JP2010511103A5 - - Google Patents
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- Publication number
- JP2010511103A5 JP2010511103A5 JP2009538691A JP2009538691A JP2010511103A5 JP 2010511103 A5 JP2010511103 A5 JP 2010511103A5 JP 2009538691 A JP2009538691 A JP 2009538691A JP 2009538691 A JP2009538691 A JP 2009538691A JP 2010511103 A5 JP2010511103 A5 JP 2010511103A5
- Authority
- JP
- Japan
- Prior art keywords
- roller
- substrate
- cathode
- base layer
- connectable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims 12
- 239000003792 electrolyte Substances 0.000 claims 9
- 239000011248 coating agent Substances 0.000 claims 8
- 238000000576 coating method Methods 0.000 claims 8
- 238000004070 electrodeposition Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 239000004020 conductor Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 239000011888 foil Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000005022 packaging material Substances 0.000 claims 1
Claims (15)
カソードとして接続可能であり、且つ電着塗装中は基層(9)に接触する、少なくとも一個の回転可能に装着されたローラー(2)を含む、少なくとも一個の電解液浴(3)を有し、
基層(9)が、塗装の間、電解液浴(3)中に収容された電解液(5)によって覆われ、且つ少なくとも一個のローラー(2)に対して相対的に移動し、
カソードとして接続可能な少なくとも一個のローラー(2)が、基層(9)と接触する間はカソードとして接続可能であり、基層(9)との接触がなくなると直ちに無極またはアノードとして接続可能であり、
ローラー(2)が、ローラー(2)の表面に電解液(5)が供給されるのを実質的に防止する遮蔽材(21)で囲まれ、
遮蔽材(21)と基材(7)の表面との間に隙間が形成され、且つ
遮蔽材(21)と基材(7)の表面との隙間が、弾力性のある表面を持つローラーで密閉されていることを特徴とする装置。 An apparatus for electrodeposition coating a structured or entire base layer (9) on the surface of a substrate (7),
Having at least one electrolyte bath (3) comprising at least one rotatably mounted roller (2) that can be connected as a cathode and that contacts the base layer (9) during electrodeposition coating;
The base layer (9) is covered by the electrolyte (5) contained in the electrolyte bath (3) during the coating and moves relative to the at least one roller (2);
At least one roller (2) connectable as a cathode can be connected as a cathode while in contact with the base layer (9), and can be connected as non-polar or anode as soon as contact with the base layer (9) is lost,
The roller (2) is surrounded by a shielding material (21) that substantially prevents the electrolyte (5) from being supplied to the surface of the roller (2),
A gap is formed between the shielding material (21) and the surface of the substrate (7), and the clearance between the shielding material (21) and the surface of the substrate (7) is a roller having an elastic surface. A device that is hermetically sealed.
基層(9)が、電解液(5)で覆われ、且つカソードとして接続可能な少なくとも一個のローラー(2)と接触し、
カソードとして接続可能なローラー(2)が、基層(9)及び/又は基材(7)と接触する間はカソードとして接続され、基層(9)及び/又は基材(7)との接触がなくなると直ちに、この上に析出した材料を除去するために、無極又はアノードとして接続されることを特徴とする方法。 A method of electrodeposition coating a structured or entire base layer (9) on a surface of a substrate (7),
The base layer (9) is in contact with at least one roller (2) covered with electrolyte (5) and connectable as a cathode;
While the roller (2) that can be connected as a cathode is in contact with the base layer (9) and / or the substrate (7), it is connected as a cathode, and there is no contact with the base layer (9) and / or the substrate (7). And immediately connected as non-polar or anode to remove material deposited thereon.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06124862 | 2006-11-28 | ||
PCT/EP2007/062805 WO2008065069A1 (en) | 2006-11-28 | 2007-11-26 | Device and method for electroplating |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010511103A JP2010511103A (en) | 2010-04-08 |
JP2010511103A5 true JP2010511103A5 (en) | 2011-01-27 |
Family
ID=39047993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009538691A Withdrawn JP2010511103A (en) | 2006-11-28 | 2007-11-26 | Electrodeposition coating method and apparatus |
Country Status (10)
Country | Link |
---|---|
US (1) | US20090301891A1 (en) |
EP (1) | EP2099954A1 (en) |
JP (1) | JP2010511103A (en) |
KR (1) | KR20090083489A (en) |
CN (1) | CN101542022A (en) |
BR (1) | BRPI0719665A2 (en) |
IL (1) | IL198594A0 (en) |
RU (1) | RU2009124293A (en) |
TW (1) | TW200829726A (en) |
WO (1) | WO2008065069A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2265746A2 (en) * | 2008-03-13 | 2010-12-29 | Basf Se | Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound |
EP2306892A1 (en) * | 2008-04-15 | 2011-04-13 | Nonin Medical, Inc | Non-invasive optical sensor |
WO2009135780A1 (en) * | 2008-05-08 | 2009-11-12 | Basf Se | Layered structures comprising silicon carbide layers, a process for their manufacture and their use |
JP2012528058A (en) * | 2009-05-26 | 2012-11-12 | ウクシィ サンテック パワー カンパニー リミテッド | Conveying roller for conveying articles |
DE102010000211A1 (en) * | 2010-01-26 | 2011-07-28 | Atotech Deutschland GmbH, 90537 | Device for transporting plate-shaped substrates in a system for chemical and / or electrochemical treatment |
CN101827444B (en) * | 2010-03-31 | 2015-03-25 | 中兴通讯股份有限公司 | Signaling configuration system and method for measuring reference signal |
DE102010042642B4 (en) | 2010-10-19 | 2013-12-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and device for galvanic coating of substrates and solar cells |
US20130255858A1 (en) * | 2012-04-03 | 2013-10-03 | Jun-Chung Hsu | Method of manufacturing a laminate circuit board |
US9970297B2 (en) * | 2014-08-29 | 2018-05-15 | Rolls-Royce Corporation | Composite fan slider with nano-coating |
KR20160140241A (en) | 2015-05-29 | 2016-12-07 | 전자부품연구원 | Method of coating specimen based on plasma electrolytic oxidation |
KR101578640B1 (en) * | 2015-08-25 | 2015-12-17 | 선호경 | PCB plating machine having partially reinforced transferring rollers |
WO2018013868A1 (en) | 2016-07-13 | 2018-01-18 | Alligant Scientific, LLC | Electrochemical methods, devices and compositions |
CN108430170A (en) * | 2018-01-29 | 2018-08-21 | 昆山群安电子贸易有限公司 | A kind of production method of circuit board substrate |
MX2021011414A (en) * | 2019-03-20 | 2022-02-11 | Univ Colorado Regents | Electrochemical storage devices comprising chelated metals. |
CA3192359A1 (en) | 2020-08-18 | 2022-02-24 | Enviro Metals, LLC | Metal refinement |
CN114481244B (en) * | 2022-02-24 | 2022-08-23 | 广东盈华电子科技有限公司 | Surface treatment process for high-temperature resistance and oxidation resistance of electrolytic copper foil |
DE102022120646A1 (en) | 2022-08-16 | 2024-02-22 | Audi Aktiengesellschaft | Method for producing a flexible printed circuit (FPC) by depositing metal conductor tracks, printed circuit and printed circuit battery system |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4019877A (en) * | 1975-10-21 | 1977-04-26 | Westinghouse Electric Corporation | Method for coating of polyimide by electrodeposition |
DE59004422D1 (en) * | 1989-12-23 | 1994-03-10 | Heraeus Elektrochemie | Method and device for the continuous electrolytic application of metal in the form of a strip from a solution and use of the device. |
DE59202882D1 (en) * | 1991-04-12 | 1995-08-17 | Siemens Ag | GALVANIZING DEVICE FOR PANEL-SHAPED WORKPIECES, ESPECIALLY PCB. |
US5705219A (en) * | 1991-04-22 | 1998-01-06 | Atotech Deutschland Gmbh | Method for coating surfaces with finely particulate materials |
DE4212567A1 (en) * | 1992-03-14 | 1993-09-16 | Schmid Gmbh & Co Geb | DEVICE FOR TREATING OBJECTS, IN PARTICULAR GALVANIZING DEVICES FOR PCBS |
US6599412B1 (en) * | 1997-09-30 | 2003-07-29 | Semitool, Inc. | In-situ cleaning processes for semiconductor electroplating electrodes |
DE19633796B4 (en) * | 1996-08-22 | 2012-02-02 | Hans Höllmüller Maschinenbau GmbH | Device for electroplating electronic circuit boards |
EP1541719A3 (en) * | 1998-05-20 | 2006-05-31 | Process Automation International Limited | An electroplating machine |
US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
DE10043817C2 (en) * | 2000-09-06 | 2002-07-18 | Egon Huebel | Arrangement and method for goods to be treated electrochemically |
DE10248965A1 (en) * | 2002-10-15 | 2004-04-29 | Simmerlein, Ewald Wilhelm | Contact system for an electroplating bath, can be a roller which is conductive for each contact point, with alternating switching as a cathode and anode |
DE10342512B3 (en) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region |
NL1025446C2 (en) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric support as well as dielectric support. |
DE102005033784A1 (en) * | 2005-07-20 | 2007-01-25 | Viktoria Händlmeier | System for the electrodeposition of a conductive layer on a non-conductive substrate |
DE102005038449B4 (en) * | 2005-08-03 | 2010-03-25 | Gebr. Schmid Gmbh & Co. | Device for the treatment of substrates, in particular for the electroplating of printed circuit boards, and method |
DE102005038450A1 (en) * | 2005-08-03 | 2007-02-08 | Gebr. Schmid Gmbh & Co. | Device for the treatment of substrates, in particular for the galvanization of substrates |
US20090178930A1 (en) * | 2006-04-18 | 2009-07-16 | Basf Se | Electroplating device and method |
US20090101511A1 (en) * | 2006-04-18 | 2009-04-23 | Rene Lochtman | Electroplating device and method |
-
2007
- 2007-10-24 TW TW096139950A patent/TW200829726A/en unknown
- 2007-11-26 EP EP07847339A patent/EP2099954A1/en not_active Withdrawn
- 2007-11-26 WO PCT/EP2007/062805 patent/WO2008065069A1/en active Application Filing
- 2007-11-26 US US12/515,289 patent/US20090301891A1/en not_active Abandoned
- 2007-11-26 KR KR1020097013503A patent/KR20090083489A/en not_active Application Discontinuation
- 2007-11-26 BR BRPI0719665-2A patent/BRPI0719665A2/en not_active IP Right Cessation
- 2007-11-26 CN CNA2007800439981A patent/CN101542022A/en active Pending
- 2007-11-26 RU RU2009124293/02A patent/RU2009124293A/en not_active Application Discontinuation
- 2007-11-26 JP JP2009538691A patent/JP2010511103A/en not_active Withdrawn
-
2009
- 2009-05-06 IL IL198594A patent/IL198594A0/en unknown
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