JP2001127400A - Rack for surface treatment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a rack with an improve property for preventing treatment irregularity due to the contact of a substrate. SOLUTION: The rack for surface treatment consists of a cage-type rack outer box, a bar that is provided at the upper and lower sides of the rack outer box for separating a substrate, a spring of a separation bar being provided between the upper-side and lower-side bars and being mounted to the upper-side and lower-side bars so that it can travel, a round rod for connecting both the springs, and a separation bar that is made of a disk-shaped pivot block with a longer diameter than that of the round rod being provided at the round rod at a fixed interval.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment rack used in a manufacturing process of a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, a double-sided printed wiring board has been manufactured by forming a circuit by drilling holes in a copper-clad laminate, metalizing the inner walls of the holes, and etching away unnecessary copper foil. In this manufacturing process, when the inner wall of the hole is metallized, electroless plating is first performed, and then electrolytic plating is performed thereon. First, electroless plating is carried out because the inner wall of the hole drilled in the copper-clad laminate is an insulator, so that electricity does not conduct, so the metal does not precipitate even if electrolytic plating is performed. We are plating. In this electroless plating, it is not simply formed by immersion in an electroless plating solution, but before that, the surface must be brought into a state suitable for electroless plating, and is generally called surface roughening. After oxidizing the resin surface of the inner wall of the hole with a strong acidic solution such as concentrated sulfuric acid, chromic acid, alkali permanganate or a mixed acid thereof to form irregularities, a plating catalyst is attached and the catalyst is nucleated. To deposit the plating metal. There is also known a method in which a solvent such as an amide-based, alcohol-based, ketone-based, ether-based, or ester-based solvent is contacted without using an acidic solution to swell the resin to form irregularities. As described above, after roughening the insulating surface of the inner wall of the hole, it is performed through a process such as a pre-dip process, a sensitizing process, and an adhesion promoting process which is called a pre-process of electroless plating. Pre-dip processing is a process of cleaning and removing rust on the copper surface that is electrically connected to the dirt on the insulating surface.
The sensitization treatment is performed by attaching a plating catalyst such as palladium to the surface to be plated, and immersed in a solution mixed with a compound such as palladium chloride. It is reduced to metallic palladium by the contained reducing agent. The next adhesion promoting treatment is a treatment for making the plating solution wet easily, and is immersed in a solution containing a surfactant or the like. As described above, in the printed wiring board, there are many steps for surface treatment, and many steps are important for circuit formation.

In order to perform such a surface treatment, a plurality of substrates to be processed are placed in a cage-shaped box called a rack, separated from each other so as not to come into contact with each other, and placed in an upright state. While keeping it, it is immersed in a tank storing each solution. This rack is usually composed of a basket-shaped rack outer box and bars provided on the upper and lower sides of the rack outer box for separating substrates.

[0004]

However, with the development of electronic devices, circuit boards have become thinner and smaller. As the weight is becoming lighter and the thickness of the board is becoming thinner, if you try to put the board in a rack like before and perform the processing, the board will bend under its own weight, However, there is a problem that the processing may not be performed sufficiently due to contact with an adjacent substrate.

An object of the present invention is to provide a rack excellent in preventing processing unevenness due to contact of a substrate.

[0006]

According to the present invention, there is provided a surface treatment rack comprising: a cage-shaped rack outer box; and bars provided on upper and lower sides of the rack outer box for separating substrates. There is a separation bar provided between the upper bar and the lower bar, a spring movably attached to each of the upper bar and the lower bar, a round bar connecting both springs, and a round bar. And a separation bar composed of a disc-shaped piece having a diameter larger than that of the round bar and provided at regular intervals.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION A cage-shaped rack outer box 1 can be used as it is for a normal rack, and can be made of a wire or steel wire coated with heat-resistant vinyl, rubberized, or rigid. Those made of high plastic can be used.

In the upper and lower sides of the rack outer box 1,
As the bar 2 provided for separating the substrate, the same as that used for the outer box of the rack, the one used for a normal rack can be used as it is, and a wire or steel wire coated with heat-resistant vinyl or rubberized, Alternatively, a member made of highly rigid plastic or the like can be used.

As shown in FIG. 1, the separation bar includes a spring 7 movably attached to each of an upper bar and a lower bar, a round bar 5 connecting both springs 7, and a round bar 5. And a disc-shaped top 6 having a larger diameter than the round bar 5 provided at regular intervals. This spring 7
Need to be movably attached to the bar 2. For example, the bar 7 may be attached in a state where the round bar 5 connected to the spring 7 is tensioned. In this manner, the separation bar can be moved to a portion of the substrate that does not become a product, and the separation bar can be prevented from being contacted and processed.

The round bar 5 may be any material that can withstand the processing liquid, and may be made of stainless steel, plastic, or the like. The disk-shaped top 6 having a large diameter is preferably made of the same material as the round bar 5 or a material softer than the substrate material, such as vinyl chloride or polypropylene, without damaging the substrate.

[0011]

As described above, according to the present invention, it is possible to provide a rack excellent in preventing processing unevenness due to contact of a substrate.

[Brief description of the drawings]

FIG. 1A is a front view and a side view showing one embodiment of the present invention, and FIG. 1B is a side view thereof.

[Explanation of symbols]

 1. Rack outer box 2. Bar 3. Substrate 5. Round bar 6. Top 7 Spring

Claims (1)

[Claims] 1. A basket-shaped rack outer box, bars provided on upper and lower sides of the rack outer box for separating substrates, and a bar provided between an upper bar and a lower bar. There is a separation bar, a spring movably attached to each of the upper bar and the lower bar, a round bar connecting both springs, and a larger bar than the round bar provided at regular intervals on the round bar. A surface treatment rack having a separation bar composed of a disc-shaped piece having a diameter.