CN111385978B - Double-layer circuit and manufacturing method thereof - Google Patents
Double-layer circuit and manufacturing method thereof Download PDFInfo
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- CN111385978B CN111385978B CN201811632205.6A CN201811632205A CN111385978B CN 111385978 B CN111385978 B CN 111385978B CN 201811632205 A CN201811632205 A CN 201811632205A CN 111385978 B CN111385978 B CN 111385978B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a double-layer circuit and a manufacturing method thereof, and relates to the technical field of printed electronic manufacturing. The manufacturing method comprises the following steps: step S1, selecting a substrate; step S2, forming a via hole penetrating through the substrate on the substrate; step S3, forming surface modification layers adhered with liquid metal on two surfaces of the base material and the inner walls of the through holes; step S4, forming patterns of the non-adhesive liquid metal on the surface modification layers on the two sides of the base material by using the material of the non-adhesive liquid metal; and step S5, coating liquid metal on the area of the surface modification layer which is not covered by the pattern without adhering liquid metal, and forming a liquid metal double-layer circuit. The liquid metal double-layer circuit in the embodiment of the invention can realize the direct coating of the liquid metal on the two sides of the substrate by utilizing the coating which is adhered and not adhered with the liquid metal, and has the advantages of high manufacturing efficiency, simple manufacturing process and convenience for batch industrial manufacturing compared with direct-write printing.
Description
Technical Field
The invention belongs to the technical field of printed electronic manufacturing, and particularly relates to a double-layer circuit and a manufacturing method thereof.
Background
With the continuous progress of printed electronics, conductive fluids, as represented by liquid metals, have made direct writing, printing, and other direct circuit printing technologies possible. In the existing liquid metal direct writing and printing, liquid metal ink is soaked and adhered to the surface of an organic polymer substrate to realize single-layer printing of a conducting circuit.
However, for the fabrication of the dual-layer circuit, the above-mentioned method needs to turn over the single-layer liquid metal circuit, form the single-layer liquid metal circuit on the other surface of the substrate, and then implement the fabrication of the dual-layer circuit through the processes of punching, via hole trimming, etc., which is inefficient and complex in process.
Disclosure of Invention
In view of the above, an objective of the present invention is to provide a method for manufacturing a liquid metal double-layer circuit, so as to solve the problem of low manufacturing efficiency of the liquid metal double-layer circuit in the prior art.
In some demonstrative embodiments, a method of fabricating the liquid metal bi-layer circuit includes: step S1, selecting a substrate; step S2, forming a via hole penetrating through the substrate on the substrate; step S3, forming surface modification layers adhered with liquid metal on two surfaces of the base material and the inner walls of the through holes; step S4, forming patterns of the non-adhesive liquid metal on the surface modification layers on the two sides of the base material by using the material of the non-adhesive liquid metal; and step S5, coating liquid metal on the area of the surface modification layer which is not covered by the pattern without adhering liquid metal, and forming a liquid metal double-layer circuit.
In some optional embodiments, in step S3, the surface modification layer is formed by immersing the substrate in a colloid containing an adhesive liquid metal, and taking out the colloid.
In some optional embodiments, the method further comprises: and after the base material is taken out, drying the colloid attached to the surface of the base material to form the surface modification layer.
In some alternative embodiments, the colloid is one or more of PDMS, Ecoflex, polyurethane, silica gel, and acrylic polymer.
In some optional embodiments, the pattern of the non-adhering liquid metal is formed on the surface modification layer by laser or spray printing in the step S4.
In some optional embodiments, the step S5 includes: and coating liquid metal on two sides of the base material in a full-page mode by using a printing and/or spraying mode, so that the liquid metal is attached to the area, which is not shielded by the pattern without the liquid metal, on the surface modification layer.
In some optional embodiments, the substrate is one of printing paper, paperboard, kraft paper, coated paper, aramid paper, copper foil, iron foil, polyethylene film, polycarbonate sheet, polyimide film, polytetrafluoroethylene sheet, cotton cloth, hemp cloth, silk cloth, polyester cloth, polyamide cloth, polypropylene cloth, viscose cloth, dust-free cloth, and acetate cloth.
In some alternative embodiments, the material that does not adhere to liquid metal is wax, carbon powder, or graphite.
Another objective of the present invention is to provide a liquid metal double-layer circuit, which can be manufactured by any one of the above methods.
In some demonstrative embodiments, the liquid metal bi-layer circuit includes: a substrate with a via hole; a surface modification layer adhered to the surface of the base material and having a liquid metal adhered thereto; the patterns are attached to the surface modification layers on the two sides of the base material and do not adhere to liquid metal; liquid metal attached to the surface modification layer in areas not obscured by the pattern of non-adherent liquid metal.
In some alternative embodiments, the substrate has a thickness of 50 μm to 5000 μm; the thickness of the surface modification layer is 1-500 μm; the thickness of the pattern of the non-adhesive liquid metal is 1-500 mu m; the thickness of the liquid metal is 1-1000 μm.
Compared with the prior art, the invention has the following advantages:
the liquid metal double-layer circuit in the embodiment of the invention can realize the direct coating of the liquid metal on the two sides of the substrate by utilizing the coating which is adhered and not adhered with the liquid metal, and has the advantages of high manufacturing efficiency, simple manufacturing process and convenience for batch industrial manufacturing compared with direct-write printing.
Drawings
FIG. 1 is a flow chart of a method of fabricating a liquid metal bilayer circuit in an embodiment of the invention;
fig. 2 is a cross-sectional view of a liquid metal bilayer circuit in an embodiment of the invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments of the invention may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
The invention provides a method for manufacturing a liquid metal double-layer circuit, and specifically, as shown in fig. 1, fig. 1 is a flow chart for manufacturing the liquid metal double-layer circuit in an embodiment of the invention, and the method for manufacturing the liquid metal double-layer circuit includes:
step S1, selecting a substrate 1;
step S2, forming a via hole 2 penetrating through the substrate 1;
step S3, forming a surface modification layer 3 adhered with liquid metal on two surfaces of the base material 1 and the inner wall of the via hole 2;
step S4, forming patterns 4 without liquid metal adhesion on the surface modification layer 3 on the two sides of the base material 1 by using the material without liquid metal adhesion;
step S5, coating the liquid metal 5 on the surface modification layer 3 in the area not covered by the pattern 4 without liquid metal adhesion, to form a liquid metal double-layer circuit.
The liquid metal double-layer circuit in the embodiment of the invention can realize the direct coating of the liquid metal on the two sides of the substrate by utilizing the coating which is adhered and not adhered with the liquid metal, and has the advantages of high manufacturing efficiency, simple manufacturing process and convenience for batch industrial manufacturing compared with direct-write printing.
The selected base material in the embodiment of the invention can be one of printing paper, paperboard, kraft paper, coated paper, aramid paper, copper foil, iron foil, polyethylene film, polycarbonate sheet, polyimide film, polytetrafluoroethylene sheet, cotton cloth, linen cloth, silk cloth, polyester cloth, polyamide cloth, polypropylene cloth, viscose cloth, dust-free cloth and acetate fiber cloth.
The via hole on the substrate in step S2 in the embodiment of the present invention may be formed by manual drilling, or by using a hole-punching machine in the prior art.
In some embodiments, step S3 involves a container containing a gel to which the liquid metal is adhered; preferably, in step 3, the substrate with the via holes is directly immersed in the colloid in the container for a certain period of time and then taken out, and after the colloid is cured, a surface modification layer attached to the whole exposed surface of the substrate (including both surfaces of the substrate and the inner wall of the via holes) is formed.
The thickness of the surface modification layer in this example is proportional to the immersion time of the base material, the longer the immersion time, the thicker the surface modification layer formed; wherein, when the surface modification layer is too thin, the surface modification layer is not sufficient to support good adhesion of the liquid metal; when the surface modification layer is thick, the structural stability between the liquid metal and the base material is poor due to the influence of the surface modification layer. Preferably, the immersion time of the substrate can be set to 1 s-60 s, and the surface modified layer with a thickness of 1 μm-500 μm can be obtained after taking out, the thickness range is enough to support good adhesion of the liquid metal on the surface modified layer, and the liquid metal can maintain good structural stability, and the thickness of the whole double-layer circuit board can be effectively controlled.
In some embodiments, between step S2 and step S3, the method may further include: the cleaning process for the surface of the substrate removes dust and impurities on the surface of the substrate to avoid the influence of the dust and impurities on the dipping effect of step S3.
In some embodiments, the colloid adhering to the liquid metal may be selected from long-chain polymer materials, such as one or more of PDMS, Ecoflex, polyurethane, silica gel, and acrylic polymer.
Between step S3 and step S4, the method may further include: and drying the colloid attached to the surface of the base material by using a hot drying mode to accelerate the solidification of the colloid and further quickly form a surface modification layer. In other embodiments, other curing methods, such as electron irradiation, ultraviolet light, etc., may be selected according to the curing method of the colloid.
In some embodiments, the pattern of non-adhering liquid metal is formed on the surface modification layer by laser or spray printing in step S4. Wherein, the material not adhered with the liquid metal can be one of wax, carbon powder or graphite. The pattern in this embodiment may be used as a screen printed layer and/or a solder resist layer for a two-layer circuit.
In some embodiments, the step S5 includes: and coating liquid metal on both sides of the base material in a printing or spraying mode to ensure that the liquid metal is attached to the area which is not shielded by the pattern which is not attached with the liquid metal on the surface modification layer. In the embodiment, the liquid metal can be coated on the whole plate by two printing rollers positioned at two sides of the base material, the liquid metal is formed on the base material at one time, and the liquid metal is extruded into the through hole and attached to the inner wall of the through hole along with the printing of the rollers. In addition, the liquid metal can be formed on the substrate by spraying, and it is necessary to pay attention to whether the spraying is good at the via hole. The two embodiments can also be combined, and for a thicker substrate, the liquid metal on the two sides of the substrate can be formed by printing, and then the inner wall of the through hole is coated by spraying. In the embodiment, the redundant liquid metal in the through hole can be taken away by selecting the round rod which is slightly smaller than the aperture of the through hole and passing through the through hole.
The liquid metal in the embodiment of the present invention is also referred to as low-melting-point metal, and includes a low-melting-point metal simple substance/low-melting-point metal alloy having a melting point below 120 ℃, or a conductive slurry formed by mixing the low-melting-point metal simple substance/low-melting-point metal alloy and metal nanoparticles, or a conductive nanofluid formed by mixing the low-melting-point metal simple substance/low-melting-point metal alloy and a fluid dispersant. More specifically, when the conductive nanofluid is selected, the fluid dispersion agent is preferably one of ethanol, propylene glycol, glycerin, polyvinylpyrrolidone, polydimethylsiloxane, polyethylene glycol, and polymethylmethacrylate.
Preferably, the liquid metal is conductive slurry formed by mixing a low-melting-point metal simple substance/low-melting-point metal alloy and metal nanoparticles, so that the surface tension and the fluidity of the liquid metal are reduced, and the self adhesion of the liquid metal is improved, thereby further improving the structural stability of the liquid metal attached to the surface modification layer. The liquid metal can be one or more of a gallium simple substance, an indium simple substance, a tin simple substance, a gallium-indium alloy, a gallium-indium-tin alloy, a gallium-zinc alloy, a gallium-indium-zinc alloy, a gallium-tin-zinc alloy, a gallium-indium-tin-zinc alloy, a gallium-tin-cadmium alloy, a gallium-zinc-cadmium alloy, a bismuth-indium alloy, a bismuth-tin alloy, a bismuth-indium-zinc alloy, a bismuth-tin-zinc alloy, a bismuth-indium-tin-zinc alloy, a tin-lead alloy, a tin-copper alloy, a tin-zinc-copper alloy, a tin-silver-copper alloy. The metal nanoparticles can be one or more of copper, iron, nickel, silver and silver-coated copper. Preferably, the metal nanoparticles can be used as a functional material to improve the characteristics of the liquid metal itself, for example, the metal nanoparticles such as silver-coated copper, silver, copper, etc. can be selected to effectively improve the conductivity of the liquid metal; the metal nanoparticles such as nickel and the like are selected to improve the oxidation resistance and the surface gloss of the liquid metal.
In some more preferred embodiments, the low melting point metal element/low melting point metal alloy is a room temperature liquid metal, such as one or more of gallium element, gallium indium alloy, gallium indium tin alloy, and gallium tin alloy, so that the liquid metal can be in a liquid or slurry state at room temperature. Or bismuth-based alloy and indium-based alloy with the melting point slightly higher than room temperature are selected, and the environment temperature can be increased to be liquid through a simple heating assembly.
Step a, selecting a PET film as a base material, wherein the thickness of the base material is 200 mu m;
b, drilling a required through hole on the base material;
c, performing surface treatment on the base material, and cleaning two surfaces of the base material and the inner wall of the via hole;
d, dipping the base material into the polyurethane colloid for 15s, taking out, drying and curing, and forming a surface modification layer with the thickness of 50 microns on the surface of the base material;
e, forming solder mask layers on the surface modification layers on the two sides of the base material respectively in a mode of printing carbon powder by laser; wherein the solder resist layer comprises a silk screen layer of the circuit;
f, putting the base material into a liquid metal coating device, and coating liquid metal on two sides of the base material by using a roller set; the liquid metal on the inner wall of the through hole is extruded into the through hole by the pressure exerted on the base material by the roller set;
and g, obtaining the liquid metal double-layer circuit.
Another objective of the present invention is to provide a liquid metal double-layer circuit, which can be manufactured by any one of the above methods.
As shown in fig. 2, fig. 2 is a schematic structural diagram of a liquid metal double-layer circuit according to an embodiment of the present invention. The liquid metal double layer circuit includes: a substrate 1 with vias 2; a liquid metal-adhering surface modification layer 3 attached to the surface of the base material 1; a pattern 4 which is not adhered with liquid metal and is adhered on the surface modification layer 3 on the two sides of the substrate 1; attached liquid metal 5 on the surface modification layer 3 in areas not obscured by the pattern 4 of non-adhering liquid metal.
In some embodiments, the substrate has a thickness of 50 μm to 5000 μm;
in some embodiments, the surface modification layer has a thickness of 1 μm to 500 μm;
in some embodiments, the pattern of non-adherent liquid metal has a thickness of 1 μm to 500 μm;
in some embodiments, the liquid metal has a thickness of 1 μm to 1000 μm.
In some embodiments, the substrate of the liquid metal bilayer circuit is controlled to be 200 μm, the thickness of the surface modification layer is controlled to be 10 μm, the thickness of the pattern not to be adhered with the liquid metal is controlled to be 3 μm, and the thickness of the liquid metal is controlled to be 5-20 μm. In the liquid metal double-layer circuit in the embodiment of the invention, under the size range, the whole thickness of the liquid metal double-layer circuit is thinner, and the sheet resistance of the liquid metal can be 5-40 milliohms, so that the flattening of the liquid metal double-layer circuit is met, and meanwhile, the conductivity of the liquid metal is better.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (10)
1. A method of fabricating a bi-layer circuit, comprising:
step S1, selecting a substrate;
step S2, forming a via hole penetrating through the substrate on the substrate;
step S3, dipping the base material into a colloid adhered with liquid metal, and taking out to form surface modification layers adhered with liquid metal on two sides of the base material and the inner walls of the via holes;
step S4, forming carbon powder patterns without adhering liquid metal on the surface modification layers on the two sides of the base material through laser printing;
and step S5, coating liquid metal on the area of the surface modification layer which is not covered by the pattern without adhering liquid metal, and forming a liquid metal double-layer circuit.
2. The method according to claim 1, wherein the surface modification layer has a thickness of 1 μm to 500 μm.
3. The method of manufacturing according to claim 1, further comprising: and after the base material is taken out, drying the colloid attached to the surface of the base material to form the surface modification layer.
4. The method according to claim 1, wherein the colloid is one or more of PDMS, Ecoflex, polyurethane, silica gel and acrylic polymer.
5. The method of claim 1, wherein the carbon powder pattern has a thickness of 1 μm to 500 μm.
6. The method according to claim 1, wherein the step S5 includes: and coating liquid metal on two sides of the base material in a full-page mode by using a printing and/or spraying mode, so that the liquid metal is attached to the area, which is not shielded by the pattern without the liquid metal, on the surface modification layer.
7. The method of claim 1, wherein the substrate is one of printing paper, cardboard, kraft paper, coated paper, aramid paper, copper foil, iron foil, polyethylene film, polycarbonate sheet, polyimide film, polytetrafluoroethylene sheet, cotton cloth, hemp cloth, silk cloth, polyester cloth, polyamide cloth, polypropylene cloth, viscose cloth, dust-free cloth, and acetate cloth.
8. The method of claim 6, wherein the step of applying the liquid metal to both sides of the substrate by printing and/or spraying comprises:
the formation of liquid metal on two sides of the substrate is realized by printing, and then the inner wall of the through hole is coated by spraying.
9. A two-layer circuit produced by the production method according to any one of claims 1 to 8, comprising:
a substrate with a via hole;
a surface modification layer adhered to the surface of the base material and having a liquid metal adhered thereto;
carbon powder patterns which are attached to the surface modification layers on the two sides of the base material and are not adhered with liquid metal;
liquid metal attached to the surface modification layer in areas not obscured by the pattern of non-adherent liquid metal.
10. The two-layer circuit of claim 9, wherein the substrate has a thickness of 50 μ ι η to 5000 μ ι η; the thickness of the surface modification layer is 1-500 μm; the thickness of the pattern of the non-adhesive liquid metal is 1-500 mu m; the thickness of the liquid metal is 1-1000 μm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4199045A1 (en) * | 2021-12-14 | 2023-06-21 | INTEL Corporation | Flexible liquid metal connection device and method |
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| CN114496447B (en) * | 2020-10-26 | 2023-05-05 | 北京梦之墨科技有限公司 | Flexible radio frequency coil and preparation method thereof |
| CN112770519A (en) * | 2020-12-22 | 2021-05-07 | 华中科技大学 | Double-layer liquid metal circuit based on airflow blowing and preparation method thereof |
| CN112822844B (en) * | 2021-01-04 | 2022-03-01 | 北京梦之墨科技有限公司 | Circuit board and manufacturing method thereof |
| CN115156528B (en) * | 2022-05-31 | 2023-08-22 | 烟台南山学院 | Protective shell structure for preventing metal gallium drops from fusion and preparation method and application method thereof |
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| CN1993025A (en) * | 2005-12-31 | 2007-07-04 | 财团法人工业技术研究院 | Multi-layer printed circuit board and method for manufacturing same |
| CN106455311A (en) * | 2016-10-31 | 2017-02-22 | 中国科学院理化技术研究所 | Method for manufacturing double-sided flexible circuit by laser printing |
| CN108430170A (en) * | 2018-01-29 | 2018-08-21 | 昆山群安电子贸易有限公司 | A kind of production method of circuit board substrate |
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| EP4199045A1 (en) * | 2021-12-14 | 2023-06-21 | INTEL Corporation | Flexible liquid metal connection device and method |
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