CN103369837B - Rolling catalysis slurry filling perforation also forms the double-sided flex circuit plate technique of circuit - Google Patents
Rolling catalysis slurry filling perforation also forms the double-sided flex circuit plate technique of circuit Download PDFInfo
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- CN103369837B CN103369837B CN201210101054.8A CN201210101054A CN103369837B CN 103369837 B CN103369837 B CN 103369837B CN 201210101054 A CN201210101054 A CN 201210101054A CN 103369837 B CN103369837 B CN 103369837B
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Abstract
Rolling catalysis slurry filling perforation of the present invention the double-sided flex circuit plate technique forming circuit belong to the method field of manufacturing of flexible PCB, bore via at flexible insulation base material coiled strip; Laminator RTR formula is adopted to stick release diffusion barrier in A face; Print the circuitous pattern that activator is formed in the B face of flexible insulation base material coiled strip, via is in silk-screen printing process and in the lump activator is inserted in hole; Utilize the tunnel type baking oven 80-85 that RTR formula automatic screen-printing machine carries
0c solidifies 20min, and rolling place of RTR formula automatic screen-printing machine automatically by flexible insulation base material be attached to the release diffusion barrier in A face and be separated, rolling respectively; The release diffusion barrier reverse side that A tears in face, then the B face of flexible insulation base material coiled strip is attached to by laminator; By flexible insulation base material be attached to the release diffusion barrier in B face and be separated, rolling respectively, double-sided flex circuit plate circuitous pattern makes complete; The method controllable degree is high and reliability is high.
Description
Technical field
The present invention relates to the manufacture method of flexible PCB, particularly relating to the method by adopting fully-additive process to manufacture double-sided flex circuit plate.
Background technology
Along with making rapid progress of microelectric technique, electronic equipment, more and more towards light, thin, short, the little and future development of multifunction, carries installation base plate miniaturization in the electronic device, the requirement of densification improves.As a link, extensively popularize installing the double-sided flex circuit plate being used for connecting between the installation base plate of various components and parts.
The traditional handicraft of double-sided flex circuit plate manufacture is a subtractive to method, comprising following technological process: bore via, hole metallization, the cleaning of copper foil surface, the coating of resist, the formation of conductive pattern, again by etching away the Copper Foil of inverter circuit figure, finally to the process that the Copper Foil stayed is correlated with, obtain double-sided flex circuit plate.Subtractive process is the main method that current printed circuit manufactures, and its great advantage is technical maturity, stable and reliable.But there is complex process, adopt etching simultaneously, also can produce the three wastes according to equivalent processes, can environmental pollution be caused if dealt with improperly.And adopt fully-additive process manufacture double-sided flex circuit plate can simplify production procedure and avoid etching, according to equivalent processes.Current fully-additive process, mainly adopt electrically conductive ink filling perforation and directly on insulating substrate, form circuit, thus forming double-sided flex circuit plate, the electrically conductive ink that can meet flexible PCB application requirement is at present silver-colored electrically conductive ink, but silver-colored electrically conductive ink is expensive, cannot industrially apply.
For the problems referred to above, and the patent of application before combining: " a kind of can the chemical plating activator preparation method of wire mark and poling processing technique thereof (application number: 201110081927.9) ", the present invention proposes a kind ofly adopt activator filling perforation to metallize and form the double-sided flex circuit plate manufacturing process of the Reel-to-reel type of conducting wire simultaneously.
Summary of the invention
According to patent, (feature of a kind of chemical plating activator preparation method of energy wire mark and the middle activator energy silk-screen coating of poling processing technique (application number: 201110081927.9)) thereof, develops the technique that a kind of fully-additive process manufactures double-sided flex circuit plate in the present invention.This fully-additive process manufactures the technique of double-sided flex circuit plate, it is characterized in that comprising the following steps:
(1) via is bored at flexible insulation base material coiled strip with adopting F502L-RTR type puncher volume to volume (RolltoRoll);
(2) for convenience of explanation, flexible insulation base material coiled strip is divided into A, B two sides, adopts laminator RTR formula sticking release diffusion barrier in A face;
(3) adopt RTR formula automatic screen-printing machine to print the circuitous pattern of activator formation in the B face of flexible insulation base material coiled strip, via is in silk-screen printing process and in the lump activator is inserted in hole;
(4) tunnel type baking oven 80 ~ 85 that RTR formula automatic screen-printing machine carries is utilized
0solidification 20min, and rolling place of RTR formula automatic screen-printing machine automatically by flexible insulation base material be attached to the release diffusion barrier in A face and be separated, rolling respectively;
(5) the A face release diffusion barrier reverse side (clean face) of tearing, then the B face of flexible insulation base material coiled strip is attached to by laminator;
(6) adopt RTR formula automatic screen-printing machine at the A face printed circuit figure of flexible insulation base material coiled strip again, being in silk-screen printing process for via inserts in hole by activator in the lump, same via adopts twice silk-screen to insert activator, guarantee that activator can be evenly distributed in hole, thus the conducting of heavy copper metapore;
(7) the tunnel type baking oven solidification 30min utilizing RTR formula automatic screen-printing machine to carry, and curing temperature is determined, wherein PET(polyester according to flexible insulation base material kind) curing temperature controls 100 ± 3
0c, PI(polyimides) curing temperature controls 130 ± 5
0c;
(8) rolling place of RTR formula automatic screen-printing machine automatically by flexible insulation base material be attached to the release diffusion barrier in B face and be separated, rolling respectively, so far, double-sided flex circuit plate circuitous pattern makes complete;
(9) metallize to double-sided flex circuit plate circuitous pattern and via, metallized mode has simultaneously: mode one adopts chemical plating thick copper liquid medicine, carries out the metallization of RTR formula electroless copper, thus realizes through hole and conductive pattern metallizes simultaneously; Mode two adopts the thin copper liquid medicine of chemical plating, carries out RTR formula and tentatively realize through hole and conductive pattern copper metallization simultaneously, then thickeied by horizontal electro-coppering;
(10) to double-sided flex circuit plate after copper metallization, reprocessing is carried out;
(11) the double-sided flex circuit plate that meets the requirements is obtained.
The flexible insulation base material of above-mentioned steps (1) is mainly PET(polyester) film and PI(polyimides) film; wherein PET thickness specification 0.0125mm, 0.025mm, 0.05mm, 0.075um, and PI thickness specification 0.015mm, 0.025mm, 0.03mm, 0.035mm, 0.038mm, 0.04mm, 0.05mm, 0.075mm, 0.08mm, 0.100mm;
Above-mentioned steps (1) is more than or equal to 0.2mm in the aperture of flexible insulation base material via, and this determines primarily of F502L-RTR type puncher borehole accuracy and activator process for filling hole;
Above-mentioned steps (2) adopts laminator RTR formula to stick release diffusion barrier in A face, its object is to for during silk-screen B face, activator is pressed in via, partial activation agents may be had and arrive screen printing table through via, dirty dye screen printing table, in order to avoid this type of situation occurs, therefore release diffusion barrier is sticked in employing;
Adopt the activator of silk-screen in above-mentioned steps (3), it is characterized in that: the scheme 1, adopting patent " a kind of chemical plating activator preparation method of energy wire mark and poling processing technique thereof " to describe prepares activator; 2, the key parameter of activator: fineness 10um and following, viscosity 10000 ± 200mps, makes activator more liquid, makes it mainly be uniformly distributed along hole wall in silk-screen filling perforation process;
The circuitous pattern that activator is formed is printed in above-mentioned steps (3), it is characterized in that: 1, adopt 450 ~ 600 object polyester nets to carry out silk-screen, when mesh number is less than 450 order silk-screen fine rule road, under stereoscope, amplify 40 times may observe burr, mesh number is higher than after 600 orders, at present oil mass is on the low side on silk-screen fine rule road, may pin-hole phenomena; 2, the live width of circuitous pattern is more than or equal to 0.25mm, and distance between centers of tracks is more than or equal to 0.25mm;
Activator is inserted in hole in (3) by above-mentioned steps, it is characterized in that: 1, utilize silk-screen scraper to scrape in hand-hole by activator, and activator bore edges is distributed, and unnecessary falls into release diffusion barrier; 2, aperture is too small, and except being distributed in the activator in hole wall, unnecessary activator can not drop on smoothly in release diffusion barrier and cause plug-hole, poor flow after follow-up metallization, therefore aperture is more than or equal to 0.30mm;
Tunnel type baking oven 80 ~ 85 in above-mentioned steps (4)
0solidification 20min, its objective is and make activator primary solidification, flexible insulation base material is at this temperature without obvious change in size simultaneously, is beneficial to the exactitude position of silk-screen B face filling perforation;
Being separated of flexible insulation base material and release diffusion barrier phase must just it separates after hardening in above-mentioned steps (4), because activator is PET or PI moistened surface is good, at release diffusion barrier moistening badness, the activator in the curing process owing to being distributed in two kinds of different substrate materials under capillary effect use separates automatically;
Stick release diffusion barrier in the B face of flexible insulation base material coiled strip in above-mentioned steps (5), its objective is the circuitous pattern that protection is printed, preventing from metallizing due to frictionally damage when silk-screen there is open circuit phenomenon;
In above-mentioned steps (6) during silk-screen A face, the accuracy of contraposition mainly relies on: 1, lower curing temperature in above-mentioned steps (4), makes flexible insulation base material without obvious change in size; 2, RTR formula automatic screen-printing machine automatic tension adjustment instrument and CCD para-position;
In above-mentioned steps (7) after baking-curing, adopt 3M adhesive tape to pull test activator adhesion on flexible insulation base material, all come off without any, therefore adhesion meets the requirements;
Above-mentioned steps (9) middle employing RTR formula realizes double-sided flex circuit plate circuitous pattern and via metallizes simultaneously, it is characterized in that: under the activator catalysis effect of forming circuit figure and via, there is the copper metallization that electroless copper reaction realizes double-sided flex circuit plate, or carry out horizontal electro-coppering thickening further, the thick copper of above-mentioned steps (9) middle employing RTR formula chemical plating realizes double-sided flex circuit plate circuitous pattern and via metallizes simultaneously, it is characterized in that: 1, technological process: anti-oxidant washing and drying is washed in washing chemical plating thick copper washing pickling, 2, wash in technological process and all adopt DI water, 1 effect of wherein washing be wash clean printed circuitous pattern flexible insulation base material on dust foreign material, in order to avoid pollution plating solution, the plating solution taken out of is removed in washing 2 effect, the dilute sulfuric acid of take out of 2 ~ 3% is removed in washing 3, and the oxidation resistance liquid taken out of is removed in washing 4, 3, the thick copper of chemical plating in technological process, what adopt be average deposition speed is the thick copper liquid medicine of the business-like chemical plating of 3 ~ 5um/h, wherein as ROHM AND HAAS, the thick copper of chemical plating of the enterprises such as Shenzhen AsiaSat electronics all meets the demands, its Operating parameters all adopts liquid medicine supplier designs optimum condition, wherein the electroless copper time is that 30min ~ 150min is adjustable, the design electroless copper time is carried out according to resistance requirements, after electroless copper layers of copper gross thickness 0 ~ 10um between, if layers of copper is more than 10um, because layers of copper stress causes more greatly layers of copper and base material adhesion not to meet double-sided flex circuit plate national standard, 4, pickling in technological process,
Adopt the dilute sulfuric acid of 2 ~ 3%, the main slight oxidation layer removed layers of copper surface and may exist; 5, anti-oxidant in technological process, that mainly adopt is organic solderability preservative (OSP), processing time 60 ~ 120s, prevents layers of copper to be oxidized impedance and increases; 6, dry in technological process, remove the moisture on double-sided flex circuit plate surface;
The thin copper liquid medicine of chemical plating is first adopted in above-mentioned steps (9); carry out RTR formula and tentatively realize through hole and conductive pattern copper metallization simultaneously; thickeied by horizontal electro-coppering again; it is characterized in that: 1, first adopt the thin copper liquid medicine of chemical plating to carry out RTR formula and tentatively realize through hole and conductive pattern copper metallization simultaneously, its objective is in order to horizontal electro-coppering has higher current efficiency; 2, technological process: anti-oxidant washing and drying is washed in the electro-coppering of washing chemical plating thin copper washing acid washing water flat; 3, wash in technological process and all adopt DI water, 1 effect of wherein washing be wash clean printed circuitous pattern flexible insulation base material on dust foreign material, in order to avoid pollute plating solution, the plating solution taken out of is removed in washing 2 effect, the acid copper plating solution taken out of is removed in washing 3, and the oxidation resistance liquid taken out of is removed in washing 4; 4, the thin copper of chemical plating in technological process,
What adopt be average deposition speed is the thin copper liquid medicine of the business-like chemical plating of 2 ~ 3um/h, and obtain crystallization uniform and delicate, low stress coating, this layer does the substrate of copper electroplating layer, and wherein the electroless copper time is that 30min ~ 60min is adjustable, 5, pickling in technological process, adopts the dilute sulfuric acid of 5 ~ 10%, main remove slight oxidation layer that layers of copper surface may exist and causes microetch to layers of copper, and copper electroplating layer and chemical plating copper layer adhesion are strengthened, 6, electro-coppering in technological process, its objective is that adding thick copper layer makes double-sided flex circuit plate circuit board meet instructions for use, the electroplating liquid medicine adopted is the electroplating acid copper of sulfuric acid system, as the sour copper liquid medicine of the companies such as Atotech and wheat dolantin, wherein its Operating parameters all adopts the liquid medicine supplier designs optimum condition electro-coppering time to be that 20min ~ 50min is adjustable, the design electro-coppering time is carried out according to resistance requirements, after plating, the THICKNESS CONTROL of layers of copper is at 0 ~ 10um, if layers of copper is more than 10um, because layers of copper stress causes more greatly layers of copper and base material adhesion not to meet double-sided flex circuit plate national standard, 7, anti-oxidant in technological process in technological process, that mainly adopt is organic solderability preservative (OSP), processing time 60 ~ 120s, prevents layers of copper to be oxidized impedance and increases, 8, dry in technological process, remove the moisture on double-sided flex circuit plate surface,
Reprocessing in above-mentioned steps (10), wherein mainly comprises voltage protection film, the techniques such as surface treatment.
Beneficial effect of the present invention:
(1) technological process is simple, automaticity is high and advantage of low cost to adopt RTR formula fully-additive process making double-sided flex circuit plate to have; (2) adopt RTR formula fully-additive process to make double-sided flex circuit plate, directly on insulating substrate, form conducting wire, avoid use Copper Foil and subtractive process etching, masking process, have that cost is low, an advantage such as low-carbon (LC) and environmental protection; (3) propose catalysis slurry filling perforation method for metallising, the method controllable degree is high and reliability is high, has developed PCB aperture metallization process.
Embodiment
Table 1 electroless copper formula of liquid (Shenzhen AsiaSat electron chemistry Materials Co., Ltd)
| Chemical reagent | Concentration (V/V) |
| 900A | 10% |
| 900B | 10% |
| 900M | 10% |
| Temperature ( 0C） | 40~45 0C |
Table 2 electroless copper plating operations concentration
| Chemical bronze plating liquid main component concentration | Concentration (g/L) |
| Cu 2+ | 1.5~2.0 |
| NaOH | 8.5~10 |
| CH 2O | 6.5~8 |
Activator layoutprocedure
According to patent (a kind of can the chemical plating activator preparation method of wire mark and poling processing technique (application number: 201110081927.9)) configuration activator thereof, it specifically passes as follows:
The preparation of film forming phase:
(1) take the conductive black of 50g, add the mixed solvent (isophorone: cyclohexanone: butyl acetate=1:3:2) of 50g, add the OP-10 emulsifying agent of 0.05ml, mix and blend 30min;
(2) added in 80g polyurethane resin by above-mentioned mixture, then add dispersion levelling agent 0.6g, defoamer 0.5g, adopts rotating speed to be 2000 turns/min, carries out stirring 15min;
(3) after mixing, adopt three-roller grinding, be ground to the regular hour, sampling adopts Hegman grind gage to measure fineness, its fineness 10um and following, and the preparation of film forming phase completes.
The preparation of activation phase:
(1) water taking the silver nitrate 5ml of 10g fully dissolves; add equivalent diacetone alcohol, alcohols solvent or esters solvent again; add 0.5mlOP-10 solution (1mlOP-10 is dissolved in wiring solution-forming in 100ml butyl acetate) in stirring and obtain A liquid, add in reaction ax;
(2) in reaction ax, add the manganese dioxide powder that quality is 2g, fully stir 20min and obtain;
(3) ascorbic acid is made into B liquid, under agitation instills in reaction ax, the silver ion reduction of a part is become silver-colored simple substance.
The preparation of activator:
(1) to the film forming prepared mutually in add the molten polyurethane resin of 20g ester, the epoxy resin of 15g, add mixed solvent 15ml;
(2) 0.3g thickener gas phase SiO is added
2, stir 10min, then add 0.2g adhesion promoter FULL-900 stirring 10min;
(3) under agitation add activation phase, continue to stir 30min;
(4) sampling adopts Hegman grind gage to measure fineness, its fineness 10um and following, if do not meet, continues dispersed with stirring;
(5) adopt the viscosity of rotary viscosity design determining product, and adopt mixed solvent by its viscosity at 10000mPas;
(6) before use slurry carries out wire mark, add 0.3% trien that quality is actived slurry, continue to stir 10min;
Embodiment 1
Activator is adopted on PET and the PI film of 75um, to make double-sided flex circuit plate respectively.
(1) according to patent (a kind of chemical plating activator preparation method of energy wire mark and poling processing technique (application number: 201110081927.9)) configuration activator thereof, its fineness 10um and following, viscosity 10000mPas;
(2) boring via aperture at flexible insulation base material coiled strip with adopting F502L-RTR type puncher volume to volume (RolltoRoll) is 0.4m;
(3) for convenience of explanation, flexible insulation base material coiled strip is divided into A, B two sides, adopts laminator RTR formula sticking release diffusion barrier in A face;
(4) adopt RTR formula automatic screen-printing machine to print the circuitous pattern of activator formation in the B face of flexible insulation base material coiled strip, via is in silk-screen printing process and in the lump activator is inserted in hole;
(5) tunnel type baking oven 80 ~ 85 that RTR formula automatic screen-printing machine carries is utilized
0solidification 20min, and rolling place of RTR formula automatic screen-printing machine automatically by flexible insulation base material be attached to the release diffusion barrier in A face and be separated, rolling respectively;
(6) the A face release diffusion barrier reverse side (clean face) of tearing, then the B face of flexible insulation base material coiled strip is attached to by laminator;
(7) adopt RTR formula automatic screen-printing machine at the A face printed circuit figure of flexible insulation base material coiled strip again, being in silk-screen printing process for via inserts in hole by activator in the lump, same via adopts twice silk-screen to insert activator, guarantee that activator can be evenly distributed in hole, thus the conducting of heavy copper metapore;
(8) the tunnel type baking oven solidification 30min utilizing RTR formula automatic screen-printing machine to carry, and curing temperature is determined, wherein PET(polyester according to flexible insulation base material kind) curing temperature controls 100 ± 3
0c, PI(polyimides) curing temperature controls 130 ± 5
0c;
(9) rolling place of RTR formula automatic screen-printing machine automatically by flexible insulation base material be attached to the release diffusion barrier in B face and be separated, rolling respectively, so far, double-sided flex circuit plate circuitous pattern makes complete;
(10) RTR formula sinks copper 60min;
(11) properties test such as table 1 shows.
Table 1
| Layers of copper and base material adhesion | Copper is thick | Conductivity (test point 1, resistance .1 between 2, the length 1.2m between 2) | Bending property (diameter 1mm circular shaft is bending to be evaluated, and 30 times of large mirror viewings are standard less than crackle) |
| 3M adhesive tape test comes off without any for 3 times | 3.5um | 2.8Ω | Have no crackle 50 times |
Embodiment 2
Be its critical process for double sided board mesoporous metal, employing thickness is 75um, and aperture is respectively
1.0mm, 0.8mm, 0.6mm, 0.4mm, 0.2mm, with crystalline phase section research activator the pattern of hole metallization and copper thick.
The filling perforation of known employing catalysis slurry again electroless copper or first electroless copper again electrolytic copper can obtain the good plated-through hole of conduction, illustrate that this invention has developed fully-additive process and manufactured double-sided flex circuit plate technique, also develop hole metallization new technology simultaneously.
Claims (9)
1. Reel-to-reel type (RTR) fully-additive process makes a technique for double-sided flex circuit plate, it is characterized in that: wire mark activator filling perforation metallization also forms the double-sided flex circuit plate manufacturing process of the Reel-to-reel type of conducting wire simultaneously, and its committed step comprises:
(1) via is bored at flexible insulation base material coiled strip with adopting F502L-RTR type puncher volume to volume (RolltoRoll);
(2) for convenience of explanation, flexible insulation base material coiled strip is divided into A, B two sides, adopts laminator RTR formula sticking release diffusion barrier in A face;
(3) adopt RTR formula automatic screen-printing machine to print the circuitous pattern of activator formation in the B face of flexible insulation base material coiled strip, via is in silk-screen printing process and in the lump activator is inserted in hole;
(4) tunnel type baking oven 80 ~ 85 DEG C solidification 20min utilizing RTR formula automatic screen-printing machine to carry, and rolling place of RTR formula automatic screen-printing machine automatically by flexible insulation base material be attached to the release diffusion barrier in A face and be separated, rolling respectively;
(5) the A face release diffusion barrier reverse side of tearing, then the B face of flexible insulation base material coiled strip is attached to by laminator;
(6) adopt RTR formula automatic screen-printing machine at the A face printed circuit figure of flexible insulation base material coiled strip again, being in silk-screen printing process for via inserts in hole by activator in the lump, same via adopts twice silk-screen to insert activator, guarantee that activator can be evenly distributed in hole, thus the conducting of heavy copper metapore;
(7) the tunnel type baking oven solidification 30min utilizing RTR formula automatic screen-printing machine to carry, and curing temperature is according to flexible insulation base material kind and determining, wherein PET curable polyester temperature control 100 ± 3 DEG C, PI polyimide curing temperature controls at 130 ± 5 DEG C;
(8) rolling place of RTR formula automatic screen-printing machine automatically by flexible insulation base material be attached to the release diffusion barrier in B face and be separated, rolling respectively, so far, double-sided flex circuit plate circuitous pattern makes complete;
(9) metallize to double-sided flex circuit plate circuitous pattern and via, metallized mode has simultaneously: mode one adopts chemical plating thick copper liquid medicine, carries out the metallization of RTR formula electroless copper, thus realizes through hole and conductive pattern metallizes simultaneously; Mode two adopts the thin copper liquid medicine of chemical plating, carries out RTR formula and tentatively realize through hole and conductive pattern copper metallization simultaneously, then thickeied by horizontal electro-coppering;
(10) to double-sided flex circuit plate after copper metallization, reprocessing is carried out;
(11) the double-sided flex circuit plate that meets the requirements is obtained;
Described activator is prepared from the following way:
The preparation of film forming phase:
(1) take the conductive black of 50g, add the mixed solvent of 50g: isophorone: cyclohexanone: butyl acetate=1:3:2, add the OP-10 emulsifying agent of 0.05ml, mix and blend 30min;
(2) added in 80g polyurethane resin by above-mentioned mixture, then add dispersion levelling agent 0.6g, defoamer 0.5g, adopts rotating speed to be 2000 turns/min, carries out stirring 15min;
(3) after mixing, adopt three-roller grinding, be ground to the regular hour, sampling adopts Hegman grind gage to measure fineness, its fineness 10um and following, and the preparation of film forming phase completes;
The preparation of activation phase:
(1) water taking the silver nitrate 5ml of 10g fully dissolves, add equivalent diacetone alcohol, alcohols solvent or esters solvent again, add 0.5mlOP-10 solution in stirring, 1mlOP-10 is dissolved in wiring solution-forming in 100ml butyl acetate and obtains A liquid, adds in reaction ax;
(2) in reaction ax, add the manganese dioxide powder that quality is 2g, fully stir 20min and obtain;
(3) ascorbic acid is made into B liquid, under agitation instills in reaction ax, the silver ion reduction of a part is become silver-colored simple substance;
The preparation of activator:
(1) to the film forming prepared mutually in add the molten polyurethane resin of 20g ester, the epoxy resin of 15g, add mixed solvent 15ml;
(2) 0.3g thickener gas phase SiO is added
2, stir 10min, then add 0.2g adhesion promoter FULL-900 stirring 10min;
(3) under agitation add activation phase, continue to stir 30min;
(4) sampling adopts Hegman grind gage to measure fineness, its fineness 10um and following, if do not meet, continues dispersed with stirring;
(5) adopt the viscosity of rotary viscosity design determining product, and adopt mixed solvent by its viscosity at 10000mPas;
(6) before use slurry carries out wire mark, add 0.3% trien that quality is actived slurry, continue to stir 10min.
2. a kind of Reel-to-reel type (RTR) fully-additive process according to claim 1 makes the technique of double-sided flex circuit plate; it is characterized in that: described flexible insulation base material is PET(polyester) film and PI(polyimides) film; wherein PET thickness specification 0.0125mm, 0.025mm, 0.05mm, 0.075um, and PI thickness specification 0.015mm, 0.025mm, 0.03mm, 0.035mm, 0.038mm, 0.04mm, 0.05mm, 0.075mm, 0.08mm, 0.100mm; Aperture is more than or equal to 0.2mm.
3. a kind of Reel-to-reel type (RTR) fully-additive process according to claim 1 makes the technique of double-sided flex circuit plate, it is characterized in that: the key parameter of activator: fineness 10um and following, viscosity 10000 ± 200mps, make activator more liquid, make it mainly be uniformly distributed along hole wall in silk-screen filling perforation process.
4. a kind of Reel-to-reel type (RTR) fully-additive process according to claim 1 makes the technique of double-sided flex circuit plate, it is characterized in that: adopt 450 ~ 600 object polyester nets to carry out silk-screen, the live width of circuitous pattern is more than or equal to 0.25mm, and distance between centers of tracks is more than or equal to 0.25mm.
5. a kind of Reel-to-reel type (RTR) fully-additive process according to claim 1 makes the technique of double-sided flex circuit plate, it is characterized in that: described flexible insulation base material and the separation sequence of release diffusion barrier phase first solidify to be separated afterwards.
6. a kind of Reel-to-reel type (RTR) fully-additive process according to claim 1 makes the technique of double-sided flex circuit plate, it is characterized in that: in described RTR formula silk-screen, the corresponding accuracy on A, B two sides controls, B face curing temperature 80 ~ 85 DEG C, makes flexible insulation base material without obvious change in size; RTR formula automatic screen-printing machine automatic tension adjustment instrument and CCD para-position.
7. a kind of Reel-to-reel type (RTR) fully-additive process according to claim 1 makes the technique of double-sided flex circuit plate, it is characterized in that: step (9) described employing RTR formula realizes double-sided flex circuit plate circuitous pattern and via metallizes simultaneously, under the activator catalysis effect of forming circuit figure and via, there is the copper metallization that electroless copper reaction realizes double-sided flex circuit plate, or carry out horizontal electro-coppering thickening further.
8. a kind of Reel-to-reel type (RTR) fully-additive process according to claim 7 makes the technique of double-sided flex circuit plate, it is characterized in that: 1, technological process: washing 1, the thin copper of chemical plating, washing 2, pickling, horizontal electro-coppering, washing 3, anti-oxidant, washing 4, dry; 2, wash in technological process and all adopt DI water, 1 effect of wherein washing be wash clean printed circuitous pattern flexible insulation base material on dust foreign material, in order to avoid pollution plating solution, the plating solution taken out of is removed in washing 2 effect, the dilute sulfuric acid of take out of 2 ~ 3% is removed in washing 3, and the oxidation resistance liquid taken out of is removed in washing 4; 3, the thick copper of chemical plating in technological process, what adopt be average deposition speed is the thick copper liquid medicine of the business-like chemical plating of 3 ~ 5um/h, wherein the electroless copper time is that 30min ~ 150min is adjustable, the design electroless copper time is carried out according to resistance requirements, after electroless copper layers of copper gross thickness 0 ~ 10um between, if layers of copper is more than 10um, because layers of copper stress causes more greatly layers of copper and base material adhesion not to meet double-sided flex circuit plate national standard; 4, pickling in technological process, adopts the dilute sulfuric acid of 2 ~ 3%, the main slight oxidation layer removed layers of copper surface and may exist; 5, anti-oxidant in technological process, that mainly adopt is organic solderability preservative (OSP), processing time 60 ~ 120s, prevents layers of copper to be oxidized impedance and increases; 6, dry in technological process, remove the moisture on double-sided flex circuit plate surface.
9. a kind of Reel-to-reel type (RTR) fully-additive process according to claim 7 makes the technique of double-sided flex circuit plate, it is characterized in that: 1, first adopt the thin copper liquid medicine of chemical plating to carry out RTR formula and tentatively realize through hole and conductive pattern copper metallization simultaneously, its objective is in order to horizontal electro-coppering has higher current efficiency; 2, technological process: washing 1, the thin copper of chemical plating, washing 2, pickling, horizontal electro-coppering, washing 3, anti-oxidant, washing 4, dry; 3, wash in technological process and all adopt DI water, 1 effect of wherein washing be wash clean printed circuitous pattern flexible insulation base material on dust foreign material, in order to avoid pollute plating solution, the plating solution taken out of is removed in washing 2 effect, the acid copper plating solution taken out of is removed in washing 3, and the oxidation resistance liquid taken out of is removed in washing 4; 4, the thin copper of chemical plating in technological process, what adopt be average deposition speed is the thin copper liquid medicine of the business-like chemical plating of 2 ~ 3um/h, obtain crystallization uniform and delicate, low stress coating, this layer does the substrate of copper electroplating layer, and wherein the electroless copper time is that 30min ~ 60min is adjustable; 5, pickling in technological process, adopts the dilute sulfuric acid of 5 ~ 10%, main remove slight oxidation layer that layers of copper surface may exist and causes microetch to layers of copper, and copper electroplating layer and chemical plating copper layer adhesion are strengthened; 6, electro-coppering in technological process, its objective is that adding thick copper layer makes double-sided flex circuit plate circuit board meet instructions for use, the electroplating liquid medicine adopted is the electroplating acid copper of sulfuric acid system, the electro-coppering time is that 20min ~ 50min is adjustable, the design electro-coppering time is carried out according to resistance requirements, after plating, the THICKNESS CONTROL of layers of copper is at 0 ~ 10um, if layers of copper is more than 10um, because layers of copper stress causes more greatly layers of copper and base material adhesion not to meet double-sided flex circuit plate national standard; 7, anti-oxidant in technological process in technological process, that mainly adopt is organic solderability preservative (OSP), processing time 60 ~ 120s, prevents layers of copper to be oxidized impedance and increases; 8, dry in technological process, remove the moisture on double-sided flex circuit plate surface.
Priority Applications (1)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20180145396A1 (en) * | 2016-11-21 | 2018-05-24 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for producing vias on flexible substrate |
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| CN105826664A (en) * | 2015-09-07 | 2016-08-03 | 维沃移动通信有限公司 | Method for making antenna and antenna structure |
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| CN1086372A (en) * | 1992-08-28 | 1994-05-04 | 株式会社日立制作所 | Produce the method for printed substrate |
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| WO2001038086A1 (en) * | 1999-11-26 | 2001-05-31 | Hitachi, Ltd. | Member having metallic layer, its manufacturing method, and its application |
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| CN1086372A (en) * | 1992-08-28 | 1994-05-04 | 株式会社日立制作所 | Produce the method for printed substrate |
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| 《高密度FPC的最新技术动向》;蔡积庆;《特种印制板》;20051130(第11期);第56-60页 * |
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| US20180145396A1 (en) * | 2016-11-21 | 2018-05-24 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for producing vias on flexible substrate |
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