RU2009124293A - DEVICE AND METHOD FOR ELECTRICAL COATING - Google Patents

DEVICE AND METHOD FOR ELECTRICAL COATING Download PDF

Info

Publication number
RU2009124293A
RU2009124293A RU2009124293/02A RU2009124293A RU2009124293A RU 2009124293 A RU2009124293 A RU 2009124293A RU 2009124293/02 A RU2009124293/02 A RU 2009124293/02A RU 2009124293 A RU2009124293 A RU 2009124293A RU 2009124293 A RU2009124293 A RU 2009124293A
Authority
RU
Russia
Prior art keywords
cathode
substrate
rollers
roller
contact
Prior art date
Application number
RU2009124293/02A
Other languages
Russian (ru)
Inventor
Рене ЛОХТМАН (DE)
Рене Лохтман
Юрген КАЧУН (DE)
Юрген КАЧУН
Норберт ВАГНЕР (DE)
Норберт Вагнер
Юрген ПФИСТЕР (DE)
Юрген ПФИСТЕР
Герт ПОЛЬ (DE)
Герт ПОЛЬ
Original Assignee
Басф Се (De)
Басф Се
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Басф Се (De), Басф Се filed Critical Басф Се (De)
Publication of RU2009124293A publication Critical patent/RU2009124293A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

1. Устройство для гальванического покрытия структурированного или голоэдрического основного слоя (9) на поверхности субстрата (7), которое включает, по меньшей мере, одну гальваническую ванну (3) с, по меньшей мере, одним включаемым в качестве катода, установленным с возможностью вращаться валиком (2), который во время гальванического покрытия контактирует с основным слоем (9), причем основной слой (9) покрыт раствором электролита, содержащимся в гальванической ванне (3), и во время покрытия движется относительно, по меньшей мере, одного валика (2), отличающееся тем, что, по меньшей мере, один включаемый в качестве катода валик (2) во время контакта с основным слоем (9) включен в качестве катода и, как только контакт с основным слоем (9) отсутствует, обесточен или включен в качестве анода, причем валики (2) окружены защитным экраном (21), который в очень значительной мере препятствует подводу раствора (5) электролита к поверхности валиков (2), и, причем между защитным экраном (21) и поверхностью субстрата (7) образован зазор, который между защитным экраном (21) и поверхностью субстрата (7) закрыт с помощью валика с эластичной поверхностью. ! 2. Устройство по п.1, отличающееся тем, что, по меньшей мере, один включаемый в качестве катода валик неподвижно установлен в гальванической ванне (3), в то время как субстрат (7) с основным слоем (9) транспортируется через гальваническую ванну (3). ! 3. Устройство по п.1, отличающееся тем, что в гальванической ванне (3) последовательно включены, по меньшей мере, два включаемые в качестве катода валика (2). !4. Устройство по п.1, отличающееся тем, что между защитными экранами (2) двух включаемых в качестве катода валико� 1. Device for electroplating a structured or holohedral base layer (9) on the surface of the substrate (7), which includes at least one electroplating bath (3) with at least one included as a cathode, installed with the ability to rotate roller (2), which during the electroplating is in contact with the main layer (9), and the main layer (9) is covered with an electrolyte solution contained in the electroplating bath (3), and during the coating moves relative to at least one roller ( 2), characterized in that at least one bead (2) switched on as a cathode during contact with the base layer (9) is switched on as a cathode and, as soon as there is no contact with the base layer (9), it is de-energized or switched on as an anode, and the rollers (2) are surrounded by a protective screen (21), which to a very large extent prevents the supply of the electrolyte solution (5) to the surface of the rollers (2), and, moreover, between the protective screen (21) and along the surface of the substrate (7) forms a gap, which is closed between the protective screen (21) and the surface of the substrate (7) by means of a roller with an elastic surface. ! 2. The device according to claim 1, characterized in that at least one roller included as a cathode is stationary in the electroplating bath (3), while the substrate (7) with the base layer (9) is transported through the electroplating bath (3). ! 3. A device according to claim 1, characterized in that in the galvanic bath (3) at least two rollers (2) are connected in series as a cathode. !4. The device according to claim 1, characterized in that between the protective screens (2) two rollers included as a cathode

Claims (15)

1. Устройство для гальванического покрытия структурированного или голоэдрического основного слоя (9) на поверхности субстрата (7), которое включает, по меньшей мере, одну гальваническую ванну (3) с, по меньшей мере, одним включаемым в качестве катода, установленным с возможностью вращаться валиком (2), который во время гальванического покрытия контактирует с основным слоем (9), причем основной слой (9) покрыт раствором электролита, содержащимся в гальванической ванне (3), и во время покрытия движется относительно, по меньшей мере, одного валика (2), отличающееся тем, что, по меньшей мере, один включаемый в качестве катода валик (2) во время контакта с основным слоем (9) включен в качестве катода и, как только контакт с основным слоем (9) отсутствует, обесточен или включен в качестве анода, причем валики (2) окружены защитным экраном (21), который в очень значительной мере препятствует подводу раствора (5) электролита к поверхности валиков (2), и, причем между защитным экраном (21) и поверхностью субстрата (7) образован зазор, который между защитным экраном (21) и поверхностью субстрата (7) закрыт с помощью валика с эластичной поверхностью.1. Device for electroplating a structured or holohedral base layer (9) on the surface of a substrate (7), which includes at least one electroplating bath (3) with at least one being included as a cathode mounted for rotation a roller (2), which during electroplating is in contact with the base layer (9), the main layer (9) being covered with an electrolyte solution contained in the electroplating bath (3), and during coating moving relative to at least one roller ( 2) characterized in that at least one roller (2) included as a cathode during contact with the main layer (9) is included as a cathode and, as soon as contact with the main layer (9) is absent, de-energized or included as an anode moreover, the rollers (2) are surrounded by a protective screen (21), which very much prevents the supply of the electrolyte solution (5) to the surface of the rollers (2), and, moreover, a gap is formed between the protective screen (21) and the surface of the substrate (7), which between the protective screen (21) and the surface of the substrate (7) is closed with Strongly roller with an elastic surface. 2. Устройство по п.1, отличающееся тем, что, по меньшей мере, один включаемый в качестве катода валик неподвижно установлен в гальванической ванне (3), в то время как субстрат (7) с основным слоем (9) транспортируется через гальваническую ванну (3).2. The device according to claim 1, characterized in that at least one roller included as a cathode is fixedly mounted in the galvanic bath (3), while the substrate (7) with the main layer (9) is transported through the galvanic bath (3). 3. Устройство по п.1, отличающееся тем, что в гальванической ванне (3) последовательно включены, по меньшей мере, два включаемые в качестве катода валика (2).3. The device according to claim 1, characterized in that in the plating bath (3), at least two rollers (2) included as a cathode are sequentially included. 4. Устройство по п.1, отличающееся тем, что между защитными экранами (2) двух включаемых в качестве катода валиков (2) установлен анод (29).4. The device according to claim 1, characterized in that between the protective shields (2) of two rollers (2) included as a cathode, an anode (29) is installed. 5. Устройство по п.4, отличающееся тем, что анод (29) образован в виде решетчатого анода.5. The device according to claim 4, characterized in that the anode (29) is formed in the form of a trellised anode. 6. Устройство по п.4, отличающееся тем, что между двумя защитными экранами (21) в область анода (29) может добавляться раствор электролита.6. The device according to claim 4, characterized in that an electrolyte solution can be added between the two shields (21) in the region of the anode (29). 7. Устройство по п.1, отличающийся тем, что подвод тока к включаемым в качестве катода валикам (2) осуществляется с помощью скользящего контакта (19).7. The device according to claim 1, characterized in that the current is supplied to the rollers (2) included as a cathode using a sliding contact (19). 8. Устройство по п.7, отличающееся тем, что включаемые в качестве катода валики (2) субстратом (7) прижимаются к скользящему контакту (19).8. The device according to claim 7, characterized in that the rollers (2) included as a cathode are pressed against the sliding contact (19) by the substrate (7). 9. Устройство по п.1, отличающееся тем, что соответственно два валика (2) располагаются напротив, между которыми пропускается субстрат (7), так что одновременно могут покрываться основной слой (9) на верхней стороне (11) и на нижней стороне (13) субстрата (7).9. The device according to claim 1, characterized in that, respectively, two rollers (2) are located opposite, between which the substrate (7) is passed, so that at the same time the main layer (9) can be covered on the upper side (11) and on the lower side ( 13) substrate (7). 10. Устройство по п.1, отличающееся тем, что напротив валиков (2) лежит транспортное устройство, которым субстрат транспортируется вдоль к валикам (2).10. The device according to claim 1, characterized in that opposite to the rollers (2) lies a transport device by which the substrate is transported along to the rollers (2). 11. Устройство по одному из пп.1-10, отличающееся тем, что включаемые в качестве катода валики (2) расположены по периметру вращающегося вала (41).11. The device according to one of claims 1 to 10, characterized in that the rollers (2) included as a cathode are located around the perimeter of the rotating shaft (41). 12. Устройство по п.11, отличающееся тем, что вращающийся вал (41) образован в виде полого вала, в котором расположен, по меньшей мере, один анод (43).12. The device according to claim 11, characterized in that the rotating shaft (41) is formed in the form of a hollow shaft in which at least one anode (43) is located. 13. Способ гальванического покрытия структурированного или голоэдрического основного слоя (9) на поверхности субстрата (7), причем основной слой окружен раствором (5) электролита и контактирует с, по меньшей мере, одним включаемым в качестве катода валиком (2), отличающийся тем, что включаемый в качестве катода валик (2) включается в качестве катода, когда он контактирует с основным слоем (9) и/или субстратом (7), и обесточивается или включается в качестве анода для удаления осевшего на нем материала, как только отсутствует контакт с основным слоем (9) и/или субстратом (7).13. The method of galvanic coating of a structured or holohedral base layer (9) on the surface of a substrate (7), the main layer being surrounded by an electrolyte solution (5) and in contact with at least one roller (2) included as a cathode, characterized in that the roller (2) included as a cathode is turned on as a cathode when it is in contact with the base layer (9) and / or the substrate (7), and de-energized or turned on as an anode to remove material deposited on it as soon as there is no contact with main layer (9) and / or a substrate (7). 14. Способ по п.13, отличающийся тем, что субстрат (7) после первого процесса гальванического покрытия поворачивается вокруг оси перпендикулярно подлежащей покрытию поверхности и затем заново проходит процесс гальванического покрытия.14. The method according to item 13, wherein the substrate (7) after the first plating process is rotated around an axis perpendicular to the surface to be coated and then the plating process is repeated. 15. Применение устройства по п.1 или способа по п.13 для изготовления токопроводящих полосок на печатных платах, антеннах радиочастотной идентификации, ретрансляционных антеннах или других антенных структур, модулей чип-карт, плоских кабелей, нагревателей сидений, пленочных проводников, токопроводящих полосок в солнечных элементах или в LCD - соответственно плазменных экранах, для изготовления декоративных или функциональных поверхностей на изделиях, которые применяются для экранирования от электромагнитного излучения, для теплопроводности или в качестве упаковки, или для изготовления изделий, покрытых гальваническим способом, в любой форме. 15. The use of the device according to claim 1 or the method according to item 13 for the manufacture of conductive strips on printed circuit boards, radio frequency identification antennas, relay antennas or other antenna structures, chip card modules, flat cables, seat heaters, film conductors, conductive strips in solar cells or in LCD - respectively plasma screens, for the manufacture of decorative or functional surfaces on products that are used for shielding from electromagnetic radiation, for heat transfer either as packaging or for the manufacture of galvanically coated products in any form.
RU2009124293/02A 2006-11-28 2007-11-26 DEVICE AND METHOD FOR ELECTRICAL COATING RU2009124293A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06124862 2006-11-28
EP06124862.1 2006-11-28

Publications (1)

Publication Number Publication Date
RU2009124293A true RU2009124293A (en) 2011-01-10

Family

ID=39047993

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2009124293/02A RU2009124293A (en) 2006-11-28 2007-11-26 DEVICE AND METHOD FOR ELECTRICAL COATING

Country Status (10)

Country Link
US (1) US20090301891A1 (en)
EP (1) EP2099954A1 (en)
JP (1) JP2010511103A (en)
KR (1) KR20090083489A (en)
CN (1) CN101542022A (en)
BR (1) BRPI0719665A2 (en)
IL (1) IL198594A0 (en)
RU (1) RU2009124293A (en)
TW (1) TW200829726A (en)
WO (1) WO2008065069A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009112573A2 (en) * 2008-03-13 2009-09-17 Basf Se Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound
US9700249B2 (en) * 2008-04-15 2017-07-11 Nonin Medical, Inc. Non-invasive optical sensor
US20110204382A1 (en) * 2008-05-08 2011-08-25 Base Se Layered structures comprising silicon carbide layers, a process for their manufacture and their use
CN102083717A (en) * 2009-05-26 2011-06-01 无锡尚德太阳能电力有限公司 Transport roller
DE102010000211A1 (en) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Device for transporting plate-shaped substrates in a system for chemical and / or electrochemical treatment
CN101827444B (en) * 2010-03-31 2015-03-25 中兴通讯股份有限公司 Signaling configuration system and method for measuring reference signal
DE102010042642B4 (en) 2010-10-19 2013-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for galvanic coating of substrates and solar cells
US20130255858A1 (en) * 2012-04-03 2013-10-03 Jun-Chung Hsu Method of manufacturing a laminate circuit board
US9970297B2 (en) * 2014-08-29 2018-05-15 Rolls-Royce Corporation Composite fan slider with nano-coating
KR20160140241A (en) 2015-05-29 2016-12-07 전자부품연구원 Method of coating specimen based on plasma electrolytic oxidation
KR101578640B1 (en) * 2015-08-25 2015-12-17 선호경 PCB plating machine having partially reinforced transferring rollers
TWI658506B (en) 2016-07-13 2019-05-01 美商英奧創公司 Electrochemical methods, devices and compositions
CN108430170A (en) * 2018-01-29 2018-08-21 昆山群安电子贸易有限公司 A kind of production method of circuit board substrate
WO2020191330A1 (en) * 2019-03-20 2020-09-24 The Regents Of The University Of Colorado, A Body Corporate Electrochemical storage devices comprising chelated metals
AU2021329906A1 (en) 2020-08-18 2023-04-27 Enviro Metals, LLC Metal refinement
CN114481244B (en) * 2022-02-24 2022-08-23 广东盈华电子科技有限公司 Surface treatment process for high-temperature resistance and oxidation resistance of electrolytic copper foil
DE102022120646A1 (en) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Method for producing a flexible printed circuit (FPC) by depositing metal conductor tracks, printed circuit and printed circuit battery system

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019877A (en) * 1975-10-21 1977-04-26 Westinghouse Electric Corporation Method for coating of polyimide by electrodeposition
ATE100871T1 (en) * 1989-12-23 1994-02-15 Heraeus Elektrochemie METHOD AND DEVICE FOR CONTINUOUS ELECTROLYTIC DEPOSITION OF METAL IN TAPE FORM FROM SOLUTION AND USE OF THE DEVICE.
ATE125001T1 (en) * 1991-04-12 1995-07-15 Siemens Ag GALVANIZING DEVICE FOR PLATE-SHAPED WORKPIECES, IN PARTICULAR CIRCUIT BOARDS.
US5705219A (en) * 1991-04-22 1998-01-06 Atotech Deutschland Gmbh Method for coating surfaces with finely particulate materials
DE4212567A1 (en) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb DEVICE FOR TREATING OBJECTS, IN PARTICULAR GALVANIZING DEVICES FOR PCBS
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
DE19633796B4 (en) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Device for electroplating electronic circuit boards
EP1541719A3 (en) * 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE10043817C2 (en) * 2000-09-06 2002-07-18 Egon Huebel Arrangement and method for goods to be treated electrochemically
DE10248965A1 (en) * 2002-10-15 2004-04-29 Simmerlein, Ewald Wilhelm Contact system for an electroplating bath, can be a roller which is conductive for each contact point, with alternating switching as a cathode and anode
DE10342512B3 (en) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region
NL1025446C2 (en) * 2004-02-09 2005-08-10 Besi Plating B V Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric support as well as dielectric support.
DE102005033784A1 (en) * 2005-07-20 2007-01-25 Viktoria Händlmeier System for the electrodeposition of a conductive layer on a non-conductive substrate
DE102005038449B4 (en) * 2005-08-03 2010-03-25 Gebr. Schmid Gmbh & Co. Device for the treatment of substrates, in particular for the electroplating of printed circuit boards, and method
DE102005038450A1 (en) * 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Device for the treatment of substrates, in particular for the galvanization of substrates
CN101473072A (en) * 2006-04-18 2009-07-01 巴斯夫欧洲公司 Electroplating device and method
EP2010700B1 (en) * 2006-04-18 2010-01-20 Basf Se Electroplating device and method

Also Published As

Publication number Publication date
JP2010511103A (en) 2010-04-08
IL198594A0 (en) 2010-02-17
EP2099954A1 (en) 2009-09-16
WO2008065069A1 (en) 2008-06-05
CN101542022A (en) 2009-09-23
TW200829726A (en) 2008-07-16
BRPI0719665A2 (en) 2013-12-17
US20090301891A1 (en) 2009-12-10
KR20090083489A (en) 2009-08-03

Similar Documents

Publication Publication Date Title
RU2009124293A (en) DEVICE AND METHOD FOR ELECTRICAL COATING
JP2010511103A5 (en)
RU2008145108A (en) DEVICE AND METHOD FOR ELECTRICAL COATING
RU2008145105A (en) METHOD AND DEVICE FOR ELECTRICAL COATING
US7578048B2 (en) Patterns of conductive objects on a substrate coated with inorganic compounds and method of producing thereof
KR101076947B1 (en) Device and method for electrolytically treating electrically insulated structures
EP0136034A2 (en) Method of forming an electrically conductive member
RU2009129827A (en) METHOD FOR PRODUCING ELECTRIC CONDUCTING SURFACES
CN103518265A (en) Sheet assembly with aluminum based electrodes
RU2440444C2 (en) Device and method for electric contact of flat item in continuous action plants
JP2009534525A5 (en)
CA2191339C (en) Method and device for continuous uniform electrolytic metallising or etching
KR101326266B1 (en) Method for producing conductive non-woven fabric and Multi-fuctional Electro Magnetic Interference shield tape using conductive non-woven fabric
KR101091937B1 (en) A embedded antenna manufacturing method has the plating layer uniform
CN1969065B (en) Device and method for electrolytically treating flat work pieces
JP6431980B2 (en) Horizontal electrochemical deposition of metals
KR20060106572A (en) A film consecutive plating apparatus and method
JP3154267U (en) Plated material holder
KR20110097225A (en) Apparatus for plate substrate
EP2625318B1 (en) Device for single-sided electrolytic treatment of a flat substrate
JP2017222907A (en) Plating device
JP2012527525A (en) Method and apparatus for controlling electrochemical surface treatment
CN202830212U (en) Electroplating device
JP2015067854A (en) Chemical treatment apparatus
CN106242314A (en) A kind of glass copper-plating technique

Legal Events

Date Code Title Description
FA92 Acknowledgement of application withdrawn (lack of supplementary materials submitted)

Effective date: 20120317