KR101811099B1 - Method for producing an organic electronic device and organic electronic device - Google Patents

Abstract

A method for manufacturing an organic electronic device includes a first step of providing a substrate layer having a conductive material. In a second step, the method includes placing a passivation layer in the passivation regions by flexographic printing. The organic semiconductor material is disposed in the third step of the method. In a fourth step, an electrode layer is disposed such that the passivation layer and the organic semiconductor material are disposed between the substrate layer and the electrode layer.

Description

≪ Desc / Clms Page number 1 > METHOD FOR PRODUCING AN ORGANIC ELECTRONIC DEVICE AND ORGANIC ELECTRONIC DEVICE,

The present invention relates to a method of manufacturing an organic electronic device and an organic electronic device manufactured by such a manufacturing method.

In the method of manufacturing a wide range of electronic devices, particularly organic electronic devices such as, for example, organic solar cells, organic light emitting diodes (OLEDs) or organic field effect transistors (OFETs), a particular surface area of a layer of each device is patterned or passivated There is a demand for passivating.

[1] describes a method for producing a lattice structure with a conductive metal paste by, for example, the flexographic printing method [2]. [3] explains a method of manufacturing an antenna with a conductive metal paste using flexo printing.

[4] used poly (3,4-ethylenedioxythiophene) poly (styrenesulfonate), abbreviated as PEDOT: PSS, to pre-wet the device surface with N-octanol to improve wetting of the surface, . Prewetting is performed by the flexo printing method.

[5] describes a flexographic printing method for producing an organic field effect transistor (OFET) by printing a strong hydrophobic material for self-orientation of PEDOT: PSS using a specific dehumidification.

[6] A method for producing a hydrophobic barrier structure for a sensor element by flexographic printing will be described.

A wide range of organic light emitting diodes can be currently placed on a polymer or plastic substrate. The plastic substrate includes an anode layer in addition to the barrier layer. The anode layer may be a transparent conductive layer, for example, a transparent conductive oxide (TCO). The patterning of the barrier layer with a transparent conductive layer can be performed by an additive or subtractive method.

Patterning or passivating a particular surface area of a layer of an organic electronic device may be performed by an addition or subtraction method.

In the addition method, when passivating, the insulating material may be applied on the anode to prevent the current from flowing from the anode to the cathode in the passivated region by way of example. In a subtractive method, the anode may be removed from the region to be passivated or patterned to illustratively prevent current from flowing.

[7] explains a method in which the anode is partially corroded by a laser to separate emission regions of the organic light emitting diode from each other. However, this process creates particles that can contaminate the remaining active elements or areas. Additionally, this process is nearly roll-to-roll compatible with the plastic barrier film because only the TCO coating can corrode without damaging the barrier layer. This creates the best requirement for all of the process parameters such as, for example, web guiding of the substrate, thickness tolerance of the substrate, thickness tolerance of the barrier layer and TCO coating or focus depth of the laser.

In the addition process, the partial passivation of the anode can be performed by depositing the patterned dielectric. [8] describes a photolithography process for depositing a patterned dielectric. However, the photolithography process is complex, costly, incompatible with or incompatible with the roll-to-roll process.

The so-called inkjet printing process is inefficient, with little roll-to-roll compatibility, especially for large areas that are passivated. In the method, a misaddressed drop may additionally reach the active element or region of the device, which may inhibit it or impair its function. Additionally, only low viscosity liquids can be printed using an inkjet method.

In screen printing, the print form contacts both the passivated and non-passivated areas, thus also scratching such areas with particles as exemplified in [8] It also makes contact with the active element that can be made. Furthermore, the screen printing method is almost not roll-to-roll compatible except for the rotary screen printing method.

Although the intaglio printing method is roll-to-roll compatible, the printing form used herein can contact the active element and scratch or contaminate the element with particles, which can interfere with the functioning of the device. In addition, passivation residues that are not stripped from the printing cylinder can contaminate the active element. According to the intaglio printing method, a low-viscosity printing material and an absorbent substrate are mainly used. Such a method is not suitable for a passivation layer which may be a viscous, non-absorbent substrate such as a plastic or metal film.

Figure 5 shows a photograph of an OLED 1005 comprising a substrate patterned by intaglio printing method wherein the passivation region is a (dark) region between the letters "COMEDD" and "R2flex" and the luminescent regions 1006a-c It can be recognized. OLED 1005 has stained OLED emission regions (active regions) 1006a-c that are generated by contamination of the active element by passivation residues.

As a result, what is desirable is a method for passivating an area of an organic electronic device that enables high throughput, reliable passivation, and high quality of the active area of the device.

It is an object of the present invention to provide an organic electronic device and, in particular, a method for manufacturing an organic light emitting diode, wherein the active region exhibits low degree of damage and / or contamination and can be manufactured at high throughput.

This object is achieved by the method according to claim 1 or 8 and the organic electronic device according to claim 9.

Embodiments of the present invention provide a method for fabricating an organic electronic device wherein the passivation layer is arranged in passivation regions between an extensive anode and a cathode by flexographic printing. Additionally, the method includes disposing an organic semiconductor material, and disposing the electrode layer such that the passivation layer and the organic semiconductor material are disposed between the substrate layer and the electrode layer.

An advantage of this embodiment is that contamination of the active area can be minimized or prevented by flexographic printing (method), and contact between the substrate and the printing form can be prevented by separating the printing form from the substrate in the spacing area outside the passivation area, Area, and thus the damage of the active area can be minimized or prevented. The method can be implemented by a roll-to-roll method so that the manufacturing throughput can be high when such a method is used. In addition, this method can be implemented in a continuous manner.

An alternative embodiment provides a method for manufacturing an organic light emitting diode using a flexo printing method.

An advantage of this embodiment is the fact that the emission region of the organic light emitting diode can represent a homogeneous emission region.

A further embodiment of the present invention provides a method for manufacturing an organic electronic device wherein the substrate or base electrode is a metal film.

An advantage of this embodiment is the fact that the electrical conductivity of the metal film, thermal conductivity to the TCO substrate, mechanical stress and / or barrier properties can be increased.

A further advantageous embodiment is the subject matter of the dependent claims.

Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 1 shows a schematic flow diagram of a method for manufacturing an organic device according to an embodiment of the present invention.
Figure 2 shows a schematic side cross-sectional view of an organic light emitting diode including a base electrode, a passivation layer, which separates an organic semiconductor material from a substrate in a passivation region in accordance with an embodiment of the present invention.
3 is a plan view of a patterned organic light emitting diode that may be produced by the method of the present invention.
4 shows a schematic diagram of a flexographic printing method according to an embodiment of the present invention.
Figure 5 shows a photograph of a patterned organic light emitting diode comprising a substrate patterned by intaglio printing methods and a luminescent region contaminated by passivation residues according to the prior art.

BRIEF DESCRIPTION OF THE DRAWINGS Before describing the embodiments of the invention in greater detail with reference to the drawings, it is believed that the same elements, objects and / or structures, or the same function or equivalent effect, It is to be pointed out that the same reference signs will be given throughout the drawings to enable or make them adaptable to each other.

The term substrate layer then refers to a layer comprising a base electrode. The substrate layer may be, for example, a metal film of aluminum, steel, silver, copper or other metal. The substrate layer may be, for example, a base electrode when embodied in a metal film. Alternatively, the substrate layer may also be a (transparent) polymer barrier film with a transparent conductive layer, or a flexible glass with a transparent conductive layer, such as a TCO layer or metal layer. When the substrate layer is a polymer barrier film or a flexible glass having a transparent conductive layer, the substrate layer may be a transparent conductive substrate. The transparent conductive layer may be a TCO layer, a nanowire, and / or a carbon nanotube (CNT). A transparent conductive layer or metal layer may be used as the base electrode. Illustratively, the base electrode may comprise silver. Silver may be disposed on the substrate layer by way of example, by vapor deposition or sputtering (cathode deposition). The substrate layer may be both a base electrode (illustratively a plastic film with TCO) and a carrier of the base electrode itself (e.g., a metal film). The terms base electrode and substrate layer are then used as synonyms and will be interpreted as interchangeable.

Figure 1 shows a schematic flow diagram of a method 100 for manufacturing an organic device. The method 100 includes a first step 110 in which a substrate layer with a conductive material is provided.

The method 100 includes a second step wherein the passivation layer is disposed in the passivation region by flexographic printing, i. E., By the flexographic method. The passivation region may be the surface region of the substrate layer so that the substrate layer is covered with the passivation layer in the passivation region. Alternatively or additionally, it is also possible that the material layer, for example an organic or inorganic conductive or semiconductor functional material, is disposed on the substrate such that the passivation region can cover the surface area of the functional material.

The method 100 includes a third step of disposing an organic semiconductor material. The organic semiconductor material may be completely or partially disposed on the region of the substrate layer such that the organic electronic material in the active region of the substrate layer contacts the active region or the base electrode and is spaced from the substrate layer in the passivation region by the passivation layer .

The method 100 includes a fourth step 140 of depositing an electrode layer such that a passivation layer and an organic semiconductor material are disposed between the substrate layer and the electrode layer in the passivation region. The electrode layer may include one or more counter electrodes, i.e., the potential may be across the entire area or may be applied to the electrode layers in different areas (of the counter electrode). In other words, the electrode layer can be formed integrally or in several pieces. When the electrode layer is implemented as a plurality of pieces, the potential can be applied to one or several subregions of the electrode layer, which means that the plurality of counter electrodes can be driven together or separately.

The organic semiconductor material can cause current to flow between the anode and the cathode in the active region. The device fabricated by method 100 may be an OLED, an organic solar cell, or an OFET.

Based on the polarity between the base electrode and the electrode layer, the base electrode or electrode layer can be used as an anode, and each counter electrode layer or base electrode can be used as a cathode. This means that the conductive material of the substrate layer can form both the anode and the cathode. The passivation layer may be disposed on the anode or the cathode. In other words, the passivation layer may be disposed on the substrate layer or electrode layer such that the third step 130 may follow the second step 120 or the second step 120 may follow the third step 130 .

The passivation layer may be illustratively a resin, polymer or plastic, or a passivation paste. The passivation layer may exhibit a layer thickness of, for example, 1 占 퐉 or more, 15 占 퐉 or more, or 20 占 퐉 or more.

The high viscosity of the passivation paste is "flowed" after the passivation paste is deposited, i. E. After being deposited on the substrate layer or the organic electronic material so that the pin holes are closed or sealed and / Or may form a smooth layer, i. E. May only exhibit low surface roughness. The average surface roughness may be in the range of 5-1000 nm, 50-800 nm or 200-500 nm.

The passivation paste may be illustratively a polyurethane resin or an epoxy resin and / or may have a viscosity in the range between 500 and 5000, 600 and 2500 or 1000 and 3000 m / pas at 20 ° C, and may be, for example, 1-100 Can be disposed on the substrate in a flexographic printing method using a contact pressure in the range of 5 to 50 N / mm, 5-50 N / mm or 7-20 N / mm, preferably 10 N / mm 10%. Alternatively, the passivation layer of the passivation paste may comprise a polymeric material.

Alternatively or additionally, the passivation paste may be a resin or polymer that cures under ultraviolet (UV) light, for example. Alternatively, the resin or polymer may also be cured, for example, when the annealing temperature is reached. The annealing temperature may be, for example, 50 DEG C or more, 120 DEG C or more, or 400 DEG C or more. In the initiation state, prior to curing, the resin or polymer may include a resin or a solvent that exits the polymer, illustratively during the time of curing to cure illustratively.

Hitherto, since the screen pattern of the anilox roller of the device for carrying out the flexographic printing method can also be seen as a result of printing which can prevent the completely sealed layer from forming, Similarly, a method different from the flexographic printing method for arranging the passivation layer was used.

The passivation material of the passivation layer may be "flowing" based on the features described above, thus allowing a uniform layer thickness to be formed.

In contrast to printing using a conductive material, as is exemplarily used in an inkjet method with an antenna structure, voids in the passivation region may short-circuit between the cathode and the anode, Can increase the line resistance. Although increasing the line resistance may illustratively reduce the efficiency of the device, the short circuit may cause the completed device to fail so that the requirements for the finished or sealed finished surface may be higher for the passivation layer than for the conductive layer. .

In other words, printing of the passivation layer in the flexographic printing method, as the method 100 allows, can be achieved by printing a passivation layer in a flexographic printing method, for example, Allowing roll-to-roll patterning of the device.

The advantage of this method is that it is an addition method and that the base electrode of the substrate layer, for example the anode (such as the polymer barrier film or the TCO layer on the metal film) is not damaged unlike the deduction method.

In particular, the method 100 has the advantage that the method 100 can still be applied if the substrate layer is a metal film, unlike the method of subtending an anode partially corroded by a laser, in particular.

In particular, the method 100 may be used to passivate a wide area of an electronic device. The resolution, i.e., the position at which the passivated area is located, may be illustratively 50 μm, 200 μm, or 1000 μm. The method can be used to print a passivation layer in a flexographic printing method to produce a wide range of flexible organic electronic devices in a roll-to-roll process.

Figure 2 shows a schematic side cross-sectional view of an organic electronic device 10 including a base electrode 12 and a passivation layer 14 wherein the passivation layer 14 extends from the base electrode 12 in the passivation region 16 Thereby separating the organic semiconductor material 18. The passivation layer 14 may be disposed by step 120 illustratively. The counter electrode layer 22 is disposed on the organic semiconductor material 18. The base electrode 12, the passivation material 14, the organic semiconductor material 18, and the counter electrode layer 22 are covered by the encapsulation layer 24. The encapsulation layer 24 may be formed to prevent mechanical damage, for example, by contact or mechanical contact between the external object and the counter electrode layer 22, the semiconductor material 18 and / or the passivation layer 14 and / Penetration.

The base electrode 12 of the organic electronic device 10 is connected to the first electrical contact 26a. The opposing electrodes 22a and 22b of the opposing electrode layer 22 of the organic electronic device 10 are connected to the portion (opposing electrode) 22a of the opposing electrode layer 22 to which the first electrical potential is coupled to the electrical contact 26b, 26c coupled to the counter electrode layer 22 so as to be able to be applied between the electrical contact 26a or the base electrode 12. The electrical contacts 26b, The second electric potential can be applied in the region (counter electrode) 22b of the electrode layer 22 coupled to the electrical contact 26c and the base electrode 12. [

This means that the organic electronic device 10 can be independently driven in the area 28a and the area 28b by the electrical contacts 26b and 26c and the voltage that can be applied to the electrical contact 26a is the area (Reference) potentials for the electrodes 28a and 28b. Based on the sign of the potential difference, the conductive material of the base electrode 12 may be illustratively the anode, and the electrode layer 22 may be the cathode of the organic device 10, or vice versa.

A metal film or polymer barrier film with a transparent conductive layer, or a flexible glass with a transparent conductive layer can form the basic electrical contact for an organic electronic device. The substrate or substrate layer with the base electrode 12 may be flexible to allow compatibility with the roll-to-roll method. The function of the organic electron (semiconductor) layer, which is illustratively deposited, is made possible by the heterojunction between electron-conducting and hole-conducting organic materials. To form the active area, the basic electrical contacts are separated from the organic electronic opposed contacts, in particular by the insulating layer (passivation) in place. The requirement for an insulating layer, i.e., a passivation layer, is that it exhibits completeness to ensure effective isolation (isolation) of the base and opposing contacts, i.e., there is no pin hole. Additionally, the passivation layer may be required to exhibit a low roughness and a small thickness to prevent as little or no interference with the subsequent coating and encapsulation process as possible. Alternatively, a high thickness may be desirable, for example to achieve a predetermined set height of the organic electronic device.

Preferably, the non-passivated regions, such as, for example, active regions or elements, are not mechanically damaged to ensure unrestricted functionality, and are not contaminated with particles or contaminated with a passivation material.

Figure 3 shows a plan view of a patterned organic light emitting diode 30 that may be produced by the method of the present invention, for example, method 100. In contrast to the organic light emitting diode 105 of FIG. 5, the organic light emitting diode 30 includes a uniform luminescent region 32a-c and a minimum number of defects and patterning residues on the luminescent region.

In other words, Figure 3 shows an organic light emitting diode 30 comprising a substrate patterned by a flexographic method. Visually, none of the defects or patterning residues can be recognized in the active OLED emission area.

Fig. 4 shows a schematic view of the flexographic printing method. The passivation material 52 is disposed in a doctor blade bath 54 and is applied to the anilox roller 56 using it. The anilox roller 56 allows the passivation material 52 to be deposited in the raised area of the print form cylinder 58 or in the raised area of the flexible print form 59 disposed in the print form cylinder 58 .

The opposite printing cylinder 62 is disposed adjacent to the printing form cylinder 58. Illustratively, substrate 64, which may or may not be the substrate layer or base electrode 12 of FIG. 2, is transferred between the printing form cylinder 58 and the opposing printing cylinder 62. Based on the mechanical contact between the flexible printed form 59 and the substrate 64, a passivation material 52 is disposed on the substrate 64 in the passivation region. The passivation area can be defined at least in part by the printed form cylinder 58 or the area disposed at the raised position on the flexible print form 59. [ The flexible print form 59 may deliver the passivation material 52 disposed in the raised area partially or completely to the substrate 64. This means that after forming the contact between the flexible printed form 59 and the substrate 64, the residue of the passivation material 52 may remain in the flexible printed form 59. [

The illustrated flexographic printing method may be implemented in a roll-to-roll method and may be carried out, for example, on a first roll 66 (Unrolled) from < / RTI > After disposing the passivation material 52 on the substrate 64 and using the UV light, the substrate can be received in the second roll 68, i.e., received or rolled, after potential drying time or irradiation of the passivation material . Alternatively, the flexographic printing method can also be used in a printing system where the individual wide web of substrate 64 is guided to the area between the printing form cylinder 58 and the opposing printing cylinder 62 and the web is conveyed, for example, Or may be provided for further processing of the steps in a laminated manner or adjacent to each other.

4 illustrates a flexo printing method for delivering an insulating layer for a flexible organic electronic device in a patterning fashion, wherein the printing material (passivation material 52) is screened over the entire area by a chamber doctor blade And the patterned passivation layer is applied on the rollers (the anilox roller 56) that is in contact with the printed circuit board 58 or the flexible printed pattern 59 with a basic electrical contact at a location where it contacts the substrate 64 , For example, a substrate 64 such as a transparent conductive oxide substrate.

An advantage herein is the fact that the substrate 64 or the electrodes disposed therein remain unaltered.

A further advantage of the (flexo printing) method described herein is that the encapsulated layer can be transferred onto the substrate 64. The sealed layer may represent both a small thickness and a large thickness. Thickness and roughness may be affected by the screening of the anilox roller 56, physical properties such as viscosity of the passivation material 52, and drying parameters. For example, contact between the printing form cylinder 58 or the flexible printing form 59 and the substrate 64 is prevented in an area (non-printed area) that remains active. This means that damage to the active device or contamination or pollution of the active device from the particulate or passivation material 52 is reduced or prevented. The flexible or resilient print form 59 reduces the stress on the substrate 64, but the print form cylinder 58 or the flexible print form 59 is in contact therewith.

Moreover, the flexographic printing method can be implemented in a highly efficient roll-to-roll method. This means that organic electronic devices can be manufactured at high throughput, i.e., fast and inexpensive. In particular, the manufacturing equipment used can be adapted to small time and / or cost factors, for example on the basis of inexpensive and fast replacement printing forms in the form of plates or sleeves.

While certain aspects have been described with reference to the apparatus, it should be understood that such aspects also represent illustrative counterparts such that blocks or elements of the apparatus are also understood to represent features of corresponding method or method steps. Similarly, aspects described in connection with or as method steps also represent descriptions of corresponding blocks or details or features of corresponding devices.

The above-described embodiments merely illustrate examples of the principles of the present invention. It is to be understood that modifications and variations of the arrangements and details set forth herein will be apparent to those skilled in the art. The present invention is intended to be limited only by the scope of the following claims, but the specific details provided herein using the description and discussion of the embodiments are not intended to be limiting.

references

J., S., Jo, J., Larsen-Olsen, TT, Sondergaard, RR, Hosel, M., Angmo, D., Jorgensen M ., Krebs, FC: Silver front electrode grids for ITO-free all printed polymer solar cells with embedded and raised topographies, prepared by thermal imprint, flexographic and inkjet roll-to-roll processes. In: Nanoscale 4, Stovring 2012: 6032-6040

[2] Kipphan, H .: Handbook of Print Media, Technologies and Production Methods. Springer-Verlag, Berlin, Heidelberg, New York 2001

[3] Siden, J., Nilsson, H.-E .: Line width limitations of flexographic-screen- and inkjet printed RFID antennas. In: Antennas and Propagation Society Inter-national Symposium, Honolulu 2007

[4] Krebs, FC, Fyenbo, J., Jorgensen M .: Product integration of compact roll-to-roll polymer solar cell modules: methods and manufacture using flexographic printing, slot-die coating and rotary screen printing. In: Journal of Materials Chemistry 20, London 2010: 8994-9001

[5] Schmidt, G .: Oberflachenspannungsstrukturiertes Drucken zur Herstellung polymerelektronischer Bauelemente. Dissertation, Chemnitz 2011

[6] Olkkonen, J., Lehtinen, K., Erho, T .: Flexographically Printed Fluidic Structures in Paper. In: Anal.Chem. 82 (24), Urbana-Champaign 2010: 10246-10250

[7] Karnakis, D., Kearsley, A., Knowles, M .: Ultrafast Laser Patterning of OLEDs on Flexible Substrate for Solid-state Lightning. In: JLMN-Journal of Laser Micro / Nanoengeniiering Vol. 4, No. 3, Osaka 2009: 218-223

[8] Philipp, A., Hasselgruber, M., Hild, O. R., May, C .: Substratstrukturierung fur organische Leuchtdioden mittels Siebdruck: Technologietag-Siebdruck, Landshut 2010

Claims (9)

In the manufacturing method (100) of the organic electronic device (10)
Providing (110) a substrate layer (12; 64) having an electrically conductive material;
Arrange (120) the passivation layer (14; 52) in the passivation regions (16) by flexographic printing to obtain a patterned passivation layer (14; 52);
Placing (130) the organic semiconductor material (18) in the passivation regions (16) to be spaced apart from the substrate layer (12; 64) by the passivation layer (14; 52); And
(140) the electrode layer (22) so that the passivation layer (14; 52) and the organic semiconductor material (18) are disposed between the substrate layer (12; 64) and the electrode layer and,
The step 120 of placing the passivation layer (14; 52)
Providing a passivation material (52);
Disposing the passivation material (52) in elevated areas of a flexible printing form (59) disposed on a printing form cylinder (58); And
Contacting the flexible printed pattern 59 with a layer disposed on the substrate layer 12 or 64 or the substrate layer 12;
The passivation material 52 is a resin,
The method
Further comprising curing the resin using UV radiation or by curing the resin by heating the resin to at least a cure temperature,
A method of manufacturing an organic electronic device. The method according to claim 1,
Wherein the organic electronic device (10) is an organic light emitting diode. 3. The method according to claim 1 or 2,
The step 120 of arranging the passivation layer 14 or 52 may be performed such that the passivation layer 14 or 52 is oriented in a direction from the substrate layer 12 to the electrode layer 22, Wherein the organic electroluminescent device is performed to have an extension. delete delete 3. The method according to claim 1 or 2,
The method is a roll-to-roll method,
Providing the substrate layer (12; 64) from a first roll (66) at a time before disposing the passivation layer (14; 52) on the substrate layer (12; 64); And
Further comprising receiving the substrate layer (12; 64) on a second roll (68) at a time after placing the passivation layer (14; 52) on the substrate layer (12; 64) , ≪ / RTI > 3. The method according to claim 1 or 2,
The step of providing (110) the substrate layer (12; 64) comprises providing a metal film or providing a transparent electrically conductive substrate. In the manufacturing method (100) of the organic electronic device (10)
Providing (110) a substrate layer (12; 64) having an electrically conductive material;
Placing (120) the passivation layer (14; 52) in the passivation regions (16) by flexographic printing to obtain a patterned passivation layer (14; 52);
Placing (130) the organic semiconductor material (18) in the passivation regions (16) to be spaced apart from the substrate layer (12; 64) by the passivation layer (14; 52); And
(140) the electrode layer (22) so that the passivation layer (14; 52) and the organic semiconductor material (18) are disposed between the substrate layer (12; 64) and the electrode layer In addition,
The step 120 of placing the passivation layer (14; 52)
Providing a passivation material (52);
Placing the passivation material (52) in raised areas of the flexible print form (59) disposed on the print form cylinder (58); And
Comprising the step of contacting said flexible print form (59) with a layer disposed on said substrate layer (12; 64) or said substrate layer (12; 64)
The passivation material (52) is a resin or a polymer,
Curing the resin or polymer using UV radiation; or
And heating the resin or polymer to at least a curing temperature to cure the resin or polymer. As the organic electronic device 10,
9. Process according to claim 1 or 8,
Includes a patterned passivation layer (14; 52) disposed between a substrate layer (12; 64) and an electrode layer (22) by a flexographic method
Wherein the passivation layer 14 and the organic semiconductor material 18 are disposed between the substrate layer 12 and the electrode layer 22,
An organic electronic device (10).

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