IL198594A0 - Method and device for electrolytic coating - Google Patents

Method and device for electrolytic coating

Info

Publication number
IL198594A0
IL198594A0 IL198594A IL19859409A IL198594A0 IL 198594 A0 IL198594 A0 IL 198594A0 IL 198594 A IL198594 A IL 198594A IL 19859409 A IL19859409 A IL 19859409A IL 198594 A0 IL198594 A0 IL 198594A0
Authority
IL
Israel
Prior art keywords
electrolytic coating
electrolytic
coating
Prior art date
Application number
IL198594A
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL198594A0 publication Critical patent/IL198594A0/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Battery Electrode And Active Subsutance (AREA)
IL198594A 2006-11-28 2009-05-06 Method and device for electrolytic coating IL198594A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06124862 2006-11-28
PCT/EP2007/062805 WO2008065069A1 (en) 2006-11-28 2007-11-26 Device and method for electroplating

Publications (1)

Publication Number Publication Date
IL198594A0 true IL198594A0 (en) 2010-02-17

Family

ID=39047993

Family Applications (1)

Application Number Title Priority Date Filing Date
IL198594A IL198594A0 (en) 2006-11-28 2009-05-06 Method and device for electrolytic coating

Country Status (10)

Country Link
US (1) US20090301891A1 (en)
EP (1) EP2099954A1 (en)
JP (1) JP2010511103A (en)
KR (1) KR20090083489A (en)
CN (1) CN101542022A (en)
BR (1) BRPI0719665A2 (en)
IL (1) IL198594A0 (en)
RU (1) RU2009124293A (en)
TW (1) TW200829726A (en)
WO (1) WO2008065069A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110014492A1 (en) * 2008-03-13 2011-01-20 Basf Se Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound
US9700249B2 (en) * 2008-04-15 2017-07-11 Nonin Medical, Inc. Non-invasive optical sensor
KR20110014996A (en) * 2008-05-08 2011-02-14 바스프 에스이 Layered structures comprising silicon carbide layers, a process for their manufacture and their use
US20120132252A1 (en) * 2009-05-26 2012-05-31 Ji Jingjia Transport roller for transporting articles
DE102010000211A1 (en) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Device for transporting plate-shaped substrates in a system for chemical and / or electrochemical treatment
CN101827444B (en) * 2010-03-31 2015-03-25 中兴通讯股份有限公司 Signaling configuration system and method for measuring reference signal
DE102010042642B4 (en) 2010-10-19 2013-12-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for galvanic coating of substrates and solar cells
US20130255858A1 (en) * 2012-04-03 2013-10-03 Jun-Chung Hsu Method of manufacturing a laminate circuit board
US9970297B2 (en) * 2014-08-29 2018-05-15 Rolls-Royce Corporation Composite fan slider with nano-coating
KR20160140241A (en) 2015-05-29 2016-12-07 전자부품연구원 Method of coating specimen based on plasma electrolytic oxidation
KR101578640B1 (en) * 2015-08-25 2015-12-17 선호경 PCB plating machine having partially reinforced transferring rollers
SG11202005062SA (en) * 2016-07-13 2020-06-29 Alligant Scientific Llc Electrochemical methods, devices and compositions
CN108430170A (en) * 2018-01-29 2018-08-21 昆山群安电子贸易有限公司 A kind of production method of circuit board substrate
EP3942313A4 (en) * 2019-03-20 2024-05-15 Univ Colorado Regents Electrochemical storage devices comprising chelated metals
MX2023002015A (en) 2020-08-18 2023-04-11 Enviro Metals Llc Metal refinement.
CN114481244B (en) * 2022-02-24 2022-08-23 广东盈华电子科技有限公司 Surface treatment process for high-temperature resistance and oxidation resistance of electrolytic copper foil
DE102022120646A1 (en) 2022-08-16 2024-02-22 Audi Aktiengesellschaft Method for producing a flexible printed circuit (FPC) by depositing metal conductor tracks, printed circuit and printed circuit battery system

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019877A (en) * 1975-10-21 1977-04-26 Westinghouse Electric Corporation Method for coating of polyimide by electrodeposition
DE59004422D1 (en) * 1989-12-23 1994-03-10 Heraeus Elektrochemie Method and device for the continuous electrolytic application of metal in the form of a strip from a solution and use of the device.
WO1992018669A1 (en) * 1991-04-12 1992-10-29 Siemens Aktiengesellschaft Galvanisation device for plate-like workpieces, especially printed circuit boards
US5705219A (en) * 1991-04-22 1998-01-06 Atotech Deutschland Gmbh Method for coating surfaces with finely particulate materials
DE4212567A1 (en) * 1992-03-14 1993-09-16 Schmid Gmbh & Co Geb DEVICE FOR TREATING OBJECTS, IN PARTICULAR GALVANIZING DEVICES FOR PCBS
US6599412B1 (en) * 1997-09-30 2003-07-29 Semitool, Inc. In-situ cleaning processes for semiconductor electroplating electrodes
DE19633796B4 (en) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Device for electroplating electronic circuit boards
EP0959153A3 (en) * 1998-05-20 2000-09-13 Process Automation International Limited An electroplating machine
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
DE10043817C2 (en) * 2000-09-06 2002-07-18 Egon Huebel Arrangement and method for goods to be treated electrochemically
DE10248965A1 (en) * 2002-10-15 2004-04-29 Simmerlein, Ewald Wilhelm Contact system for an electroplating bath, can be a roller which is conductive for each contact point, with alternating switching as a cathode and anode
DE10342512B3 (en) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region
NL1025446C2 (en) * 2004-02-09 2005-08-10 Besi Plating B V Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric support as well as dielectric support.
DE102005033784A1 (en) * 2005-07-20 2007-01-25 Viktoria Händlmeier System for the electrodeposition of a conductive layer on a non-conductive substrate
DE102005038450A1 (en) * 2005-08-03 2007-02-08 Gebr. Schmid Gmbh & Co. Device for the treatment of substrates, in particular for the galvanization of substrates
DE102005038449B4 (en) * 2005-08-03 2010-03-25 Gebr. Schmid Gmbh & Co. Device for the treatment of substrates, in particular for the electroplating of printed circuit boards, and method
JP2009534525A (en) * 2006-04-18 2009-09-24 ビーエーエスエフ ソシエタス・ヨーロピア Electrolytic coating apparatus and electrolytic coating method
WO2007118875A2 (en) * 2006-04-18 2007-10-25 Basf Se Electroplating device and method

Also Published As

Publication number Publication date
EP2099954A1 (en) 2009-09-16
WO2008065069A1 (en) 2008-06-05
CN101542022A (en) 2009-09-23
RU2009124293A (en) 2011-01-10
TW200829726A (en) 2008-07-16
BRPI0719665A2 (en) 2013-12-17
KR20090083489A (en) 2009-08-03
JP2010511103A (en) 2010-04-08
US20090301891A1 (en) 2009-12-10

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