EP2010699A2

EP2010699A2 - Electroplating device and method

Info

Publication number: EP2010699A2
Application number: EP07728172A
Authority: EP
Inventors: Rene Lochtman; Jürgen Kaczun; Norbert Schneider; Jürgen PFISTER; Gert Pohl; Norbert Wagner
Original assignee: BASF SE
Current assignee: BASF SE
Priority date: 2006-04-18
Filing date: 2007-04-17
Publication date: 2009-01-07
Also published as: RU2008145108A; WO2007118875A3; TW200811316A; WO2007118875A2; RU2420616C2; CN101473072A; CA2649786A1; KR20090009876A; JP2009534527A; BRPI0710241A2; US20090101511A1; IL194754A0

Abstract

The invention relates to a device for electroplating at least one electrically conductive substrate (8), or an electrically conductive structure situated on a non-conductive substrate (8). Said device comprises at least one bath, an anode and a cathode (2). The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least one strip (2) with at least one electrically conductive segment (12) and is guided around at least two rotating shafts (3). The invention also relates to a method for electroplating at least one substrate that is carried out in a device according to the invention. According to said method, to produce the coating, the strip lies on the substrate and circulates at a speed corresponding to the speed at which the substrate is conveyed through the bath. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.

Description

Apparatus and method for galvanic coating

description

The invention relates to a device for electroplating at least one electrically conductive substrate or an electrically conductive structure on a non-conductive substrate, which comprises at least one bath, an anode and a cathode, wherein the bath contains an electrolyte solution containing at least one metal salt, from the metal ions be deposited on electrically conductive surfaces of the substrate to form a metal layer.

The invention further relates to a process for the galvanic coating of at least one substrate, which is carried out in a device designed according to the invention.

Galvanic coating methods are used, for example, to coat electrically conductive substrates or structured or full-area electrically conductive surfaces on non-conductive substrates. With these methods, it is possible, for example, to produce conductor tracks on printed circuit boards, RFID antennas, flat cables, thin metal foils, conductor tracks on solar cells, and to galvanically coat other products, such as two- or three-dimensional objects, for example plastic molded parts.

DE-B 103 42 512 discloses an apparatus and a method for the electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of band-shaped material to be treated. Here, the material to be treated is conveyed continuously on a transport path and in a transport direction, wherein the material to be treated is contacted with a contacting electrode arranged outside of an electrolysis region, whereby negative voltages are applied to the electrically conductive structures. In the electrolysis region, metal ions are deposited on the electrically conductive structures from the treatment liquid to form a metal layer. Since only metal is deposited on the electrically conductive structures, as long as they are contacted by the contact electrode, only those structures can be coated which are dimensioned so large that the electrically conductive structure to be coated is located in the electrolysis region, while at the same time outside the Electrolysis area is contacted.

An electroplating apparatus in which the contacting unit is arranged in the electrolyte bath is disclosed, for example, in DE-A 102 34 705. The galvanization device described here is suitable for coating structures that are already conductive and that are arranged on a band-shaped carrier. The contacting takes place in this case via rollers which are in contact with the conductive structures. Since the rollers are in the electrolyte bath, metal also separates out from the electrolyte bath. In order to be able to remove the metal again, the rollers are made up of individual segments which are switched cathodically, as long as they are in contact with the structures to be coated and are switched anodically, if there is no contact of roller and electrically conductive structure. Disadvantage of this arrangement, however, is that on short structures, seen in the transport direction, only a short time a voltage is applied, while seen on long structures, also in the transport direction, over a much longer period of tension. As a result, the layer which is deposited on long structures is substantially larger than the layer which is deposited on short structures.

Disadvantage of the known from the prior art method is that with these no very short structures - especially in the transport direction of the substrate - can be coated. Another disadvantage is that many sufficiently long contact times are required to realize sufficiently long contact times.

The object of the invention is to provide a device which ensures a sufficiently long contact time even for short structures, so that even short structures can be provided with a sufficiently thick metal layer.

The object is achieved by a device for electroplating at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a non-conductive substrate, which comprises at least one bath, an anode and a cathode, wherein the bath is at least one metal salt contains containing electrolyte solution. From the electrolytic solution, metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer. For this purpose, the at least one cathode is brought into contact with the surface of the substrate to be coated, while the substrate is conveyed through the bath. According to the invention, the at least one cathode comprises at least one band with at least one electrically conductive section, which is guided around at least two rotatable shafts. The waves are carried out with a suitable, matched to the respective substrate cross-section. Preferably, the waves are cylindrically shaped and may for example be provided with grooves in which the at least one band runs. For electrically contacting the band, preferably at least one of the cores is cathodically connected, wherein the shaft is designed such that the current is transmitted from the surface of the shaft to the band. If the shafts are provided with grooves in which the at least one belt runs, the substrate can be contacted simultaneously via the shafts and the belt. However, only the grooves can be electrically conductive and the regions of the waves between the grooves can be made of an insulating material in order to avoid that the substrate is also electrically contacted via the waves. The shaft is supplied with power via slip rings, for example, but it is also possible to use any other suitable device with which current can be transmitted to rotating shafts.

Characterized in that the cathode comprises at least one band with at least one electrically conductive portion, even substrates with short electrically conductive structures, especially in the transport direction of the substrate, can be provided with a sufficiently thick coating. This is possible since, according to the invention, by the design of the cathode as a band, even short electrically conductive structures are in contact with the cathode for a longer time than is the case with the methods known from the prior art.

In order to coat also the regions of the electrically conductive structure on which the band designed as a cathode rests for contacting, in a preferred embodiment, at least two bands are arranged offset one behind the other. The arrangement is preferably such that the second band arranged behind the first band contacts the electrically conductive structure in the region on which the metal was deposited during the contacting with the first band. In order to achieve a greater thickness of the coating, preferably more than two bands are connected in series.

In one embodiment, each successive, offset bands arranged over at least one common shaft. In this case, when the tapes are each passed over two shafts, in this case, seen in the transport direction of the substrate, the rear shaft of the first belt is at the same time the front shaft of the second belt. Advantage of this arrangement is that waves can be saved and the bath can be kept shorter. In addition to the arrangement in which each successive, staggered bands are guided over at least one common shaft, it is also possible to guide the successively arranged bands via respective independent waves. In such an arrangement, it is advantageous if the waves are designed so that they can be lifted from the substrate nen. During the coating process, ie as long as the waves and the bands are connected cathodically, metal is also deposited on the bands and the waves. To remove this metal again, it is necessary to switch the waves and the bands anodically. If the bands are each arranged independently on waves, individual bands together with their waves can each be lifted from the substrate and anodically switched, while at the same time bands arranged upstream or downstream of the raised bands guide the substrate and the electrically conductive structures located thereon. - A -

contact, so that the removal of the deposited metal from the bands and waves can take place during operation. If the waves can not be lifted, or if there is only one set of staggered bands in which successive staggered bands pass over at least one common shaft, the metal deposited on the bands and shafts can only be released while removing production interruptions.

In a further embodiment, the at least one band has a network structure. The advantage of the network structure is that in each case only small areas of the electrically conductive structures to be coated on the substrate are covered by the band. The coating takes place in the holes of the net. In order to coat the electrically conductive structures in the areas in which the network rests, it is also advantageous for the case in which the bands are designed in the form of a network structure to arrange at least two bands one behind the other. It is also possible to connect two bands formed as nets directly one behind the other, the nets then each having different mesh sizes and / or different mesh shapes to coat also the areas in which the front net rests. Furthermore, it is also possible to provide a band designed as a net, the band having regions with different mesh width and / or different mesh shape. For the purposes of the present invention, webs are to be understood as meaning tapes with individual holes formed therein.

Advantage of a formed in the form of a network band is that the network can extend over the entire width of the waves. It is not necessary to arrange several narrow bands formed in the form of nets next to each other.

In order to be able to coat even the smallest possible electrically conductive structures, that is also structures smaller than 500 μm, as required in printed circuit board production, the width of the individual strips, if these are not formed in the form of a network, as narrow as possible. The width of the tapes depends on the production options. The narrower the bands can be formed, the smaller the conductive structures can be coated. An advantage of narrow bands with small distances from one another is that the contact probability of the smallest structures is thereby greater than with a smaller number of broad bands. Since the contact surface of the bands by covering the structures just below the band inhibits the deposition, it is advantageous to minimize this coverage effect by narrow bands. At the same time, the electrolyte purging of the surfaces to be metallized becomes more uniform by a multiplicity of smaller surface accesses than in the case of a few surface accesses, such as are present in a small number of wide bands. The number of juxtaposed bands depends on the width of the substrate. The wider the substrate to be coated, the more ribbons must be placed side by side. In this case, care must be taken that a free gap remains between the bands, in which the metal can be deposited on the electrically conductive substrate or the structured or full-surface electrically conductive surface of the substrate. If at least two bands are arranged offset one behind the other, the gap between two juxtaposed bands is preferably as wide as the band arranged behind it. Since, in the case of a net-shaped band, the coating takes place at the points of the substrate which are exposed through the individual holes of the net, it is not absolutely necessary here to arrange several narrow net-shaped bands next to one another. In this case, it is also sufficient to use a tape which extends over the entire width of the substrate.

In a further embodiment, the at least one band comprises alternately conductive and non-conductive sections. In this case, it is possible to additionally guide the band around at least one anodically connected wave, wherein it should be noted that the length of the conductive sections is smaller than the distance between a cathodic and an adjacent anodically connected shaft. In this way, the portions of the tape which contact the substrate to be coated are switched cathodically and the portions of the tape which are not in contact with the substrate become anodic. The advantage of this circuit is that metal which deposits on the tape during the cathodic circuit of the tape is removed during the anodic circuit. In order to remove all the metal deposited on the tape while it was cathodically connected, the anodized region is preferably longer or at least as long as the cathodically connected region. On the one hand, this can be achieved in that the anodically connected wave has a larger diameter than the cathodically connected waves, on the other hand, it is also possible to provide at least the same or smaller diameter of the anodically connected waves, at least as many as cathodically connected waves, wherein the Distance of the cathodically connected waves and the distance of the anodically connected waves is preferably the same size.

In order to achieve an uninterrupted cathodic circuit of the strip while it contacts the electrically conductive surfaces of the substrate with the electrically conductive structures located thereon, the length of the conductive sections is preferably greater than or equal to the distance between two adjacent cathodically connected waves. A coating on the electrically conductive structure of the substrate then takes place from the first contact of the electrically conductive structure the cathodically connected portion of the tape to the time at which the contact of the cathodically connected portion of the tape is terminated with the electrically conductive structure on the substrate.

As bands with alternating conductive and non-conductive sections, for example, link bands can be used, in which the individual members are fastened to each other, for example by means of clamps. According to the required length of the conductive portions, a corresponding number of electrically conductive members are mounted one behind the other. In order to produce a non-electrically conductive portion, at least one non-conductive member is inserted between two electrically conductive members. In addition to the structure as a link chain, it is also possible to provide at least one electrically non-conductive, flexible band as a carrier, which at predetermined intervals against each other electrically insulated mounted electrically conductive sections. As a conductive material are here, for example, wire or films, with which the carrier is wrapped or flexible or rigid films, which may for example be in the form of a network or holes may have, which are connected to the carrier. The connection with the carrier can be done for example by gluing. In addition to the embodiment with a single carrier per band, for example, a plurality of carriers may be arranged side by side, which are interconnected by common conductive portions. Between the individual carriers, a gap is preferably formed in this case. Furthermore, it is also possible that the carriers contain holes or have a reticulated structure.

When the tape has a network structure in which, for example, an electrically conductive network is connected to an electrically nonconductive network in order to form the electrically conductive sections and electrically non-conductive sections, the electrically conductive reticulated sections can be formed, for example, by means of a wire, which is guided through the individual meshes of the network structure, are connected to the meshes of a non-conductive section.

However, in addition to the embodiments described here, the band can also have any further structure by means of which conductive and non-conductive sections can be realized alternately.

In a further embodiment, the device for electroplating further comprises a device with which the substrate can be rotated. The axis of rotation of the device, with which the substrate can be rotated, is arranged perpendicular to the surface of the substrate to be coated, if by turning electrically conductive structures, which are initially seen in the transport direction of the substrate, wide and short, so to be aligned that after the Drew hen seen in the transport direction are narrow and long. By turning different coating times are compensated, which result from the fact that a coating takes place already with the first contact of the electrically conductive structure with the cathodically connected band.

When coated on multiple sides of the substrate, it can preferably be rotated in the device with which the substrate can be rotated so that, after rotation, the surface to be coated next points in the direction of the cathode.

In order to simultaneously coat both the upper side and the lower side of the substrate, in a further embodiment, at least two bands are arranged such that the substrate to be coated is passed between them and the bands contact the upper side and the lower side of the substrate, respectively.

For coating rigid structures, the structure of the device for galvanic coating is preferably such that the transport plane of the substrate acts as a mirror plane. If films are to be coated whose length exceeds the length of the bath - so-called continuous films, which are initially unwound from a roll, passed through the device for electroplating and then wound up again - these can, for example, also zig-zag or in shape a meander around one or more galvanic coating devices according to the invention, which can then be arranged, for example, one above the other or next to one another, through the bath. The devices can each be aligned at any angle in the bath. If the electroplating devices are arranged one above the other, it is also possible to simultaneously coat the films on the upper side and the lower side by passing them between two devices which contact the film at their top and bottom side and after passing through is deflected by one of the devices, to then be passed between this and another device disposed above or below the device.

With the device according to the invention and the method according to the invention, it is furthermore possible to coat also through holes, such as holes or slots, or also depressions, such as blind holes, contained in the substrate. In the case of continuous holes of shallow depth, the coating takes place in that the metal layers deposited on the upper side and the underside deposited on the lower side grow together in the hole. For holes which are too deep for the metal layers to grow together, at least in part a conductive hole wall is provided, which is coated by the method according to the invention. As a result, then also the entire wall of the hole can be coated. If not the entire perforated wall is electri- is conductive, the coating of the entire hole wall takes place here by growing together of the metal layers.

In order to be able to remove the metal deposited on the cathodically connected shafts and / or strips during operation of the galvanic coating device, the shafts are both anodically and cathodically switchable in a preferred embodiment and can be lowered onto the substrate or lifted from the substrate become. While the waves are raised from the substrate and are not in contact with the substrate, they can be anodically switched. While the waves are connected anodically, the metal deposited thereon is removed again. At the same time, the at least one band circulating the waves is connected anodically, so that the metal deposited thereon is also removed therefrom. The waves, which are in contact with the substrate via the at least one strip, are connected cathodically.

In a further embodiment, the waves may also contain a plurality of electrically conductive regions, of which at least one is connected anodically and at least one further cathodically. In this case, in the cathodically connected region of the shaft, the circulating band is also switched cathodically, so that a coating of the electrically conductive substrate or the structured or full-surface electrically conductive surfaces of the substrate takes place while in the anodic region, the previously undesired deposited metal of the Wave and / or the at least one band is removed again. In this case, it is necessary for the band to have electrically isolated sections which are arranged on the shafts so that an electrically conductive area of the band does not simultaneously touch an anodically connected area and a cathodically connected area on the shaft in order to avoid a short circuit ,

In addition to the cleaning by polarity reversal of the waves, other cleaning variants, for example, a chemical or mechanical cleaning, possible.

The electrically conductive sections of the at least one band as well as the wave surfaces or the wavebands which are in contact with the at least one band are preferably made of an electrically conductive material which does not change into the electrolytic solution during operation of the device. Suitable materials for the fabrication of the conductive portions of the tape and the wave surfaces or regions which are in contact with the at least one tape are, for example, metals, graphite, conductive polymers such as polythiophenes or metal / plastic composites. Preferred materials are stainless steel and / or titanium. On the one hand, anodes can serve, with different polarity of the waves, the anodically connected waves, on the other hand, it is also possible to additionally provide anodes in the bath. If only cathodically connected waves are provided, it is necessary to additionally arrange anodes in the bath. The anodes are preferably arranged as close as possible to the structure to be coated. For example, the anodes may each be arranged between two cathodically connected waves. Suitable material for the anodes is on the one hand any material known to those skilled in the art for insoluble anodes. Preference is given here, for example, stainless steel, graphite, platinum, titanium or metal / plastic composites. On the other hand, it is also possible to provide detachable anodes. These then preferably contain the metal, which is deposited galvanically on the electrically conductive structures. The anodes can take any known form to those skilled in the art. For example, flat rods can be used as anodes, which have a minimum distance to the substrate surface during operation of the device, and which can be pulled out of the device in a position change of the waves in the direction of the shaft axes. It is also possible to use flat sheets as anodes, which can be folded upwards or downwards by 90 ° between the roll lifting paths. Another possibility is to provide elastic wires, preferably spiral wires, as anodes, which can be pulled upwards or downwards from the device or introduced into it from winding / unwinding devices.

The galvanic coating device can be used for any conventional metal coating. In this case, the composition of the electrolyte solution used for the coating depends on which metal the electrically conductive structures are to be coated on the substrate. Typical metals which are deposited by electroplating on electrically conductive surfaces are, for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium.

Suitable electrolyte solutions which can be used for the electroplating of electrically conductive structures are known to those skilled in the art, for example, from Werner Jillek, Gustl Keller, Handbuch der Leiterplattentechnik, Eugen G. Leuze Verlag, 2003, Vol. 4, pages 332 to 352.

For galvanic coating of the electrically conductive structures on the substrate, this is first supplied to the bath with the electrolyte solution. The substrate is then conveyed through the bath with the at least one ribbon of the cathode resting on the substrate to contact the electrically conductive structures, preferably with the belt moving at a rotational speed equal to the rate at which the substrate passes through the bath to be led. The transport of the sub strates through the bath can be done, for example, with a transport device, as known to those skilled in the art. However, it is also possible to arrange the device for coating so that the substrate rests on the at least one cathodically connected strip and is transported by the movement of the strip through the bath. The transport of the substrate through the bath, in which the at least one band of the device for coating acts as a transport device, is particularly advantageous if the substrate is to be coated on the upper side and on the lower side. In this case, the substrate rests on one device while it is pressed by the other device to the device on which it rests. The movement of the belts then transports the substrate through the device.

However, in addition to the bands, for example, at least one further transport roller, which preferably consists of an electrically insulating material, can transport the substrate through the bath. A combination of at least one band with at least one additional transport roller is also possible. The number of required transport rollers depends on the size of the substrate to be coated. The distance of the transport rollers must be selected so that always at least one transport roller with the substrate in contact, unless the transport is done by the bands. In the galvanic coating of endless substrates, the transport can also be realized by the winding and unwinding unit, which is preferably arranged outside the bath.

If the shafts are provided with grooves in which the at least one belt runs, the transport of the substrate takes place through the shafts and / or through the belt when they are driven.

So that on the one hand the substrate does not lift off from the device for galvanic coating and / or on the other hand pressed against the device from below and thus at the same time a good contact of the substrate is ensured with the cathodically connected areas, in one-sided coating is preferably at least one pressure roller or a pressing belt is provided, with which the substrate is pressed against the cathodically connected areas.

Good contact between the cathodically connected tape and the substrate to be coated can also be achieved by pressing the tape against the substrate via the weight of the corrugations that surround it. It is also possible to generate an additional contact pressure in that the band is pressed against the substrate via a resilient mounting of the shafts. The drive of the waves is preferably outside the bath. In a preferred embodiment, all waves are driven. However, it is also possible to drive only individual waves. When a transport device independent of the cathodes is provided, the belts can be driven by the substrate in contact with them, with no shaft circulating around the belt being provided with its own drive. However, it is also possible to drive the band in addition by at least one wave that revolves around it. So that a uniform speed of all belts is achieved, it is preferred that the shafts are driven by a common drive unit. The drive unit is preferably an electric motor. The shafts are preferably connected to the drive via a chain or belt transmission. But it is also possible to provide each of the shafts with gears that mesh with each other and over which the waves are driven. In addition to the possibilities described here, any other suitable drive known to those skilled in the art for driving the shafts can also be used.

In a preferred embodiment, the at least one band is supplied with voltage via the waves that surround it. In this case, the waves can be electrically conductive over the entire surface or partially at the surface. However, it is also possible to manufacture the shafts from an insulating material and to provide contact means, which are arranged for example between individual shafts. Such contact means may, for example, be brushes which are in contact with the electrically conductive portions of the tape. Preferably, however, the power will be supplied via the waves. The power supply of the waves takes place preferably outside of the bath. Suitable means for transmitting current to the shafts are, for example, slip rings arranged on the shafts. For tapes whose electrically conductive portion is at least as long as the contact surface on the substrate, it is also possible to conduct only a single wave electrically conductive and the remaining waves isolated. In this case, it is also possible to connect one wave anodically and one wave cathodically, while the other waves are isolated. In this embodiment, care must then be taken that the distance between the cathodically connected shaft and the anodically connected shaft is greater than the length of the electrically conductive region of the band.

In order to demetallize the cathodically connected waves and, if appropriate, strips, ie to remove the metal deposited on them, they are either connected anodically during production interruptions or lifted off the substrate and then connected anodically. It is necessary that there be no contact of the waves with the structures to be coated when they are demetallised. Otherwise, the structures to be coated would also be switched anodically and the material already deposited thereon would be removed again. If the at least one band, which forms the cathode, consists of segmental conductive and non-conductive In the construction of the sections which revolve around anodically and cathodically connected waves, in a preferred variant of the method the cathodically switched waves are raised from the substrate for demetallation, while at the same time the anodically connected waves are lowered onto the substrate. Simultaneously with the wave change, the previously cathodically switched waves are switched anodically so that the metal deposited thereon is removed, and the previously anodically connected waves are switched cathodically so that the electrically conductive structures on the substrate can be further coated. Such a wave change is preferably carried out while the cathodically connected strip section just does not contact a structure to be coated. However, it is also possible to provide at least one preferably insulated shaft as tensioning roller, so that all waves are switched cathodically to change the shaft, then the previously anodically switched waves are lowered onto the substrate, the previously cathodically switched waves are lifted from the substrate and, after these were raised to be anodically switched. When the device is disposed below the substrate, the previously cathodically switched waves are lowered and then anodized, while the previously anodically switched waves are raised against the substrate and then switched to cathodic. If additionally insulated transport shafts or tension shafts are provided, the lowering and raising of the shafts as well as the polarity reversal can take place simultaneously.

In addition to reversing the waves to remove the metal deposited thereon, it is also possible to provide shields on the cathodically connected waves, which reduce metal deposition on the waves. Such shields are, for example, nonconductive sheaths of the shafts which cover the shafts in the areas in which they are in contact with the electrolyte solution, the sheaths being at a very small distance from the shaft surface and releasing the shafts only at the points where the shroud is located Substrate and / or the bands are contacted.

In a further variant of the method, the substrate to be coated is rotated after passing through the device for galvanic coating by a predetermined angle. After rotation, the substrate either passes through the device a second time or a second corresponding device. The angle through which the substrate is rotated is preferably in the range of 10 ° to 170 °, more preferably in the range of 50 ° to 140 °, in particular in the range of 80 ° to 100 °, and most preferably the angle is the substrate is rotated, substantially 90 °. Essentially 90 ° means that the angle through which the substrate is rotated does not deviate more than 5 ° from 90 °. The device for rotating the substrate can be arranged inside or outside the bath. To further coat the same side of the substrate, for example, a larger layer of To achieve the metal layer, the axis of rotation is perpendicular to the surface to be coated. When another surface of the substrate is to be coated, the rotation axis is arranged so that after rotation, the substrate is positioned so that the surface to be coated next faces the cathode.

The layer thickness of the metal layer deposited on the electrically conductive structure by the method according to the invention depends on the contact time, which results from the passage speed of the substrate through the device and the number of bands positioned behind one another, and the current intensity with which the device is operated. A higher contact time can be achieved, for example, by connecting several devices according to the invention in series in at least one bath.

In one embodiment, a plurality of devices according to the invention are connected in series in each case in individual baths. This makes it possible to hold in each bath a different electrolyte solution to sequentially deposit different metals on the electrically conductive structures. This is advantageous, for example, in decorative applications or in the production of gold contacts. Again, the respective layer thicknesses are adjustable by the choice of the flow rate and the number of devices with the same electrolyte solution.

With the device according to the invention, all electrically conductive surfaces can be coated, regardless of whether electrically insulated structures insulated from one another are to be coated on a nonconductive substrate or a full surface area. The device is preferably used for coating electrically conductive structures on a non-electrically conductive support, for example reinforced or unreinforced polymers, such as are conventionally used for printed circuit boards, ceramic materials, silicon, glass, textiles, etc. The thus produced, galvanic Coated electrically conductive structures are, for example, conductor tracks. The electrically conductive structures to be coated can be printed on the printed circuit board, for example, from an electrically conductive material. The electrically conductive structure preferably contains either particles of any geometry made of an electrically conductive material in a non-conductive matrix or consists essentially of the electrically conductive material. Suitable electrically conductive materials are, for example, carbon or graphite, metals, preferably aluminum, iron, gold, copper, nickel, silver and / or alloys or metal mixtures containing at least one of these metals, electrically conductive metal complexes, conductive organic compounds or conductive polymers. Optionally, a pretreatment is first required to make the structures electrically conductive. This may be, for example, a chemical or a mechanical pretreatment such as a suitable cleaning. As a result, for example, the oxide layer of metals which is troublesome for the electroplating is removed. However, the electrically conductive structures to be coated can also be applied to the printed circuit boards by any other methods known to those skilled in the art. Such printed circuit boards are installed, for example, in products such as computers, telephones, televisions, electrical automotive components, keyboards, radios, video, CD, CD-ROM and DVD players, game consoles, measuring and control devices, sensors, electrical kitchen appliances, electric Toys etc.

Also, with the device according to the invention, electrically conductive structures can be coated on flexible circuit carriers. Such flexible circuit carriers are, for example, polymer films, such as polyimide films, PET films or polyolefin films, on which electrically conductive structures are printed. Furthermore, the device according to the invention and the method according to the invention are suitable for the production of RFID antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, foil conductors, printed conductors in solar cells or in LCD or plasma picture screens, thin metal foils or for the production of electroplated products in any desired form, such as, for example, single-sided or double-sided metal-clad polymer supports with defined layer thickness, 3D-molded interconnect devices or also for the production of decorative or functional surfaces on products, for example for shielding from electromagnetic radiation, for heat conduction or as packaging become. Furthermore, the production of contact points or contact pads or wiring on an integrated electronic component is possible.

After leaving the device for galvanic coating, the substrate can be further processed according to all steps known to those skilled in the art. For example, existing electrolyte residues can be removed from the substrate by rinsing and / or the substrate can be dried.

The device according to the invention for the electroplating of electrically conductive substrates or of electrically conductive structures on electrically non-conductive substrates can be equipped with any additional device known to the person skilled in the art as required. Such ancillary devices include, for example, pumps, filters, chemical feeders, roll-up and roll-down devices, etc.

To shorten the maintenance intervals, all methods of etching the electrolyte solution known to those skilled in the art can be used. Such care methods are, for example, systems in which the electrolyte solution regenerates itself. The device according to the invention can also be operated, for example, in the pulse method known from Werner Jillek, Gustl Keller, Handbuch der Leiterplattentechnik, Eugen G. Leuze Verlag, 2003, Vol. 4, pages 192, 260, 349, 351, 352, 359.

The advantage of the device according to the invention and of the method according to the invention is that the at least one strip provides a larger contact surface and thus a longer contact time than is the case with the exclusive use of rollers known from the prior art , As a result, the desired layer thicknesses of electrically conductive structures within a shorter distance can be achieved, whereby the plants can be built shorter or can be operated at a higher throughput, whereby lower operating costs are achieved. Another significant advantage is that now even very short structures, as they are desired for example in the production of printed circuit boards, faster, more targeted and above all reproducible and can be realized with homogeneous layer thicknesses than with the roll systems known from the prior art is possible.

In the following the invention will be described in more detail with reference to the drawings. The figures show only one possible embodiment by way of example. Of course, except in the listed embodiments, the invention can also be implemented in further embodiments or in combination of these embodiments.

It shows:

1 shows a plan view of an inventively designed device with a plurality of successively staggered bands,

FIG. 2 shows a side view of the device according to FIG. 1,

FIG. 3 shows a side view of a device according to the invention with bands resting on the shaft,

FIG. 4 shows a top view of the device according to FIG. 3,

FIG. 5 shows a side view of a device according to the invention with bands which lie in grooves of the shaft,

FIG. 6 shows a plan view of a device according to FIG. 5, FIG. 7 shows a side view of a device designed according to the invention with cathodically and anodically connected shafts,

FIG. 8 shows a detail of a band, as used for example in FIG. 7,

9 shows a detail of an inventively designed device in which the anodically and the cathodically switched waves can be raised or lowered,

FIG. 10 shows a device according to the invention in which the top and bottom sides of a substrate are coated,

FIG. 11 shows a device with which top and bottom sides of a substrate can be coated, in which bands arranged one behind the other are arranged,

FIG. 12 is an enlarged view of a section of a band in a first embodiment,

13 is an enlarged view of a belt in a second embodiment,

FIG. 14 shows a plan view of a detail of a band in a third embodiment,

FIG. 15 shows a side view of the band according to FIG. 14,

Figure 16 is a side view of a device according to the invention with segmented

Waves,

FIG. 17 shows a side view of anodes during the galvanic coating,

Figure 18 is a side view of the anodes according to Figure 17 when changing the waves.

Figure 1 shows a plan view of a cathode formed according to the invention, in which a plurality of bands are arranged offset one behind the other.

A cathode 1 comprises a plurality of bands 2, which are each guided over two shafts 3.

Adjacent bands 2 are arranged so that a gap 4 is formed between them. The width of the gap 4 is preferably greater than or equal to the width of a belt 2. In this way, the offset behind the belt 2 of a series arranged bands 2 are guided through the gap. In the case of the embodiment shown in FIG. 1, in each case one shaft 3 simultaneously serves as the rear shaft of the bands 2 of a first row and as the front shaft 3 for the bands 2 of a second row. In this way, compared to an arrangement in which the offset behind a series of arranged bands are guided by two separate waves, waves and space can be saved. The coating in the embodiment shown in FIG. 1 takes place in each case in the gaps 4 between the bands 2, as long as the electrically conductive structures which are to be coated are touched by a band 2.

FIG. 2 shows a side view of the arrangement from FIG. 1.

In the side view shown in Figure 2 it can be seen that the bands 2 are each guided by two shafts 3. The waves are arranged in series one behind the other. The substrate to be coated may be in contact with the cathode 1 either at the top 5 or at the bottom 6. In this case, it is only necessary to ensure that the electrically conductive structures to be coated are assigned to the strip 2. When the substrate to be coated is guided along the upper side 5 of the cathode 1, the cathode 1, as shown in FIG. 2, can simultaneously serve as a transport device. If the substrate to be coated is guided along the underside 6, a device is additionally provided with which the substrate is placed against the bands 2 in order to produce an electrical contact of the underside 6 of the cathode 1 with the substrate to be coated. This device is preferably a transport device. Such devices are, for example, conveyor belts or transport shafts.

For electrically contacting the bands 2, in the embodiment shown in FIGS. 1 and 2, in each case at least one shaft 3, which is circulated by a band 2, is connected cathodically. Furthermore, it is also possible to switch each shaft 3 cathodically.

In order to enable a galvanic coating, anodes 31 must be provided in the bath in addition to the cathode 1. The anodes 31 can either be arranged as shown in Figure 2 between the waves 3 or above or below the belt 2.

An inventively designed device with bands 2, which rest on the shaft 3 is shown in Figure 3 in side view and in Figure 4 in plan view. The bands 2 are each guided by two shafts 3. Characterized in that the shafts 3 are formed as cylindrical rollers, the bands 2 are on the rollers. Contact with the substrate takes place here only through the band. In contrast to this is in FIG. 5 shows a side view and in FIG. 6 a plan view of an embodiment in which the bands 2 are received in grooves 30 in the shafts 3. The width of a groove 30 preferably corresponds to the width of a band 2 and the depth of a groove 30 preferably the thickness of a band 2. By receiving the bands 2 in the grooves 30, an axial displacement of the bands 2 on the shafts 3 can be avoided. In an embodiment in which the depth of the groove 30 corresponds to the thickness of a band 2, as shown here, the shaft 3 also rests on the substrate. This allows an additional contact made by the shaft 3.

FIG. 7 shows a further embodiment of a device according to the invention for galvanic coating in a sectional representation.

In the embodiment shown in Figure 7 is an electrically conductive structure

7 coated on a substrate 8 with a device designed according to the invention. The device comprises a band 2, which is guided around a plurality of shafts 3. The shafts 3 are arranged in an upper row 9 and a lower row 10. The waves of the lower row 10 are connected cathodically, while the waves of the upper row 9 are connected anodically. Via the band 2, the voltage of the cathodically connected waves of the lower row 10 is transmitted to the electrically conductive structure 7. As a result, the electrically conductive structure 7 is also charged negatively, so that metal ions from the electrolyte solution in which the substrate

8 and the device are received, depositing to form a metal layer. Since the waves 3 of the lower row 10 and the band 2 in the region of the lower row 10 are negatively charged, metal ions are also deposited thereon. In order to remove the metal deposited on the strip 2 again, the upper row 9 is connected anodically. As a result, the band 2 is positively charged in the upper row 9 and the metal ions go back into the electrolyte solution. The liquid level of the bath with the electrolyte solution is denoted by reference numeral 11 and shown by a solid line.

In addition to the anodically connected waves of the upper row 9, anodes 31 may be arranged between the cathodes, as shown here. The anodes 31 are formed, for example, as flat bars.

So that there is no short circuit in the band 2, the band 2 in the embodiment shown in FIG. 7 is constructed as shown in FIG. In this case, the band 2 comprises electrically conductive sections 12 and electrically non-conductive sections, ie insulating sections 13. The length L of an electrically conductive section 12 is preferably greater than or equal to the distance h of two cathodically connected channels 3. In order to avoid a short circuit , the length L of an electrically conductive However, the portion 12 may be smaller than the distance d of a cathodically connected wave to an adjacent anodically connected wave.

By the arrow 14, the transport direction of the substrate 8 is shown. In order to press the substrate against the belt 2, 8 pressing rollers 21 are arranged below the substrate. The substrate 8 is passed between the pressure rollers 21 and the belt 2. The required contact pressure can be achieved on the one hand, that the pressure rollers 21 are fixedly mounted and the shafts 3, which surrounds the belt 2, are resiliently mounted and pressed against the substrate 8 or the shafts 3 are fixedly mounted and the pressure rollers 21 are movable stored and are moved against the substrate 8 with the required contact force. If it is provided that the shafts 3 of the upper row 9 and the lower row 10 can exchange their positions, it is preferred that the pressure rollers 21 are fixedly mounted and the required contact pressure by the movable shafts 3 of the lower row 10 on the submersible strat 8 is applied.

Instead of the individual pressing rollers 21, as shown in Figure 7, it is also possible to use a band which rotates waves and which is for example constructed as the cathode shown in Figure 2, but without being electrically conductive.

In a further embodiment, instead of the pressure rollers 21, a further apparatus for galvanic coating may also be arranged below the substrate 8. In this case, the substrate 8 can then be simultaneously coated on its top and bottom.

FIG. 9 shows a side view of a device designed according to the invention in a further embodiment.

In the embodiment shown in Figure 9, the waves of the anodized upper row 9 are offset from the waves of the cathodically connected lower row 10 is arranged. The distance h between two anodically connected waves or between two cathodically connected waves is chosen so that in each case an anodically connected wave can be passed between two adjacent cathodically switched waves and a cathodically connected wave between adjacent anodically connected waves. With the arrows 15 is shown in Figure 9 that the waves of the lower row 10 can be raised and the waves of the upper row 9 can be lowered. This makes it possible to remove the metal deposited on the cathodically connected waves even during ongoing production operation. For this purpose, the cathodically connected waves of the lower row 10, as shown by the arrows 15, raised while the waves of the upper row 9, as shown by the arrows 16, are lowered. At the same time the polarity of the waves is reversed, so that after lowering the upper row 9, these waves are switched cathodically and after raising the lower row 10, these waves are connected anodically. As a result of the poling change, metal now deposits on the previously anodically connected waves of the upper row 9, which now form the lower row 10 and are connected cathodically, while the metal previously deposited on the cathodically connected waves of the lower row 10 is removed long these form the upper row 9 and are connected anodically.

In addition to the embodiments, as shown in Figures 3 and 5, in which all the waves of the upper row 9 are connected anodically and all waves of the lower row 10 are connected cathodically, it is also possible to provide in each row at least one transport shaft, which is not electrically conductive. The transport shafts are preferably in each case the first and / or the last wave of a row 9, 10.

In order to be able to remove all the metal again from the shafts 3 and the belts 2, at least as many shafts 3 are connected anodically as are cathodic. Preferably, the number of anodically connected waves is greater than that of the cathodically connected waves. In order to achieve this, for example, in the embodiment illustrated in FIG. 9, the first shaft of the upper row 9 can always remain anodically connected and remain in place.

FIG. 10 shows a device for galvanic coating in a further embodiment.

In the apparatus shown in Figure 10, the substrate 8 is simultaneously coated on the top and bottom. For this purpose, the substrate 8 is passed between an upper device 17 and a lower device 18. The distance between the upper device 17 and the lower device 18 is selected such that it corresponds exactly to the thickness of the substrate 8.

In the embodiment shown here, the shafts 19 facing the substrate are in each case connected cathodically, while the shafts 20 facing away from the substrate are connected anodically. In the embodiment shown in FIG. 10, too, it is preferable to raise the shafts 19 from the substrate 8 and to lower the shafts 20 onto the substrate 8. At the same time in this case the polarity of the waves is reversed, so that the waves 20, as soon as they contact the substrate 8, are switched cathodically and the waves 19, as soon as they are lifted from the substrate 8, are connected anodically. In the embodiment shown here, several bands 2 are arranged one behind the other at the top side and at the bottom side of the substrate 8 arranged. The bands 2 are each guided by separate waves. Preferably, the belts 2 arranged one behind the other are arranged offset relative to one another.

The embodiment shown in FIG. 11 corresponds largely to the embodiment shown in FIG. However, in each case a cathodically connected shaft 19 and an anodically connected shaft 20 form the rear shaft of a belt 2 and at the same time the front shaft of another belt 22, which is shown here by dashed lines. In the top view, the arrangement of the bands 2 and the further bands 22 shown in dashed lines corresponds to the arrangement shown in FIG. Here, each of the bands 22 are arranged offset behind the bands 2.

FIG. 12 shows an enlarged view of a first embodiment of a band according to the invention with electrically conductive and electrically non-conductive sections.

The band 2 shown schematically here is composed of individual conductive segments 23 and non-conductive segments 24. The individual segments 23, 24 are each secured with brackets 25 to each other. The length of the conductive portions is determined by the number of conductive segments 23 attached to each other. Between two conductive sections, an electrically non-conductive portion is arranged in each case. In general, it is already sufficient to use a single electrically non-conductive segment 24 for the electrically non-conductive portion. However, it is also possible to arrange a plurality of non-conductive segments 24 one behind the other.

FIG. 13 shows a further embodiment of a band 2. The band 2 is made of a flexible carrier 26 which is wrapped by an electrically conductive wire 27 to produce an electrically conductive portion 12. As a flexible carrier 26 is suitable, for example, a non-conductive plastic tape, which is optionally made of an elastomer. Instead of the electrically conductive wire 27 shown in FIG. 13, the flexible carrier 26 may, for example, also be wound with an electrically conductive foil in order to produce the electrically conductive sections 12.

A further embodiment of a band 2 is shown schematically in plan view in FIG. 14 and side view in FIG. The band 2 shown here comprises two flexible non-conductive supports 26, on which conductive portions 32 are fixed at regular intervals. The attachment of the conductive portions 32 on the non-conductive supports 26 can be done for example by gluing. The conductive portions 32 may be either rigid or flexible. In the case of rigid conductive sections 32, their width is preferably selected such that they can rotate around the corrugations 3. For this purpose, it is necessary that the width of the conductive portions 32 is smaller as the radius of the shaft 3. If the conductive portions 32 are to be made wider, they are preferably made of a flexible material. A suitable material is for example a still flexible metal foil. The non-conductive support 26 and / or the conductive portions 32 of the tape 2 may also be provided with holes or be made net-shaped.

In addition to the embodiments of the bands 2 shown in Figures 12 to 15 with electrically conductive portions 12 and electrically non-conductive portions 13, any other known in the art structure is possible from which a band can be produced, which alternately electrically conductive and electrically has non-conductive portions. Thus, it is possible, for example, to provide a network structure as band 2, wherein an electrically conductive network is connected to an electrically non-conductive network, wire or polymer carrier in order to form the electrically conductive sections 12 and electrically non-conductive sections 13. The electrically conductive net-shaped sections can then be connected, for example with the aid of a wire, which is guided through the individual meshes of the network structure, to the meshes of a non-conductive section.

FIG. 16 shows an embodiment of a device designed according to the invention, in which the shafts 3 are constructed from individual conductive segments 35 and non-conductive segments 36. The conductive segments 35 and the non-conductive segments 36 are alternately arranged. This makes it possible to anodically connect a conductive segment 35 cathodically and an adjacent conductive segment 35, which is separated by a non-conductive segment 36 from the cathodically connected segment 35. In order to prevent a short circuit, it is necessary that the band 2 revolving around the shafts 3 be embodied in individual conductive 12 and electrically non-conductive sections 13. The non-conductive portions 13 of the band 2 must be arranged so that they each rest against a non-conductive segment 36 of the shaft. Removal of the metal deposited on the cathodically connected segment 35 of the shaft and the cathodically connected section 12 of the strip 2 is achieved by switching them anodically in the further circulation. For this purpose, 3 sliding contacts 37, 38 are preferably provided on the shafts. The first sliding contact 37 serves as the anode, the second sliding contact 38 as the cathode. As long as a conductive segment 35 is in contact with the first sliding contact 37, this segment 35 is anodically switched, as soon as it comes into contact with the second sliding contact 38, it is switched cathodically. In addition to the sliding contacts 37, 38 described here, it is also possible to use any other contact which does not hinder rotation of the shafts 3 and with which the conductive segments 35 can optionally be switched cathodically and anodically. The distance between the anode 37 and the cathode 38 must be so great that an equal early contact of anode 37 and cathode 38 with a conductive segment 35 is avoided.

Due to the anodically connected electrically conductive segments 35, it is not necessary in the embodiment shown in FIG. 16 to additionally provide further anodes. However, it is possible to arrange further anodes, for example in the form of flat bars, between the shafts 3.

FIG. 17 shows a side view of anodes during the galvanic coating.

Figure 18 shows the anodes in a position when the shafts 3, which are not shown here, change position.

If, in addition to the anodically connected shafts 3 or electrically conductive segments of the shafts 3 anodes 31 are provided, they can be constructed, for example, as shown in Figures 17 and 18.

During the coating process, the anodes 31 are in their extended position. In this case, they are arranged above and below the substrate 8 in the case of a substrate 8 which is simultaneously coated on the upper side and on the lower side. When only one side of the substrate 8 is coated, the anode 31 is preferably disposed on the side of the substrate 8 which is coated. Care must be taken here that the anode 31 does not touch the substrate. Otherwise, it could lead to a short circuit on the one hand, if the cathode touches the same electrically conductive structure as the anode, on the other hand would be removed during contact with the anode 31, the metal previously deposited on the structure again.

In order to enable a change of the waves, the anodes 31, as shown in FIG. 18 by the double arrow 41, are movable parallel to the surface of the substrate 8 to be coated. The movement is transverse to the direction in which the substrate is transported through the bath. This makes it possible to remove the anodes while the shafts 3 change position. Damage to anodes 31 and 3 waves is thereby avoided. In the embodiment shown here, the anodes 31 are made of a flexible material. As a result, it is possible to wind up or unwind the anodes in respectively assigned anode winding / unwinding devices 40. The anode winder / unwind devices 40 are preferably located above and below the bath as shown here. Such anable and unwindable anodes are made for example in the form of flexible metal bands or elastic spirals. If the anodes are made of elastic spirals, preferably several of the spirals are fastened next to one another. LIST OF REFERENCE NUMBERS

1 cathode

2 band

3 shaft 4 gap

5 top

6 bottom

7 electrically conductive structure

8 substrate 9 upper row

10 lower row

1 1 liquid level

12 electrically conductive section

13 electrically non-conductive section 14 transport direction

15 direction of movement of the waves

16 direction of movement of the waves

17 upper device

18 lower device 19 cathodically connected waves

20 anodic waves

21 pressure roller

22 more band

23 conductive segment 24 non-conductive segment

25 clip

26 flexible carrier

27 wire 30 groove 31 anode

32 senior section

35 conductive segment

36 non-conductive segment

37 anode 38 cathode

40 anode charging / unwinding device

41 direction of movement of the anode

d Distance between a cathodic and an anodically connected shaft h Distance between two cathodically connected waves

L length

Claims

claims

1. A device for electroplating at least one electrically conductive substrate (8) or a structured or full-surface electrically conductive surface on a non-conductive substrate (8), which at least one

Bath, an anode and a cathode (1), wherein the bath contains an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate (8) to form a metal layer, while the cathode (1) is connected to the to be coated O- berfläche of the substrate (8) is brought into contact and the substrate through the

Bad is promoted, characterized in that the cathode (1) comprises at least one band (2) with at least one electrically conductive portion which is guided by at least two rotatable shafts (3, 19).

2. Apparatus according to claim 1, characterized in that at least one of the shafts (3, 19, 20) is electrically conductive, wherein the voltage supply of the belt via the shaft (3, 19, 20).

3. Apparatus according to claim 1 or 2, characterized in that a plurality of strips (2) are arranged offset one behind the other.

4. Apparatus according to claim 3, characterized in that each successive staggered bands (2) via at least one common shaft (3) are guided.

5. Device according to one of claims 1 to 3, characterized in that at least one band (2) is in the form of a network or has holes.

6. The device according to claim 5, characterized in that the band formed in the form of a network comprises sections with different mesh size and / or mesh shape and / or offset stitches.

7. The device according to claim 5, characterized in that the perforated band comprises sections with different sized holes and / or differently shaped holes and / or staggered holes.

8. Device according to one of claims 1 to 7, characterized in that at least one band (2) alternately conductive portions (12) and non-conductive portions (13).

9. Apparatus according to claim 8, characterized in that the band (2) is additionally guided by at least one anodically connected shaft (3, 20).

10. The device according to claim 9, characterized in that the length (L) of the conductive portions (12) is greater than or equal to the distance (h) between the at least two cathodically connected waves and smaller than the distance (d) between a cathodic and a adjacent anodically connected wave.

11. Device according to one of claims 1 to 10, characterized in that the device further comprises a device with which the substrate (8) can be rotated, wherein the device can be arranged inside or outside the bath.

12. Device according to one of claims 1 to 1 1, characterized in that at least two bands (2) are arranged so that the substrate to be coated (8) is passed between them and the bands (2) respectively the top and the bottom contact the substrate (8).

13. Device according to one of claims 1 to 12, characterized in that the shafts (3) are both anodically and cathodically switchable and can be lowered onto the substrate (8) or raised from the substrate (8)

14. Device according to one of claims 1 to 13, characterized in that the conductive portions (12) of the at least one band (2) and the shaft surfaces are made of an electrically conductive material, which does not pass into the electrolyte solution during operation of the device.

15. Device according to one of claims 1 to 14, characterized in that for coating of flexible carriers, which are unwound from a first roll and wound onto a second roll, a plurality of at least two shafts (3) guided bands (2) one above the other or are arranged side by side, wherein the flexible carrier, the bands (2) meandering through.

16. Device according to one of claims 1 to 8, characterized in that the shafts (3) of a plurality of electrically conductive segments (35) are constructed, which are each separated by non-conductive segments (36) from each other, wherein the electrically conductive segments ( 35) can be switched both anodically and cathodically and the at least one band (2) of conductive sections (12) and non-conductive sections (13) is constructed and so on the waves (3) is positioned such that in each case a non-conductive portion (13) of the band (2) bears against a non-conductive segment (36) of the shaft (3).

17. A device for the galvanic coating of an electrically conductive substrate or an electrically conductive structure on a non-conductive substrate, characterized in that the device comprises a plurality of devices according to one of claims 1 to 16, which are connected in series.

18. A method for electroplating at least one substrate, which is carried out in a device according to one of claims 1 to 17, wherein for coating, the tape rests on the substrate and rotates at a rotational speed corresponding to the speed at which the substrate through the Bad is led.

19. The method according to claim 18, characterized in that the at least one band is supplied via at least one shaft with voltage.

20. The method according to claim 18 or 19, characterized in that for demetallizing the cathodically connected waves, these are raised and connected anodically.

21. The method according to claim 18 or 19, characterized in that the shafts are connected to the demetallizing during a production interruption anodic.

22. The method according to claim 18 or 19, characterized in that the band rotates at least one further shaft, which is connected as an anode, wherein the band alternately has conductive and non-conductive portions, the length of the conductive portions is smaller than the distance between a as an anode and a wave connected as a cathode and the band with the area between two waves contacts the substrate with which it is connected cathodically.

23. The method according to claim 22, characterized in that for demetallizing the cathodically connected waves, these are raised and switched anodically, while the anodically connected waves are lowered and switched cathodically.

24. The method according to any one of claims 18 to 23, characterized in that the substrate is rotated after passing through the device by a predetermined angle and the device then passes through a second time or a second device for electroplating.

25. The method according to any one of claims 18 to 24, characterized in that for adjusting the layer thickness of the metal layer, with which the electrically conductive substrate or the electrically conductive structure is coated on a non-conductive substrate, the contact time by increasing or decreasing the

Throughput speed and / or by the number of cascaded devices according to one of claims 1 to 16 is set.

26. Use of the device according to one of claims 1 to 17 for the galvanic see coating of electrically conductive substrates or of structured or full-surface electrically conductive surfaces on non-conductive substrates.

27. Use of the device according to one of claims 1 to 17 for the production of printed conductors on printed circuit boards, RFID antennas, transponder antennas or other antenna structures, smart card modules, flat cables, seat heaters, foil conductors, printed conductors in solar cells or in LCD or plasma screens or for the production of electroplated products in any form.

28. Use of the device according to one of claims 1 to 17 for the production of decorative or functional surfaces on products that are used for shielding from electromagnetic radiation, for heat conduction or as packaging.

29. Use of the device according to one of claims 1 to 17 for the production of thin metal foils or one or two-sided metal-clad polymer supports.