connected as cathodes and bonded to each other can be used simultaneously for transport of the substrate through the bath.

Each shaft or all shafts can be driven to carry the substrate. These shafts are preferably driven outside the bath. When a transport device is provided that is independent of the cathode connected disk, the shaft and the disk coupled to the shaft can be set while rotating by the substrate, so that the circumferential speed of the disk corresponds to the speed at which the substrate is transported.

In order to achieve a uniform circumferential speed of all shafts or disks, it is desirable to drive all shafts via a common drive unit. The drive unit is preferably an electric motor. The shaft is preferably connected to the drive unit via a chain or belt transmission. However, it is also possible to provide each of the gears that mesh with each other and to drive the shaft via them. In addition to the feasible means described herein, any other suitable drive known to those skilled in the art for the drive of the shaft can be used.

On the one hand, with various polling of the shaft, disk or disk sections insulated from each other, the shafts, disks or disk sections insulated from each other can be used as anodes and on the other hand provide additional anodes in the bath. Can be. When only cathode-connected shafts and disks are provided, it is necessary to place additional anodes in the bath. The anode is then preferably arranged as close as possible to the structure to be plated. For example, the anode can be disposed in front of the first shaft and behind the final shaft, respectively, with the disks joined together. When plating the substrate only on one side, it is also possible to place the cathode on one side of the substrate to be electroplated, for example, and to place the anode on the other side of the substrate without contacting the substrate. On the one hand any material known to those skilled in the art as a material for insoluble anodes is suitable as material for the anode. In this case, for example, stainless steel, graphite, platinum, titanium, or metal / plastic composite material is preferred. On the other hand, soluble anodes may also be provided. These anodes preferably comprise a metal deposited by electrolysis on the electrically conductive structure. The anode can be assumed to be any desired shape known to those skilled in the art. For example, as an anode it is possible to use flat rods which are spaced at a minimum distance from the substrate surface during operation of the device. It is also possible to use flat wires or elastic wires, for example spiral wires, as anodes.

To plate the flexible circuit support, which is preferably in strip form, the support is released from the roll located in front of the bath and wound on a new roll after passing through the bath.

With the device according to the invention, it is possible to plate all electrically conductive surfaces, whether or not to plate mutually insulated electrically conductive structures on a non-conductive substrate or to plate the front surface. Such devices are preferably used for plating electrically conductive structures on electrically nonconductive supports such as, for example, reinforcing or non-reinforcing polymers, ceramic materials, glass, silicon, textiles, and the like, commonly used in circuit boards. An electrically conductive structure electroplated in this manner is for example a conductor track. The electrically conductive structure to be plated can be made of, for example, an electrically conductive material printed on a circuit board. The electrically conductive structure preferably comprises particles of any geometric shape made of an electrically conductive material in a suitable matrix, or is based primarily on the electrically conductive material. Suitable electrically conductive materials include, for example, metals, electrically conductive metal composites, such as carbon or graphite, preferably alloys or mixtures of metals comprising aluminum, iron, gold, copper, nickel, silver, and / or at least one of these metals, Conductive organic compounds or conductive polymers.

In order for the structure to be electrically conductive, it may first need pretreatment. Such pretreatment may include, for example, chemical or mechanical pretreatment such as appropriate washing. In this way, the oxide layer, for example damaging the electrolytic plating, is removed from the metal beforehand. However, the electrically conductive structure to be plated can also be attached onto the circuit board by any other method known to those skilled in the art.

Such circuit boards include, for example, computers, telephones, televisions, electronic components of automobiles, keyboards, radios, video players, CD players, CD-ROM players, and DVD players, game controllers, measuring and control devices, sensors, and kitchen appliances. It is installed in products such as equipment and electric toys.

The electrically conductive structure on the flexible circuit support can also be plated using the device according to the invention. This flexible circuit support is, for example, a polymer film such as a polyimide film, a PET film or a polyolefin film, on which the electrically conductive structure is printed. The device according to the invention and the method according to the invention are RFID antennas, transponder antennas, or other types of antennas, chip card modules, flat cables, seat heaters, foil conductors, conductors in solar cells or LCD / plasma display screens. Production of tracks, or products electroplated in any form, for example thin metal foil, polymer supports coated on one or both sides with a predetermined layer thickness, production of three-dimensional molded interconnect devices, or decoration of products Cotton or functional cotton is more suitable for the production of other products, for example used for the shielding of electromagnetic radiation or for shielding heat conduction or for use as a package. It is also possible to form contact sites, contact pads, or interconnections on integrated electronic elements.

After exiting the electrolytic plating apparatus, the substrate can be further processed according to all steps known to those skilled in the art. For example, remaining electrolyte residue may be removed from the substrate by washing and / or the substrate may be dried.

The device according to the invention for the electroplating of electrically conductive substrates or electrically conductive structures on electrically nonconductive substrates can, according to the requirements, be equipped with any auxiliary device known to those skilled in the art. Such auxiliary devices are, for example, pumps, filters, chemical supply devices, winding instruments and unwinding instruments.

Any method for treating electrolyte solutions known to those skilled in the art can be used to shorten maintenance time. For example, this treatment is also used in systems in which the electrolyte solution is self regenerated.

In addition, the apparatus according to the present invention can be found, for example, in the Handbook on Printed Circuit Techniques of Werner Gillek, Gustle Keller, and in the 2003 edition of Eugene Rat, Roy Ferrer, Volume 4, pages 192, 260, 349, 351, 352 and 359. Can be operated in a known pulse manner.

The electrolytic plating apparatus can be used for any conventional metal plating. In this case the composition of the electrolyte solution used for plating depends on the metal to be plated in the electrically conductive structure on the substrate. Typical metals deposited on the electrically conductive surface by electrolytic plating are, for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium.

Suitable electrolyte solutions that can be used for electroplating of electrically conductive structures are described, for example, in the Handbook on Printed Circuit Techniques of Werner Zilek, Gustle Keller, and in the 2003 edition of Eugene Rat, Royche Perlac, Vol. 4, 192, 260, 349, It is known to those skilled in the art from pages 351, 352, 359.

An advantage of the device according to the invention and the method according to the invention is that the discs which are joined together provide a larger contact area than when using rolls as known from the prior art and thus longer contact times per unit area. Is in point. Thus, the metal can grow more and form a shorter path while having a more uniform layer thickness. In addition, the installation can also be more compact, which allows for greater throughput with less operating costs. Another important advantage is that even now very short structures, such as those required in the fabrication of circuit boards, have better control and above all reproducibility with a uniform layer thickness than is possible with roll systems known from the prior art. It can be manufactured quickly while maintaining.

The invention will be explained in more detail below with the aid of the drawings. The figures each show only one possible embodiment as an example. In addition to the embodiments mentioned, the invention can of course also be practiced in further embodiments or in combinations of these embodiments.

1 is a plan view of a device constructed in accordance with the present invention.

2 is a side view of a device constructed in accordance with the present invention.

3 is a side view of a second embodiment of a device constructed in accordance with the present invention.

4 shows a shaft on which one disc is mounted.

FIG. 5 shows a disk constructed in accordance with the invention with individual sections distributed around and electrically insulated from another section. FIG.

6 shows a contact disk for current supply.

1 is a plan view of a device constructed in accordance with the present invention. A plurality of first disks 2 are arranged on the first shaft 1. The discs 2 are each mounted on the shaft 1 at predetermined intervals 3. The spacing 3 is selected such that the disk 4 fixed on the second shaft 5 can be engaged in the spacing. The spacing 6 of the second disk 4 is selected so that the first disk 2 can be respectively coupled between the two second disks 4.

In the embodiment shown in FIG. 1, the first disk 2 mounted on the first shaft 1 and the second disk 4 mounted on the second shaft 5 are each the same in width. However, it is also possible to provide disks with different widths. In this case, discs of the same width may each be provided on one shaft, whereas discs having a width different from the width of the disc on the first shaft may be provided on the second shaft, or discs having a different width may be provided. It is mounted on one shaft. When discs of different widths are mounted on one shaft, between two discs on the second shaft and joined between two discs on the second shaft so that discs of different widths can be combined within the gap. It is necessary to select the distance accordingly.

Further, preferably, at least two shaft pairs with disks engaged with each other can be connected in series. The shaft pairs can then be aligned to be offset from each other. It is also possible for the disks of the front shafts of the rear pair to be engaged in the gap between the disks of the rear shafts of the front pair.

The spacing 3 between the two first disks 2 is at least equal to the width of the second disk 4. The spacing 6 of the second disk 4 is similarly at least equal to the width of the first disk 2. Since the spacings 3 and 6 between the two disks 2 and 4 are preferably larger than the widths of the disks 2 and 4 respectively coupled within this spacing, the electrolyte solution has such spacing in the direction of the substrate to be plated. Can flow through. The engagement depth 7 when the second disk 4 engages in the first disks 2 depends on the spacing for which the first disk 2 and the second disk 4 are intended to contact the substrate. . For example, the disks 2, 4 are precisely coupled to each other precisely in the edge region or the first disk 2 is widely coupled between the second disks 4 so that the first disk 2 is connected to the second shaft ( 5) can barely reach. If the diameters of the first disk 2 and the second disk 4 are the same, in this case the second disk 4 also comes into contact with the first shaft 1. However, the first disk 2 and the second disk 4 are not necessarily configured to have the same diameter. It is also possible for the diameters of the first disk 2 and the second disk 4 to be different.

2 is a side view of a device constructed in accordance with the present invention.

2 shows how the first disk 2 is coupled in the second disk 4. The contact between the electrically conductive structure 30 to be plated on the substrate 31 and the disks 2 and 4 is made while maintaining the distance between the axial midpoints of the first shaft 1 and the second shaft 5. The closer the axial midpoints of the first shaft 1 and the second shaft 5 are to each other, the closer the contact points of the first disk 2 and the second disk 4 with the substrate are located. The interval between the first disk 2 and the second disk 4 in contact with the substrate is indicated by reference numeral 8 .

In the embodiment shown here, the substrate 31 is carried by the conveying device 32 through a bath of electrolyte solution. The conveying device 32 in the embodiment shown here comprises an endless belt 33 extending around two shafts 34, 35. The distance between the belt 33 and the disks 2, 4 is selected such that the substrate 31 with the electrically conductive structure 30 is pressed on the disks 2, 4 by applying a predetermined force. The electrically conductive structure 30 is fixed by mounting the conveying device 32 and by pressing the disks 2, 4, for example by applying a predetermined force on the substrate 31 with the electrically conductive structure 30. It can be selectively pressed on the discs 2, 4, and the shafts 1, 5 of the discs 2, 4 can be elastically mounted at the ends of the structure. Alternatively, the axes 1, 5 of the discs 2, 4 may be fixedly mounted, and a force determined in advance to be exerted may act on the substrate 31 by the conveying device 32. For this purpose, the shafts 34, 35 of the conveying device 32 are preferably mounted elastically. Instead of the conveying device 32 as shown in FIG. 2, a plurality of individual shafts arranged next to each other can also be used as the conveying device. Instead of the conveying device 32, it is also possible to provide a second device according to the invention, which comprises at least two axes on which the discs which engage with one another are arranged.

To ensure transport, the discs 2, 4 can drive either the fixed shafts 1, 5 or the shafts 34, 35 with endless belts 33. It is also possible to drive both the shafts 1, 5 and the shafts 34, 35 on which the disks 2, 4 are arranged. The drives of the shafts 1, 5 and 34, 35 are preferably arranged outside the bath. On the one hand, each shaft 1, 5, 34, 35 can be driven individually, but preferably the shafts 1 and 5 are driven by a first drive and the shafts 34 and 35 are second Driven or all shafts 1, 5, 34, 35 are driven by a common drive. The individual shafts 1, 5 and / or 34, 35 are connected together, for example by means of gears, chains or belt transmissions.

An anode 36 is also provided in the bath to allow current to flow in the electrolyte solution and thus electrolytic plating of the electrically conductive structure 30. The anode 36 may be configured in the form of a flat rod, for example as shown herein. The anode 36 is preferably arranged near the electrically conductive structure 30 to be plated. In such a case, care must be taken not to contact the anode 36 with the electrically conductive structure 30 because otherwise the metal already deposited in the electrically conductive structure is removed again. In addition to the embodiment of the anode 36 in the form of a flat rod, the anode 36 may also be configured as a flat metal or as an elastic wire, for example as a helical wire. It is also possible to use other anode forms known to those skilled in the art. The anode may be insoluble or soluble.

Materials for the insoluble anode 36 are known to those skilled in the art. For the soluble energy 36, it is preferable to use a metal deposited on the electrically conductive structure 30.

3 is a side view of a device constructed according to the invention in a further embodiment.

Unlike the embodiment shown in FIG. 2, in the apparatus shown in FIG. 3, the electrically conductive structure 30 can be plated simultaneously on the upper side and the lower side of the substrate 31. It is also possible to electroplate the holes 37 in the substrate so that an electrically conductive connection between the electrically conductive structure 30 on the upper side of the substrate 31 and the electrically conductive structure 30 on the lower side of the substrate is obtained. Can be. To this end, a device comprising at least two shafts 1, 5 on which discs 2, 4, which are joined to each other, is arranged on the upper side of the substrate 31, and the discs 2, An apparatus comprising at least two shafts 1, 5 on which 4) is disposed is arranged on the lower side of the substrate 31. The substrate is guided between these devices. The substrate is preferably carried by the disks 2, 4 in contact with the electrically conductive structure 30. To this end, it drives all the shafts 1, 5 on which the discs 2, 4 are arranged, or only drives the respective shafts 1, 5 while the substrate is in contact with the discs 2, 4 on these shafts. Other shafts are mounted so that these disks are set during rotation by the substrate 31.

Figure 4 shows a shaft constructed in accordance with the invention as mounted on a disk.

The disk 10 as shown in FIG. 4 consists of individual sections 11. The sections 11 are each electrically insulated from each other by an insulator 12. Thus, for example, the sections 11 located next to each other can be connected differently. For example, one section 11 can be connected to the cathode while the neighboring section 11 is connected to the anode. The advantage of this embodiment is that the metal deposited on the given section 11 is removed from this section 11 again when the section is connected to the anode while the given section 11 is connected to the cathode. The metal deposited on the individual sections 11 can thus be removed during the operation of the plating apparatus. In order to allow the sections 11 located next to each other to be connected differently, their current supply 13 is provided for each section 11 on each individual disk 10, or adjacent disks ( Each continuous current supply 13 in contact with the neighboring section 11 of 10 may be provided, in which the neighboring sections 11 of the disk 10 located next to each other are connected in the same way. Because it can. An insulated cable fixed on the outer periphery of the roll is suitable as the current supply 13, for example. Instead of being on the outer perimeter of the shaft 14, the insulated cable can also extend into the shaft 14. For this purpose, for example, it is necessary to configure the shaft 14 as a hollow shaft.

In addition to the current supply via an insulated cable, the current supply can also be made directly via the shaft. To this end, with respect to the disk 10 constructed in separate sections 11 electrically insulated from each other, the shaft 14 is similarly constructed in separate sections electrically insulated from each other. The current supply can thus each take place via a separate section that is electrically conductive of the shaft 14. For this purpose, the sections 11 of the disk 10 are respectively connected to the electrically conductive sections of the shaft 14.

When the current supply to the individual sections 11 of the disk 10 is made respectively via a current supply 13 in the form of an insulated cable, the individual sections 11 are for example connected by a cable connection 15 to the current supply 13. Are each connected to. The cable connection 15 as shown in FIG. 4 may also provide the cable connection 15 at the end of the individual segment 11 facing the shaft 14 but prevent any lateral expansion of the disk 10. It may be arranged outside the disk 10 to do so. This can be done, for example, using a pin inserted in an insulated cable which functions as the current supply 13.

5 is a side view of the disk according to FIG. 4.

In the embodiment shown here, the current supply of the individual segments 11 of the disk 10 is via a respective insulated cable arranged around the outside of the shaft 14. When a plurality of discs 10 are arranged next to each other on the same shaft 14, the openings through which the cables 17 through can be guided are preferably separated into individual segments (at the sides facing the shaft 14). 11) is formed. The individual segments 11 are connected to the cable via the contact connection 15.

In order to improve the electrolyte supply to the substrate to be plated, recesses 16 may be formed in the segment 11. In this case, the electrolyte solution may flow through the recess 16. The recesses 16 may be formed in each individual segment 11 of the disk 10 only, or may be formed in all segments 11 of the disk 10. In addition, instead of the recesses 16 in the disk 10, it is also possible to configure the disk 10 in the form of a wheel in which an electrically conductive ring with individual spokes is coupled on the shaft 14. In order to enable electroplating of the substrate, the disk 10 needs to be electrically conductive on its outer periphery. To this end, it is also possible to provide the disk 10 with an annular contact area 18, for example provided around the outside of the disk 10. Conventional materials currently used for insoluble anodes and known to those skilled in the art may be suitable, for example, as materials for the annular contact region 18. It may for example be titanium plated with a conductive mixture of metal oxides.

When only the annular contact region 18 is configured to be electrically conductive, the individual segments 11 can be made of an electrically insulating material in the region between the annular contact region 18 and the shaft 14. In such a case, it is only necessary to provide a current conductor through the electrically conductive material or on the surface of the individual segment, and in the embodiment shown here, the current supply part configured as a cable 17 seated around the outside of the shaft ( The voltage from 13 can be transferred to the annular contact region 18 by the current lead. However, when only the annular contact region 18 is configured to be electrically conductive, in order to alternately enable anode connection and cathode connection, there is alternatively an insulation between the individual segments 19 of the annular contact region 18, respectively. It is enough to provide (12). Directly by this, the segments 19 of the annular contact region 18 are electrically insulated from each other sufficiently to prevent a short circuit between the anode connected segment 19 and the cathode connected segment 19.

6 shows an embodiment of a current supply of a device constructed in accordance with the invention.

The supply of current to the shaft 14, on which the disk 10 is arranged, can be effected, for example, via an additional disk 20 arranged outside the bath of electrolyte solution. The additional disk 20 is configured similarly to the disk 10, for example, in which the substrate to be plated is in contact. For this purpose, the additional disk 20 likewise comprises an annular contact area 18 which is divided into individual segments 19. Instead of the annular contact region 18, it is also possible to manufacture each of the individual segments 11 of the additional disk 20 entirely of electrically conductive material. In order to reduce the weight, it is also possible to provide a recess 16 in the individual segment 11 for the additional disk 20. The recess 16 may be formed in each segment 11 or only in an individual segment 11. In the embodiment shown in FIG. 6, the individual segments 19 of the annular contact region 18 are electrically connected to a current supply 13 which is similarly configured in the form of a cable 17 arranged around the outside of the shaft 14. Connected.

If the entire section 11 is made of an electrically conductive material, it is preferred that the additional disk 20 is provided with an electrical insulation on the front face of the end so that an electrically conductive surface exists only on the outer periphery. This can prevent injuries caused by accidental contact with the disk 20.

In order to supply voltage to the annular contact region 18, in the embodiment shown herein, the cathode slide contact 21 connected to the cathode current supply 22 and the anode slide contact connected to the anode current supply 24 ( 23) is provided. Any slide contact known to those skilled in the art can be used as cathode slide contact 21 and anode slide contact 23.

When constructing the shaft with discrete segments of electrical conductivity separated from each other by insulation, the current supply can also be made directly to the shaft via the slide contacts. In this case, the additional disk 20 is not necessary.

In order to prevent a short circuit, the distance between the anode slide contact 23 and the cathode slide contact 21 should each be formed sufficiently far. The gap 25 between the anode slide contact 23 and the cathode slide contact 21 must be greater than the width of the segment 19. If the width 25 of the section is less than or equal to the width of the segment 19, a short circuit occurs every time the segment 19 contacts the cathode slide contact 21 and the anode slide contact 23 simultaneously.

The anode contact region is preferably larger than the cathode contact region so that all metal deposited on the disk 10 can be removed from the disk again while the disk is connected to the cathode. This means that it is desirable to have more anode connected segments than cathode connected segments. The maximum number of cathode connected segments 19 corresponds to the number of anode connected segments 19.

In the case of the cable 17 extending radially in the shaft 14, in the embodiment shown in FIG. 5, the substrate to be plated must be guided along the lower side of the disk 10. If the substrate is guided along the upper side of the disk 10 so that the lower side of the substrate is plated, the cathode slide contact must be placed on the upper side of the additional disk 20 and the anode slide contact is disposed on the lower side of the additional disk 20. Should be.

In order to be able to plate the substrate simultaneously on the upper side and the lower side of the substrate, two electrolytic plating apparatuses, one on top of the other or adjacent to each other, can be arranged, and the substrate is guided through these devices to guide the disk 10 The upper side and the lower side are in contact at the same time.

The substrate may be guided along each device at any predetermined angle, as long as the segment in which the cathode contact is made with the substrate is located inside the electrolyte solution. It is not necessary to transport the substrate horizontally, ie parallel to the liquid surface, through the bath. For example, if the substrate to be plated is sufficiently rigid, it is even possible to guide the substrate perpendicularly to the liquid surface along the disk 10 for contact.

Claims (24)

An apparatus for electrolytic plating of a structured surface or of an entire surface that is conductive on at least one electrically conductive substrate or non-conductive substrate, At least one bath, one anode, and one cathode, the bath containing an electrolyte solution containing at least one metal salt and from the electrolyte solution while the cathode is in contact with the surface of the substrate to be plated. Metal ions are deposited on the electrically conductive surface of the substrate to form a metal layer, the substrate being transported through the bath, the cathode being mounted on each shaft 1, 5, 14 so as to be rotatable. , 4, 10, wherein these disks (2, 4, 10) are bonded to each other. 2. An electrolytic plating apparatus according to claim 1, wherein a plurality of said disks (2, 4, 10) are arranged next to each other on each shaft (1, 5, 14). Electrolytic plating apparatus according to claim 2, wherein the spacing between two disks (2, 4, 10) on the shaft (1, 5, 14) at least corresponds to the width of the disks (2, 4, 10). The electroplating apparatus according to any one of claims 1 to 3, wherein the disk (2, 4, 10) is supplied with a voltage via a shaft (1, 5, 14). 5. Electrolytic plating apparatus according to claim 4, wherein the shafts (1, 5, 14) and discs (2, 4, 10) are at least partially made of an electrically conductive material that is not transferred to the electrolyte solution during operation of the apparatus. 6. Electrolytic plating apparatus according to any one of the preceding claims, wherein a recess (16) is formed in the disk (2, 4, 10). 7. Electrolytic plating apparatus according to claim 6, wherein the disk (2, 4, 10) comprises a ring fixed on the shaft by spokes. 8. Electrolytic plating apparatus according to any one of the preceding claims, wherein the disks (2, 4, 10) have separate sections (11) electrically insulated from one another and distributed over the perimeter. 9. Electrolytic plating apparatus according to claim 8, wherein the sections (11) electrically insulated from each other can be connected both to the cathode and to the anode. 10. The shaft (1) according to claim 8 or 9, wherein the shafts (1) and (5) consist of a plurality of electrically conductive segments, each separated from each other by non-conductive segments, the electrically insulated segments both as cathodes and as anodes. Connectable, the conductive segment of the shaft being in contact with the electrically conductive section (11) of the disc, respectively. Electrolytic plating apparatus according to claim 1, wherein the disks 2, 4, 10 can be lifted off the substrate 31 or can be lowered on the substrate. . The electrolytic plating apparatus according to any one of claims 1 to 11, wherein the electroplating apparatus further comprises an apparatus which allows the substrate 31 to be rotated and which can be disposed inside or outside the bathtub. . The two electroplating apparatuses according to any one of claims 1 to 12, each having at least two shafts (1, 5) on which the disks (2, 4, 10) to be joined to each other are opposed to each other. The substrate 31 to be plated so as to be plated may pass between these electroplating apparatuses, and at least two shafts 1 and 5 on which the disks 2, 4 and 10 that are coupled to each other are disposed may be formed of the substrate 31. Electrolytic plating device which is in contact with the upper side and the lower side, respectively. The disks 2, 4 and 10, which are joined to each other, are arranged in order to plate the flexible support which is released from the first roll and wound on the second roll. The plurality of electroplating apparatuses each having at least two shafts 1 and 5 are arranged on one another or adjacent to each other, wherein the flexible support passes through the electroplating apparatus in a curved form. Electrolytic plating device. An apparatus for electrolytic plating of a structured surface or an entire surface of a conductive surface on at least one electrically conductive substrate or non-conductive substrate, comprising: a plurality of electrolytic plating apparatus according to any one of claims 1 to 14 connected in series Electrolytic plating device that comprises. A method of electroplating a structured surface or an entire surface of at least one electrically conductive substrate or a non-conductive substrate, wherein the electrolytic plating is performed in the electrolytic plating apparatus according to any one of claims 1 to 15. Plating method. The method of claim 16, wherein the disks that contact the substrate are cathode connected and the disks that do not contact the substrate can be connected anode. The method of claim 16, wherein the section of the disk in contact with the substrate is cathode connected and the section of the disk not in contact with the substrate can be connected anode. 19. The electroplating method according to any one of claims 16 to 18, wherein the disk is supplied with a voltage via a shaft. 18. The electroplating method according to claim 16, wherein the shaft is connected to the anode for removing the metal foil during production stop. Use of an electrolytic plating apparatus according to any one of claims 1 to 15 for electrolytic plating of structured or entire surfaces conductive on at least one electrically conductive substrate or non-conductive substrate. Production of conductor tracks on printed circuit boards, RFID antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, foil conductors, solar cells or LCD / plasma display screens, Or the use of an electroplating apparatus according to any one of claims 1 to 15 for the production of an electroplated product in any form. Use of an electroplating apparatus according to claims 1 to 15 for the manufacture of decorative or functional surfaces on a product used for shielding or shielding thermally conductive radiation of electromagnetic radiation or for use as a package. Use of an electrolytic plating apparatus according to any one of claims 1 to 15 for producing a polymer support or thin metal foil clad with metal on one or both sides.

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