IL194754A0 - Electroplating device and method - Google Patents

Electroplating device and method

Info

Publication number
IL194754A0
IL194754A0 IL194754A IL19475408A IL194754A0 IL 194754 A0 IL194754 A0 IL 194754A0 IL 194754 A IL194754 A IL 194754A IL 19475408 A IL19475408 A IL 19475408A IL 194754 A0 IL194754 A0 IL 194754A0
Authority
IL
Israel
Prior art keywords
electroplating device
electroplating
Prior art date
Application number
IL194754A
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL194754A0 publication Critical patent/IL194754A0/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
IL194754A 2006-04-18 2008-10-22 Electroplating device and method IL194754A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112723 2006-04-18
PCT/EP2007/053707 WO2007118875A2 (en) 2006-04-18 2007-04-17 Electroplating device and method

Publications (1)

Publication Number Publication Date
IL194754A0 true IL194754A0 (en) 2009-08-03

Family

ID=38236519

Family Applications (1)

Application Number Title Priority Date Filing Date
IL194754A IL194754A0 (en) 2006-04-18 2008-10-22 Electroplating device and method

Country Status (11)

Country Link
US (1) US20090101511A1 (en)
EP (1) EP2010699A2 (en)
JP (1) JP2009534527A (en)
KR (1) KR20090009876A (en)
CN (1) CN101473072A (en)
BR (1) BRPI0710241A2 (en)
CA (1) CA2649786A1 (en)
IL (1) IL194754A0 (en)
RU (1) RU2420616C2 (en)
TW (1) TW200811316A (en)
WO (1) WO2007118875A2 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1919703B1 (en) 2005-08-12 2013-04-24 Modumetal, LLC Compositionally modulated composite materials and methods for making the same
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
KR20100126505A (en) * 2008-03-13 2010-12-01 바스프 에스이 Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound
NL1035265C2 (en) * 2008-04-07 2009-10-08 Meco Equip Eng Method and device for the electroplating of non-metallic glassy substrates.
CN102639758B (en) 2009-06-08 2016-05-18 莫杜美拓有限公司 For etch-proof electroplating nano laminated coating and covering
TW201121680A (en) * 2009-12-18 2011-07-01 Metal Ind Res & Dev Ct Electrochemical machining device and machining method and electrode unit thereof.
KR101103450B1 (en) * 2010-07-27 2012-01-09 주식회사 케이씨텍 Apparatus to plate substrate
US20120231574A1 (en) * 2011-03-12 2012-09-13 Jiaxiong Wang Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells
EA201500948A1 (en) 2013-03-15 2016-03-31 Модьюметл, Инк. METHOD OF MANUFACTURING A PRODUCT AND A PRODUCT MANUFACTURED BY THE ABOVE INDICATED BY THE METHOD
CA2905548C (en) 2013-03-15 2022-04-26 Modumetal, Inc. Nanolaminate coatings
CN105189828B (en) 2013-03-15 2018-05-15 莫杜美拓有限公司 Nickel chromium triangle nanometer laminate coat with high rigidity
CN105143521B (en) 2013-03-15 2020-07-10 莫杜美拓有限公司 Method and apparatus for continuous application of nanolaminate metal coatings
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
RU2534794C2 (en) * 2013-03-21 2014-12-10 Открытое акционерное общество "Научно-исследовательский институт конструкционных материалов на основе графита "НИИграфит" Method of binding fibrous pan material when carrying out steps of producing carbon fibre therefrom
EP2799939A1 (en) * 2013-04-30 2014-11-05 Universo S.A. Support for the treatment of micromechanical parts
KR101419276B1 (en) * 2013-08-27 2014-07-15 (주)엠에스티테크놀로지 Coating method by plasma electrolytic oxidation
BR112017005464A2 (en) * 2014-09-18 2017-12-05 Modumetal Inc Method and Apparatus for Continuously Applying Nannaminated Metal Coatings
BR112017005534A2 (en) 2014-09-18 2017-12-05 Modumetal Inc Methods of preparing articles by electrodeposition processes and additive manufacturing
DE102015121349A1 (en) 2015-12-08 2017-06-08 Staku Anlagenbau Gmbh Apparatus for surface treatment of a continuous material and its use
KR101681083B1 (en) * 2016-06-26 2016-12-01 주식회사 지에스아이 Plating device having curved mesh
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
CA3057836A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
US11286575B2 (en) 2017-04-21 2022-03-29 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
EP3784823A1 (en) 2018-04-27 2021-03-03 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN110952121B (en) * 2018-12-17 2023-12-05 嘉兴瑞通智能装备有限公司 Solder strip manufacturing device, electroplating mechanism and electroplating method thereof
CN113512749A (en) * 2020-12-08 2021-10-19 郑州大学 Experimental device for electroplated diamond cutter
JPWO2022224817A1 (en) * 2021-04-21 2022-10-27
CN113400698B (en) * 2021-05-11 2022-12-20 重庆金美新材料科技有限公司 Conductive transmission belt, preparation method thereof and film water electroplating equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1756267A1 (en) * 1968-04-27 1971-10-07 Carl Klingspor Electroplating device for fabric
LU80496A1 (en) * 1978-11-09 1980-06-05 Cockerill METHOD AND DIOPOSITIVE FOR THE CONTINUOUS ELECTROLYTIC DEPOSITION AT HIGH CURRENT DENSITY OF A COATING METAL ON A SHEET
DE4413149A1 (en) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Device for treating objects, in particular electroplating device for printed circuit boards
DE10234705B4 (en) * 2001-10-25 2008-01-17 Infineon Technologies Ag Electroplating and electroplating system for coating already conductive structures
WO2003038158A2 (en) * 2001-10-25 2003-05-08 Infineon Technologies Ag Electroplating device and electroplating system for coating already conductive structures
DE10342512B3 (en) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region

Also Published As

Publication number Publication date
CA2649786A1 (en) 2007-10-25
RU2420616C2 (en) 2011-06-10
EP2010699A2 (en) 2009-01-07
CN101473072A (en) 2009-07-01
WO2007118875A2 (en) 2007-10-25
BRPI0710241A2 (en) 2011-08-09
TW200811316A (en) 2008-03-01
RU2008145108A (en) 2010-05-27
JP2009534527A (en) 2009-09-24
WO2007118875A3 (en) 2008-08-07
KR20090009876A (en) 2009-01-23
US20090101511A1 (en) 2009-04-23

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