CN108430170A - A kind of production method of circuit board substrate - Google Patents
A kind of production method of circuit board substrate Download PDFInfo
- Publication number
- CN108430170A CN108430170A CN201810082476.2A CN201810082476A CN108430170A CN 108430170 A CN108430170 A CN 108430170A CN 201810082476 A CN201810082476 A CN 201810082476A CN 108430170 A CN108430170 A CN 108430170A
- Authority
- CN
- China
- Prior art keywords
- base material
- hole
- circuit board
- production method
- board substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of production methods of circuit board substrate, include the base material for processing, further comprising the steps of：To the processing of base material holes drilled through；To carrying out double spread using pair roller type roller coating machine by drilling treated base material, it is nanometer silver inks to be coated with coating used；It is dried, the base material after coating process is put into baking oven and is dried.The application is coated nanometer silver inks to substrate surface and through-hole by pair roller type roller coating machine, it only needs to carry out electroplating processes to through-hole when making circuit board, without carrying out black holes or PTH processing, greatly simplifies and the time is made, saved and cost is made.
Description
Technical field
The present invention relates to circuit board substrate field, more particularly to a kind of production method of circuit board substrate.
Background technology
With the fast development of electronic equipment in recent years, the requirement to circuit board is higher and higher, as mobile phone, tablet computer,
Display, navigator etc..
Existing circuit board, conductive layer generally use copper is at constantly pursuing more lighter thinner trend in electronic product
Under, also require circuit board more and more thinner, therefore, the reduction of the thickness of circuit board directly affects the economic benefit of enterprise；It is existing
Circuit board using electro-coppering material layer as conductive layer, have the following disadvantages：1) plating copper product is when metal etch
It is easily etched, the copper product of reserved certain size is needed to make, and in etching, wider circuit, the grade of product can only be made
It is relatively low；2) when first time copper plated material layer, the thickness of the copper material bed of material is 3 microns or more so that circuit plate thickness is thicker.
My earlier application CN107295754A and CN205793691U discloses semi-additive process and makes circuit board respectively
Method and a kind of circuit board, need to use the substrate with silver material layer during making this thin circuit board, lead to
Silver is crossed as middle layer to which thinner circuit board be made, but is all attached with one layer of silver material layer on existing substrate, is being added
It by being not no conductive layer in drilling metapore during work, therefore just needs to make hole conductive layer, makes hole conductive layer
Process it is complex, the PTH or black holes technique of generally use make conductive layer, are easy to damage on substrate in fabrication
Silver material layer, therefore how to exempt the process is the problem that this field faces always.
Invention content
Remove black holes from the technical problem to be solved by the present invention is to provide a kind of cocoa or PTH techniques make hole conductive layer step
A kind of circuit board substrate production method.
The technical solution adopted by the present invention to solve the technical problems is：A kind of production method of circuit board substrate, including
It is further comprising the steps of for the base material of processing：
A, drilling is handled, and is handled base material holes drilled through or blind hole；
B, coating process, specific is two-sided to being carried out using pair roller type roller coating machine by drilling treated base material
Coating is coated with one layer of nanometer silver ink on the base material for be drilled with through-hole while so that nanometer silver ink is filled among through-hole；
C, drying and sintering is handled, and the base material after coating process is put into baking oven and is dried.
The application is coated nanometer silver ink to substrate surface and through-hole by pair roller type roller coating machine, is making electricity
It only needs to carry out electroplating processes to through-hole when the plate of road, without carrying out black holes or PTH processing, greatly simplifie
The time is made, has saved and cost is made.
It is further：The base material is PI base materials.
It is further：It also include step between a steps and b step：A1, hole dirt slagging-off is carried out to through-hole.
The beneficial effects of the invention are as follows：Nanometer silver ink is coated to substrate surface and led to by pair roller type roller coating machine
In hole, only need to carry out electroplating processes to through-hole when making circuit board, without carrying out at black holes or PTH
Reason, greatly simplifies and the time is made, saved and cost is made, shorten and the time is made.
Description of the drawings
Fig. 1 is finished product structure sectional view.
Fig. 2 is pair roller type roller coating machine schematic diagram.
In figure label for：Base material 1, silver conductive layer 2.
Specific implementation mode
The present invention is further described with reference to the accompanying drawings and detailed description.
As depicted in figs. 1 and 2, a kind of production method of circuit board substrate, includes the base material for processing, and the base material is
Circuit board making field routinely uses base material, such as PVC, and preferably PI base materials, PI are polyamide, with fire-retardant, insulation, by force
Tough feature, it is further comprising the steps of：
A, drilling is handled, and is specifically, is handled 1 drilling of base material, is obtained the base material 1 with blind hole or through-hole, the brill
Hole mode is the mode to drill when common circuit board is processed, such as machine drilling or laser drill, and through-hole will for being arranged
The conductive layer of the upper surface and lower surface conducting of substrate, to realize the Highgrade integration of circuit board；
A1, carry out dirt slagging-off in hole to through-hole, be specifically, in holes drilled through on base just 1, through hole may have hole dirty or
Person's residue carries out hole dirt slagging-off, to ensure the smooth neatly without dirt of through-hole, to not interfere with follow-up work after piercing
Sequence；
B, coating process is specifically, to by drilling, treated that base material is coated with one layer of uniform silver conductive layer 2, painting
Coating used in cloth is nanometer silver ink, and nanometer silver ink passes through addition by the way that Silver nanoparticles are added in solvent
Suitable dispersant, surfactant and other auxiliary agents make Silver nanoparticles be uniformly dispersed in solvent, due to nanometer
The low feature of good leveling property, the viscosity of silver ink, therefore can be used for directly being coated with, it is pair roller type rolling to be coated with machine used
Coating machine is taken turns, this roller coating machine is generally used in the fields such as adhesive tape or film, by two pairs of rollers to realize while double spread,
And base material please by pair roller type roller coating machine for circuit board itself makes, due to there is certain pressure between two pairs of rollers, when right
When roller by the processing rear substrate that drills to being coated, nanometer silver ink can be pressed into through-hole, to fill up through-hole；
C, drying and sintering is handled, and is specifically that the base material after coating process, which is put into baking oven, is dried sintering, is dried
The actual temp of case is to make solvent in nano silver ink and other components volatilize completely, and remaining Solid Silver then can
It is attached on hole wall so that silver conductive layer 2 is also formed in hole wall, the application is by controlling the solid content of nanometer silver ink to control
The thickness of silver conductive layer 2 in through-hole processed.
The pair roller type roller coating machine for being usually used in adhesive tape, film field is used in the middle is used for field of circuit boards by the application, is used
The coating machine forms silver conductive layer 2 by nanometer silver ink uniformly coating to substrate surface and through-hole after dried so that
The application only needs to carry out electroplating processes to through-hole when making circuit board, without carrying out at black holes or PTH
Reason, greatly simplifies and the time is made, and has saved and has been made this, to can also be more careful with this substrate manufacture circuit, more
Add slim circuit board.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical solution and advantageous effect
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the present invention
Within the scope of shield.
Claims (3)
1. a kind of production method of circuit board substrate, it is characterised in that：Include the base material for processing, it is further comprising the steps of：
A, drilling is handled, specific for base material (1) holes drilled through or blind hole processing；
B, coating process, it is specific for by drilling, treated that base material carries out two-sided painting using pair roller type roller coating machine
Cloth is coated with one layer of nanometer silver ink (2) on the base material for be drilled with through-hole while so that nanometer silver ink is filled among through-hole；
C, drying and sintering is handled, specific to be dried for the base material after coating process is put into baking oven.
2. the production method of circuit board substrate as described in claim 1, it is characterised in that：The base material is PI base materials.
3. the production method of circuit board substrate as described in claim 1, it is characterised in that：Between a steps and b step also
Including step：
A1, hole dirt slagging-off is carried out to through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810082476.2A CN108430170A (en) | 2018-01-29 | 2018-01-29 | A kind of production method of circuit board substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810082476.2A CN108430170A (en) | 2018-01-29 | 2018-01-29 | A kind of production method of circuit board substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108430170A true CN108430170A (en) | 2018-08-21 |
Family
ID=63156312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810082476.2A Pending CN108430170A (en) | 2018-01-29 | 2018-01-29 | A kind of production method of circuit board substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108430170A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111385978A (en) * | 2018-12-29 | 2020-07-07 | 北京梦之墨科技有限公司 | Double-layer circuit and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU526505A2 (en) * | 1974-11-18 | 1976-08-30 | Lumber Base | |
| CN1462173A (en) * | 2002-05-31 | 2003-12-17 | 欣兴电子股份有限公司 | Manufacturing method of multilayer printed circuit board |
| CN101542022A (en) * | 2006-11-28 | 2009-09-23 | 巴斯夫欧洲公司 | Device and method for electroplating |
| CN102281700A (en) * | 2010-06-10 | 2011-12-14 | 南亚电路板股份有限公司 | Electrical structure of multilayer printed circuit board and manufacturing method thereof |
-
2018
- 2018-01-29 CN CN201810082476.2A patent/CN108430170A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU526505A2 (en) * | 1974-11-18 | 1976-08-30 | Lumber Base | |
| CN1462173A (en) * | 2002-05-31 | 2003-12-17 | 欣兴电子股份有限公司 | Manufacturing method of multilayer printed circuit board |
| CN101542022A (en) * | 2006-11-28 | 2009-09-23 | 巴斯夫欧洲公司 | Device and method for electroplating |
| CN102281700A (en) * | 2010-06-10 | 2011-12-14 | 南亚电路板股份有限公司 | Electrical structure of multilayer printed circuit board and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111385978A (en) * | 2018-12-29 | 2020-07-07 | 北京梦之墨科技有限公司 | Double-layer circuit and manufacturing method thereof |
| CN111385978B (en) * | 2018-12-29 | 2021-06-01 | 北京梦之墨科技有限公司 | Double-layer circuit and manufacturing method thereof |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180821 |