JP2015164129A - Method for manufacturing organic electronic device and organic electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic electronic device which minimizes contamination of an active region and enables manufacturing with high through-put.SOLUTION: A manufacturing method of an organic electronic device includes: a step 110 where a substrate layer having an electric conductive material is provided; a step 120 where a passivation layer is disposed on a passivation region by flexographic printing; a step 130 where an organic semiconductor material is disposed; and a step 140 where an electrode layer is disposed so that the passivation layer and the organic semiconductor material are disposed between the substrate layer and the electrode layer.

Description

  The present invention relates to a method of manufacturing an organic electronic device and an organic electronic device manufactured by this method.

  In a wide range of electronic device manufacturing methods, for example, specific organic electronic devices such as organic solar cells, organic light emitting diodes (OLEDs) or organic field effect transistors (OFETs), specific surface areas of the layers of each device There is a need to pattern or passivate (passivate).

  Non-Patent Document 1 describes a method of manufacturing a lattice structure using an electrically conductive metal paste by, for example, a flexographic printing method (Non-Patent Document 2). Non-Patent Document 3 describes a method of manufacturing an antenna using an electrically conductive metal paste using flexographic printing.

  Non-Patent Document 4 states that poly (3,4-ethylenedioxythiophene) poly (styrene sulfonic acid) —hereinafter abbreviated as PEDOT: PSS—to improve surface wetting for solar cell manufacturing. Describes prewetting the device surface with N-octanol. Prewetting is performed by the flexographic printing method.

  Non-Patent Document 5 describes a flexographic printing method for manufacturing an organic field effect transistor (OFET) by printing a strong hydrophobic material against the self-orientation of PEDOT: PSS using specific dewetting. Is described.

  Non-Patent Document 6 describes a method of manufacturing a hydrophobic barrier structure for a sensor element by flexographic printing.

  A wide range of organic light emitting diodes can now be placed on polymer or plastic substrates. The plastic substrate comprises an anode layer remote from the barrier layer. The anode layer can be a transparent conductive layer such as, for example, a transparent conductive oxide (TCO). Patterning of the barrier film with a transparent conductive layer can be performed by an addition method or a subtraction method.

  Patterning or passivation of specific surface areas of a layer of an organic electronic device can be performed by addition or subtraction methods.

  In the addition method, when passivation is performed, an insulating material can be exemplarily applied on the anode in order to prevent a current from flowing from the anode to the cathode in the passivated region. In the subtraction method, the anode can be exemplarily removed in a passivated or patterned area to prevent current from flowing.

Non-Patent Document 7 describes a subtraction method in which the anode is partially eroded by the laser and thus the light emitting areas of the organic light emitting diodes are separated from each other. However, this process causes particleization that can contaminate the remaining active elements or regions.
In addition, this process is hardly roll-to-roll compatible with plastic barrier films because only the TCO coating can be eroded without damaging the barrier film. This results in high requirements for all process parameters such as substrate web guide, substrate thickness tolerance, barrier layer thickness crossing and TCO coating or laser depth of focus.

  In the summing method, partial passivation of the anode can be done by depositing a patterned dielectric. Non-Patent Document 8 describes a photolithographic process for depositing a patterned dielectric. However, the photolithographic process is complex, expensive, not compatible with roll-to-roll processes, or simply poorly compatible.

  The so-called ink jet printing process is also inefficient, with little roll-to-roll compatibility, especially for large areas that are passivated. During this method, a misaddressed drop may additionally reach the active element or region of the device, hindering it or its function. In addition, only low viscosity liquids can be printed using the ink jet method.

  In screen printing, the printing form touches both the passivated and non-passivated areas, and thus scratches them with particles, as exemplarily described in [8] It also contacts active elements that can become contaminated. Furthermore, the screen printing method is hardly roll-to-roll compatible except for the rotary screen printing method.

  Intaglio printing is roll-to-roll compatible, but the printing form used here can contact the active element and scratch or contaminate it with particles, thus hindering the function of the device. In addition, passivation residues that are not rubbed off the printing cylinder can contaminate the active elements. For intaglio printing, low viscosity printing materials and absorbent substrates are often used. This type of method is not suitable for passivation layers that can be viscous non-absorbing substrates such as plastic or metal films.

  FIG. 5 shows a photograph of an OLED 1005 with a substrate patterned by intaglio printing, where the passivation area is the (dark) area between the letters “COMEDD” and “R2flex” and the light emitting areas 1006a-c. It is recognized as. The OLED 1005 has a dirty OLED light emitting area (active area) 1006a-c, which is caused by contamination of the active device by passivation residues.

  Therefore, in organic electronic devices, a method of passivating regions that allows high throughput, highly reliable passivation and high quality of the active region of the device is desirable.

Yu, J.-S., Kim I., Kim, J.-S., Jo, J., Larsen-Olsen, TT, Sondergaard, RR, Hosel, M., Angmo, D., Jorgensen M., Krebs , FC: Silver front electrode grids for ITO-free all printed polymer solar cells with embedded and raised topographies, prepared by thermal imprint, flexographic and inkjet roll-to-roll processes.In: Nanoscale 4, Stovring 2012: 6032-6040 Kipphan, H .: Handbook of Print Media, Technologies and Production Methods.Springer-Verlag, Berlin, Heidelberg, New York 2001 Siden, J., Nilsson, H.-E .: Line width limitations of flexographic-screen- and inkjet printed RFID antennas. In: Antennas and Propagation Society Inter-national Symposium, Honolulu 2007 Krebs, FC, Fyenbo, J., Jorgensen M .: Product integration of compact roll-to roll processed polymer solar cell modules: methods and manufacture using flexographic printing, slot-die coating and rotary screen printing.In: Journal of Materials Chemistry 20 , London 2010: 8994-9001 Schmidt, G .: Oberflachenspannungsstrukturiertes Drucken zur Herstellung polymerelektronischer Bauelemente. Dissertation, Chemnitz 2011 Olkkonen, J., Lehtinen, K., Erho, T .: Flexographically Printed Fluidic Structures in Paper. In: Anal.Chem. 82 (24), Urbana-Champaign 2010: 10246-10250 Karnakis, D., Kearsley, A., Knowles, M .: Ultrafast Laser Patterning of OLEDs on Flexible Substrate for Solid-state lightning.In: JLMN-Journal of Laser Micro / Nanoengeniiering Vol. 4, No. 3, Osaka 2009: 218-223 Philipp, A., Hasselgruber, M., Hild, O. R., May, C .: Substratstrukturierung fur organische Leuchtdioden mittels Siebdruck: Technologietag-Siebdruck, Landshut 2010

  It is an object of the present invention to provide a method for manufacturing an organic electronic device, in particular an organic light emitting diode, such that the active area is less damaged and / or contaminated and can be manufactured at a high throughput rate. .

  This object is achieved by a method according to claim 1 or 8 and an organic electronic device according to claim 9.

  Embodiments of the present invention provide a method of manufacturing an organic electronic device in which a passivation layer is placed in a wide passivation region between the anode and cathode by flexographic printing. In addition, the method includes disposing an organic semiconductor material and disposing the electrode layer such that the passivation layer and the organic semiconductor material are disposed between the substrate layer and the electrode layer.

  The advantage of this embodiment is that the flexographic printing (method) can minimize or prevent contamination of the active area, and the printing form is spaced from the substrate in the spacing area outside the passivation area. Is the fact that contact between the substrate and the printing form can be prevented in these spacing regions, and therefore damage to the active area or region can be minimized or prevented. This method can be realized as a roll-to-roll method so that the production throughput when this method is used can be increased. In addition, the method can be realized as a continuous method.

  Another embodiment provides a method of manufacturing an organic light emitting diode by flexographic printing.

  The advantage of these embodiments is the fact that the light emitting area of the organic light emitting diode can exhibit a homogeneous light emitting area.

  A further embodiment of the present invention provides a method of manufacturing an organic electronic device in which the substrate or base electrode is a metal film.

  The advantage of this embodiment is the fact that the electrical conductivity, thermal conductivity, mechanical stress resistance and / or barrier properties of the metal film can be increased relative to the TCO substrate.

  Further advantageous embodiments are the subject matter of the dependent claims.

  Preferred embodiments of the present invention are subsequently described in detail with reference to the following accompanying drawings.

1 shows a schematic flowchart of a method for manufacturing an organic device according to an embodiment of the present invention. 1 shows a schematic cross-sectional side view of an organic light emitting diode comprising a passivation layer spaced from an organic semiconductor material in a base electrode, passivation region and spaced from an organic semiconductor material, according to an embodiment of the present invention. FIG. 2 shows a top view of a patterned organic light emitting diode that can be produced by the inventive method. 1 shows a schematic diagram of a flexographic printing method according to an embodiment of the present invention. FIG. Figure 3 shows a photograph of a patterned organic light emitting diode comprising a substrate patterned by an intaglio printing method and a light emitting area contaminated by a passivation residue according to the prior art.

  Before the embodiments of the present invention are described in more detail below with reference to the drawings, the same elements, objects and / or structures or their equivalent functions or effects are described in different embodiments. It is pointed out that the description is provided by the same reference numerals throughout the drawings so that the descriptions are interchangeable or applicable to each other.

  Subsequently, the term “substrate layer” means a layer comprising a base electrode. The substrate layer can illustratively be a metal film made of aluminum, steel, silver, copper or other metals. The substrate layer can be a base electrode when realized as a metal film, for example. Alternatively, the substrate layer can be a polymer barrier film with a transparent electrical conductive layer, such as a TCO layer or a metal layer (possibly transparent) or a flexible glass with a transparent electrical conductive layer. When the substrate layer is a polymer barrier film or flexible glass having a transparent electrically conductive layer, the substrate layer can be a transparent electrically conductive substrate. The transparent electrically conductive layer can be a TCO layer, nanowires and / or carbon nanotubes (CNT). A transparent electrically conductive layer or metal layer can be used as the base electrode. Illustratively, the base electrode can include silver. Silver can be illustratively disposed on the substrate layer by vapor deposition or sputtering (cathode vapor deposition). The substrate layer can be both the carrier of the base electrode (ex. TCO plastic film) and the base electrode itself (ex. Metal film). The terms “base electrode” and “substrate layer” are subsequently used interchangeably and are understood to be interchangeable.

  FIG. 1 shows a schematic flowchart of a method 100 for manufacturing an organic device. The method 100 comprises a first step 110 in which a substrate layer having an electrically conductive material is provided.

  The method 100 includes a second step in which a passivation layer is placed in the passivation region by flexographic printing, ie by flexographic printing. The passivation region can be a surface region of the substrate layer, so that the substrate layer is covered with the passivation layer in the passivation region. Alternatively or in addition, a layer of material such as, for example, an organic or inorganic conductive or semiconductor functional material can be disposed on the substrate, so that the passivation area covers the surface area of the functional material. can do.

  The method 100 comprises a third step in which an organic semiconductor material is disposed. The organic semiconductor material can exemplarily be placed completely or partially over the area of the substrate layer, so that the organic electronic material contacts it or the base electrode in the active region of the substrate layer and is passivated In the region, the passivation layer is spaced from the substrate layer.

  The method 100 comprises a fourth step 140 in which the electrode layer is disposed, so that in the passivation region, the passivation layer and the organic semiconductor material are disposed between the substrate layer and the electrode layer. The electrode layer can comprise one or several counter electrodes, i.e. a potential can be applied to the electrode layer on all areas (of the counter electrode) or in different regions. In other words, the electrode layer can be integrated or as several pieces. When the electrode layer is implemented in several pieces, the potential can be applied to one or several small areas of the electrode layer, which can drive several counter electrodes together or separately Means that you can.

  Organic semiconductor materials can tolerate current flowing between the anode and cathode in the active region. The device manufactured by the method 100 can be an OLED, an organic solar cell or an OFET.

  Based on the polarity between the base electrode and the electrode layer, the base electrode or electrode layer can be used as an anode and the opposite electrode layer or base electrode can be used as a cathode. This means that the electrically conductive material of the substrate layer can form both an anode and a cathode. The passivation layer can be disposed on the anode or the cathode. In other words, the passivation layer can be disposed on the substrate layer or the electrode layer, so that the third step 130 can follow the second step 120, or the second step 120 can be the third step. Step 130 can be followed.

  The passivation layer can illustratively be a resin, polymer or plastic, or a passivation paste. The passivation layer can exhibit a layer thickness of 1 μm or more, 15 μm or more, or 20 μm or more.

  A highly viscous passivation paste is deposited, i.e. "flows" after being placed on a substrate layer or organic electronic material, thus closing or sealing pinholes and / or a layer of uniform thickness and / or It makes it possible to form a smooth layer, i.e. to exhibit only a low surface roughness. The average surface roughness can be in the range of 5-1000 nm, 50-800 nm, or 200-500 nm.

  The passivation paste can illustratively be a polyurethane resin or an epoxy resin and / or exhibit a viscosity in the range between 500 and 5000, 600 and 2500 or 1000 and 3000 m / pas at 20 ° C. During flexographic printing, for example, placing on the substrate using a contact pressure in the range of 1-100 N / mm, 5-50 N / mm or 7-20 N / mm, preferably 10 N / mm ± 10%. Can do. Alternatively, the passivation layer of the passivation paste can comprise a polymeric material.

  Alternatively or additionally, the passivation paste can be illustratively a cure of a resin or polymer under ultraviolet (UV) light. Alternatively, the resin or polymer can be cured when the annealing temperature is reached. Annealing temperature can be 50 degreeC, 120 degreeC, or 400 degreeC or more, for example. In the starting state, prior to curing, the resin or polymer can include a solvent that illustratively escapes the resin or polymer during curing and consequently cures.

  Until now, as is known from the prior art for the arrangement of the passivation layer, the screen pattern of the anilox roller of the apparatus performing the flexographic printing method can be visible in the printed result and is completely sealed. Therefore, the person skilled in the art has used a method different from the flexographic printing method.

  The passivation material of the passivation layer can be “flowed” based on the aforementioned characteristics, thus making it possible to form a uniform layer thickness.

  In contrast to printing with electrically conductive materials, such as those used in inkjet methods by way of example with antenna structures, voids in the passivation area can result in a short circuit between the cathode and anode. On the other hand, local voids in the conductive material can result in increased line resistance. While increased line resistance can illustratively reduce device efficiency, a short circuit can result in complete device failure, resulting in sealed or closed or full The requirement for such a surface layer can be higher for the passivation layer than for the conductive layer.

  In other words, as a method 100, printing a passivation layer in a flexographic printing method is a wide range of flexible organic electronics with a non-conductive passivation material (insulating layer), for example, by printing the passivation layer in a flexographic printing method. Enables roll-to-roll patterning of devices.

  The advantage of this method is that it is an addition method, where the base electrode of the substrate layer, illustratively the anode (such as a polymer barrier film or a TCO layer on a metal film), is damaged in contrast to the subtraction method. It is to remain without receiving.

  In particular, the method 100 has the advantage that it can still be applied when the substrate layer is a metal film, as opposed to the subtraction method where the anode is illustratively partially eroded by the laser.

  In particular, the method 100 can be used for passivation of large elements of electronic devices. The resolution, that is, the position where the passivation area is arranged can be illustratively 50 μm, 200 μm, or 1000 μm. This method can be used to manufacture a wide range of flexible organic electronic devices in a roll-to-roll process by printing a passivation layer with a flexographic printing method.

  FIG. 2 is a schematic cross-sectional side view of an organic light emitting diode 10 that includes a base electrode 12 and a passivation layer 14 that places an organic semiconductor material 18 spaced from the base electrode 12 in the passivation region 16. The passivation layer 14 can be exemplarily disposed by step 120. The counter electrode layer 22 is disposed on the organic semiconductor material 18. Base electrode 12, passivation material 14, organic semiconductor material 18 and counter electrode layer 22 are covered by an encapsulation layer 24. The encapsulating layer 24 prevents mechanical damage, for example due to mechanical contact or contact with external objects of the counter electrode layer 22, the semiconductor material 18 and / or the passivation layer 14, and / or makes them water and Configured to protect against oxygen penetration.

  The base electrode 12 of the organic electronic device 10 is connected to the first electrical contact 26a. The counter electrodes 22a and 22b of the counter electrode layer 22 of the organic electronic device 10 are connected to electrical contacts 26b and 26c, which are the part of the counter electrode layer 22 (counter electrode) 22a and the electrode 26a or The counter electrode layer 22 is coupled so that a first potential can be applied between the base electrodes 12. The second potential can be applied to the electrical contact 26 c and the region (counter electrode) 22 b of the electrode layer 22 coupled to the base electrode 12.

  This is because the organic light emitting diode 10 can be independently driven by the electrical contacts 26b and 26c in the regions 28a and 28b, and the voltage that can be applied to the electrical contacts 26a is common to the regions 28a and 28b. (Reference) Means forming a potential. Based on the sign of the potential difference, the electrically conductive material of the base electrode 12 can be illustratively an anode and the electrode layer 22 can be the cathode of the organic device 10 or vice versa.

  A metal film or a polymer barrier film having a transparent electrically conductive layer or a flexible glass having a transparent electrically conductive layer can form an electrical basic contact for an organic electronic device. The substrate or substrate layer having the base electrode 12 can be flexible to allow compatibility with the roll-to-roll process. Illustratively, the function of the organic electronic (semiconductor) layer deposited thereon is enabled by a heterojunction between the electron conductive organic material and the hole conductive organic material. In order to define the active area, the electrical basic contact is separated in some places by an insulating layer (passivation), in particular from an organic electronic pair contact. A requirement for the insulating layer, i.e. the passivation layer, is that it exhibits integrity, i.e. it has no pinholes to ensure effective separation (insulation) of the basic contact points. In addition, it may be necessary for the passivation layer to exhibit low roughness and small thickness so that it does not interfere with the subsequent coating and encapsulation process as much or as little as possible. Alternatively, a high thickness may be desirable, for example, to achieve a predetermined setup height for organic electronic devices.

  Preferably, non-passivated areas, such as active areas or elements, are not mechanically damaged, not contaminated by particles, or contaminated by the passivation material to ensure unrestricted function.

  FIG. 3 shows a plan view of a patterned organic light emitting diode 30 that can be manufactured by an inventive method, such as method 100. In contrast to the organic light emitting diode 105 of FIG. 5, the organic light emitting diode 30 comprises a homogeneous light emitting area 32a-c and a minimum number of defects and patterned residues on the light emitting area.

  In other words, FIG. 3 shows an organic light emitting diode 30 comprising a substrate patterned by flexographic printing. The naked eye cannot recognize any defects or patterned residues in the active OLED light emitting area.

  FIG. 4 shows a schematic diagram of the flexographic printing method. Passivation material 52 is placed in doctor blade bath 54 and dispensed onto anilox roller 56 using it. By means of the anilox roller 56, the passivation material 52 is deposited or placed on the raised area of the printing form cylinder 58 or on the raised area of the flexible printing form 59 that is placed on the printing form cylinder 58.

  The counter print cylinder 62 is disposed adjacent to the print form cylinder 58. A substrate 64, illustratively the substrate layer or base electrode 12 of FIG. 2, may be transferred between a printing form cylinder 58 and a counter-printing cylinder 62. Based on the mechanical contact between the flexible printing form 59 and the substrate 64, the passivation material 52 is disposed on the substrate 64 in the passivation region. The passivation area can be defined, at least in part, by the raised position of the printing form cylinder 58 or the area located on the flexible printing form 59. The flexible printing form 59 can transfer the passivation material 52 placed in the raised area, partially or completely, to the substrate 64. This means that a residue of the passivation material 52 may remain on the flexible printing form 59 after contact between the flexible printing form 59 and the substrate 64 is made.

  The illustrated flexographic printing method can be implemented as a roll-to-roll method, providing the substrate 64 from, for example, the first roll 66 before the substrate 64 contacts the raised area of the flexible printing form 59. It can be executed so that it can be unrolled. After the passivation material 52 is placed on the substrate 64 and after a possible fixing time or after irradiation of the passivation material with a UV light, the substrate is received, i.e. taken up or wound on a second roll 68. be able to. Alternatively, the flexographic printing method can be performed such that the individual broad webs of the substrate 64 are guided into the area between the printing form cylinder 58 and the counter-printing cylinder 62, which is a further processing step. On the other hand, it can be provided, for example, in individual layers, in a stacked manner or adjacent to each other.

  In other words, FIG. 4 shows a flexographic printing method for transferring an insulating layer in a patterned manner for a flexible organic electronic device, where the printing material (passivation material 52) is transferred to the entire area by a doctor blade chamber. The patterned passivation layer dispensed on the roller to be screened on (anilox roller 56) provides, for example, electrical basic contacts at those locations where the printing form cylinder 58 or flexible printing form 59 contacts the substrate 64. It is transferred onto a substrate 64, such as a transparent conductive oxide substrate.

  The advantage here is the fact that the substrate 64 or the electrodes disposed thereon remain unchanged.

  A further advantage of the method described here (flexographic printing method) is that the sealed layer can be transferred onto the substrate 64. The sealed layer can exhibit both a smaller thickness and a larger thickness. Thickness and roughness can be affected by physical characteristics such as screening of the anilox roller 56, viscosity of the passivation material 52, and drying parameters. For example, contact between the printing form cylinder 58 or flexible printing form 59 and the substrate 64 is prevented in areas that remain active (non-printing areas). This means that active element damage or contamination or contamination by / from active element particles or passivation material 52 is reduced or prevented. While the printing form cylinder 58 or flexible printing form 59 contacts the substrate 64, the flexible or elastic printing form 59 allows a reduced stress on the substrate 64.

  Furthermore, the flexographic printing method can be implemented as a very efficient roll-to-roll method. This means that organic electronic devices can be manufactured at high throughput, that is, at high speed and at low cost. In particular, based on cheap and fast exchangeable printing forms in the form of plates or sleeves, for example, the production equipment used can be adapted with less time and / or cost factors.

  Although some aspects are described in the context of an apparatus, these aspects correspond, as it is understood that the blocks or devices of the apparatus also represent corresponding method steps or features of the method steps. It is understood that it also represents a description of the method. Similarly, aspects described in connection with or as method steps also represent corresponding blocks or descriptions of details or features.

  The above-described embodiments are merely illustrative of the principles of the invention. It will be understood that modifications and changes in the arrangements and details described herein will be apparent to other persons skilled in the art. Accordingly, the present invention is intended to be limited only by the scope of the following claims and not by the specific details presented herein using the description and description of the embodiments.

Claims (9)

A method of manufacturing an organic electronic device (10) comprising:
Providing (110) a substrate layer (12; 64) comprising an electrically conductive material;
Placing the passivation layer (14; 52) in the passivation region (16) by flexographic printing (120);
Disposing an organic semiconductor material (18) (130);
Disposing the electrode layer (22) such that the passivation layer (14; 52) and the organic semiconductor material (18) are disposed between the substrate layer (12; 64) and the electrode layer (22). (140),
With a method.   The method of claim 1, wherein the organic electronic device is an organic light emitting diode.   The step (120) of disposing the passivation layer (14; 52) comprises at least 1-20 μm of the passivation layer (14; 52) from the substrate layer (12; 64) toward the electrode (22). The method according to claim 1, wherein the method is performed to have stretching. Disposing (120) the passivation layer (14; 52) comprises:
Providing a passivation material (52);
Disposing the passivation material (52) on a raised area of a flexible printing form (59) disposed on a printing form cylinder (58);
Contacting said flexible printing form (59) with said substrate layer (12; 64) or a layer disposed thereon;
The method according to claim 1, comprising: The passivation material (52) is a resin or polymer,
Curing the resin or polymer using UV radiation, or curing the resin or polymer by heating the resin or polymer to at least a curing temperature;
The method of claim 4, further comprising: The method is a roll-to-roll method,
Providing the substrate layer (12; 64) at a time from a first roll (66) before placing the passivation layer (14; 52) on the substrate layer (12; 64);
Receiving the substrate layer (12; 64) at a time on a second roll (68) after placing the passivation layer (14; 52) on the substrate layer (12; 64);
The method according to claim 1, further comprising:   The providing (110) of the substrate layer (12; 64) comprises either providing a metal film or providing a transparent electrically conductive substrate. the method of. A method (100) for producing an organic electronic device (10) comprising:
Providing (110) a substrate layer (12; 64) comprising an electrically conductive material;
Placing the passivation layer (14; 52) in the passivation region (16) by flexographic printing (120);
Disposing an organic semiconductor material (18) (130);
Disposing the electrode layer (22) such that the passivation layer (14; 52) and the organic semiconductor material (18) are disposed between the substrate layer (12; 64) and the electrode layer (22). (140),
With
Disposing (120) the passivation layer (14; 52) comprises:
Providing a passivation material (52);
Disposing the passivation material (52) on a raised area of a flexible printing form (59) disposed in a printing form cylinder (58);
Contacting said flexible printing form (59) with said substrate layer (12; 64) or a layer disposed thereon;
With
The passivation material (52) is a resin or polymer, and the method comprises:
Curing the resin or polymer using UV radiation, or curing the resin or polymer by heating the resin or polymer to at least a curing temperature;
The method further comprising:   Organic device (10) comprising a passivation layer (14; 52) disposed between a substrate layer (12; 64) and an electrode layer (22) by flexographic printing.

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