CN205133768U - Negative pole roller assembly and plating device - Google Patents
Negative pole roller assembly and plating device Download PDFInfo
- Publication number
- CN205133768U CN205133768U CN201490000514.0U CN201490000514U CN205133768U CN 205133768 U CN205133768 U CN 205133768U CN 201490000514 U CN201490000514 U CN 201490000514U CN 205133768 U CN205133768 U CN 205133768U
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- Prior art keywords
- roller
- plating
- mode
- plating material
- hardness
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- Expired - Fee Related
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- 238000007747 plating Methods 0.000 title claims abstract description 153
- 239000000463 material Substances 0.000 claims abstract description 96
- 238000004804 winding Methods 0.000 claims description 24
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 210000000721 basilar membrane Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides a negative pole roller assembly and plating device, negative pole roller assembly contains: first roller, it has first hardness with at least surface and carries out rotatory mode and possesses to the mode that has electric conductivity with at least surface possesses, and with the contact of one side by the plating material, and the second roller, its at least surface has and is less than the second hardness of first hardness, and with the mode configuration of first roller subtend, so that by the plating material through its with between the first roller, and with the mode that first roller offseted is rotatory, and with contacted by the another side of plating material. Therefore, the utility model discloses can use in the electroplating to reducible negative pole roller is bad with the contact by the plating material.
Description
Technical field
The utility model relates to a kind of cathode roller (cathoderoller) assembly and plating apparatus.
Background technology
At printed circuit board (PCB), lead frame (leadframe) and photodiode (LightEmittingDiode, LED), in the various electronic installation such as element and/or part, method for plating is used to form conductive pattern (pattern).
In this method for plating, use the cathode roller being applied in cathode power.The surface of this cathode roller has electroconductibility, is formed by the high metal to certain grade of surface hardness.Therefore, when being had flexure by the surface of plating material, cathode roller is easy to by the surface of plating material, contact to be occurred bad.
Such as, as shown in (a) of Fig. 1, when having basilar membrane (basefilm) (510) of different the first conductive pattern (521) of length to the 3rd conductive pattern (523) and carrying out plating by first cathode roller (101) of configuration continuously to the 3rd cathode roller (103), the first conductive pattern (521) first contacts with the first cathode roller (101) and forms the first plating layer (531) (b).Secondly, first conductive pattern (521) and the second conductive pattern (522) contact with the second cathode roller (102) and form the second plating layer (532), and the first plating layer (531) becomes thicker (c).After this, first conductive pattern (521), the second conductive pattern (522) and the 3rd conductive pattern (523) contact with the 3rd cathode roller (103) and form the 3rd plating layer (533), and the first plating layer (531) and the second plating layer (532) become thicker.
As mentioned above, produce the thickness deviation of the first plating layer (531) to the 3rd plating layer (533) because carrying out plating, thus possibility contact between conductive pattern and cathode roller occurring bad is higher.This problem is particularly the same as being formed locally plating layer by a part for plating material in picture point (spot) plating, be there is surface flexure because being formed in by the conductive pattern on the surface of plating material, therefore can provide and being enough to the bad environment of above-mentioned contact occurs.
Utility model content
[problem of utility model for solving]
The utility model for overcoming problem and/or the limit of conventional art, the object of one side of the present utility model be to provide a kind of be formed uniformly with by the contact of plating material, by minimized for the thickness deviation of plating layer cathode roller assembly and plating apparatus.
[solving the means of problem]
According to one side of the present utility model, there is provided a kind of cathode roller assembly, it comprises: the first roller, and it has the first hardness and the mode of carrying out rotating possesses with at least surface, and possess in the mode that at least outside surface has electroconductibility, and contact with by the one side of plating material; And second roller, it at least has the second hardness being less than described first hardness in surface, and to configure with the mode of described first roller subtend, passed through between itself and described first roller by plating material so that described, and rotate in the mode offseted with described first roller, and contact with the described another side by plating material.
According to another feature of the present utility model, connect the turning axle of described first roller and the turning axle of described second roller imaginary line and described formed by the direct of travel of plating material angle can be right angle.
According to another feature of the present utility model, described second roller can be possessed by the mode direct of travel of plating material being positioned at more described first roller more front described.
According to another feature of the present utility model, the radius of described second roller can be greater than the radius of described first roller.
According to another feature of the present utility model, in described second roller, at least outside can be formed by the material of softness.
According to another feature of the present utility model, described second roller can comprise: the first roll is around (rolling) parts; And second winding unit, it is positioned at the described first roll around member outside, and has described second hardness.
According to another feature of the present utility model, in described second roller, at least outside can be formed by electric insulating quality material.
According to another aspect of the present utility model, there is provided a kind of plating apparatus, it comprises: the first roller, and it has the first hardness and the mode of carrying out rotating possesses with at least surface, and possess in the mode that at least outside surface has electroconductibility, and contact with by the one side of plating material; Second roller, it at least has the second hardness being less than described first hardness in surface, and to configure with the mode of described first roller subtend, is passed through between itself and described first roller by plating material so that described, and rotate in the mode offseted with described first roller, and contact with the described another side by plating material; And power subsystem (powerunit), it is electrically connected to described first roller, applies cathode power to described first roller.
According to another feature of the present utility model, connect the turning axle of described first roller and the turning axle of described second roller imaginary line and described formed by the direct of travel of plating material angle can be right angle.
According to another feature of the present utility model, described second roller can be possessed by the mode direct of travel of plating material being positioned at more described first roller more front described.
According to another feature of the present utility model, the radius of described second roller can be greater than the radius of described first roller.
According to another feature of the present utility model, in described second roller, at least outside can be formed by the material of softness.
According to another feature of the present utility model, described second roller can comprise: the first winding unit; And second winding unit, it is positioned at the described first roll around member outside, and has described second hardness.
According to another feature of the present utility model, in described second roller, at least outside can be formed by electric insulating quality material.
According to another feature of the present utility model, also can comprise driver element, described driver element is connected to described second roller, rotates to make described second roller.
[utility model effect]
The utility model can reduce cathode roller with bad by the contact of plating material.
The utility model can be applicable in a plating.
Accompanying drawing explanation
(a), (b), (c) and (d) of Fig. 1 is the figure of the problem of the method for plating diagrammatically represented in the past.
Fig. 2 is the pie graph of a part for the plating apparatus diagrammatically representing an embodiment of the present utility model.
Fig. 3 is the figure of another embodiment representing the second roller.
Fig. 4 is the sectional view more specifically representing the state that the first roller and the second roller connect with by plating material.
Fig. 5 is the pie graph of a part for the plating apparatus diagrammatically representing another embodiment of the present utility model.
Fig. 6 is the pie graph of the plating apparatus diagrammatically representing another embodiment of the present utility model.
Fig. 7 is the pie graph of the plating apparatus diagrammatically representing another embodiment of the present utility model.
Fig. 8 is the pie graph of a part for the plating apparatus diagrammatically representing another embodiment of the present utility model.
Fig. 9 is the pie graph of a part for the plating apparatus diagrammatically representing another embodiment of the present utility model.
Figure 10 is the part sectioned view of the state represented when carrying out plating according to embodiment of the present utility model.
Figure 11 represents the sectional view by another example of plating material.
Figure 12 represents the sectional view by the another example of plating material.
Embodiment
Below, with reference to accompanying drawing, in more detail embodiment of the present utility model is described.
Fig. 2 is the pie graph of a part for the plating apparatus diagrammatically representing an embodiment of the present utility model.The plating apparatus of the embodiment shown in Fig. 2 comprises the cathode roller assembly 1 with the first roller 11 and the second roller 12.
Described first roller 11 and the second roller 12 configure in opposite to one another and adjacent mode, so that by plating material 5 by between described first roller and the second roller.Described first roller 11 and the second roller 12 can rotate in the mode offseted each other.
Described first roller 11 has the first hardness with at least its surface and the mode of carrying out rotating possesses.The mode that described first roller 11 has electroconductibility with at least outside surface possesses, and therefore can be formed by metal.Non-essential to form described first roller 11 by metal overall, can form body, only make the surface of body have electroconductibility by plastics (plastic) material.
Described first roller 11 is electrically connected to power subsystem 3, and described power subsystem 3 can apply cathode power to described first roller 11.
Described first roller 11 connects with by a side surface of plating material 5, forms contact with by a side surface of plating material 5.
In described second roller 12, at least surface has the second hardness being less than described first hardness.Described second roller 12 connects with the described opposite side surface by plating material 5.Described by the face of the opposition side on the surperficial surface for connecting with the first roller 11 of the opposite side of plating material 5.
As mentioned above, make the surface of the second roller 12 have the hardness on the surface being less than the first roller 11, thus when with the first roller 11 formed contact by a side surface of plating material 5, be there is flexure, also can be formed uniformly the first roller 11 with by the contact of plating material 5.Following, this situation is described in detail.
Also can connect driver element 4 at described second roller 12, described driver element 4 can make the second roller 12 rotary actuation.Thus, advancing by plating material 5 is promoted by the rotation of the second roller 12.But be non-essentially defined in this, the first roller 11 and/or the second roller 12 so that without driving element especially, rotatable mode possesses, can rotate with by advancing of plating material 5 accordingly.
In roller assembly 1 as above, the imaginary line connecting the turning axle of the first roller 11 and the turning axle of the second roller 12 can with described by the direct of travel form right angle of plating material 5.Thus, contact can be reduced further in by the contact of plating material 5 and the first roller 11 bad.
The radius R 2 of described second roller 12 can be made identical with the radius R 1 of the first roller 11 or be greater than the radius of the first roller.When the radius R 2 of the second roller 12 is radius R more than 1 of the first roller 11, can further improve and improve by the bad effect of the contact of plating material 5 and the first roller 11.At least surface hardness of the second roller 12 is less than at least surface hardness of the first roller 11, therefore as described below, when being there is flexure by the surface of plating material 5, also by make the radius R 2 of described second roller 12 identical with the radius R 1 of the first roller 11 or be greater than the first roller radius and by the second roller 12 at least surface absorb fully described by the degree of flexibility on the surface of plating material 5.
In described second roller 12, at least outside can be formed by the material of softness.Thus, as mentioned above, can absorb described by the degree of flexibility on the surface of plating material 5 fully by least surface of the second roller 12.
In addition, in described second roller 12, at least outside can be formed by electric insulating quality material.The described surface realizing plating by plating material 5 becomes the face connected with described first roller 11, therefore can make to have electric insulating quality with described the second roller 12 by the back face of plating material 5 and prevent described second roller 12 from becoming obstruction key element to the plating utilizing the first roller 11 to carry out.
For this reason, the material that at least outside can be by polymkeric substance (polymer) of described second roller 12 is formed, but is non-essentially defined in this, can be formed by the material of the softness of the impact of Absorbable rod as rubber.
Described second roller 12 entirety can be formed by single material, but is non-essentially defined in this, as shown in Figure 3, can comprise the first winding unit 121 and be positioned at second winding unit 122 in outside of described first winding unit 121.Now, described second winding unit 122 can be formed by the material with the second hardness.
The second roller 12 ' shown in Fig. 3 comprises: the first winding unit 121, and its two ends are connected with axle 120; And second winding unit 122, it is positioned at outside described first winding unit 121, is formed by the material of the softness with above-mentioned second hardness.
Described first winding unit 121 axially X extends, and can be formed as pipe (pipe) shape of hollow.Described first winding unit 121 can be formed, in two ends combined axis 120 by metal or rigid plastics material.Described axle 120 can form as one with described first winding unit 121.
Described second winding unit 122 extends with axially X and the mode covering the surface of described first winding unit 121 possesses.Described second winding unit 122 can be formed by the material of above-mentioned polymer system, can be formed by rubber material or nonrigid plastic material.
The thickness t2 of described second winding unit 122 is formed as the thickness t1 being thicker than the first winding unit 121, the second winding unit 122 can be made thus to absorb above-mentioned by the flexure on the surface of plating material 5.
As shown in Figure 4, describedly comprised the substrate parts 51 of film form by plating material 5 and be formed in multiple pads (pad) 52 on surface of described substrate parts.Plating layer is formed at the contact of described pad 52 and the first roller 11.Described substrate parts 51 can be the polymeric film as poly-imines (polyimide) film, and described pad 52 can be formed by conductive metal, is formed by methods such as printings (printing).Now, be preferably described first roller 11 and connect with pad 52, described second roller 12 is positioned at the opposition side of pad 52.
Fig. 5 is the pie graph of a part for the plating apparatus diagrammatically representing another embodiment of the present utility model.
With the embodiment shown in Fig. 1 differently, the cathode roller assembly 10 of the embodiment shown in Fig. 5 can be possessed described second roller 12 by the mode direct of travel of plating material 5 is positioned at compared with the first roller 11 more front.The rotation of the second roller 12 can, in the direction compressing to the first roller 11 by the form of plating material 5, can prevent the first roller 11 with bad by the contact of plating material 5 thus.Certainly, the embodiment shown in Fig. 5 also can possess the second roller 12 ' as shown in Figure 2.
In the embodiment shown in Fig. 1 and Fig. 5, cathode roller assembly 1,10 can be applicable to electroplanting device.
Fig. 6 is the pie graph of the example diagrammatically representing this plating apparatus.
With reference to Fig. 6, there is at least more than one cathode roller assembly 1 in plating coating groove 6 inner position containing plating solution, to be positioned with positive plate (anodeplate) 21 with the mode of described cathode roller assembly 1 subtend.
In inside and/or the outside of described plating coating groove 6, be positioned with transfer by plating material 5 by plating material transferred unit 7.Described by plating material transferred unit 7 comprise support described by multiple supporting rolls 71 of plating material 5.Described supporting roll 71 at least to possess described by the position of the going direction changing of plating material 5, make described by plating material 5 by described plating coating groove 6.
Inner at described plating coating groove 6, configure at least more than one cathode roller assembly 1, described cathode roller assembly comprises the first roller 11 and the second roller 12 adjacent one another are.Same as the previously described embodiments to the explanation of described first roller 11 and 12 two, the second roller.
Embodiment according to Fig. 6, have multiple described first roller 11 and the second roller 12 respectively, multiple first roller 11 is all positioned at equidirectional, and multiple second roller 12 is all positioned at equidirectional.
In figure 6, eliminate the diagram of the power subsystem being connected to the first roller 11 and the driver element being connected to the second roller 12, but certainly can the structure of application drawing 1 to Fig. 5.
In described plating coating groove 6, can be positioned with positive plate 21 with the mode of cathode roller assembly 1 subtend.Be electrically connected plate supply unit (not shown) at described positive plate 21 and plate supply is applied to described positive plate.
According to plating apparatus as above, uniform plating layer can be formed being prevented contact bad by the one side of plating material 5.
In the embodiment shown in fig. 6, certainly also can the cathode roller assembly 10 shown in application drawing 5.
Fig. 7 is the pie graph of another example diagrammatically representing plating apparatus of the present utility model.
With reference to Fig. 7, in described plating coating groove 6, by plating material 5 alternately by the first roller 11 and the second roller 12.For this reason, described multiple second roller 12 is made alternately to be positioned at top and bottom relative to each first roller 11 described.Further, positive plate 21 is also all configured to top and the bottom of cathode roller assembly 1.In Figure 5, eliminate the diagram of the power subsystem being connected to the first roller 11 and the driver element being connected to the second roller 12, but certainly can the structure of application drawing 1 to Fig. 3.
According to plating apparatus as above, uniform plating layer can be formed being prevented contact bad by two faces of plating material 5.
In the embodiment shown in fig. 7, certainly also can the cathode roller assembly 10 shown in application drawing 5.
On the other hand, described cathode roller assembly 1,10 as shown in Figures 1 and 5 also can be applicable to point (spot) plating appts.
Fig. 8 is the pie graph of a part for the plating apparatus diagrammatically representing another embodiment of the present utility model.
Embodiment shown in Fig. 8, except the embodiment shown in Fig. 1, also comprises the plating solution injection unit 22 adjacent with described first roller 11.Described plating solution injection unit 22 is sprayed by plating material 5 and the contact of the first roller 11 and/or the adjacent regions of described contact the plating solution comprising anode ion (ion) to described.Thus, local plating can be carried out.In the embodiment shown in fig. 8, only possess a cathode roller assembly 1, but be non-essentially defined in this, certainly can possess multiple cathode roller assembly 1 and/or plating solution injection unit 22.
Fig. 9 is the pie graph of a part for the plating apparatus diagrammatically representing another embodiment of the present utility model.
With reference to Fig. 9, multiple first roller 11 is to be configured to circle and to make the mode of described circle rotation possess, at multiple second roller 12 of the configuration at least partially of described circle.As shown in Figure 9, described multiple second roller 12 can be formed the mode subtend configuration of semicircle with the outside of the circle at described first roller 11.In the periphery of the second roller 12, configure supporting roll 71 and support by the transfer of plating material 5.Describedly performed plating processing procedure by plating material to be configured by the mode between the circle that formed by the first roller 11 and the semicircle formed by the second roller 12.When this plating apparatus, in the space of relative narrower, Plating efficiency can be improved further.
Figure 10 is the figure of the state represented when carrying out plating by the cathode assembling body of the embodiment shown in Fig. 1 and Fig. 5.
As mentioned above, describedly comprised the substrate parts 51 of film form by plating material 5 and be formed in multiple pads 52 on surface of described substrate parts.
As shown in Figure 10, make on part pad 52, be formed with being connected with the first roller 11 by other pads 52 not forming plating layer of plating material 5 of plating layer 53, when wanting thus to form plating layer on described pad 52, by the back side with the hardness being less than the first roller 11, the second roller 12 support base parts 51 namely formed by flexibility material, the contact that therefore pad 52 and the first roller 11 can not occur is bad.Its reason is, the second roller 12 can absorb fully by the surface of plating material 5, namely by the flexure on the surface towards the first roller 11 of plating material 5.
As shown in Figure 10, each pad 52,52 is formed the order of plating layer different time also can play effect as above, but be non-essentially defined in this.
Also applicable following by plating material 5 ': as shown in figure 11, be formed with the pad 52 of same thickness at substrate parts 51, described pad 52 formed plating layer 53a, 53b, 53c, 53d of different thickness.
In addition, also applicable in following situation: as shown in figure 12, pad 52a, 52b, 52c, 52d of different thickness is formed at substrate parts 51.Particularly, " not only be can be applicable in the plating of above-mentioned point by plating material 5, and can be applicable to the situation simultaneously forming plating layer on entirety pad 52a, 52b, 52c, 52d shown in Figure 12.In this case, because the thickness padding 52a, 52b, 52c, 52d exists deviation, therefore can absorb described thickness deviation fully by the second roller 12 and make described pad 52a, 52b, 52c, 52d and the first roller 11 all form good contact.
In Figure 10 to Figure 12, illustrate only in the situation being formed plating layer by the one side of plating material 5, but certainly also can be applied in the same manner in the situation being formed plating layer by two faces of plating material 5.
With reference to an embodiment shown in the drawings, the utility model is illustrated, but described embodiment is only example, should understands commonsense personnel in the art, other embodiments of various distortion and equalization can be realized from described embodiment.Therefore, real protection domain of the present utility model should only determine according to the technical solution of the utility model.
[utilizability in industry]
Embodiment of the present utility model can be applicable in various electronic products etc.
Claims (15)
1. a cathode roller assembly, is characterized in that, comprises:
First roller, it has the first hardness and the mode of carrying out rotating possesses with at least surface, and possesses in the mode that at least outside surface has electroconductibility, and contacts with by the one side of plating material; And
Second roller, it at least has the second hardness being less than described first hardness in surface, and to configure with the mode of described first roller subtend, is passed through between itself and described first roller by plating material so that described, and rotate in the mode offseted with described first roller, and contact with the described another side by plating material.
2. cathode roller assembly according to claim 1, is characterized in that:
Connect the turning axle of described first roller and the turning axle of described second roller imaginary line and described formed by the direct of travel of plating material angle be right angle.
3. cathode roller assembly according to claim 1, is characterized in that:
Described second roller is to be possessed by the mode direct of travel of plating material being positioned at more described first roller more front described.
4. the cathode roller assembly according to any one of claims 1 to 3, is characterized in that:
The radius of described second roller is greater than the radius of described first roller.
5. the cathode roller assembly according to any one of claims 1 to 3, is characterized in that:
In described second roller, at least outside is formed by the material of softness.
6. the cathode roller assembly according to any one of claims 1 to 3, is characterized in that described second roller comprises:
First winding unit; And second winding unit, it is positioned at the described first roll around member outside, and has described second hardness.
7. the cathode roller assembly according to any one of claims 1 to 3, is characterized in that:
In described second roller, at least outside is formed by electric insulating quality material.
8. a plating apparatus, is characterized in that comprising:
First roller, it has the first hardness and the mode of carrying out rotating possesses with at least surface, and possesses in the mode that at least outside surface has electroconductibility, and contacts with by the one side of plating material;
Second roller, it at least has the second hardness being less than described first hardness in surface, and to configure with the mode of described first roller subtend, is passed through between itself and described first roller by plating material so that described, and rotate in the mode offseted with described first roller, and contact with the described another side by plating material; And
Power subsystem, it is electrically connected to described first roller, applies cathode power to described first roller.
9. plating apparatus according to claim 8, is characterized in that:
Connect the turning axle of described first roller and the turning axle of described second roller imaginary line and described formed by the direct of travel of plating material angle be right angle.
10. plating apparatus according to claim 8, is characterized in that:
Described second roller is to be possessed by the mode direct of travel of plating material being positioned at more described first roller more front described.
Plating apparatus according to any one of 11. according to Claim 8 to 10, is characterized in that:
The radius of described second roller is greater than the radius of described first roller.
Plating apparatus according to any one of 12. according to Claim 8 to 10, is characterized in that:
In described second roller, at least outside is formed by the material of softness.
Plating apparatus according to any one of 13. according to Claim 8 to 10, is characterized in that described second roller comprises:
First winding unit; And second winding unit, it is positioned at the outside of described first winding unit, and has described second hardness.
Plating apparatus according to any one of 14. according to Claim 8 to 10, is characterized in that:
In described second roller, at least outside is formed by electric insulating quality material.
Plating apparatus according to any one of 15. according to Claim 8 to 10, is characterized in that also comprising driver element, and described driver element is connected to described second roller, rotates to make described second roller.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130005105A KR101585629B1 (en) | 2013-01-16 | 2013-01-16 | Cathode roller assembly and plating apparatus |
| KR10-2013-0005105 | 2013-01-16 | ||
| PCT/KR2014/000493 WO2014112816A1 (en) | 2013-01-16 | 2014-01-16 | Cathode roller assembly and plating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205133768U true CN205133768U (en) | 2016-04-06 |
Family
ID=51209847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000514.0U Expired - Fee Related CN205133768U (en) | 2013-01-16 | 2014-01-16 | Negative pole roller assembly and plating device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101585629B1 (en) |
| CN (1) | CN205133768U (en) |
| WO (1) | WO2014112816A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105420799A (en) * | 2015-12-30 | 2016-03-23 | 长沙岱勒新材料科技股份有限公司 | Plating tank, diamond fretsaw manufacturing device and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104928738B (en) * | 2015-05-21 | 2017-04-19 | 中国科学院山西煤炭化学研究所 | Continuous metal electroplating method and device for carbon fiber tows |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0344495A (en) * | 1989-07-12 | 1991-02-26 | Mitsubishi Electric Corp | Cathode roller mechanism |
| DE10323660A1 (en) * | 2003-05-15 | 2004-12-02 | Gebr. Schmid Gmbh & Co. | Device for treating objects, in particular electroplating for printed circuit boards |
| DE102005031948B3 (en) * | 2005-07-08 | 2006-06-14 | Höllmüller Maschinenbau GmbH | Device for electrolytically treating strip-like material comprises contact rollers made from metal arranged on at least one side of the material and counter rollers arranged on the opposite-lying side of the strip as a contact pair |
| JP2008255482A (en) * | 2007-03-13 | 2008-10-23 | Mitsubishi Materials Corp | Power feed mechanism |
| JP4805195B2 (en) | 2007-03-13 | 2011-11-02 | 富士フイルム株式会社 | Bearing body, liquid draining device, and apparatus for producing film with plating film |
| JP2008248337A (en) * | 2007-03-30 | 2008-10-16 | Fujifilm Corp | Energization processing apparatus and manufacturing apparatus for film with plated film |
-
2013
- 2013-01-16 KR KR1020130005105A patent/KR101585629B1/en active IP Right Grant
-
2014
- 2014-01-16 CN CN201490000514.0U patent/CN205133768U/en not_active Expired - Fee Related
- 2014-01-16 WO PCT/KR2014/000493 patent/WO2014112816A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105420799A (en) * | 2015-12-30 | 2016-03-23 | 长沙岱勒新材料科技股份有限公司 | Plating tank, diamond fretsaw manufacturing device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014112816A1 (en) | 2014-07-24 |
| KR20140092706A (en) | 2014-07-24 |
| KR101585629B1 (en) | 2016-01-14 |
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