JP2008248337A - Energization processing apparatus and manufacturing apparatus for film with plated film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an energization processing apparatus which can substantially uniformly perform energization processing of a belt-shaped material to be energized without generating scratches and abrasions on an energizing part of the belt-shaped material to be energization processed. <P>SOLUTION: The energization processing apparatus 48A is equipped with a cathode power feeding roller 50A for performing powder while being feed brought into contact with a conductive metal part of a photosensitive web 18 and a plating tank 60A filled with a plating solution 61 which is provided downstream from the cathode power feeding roller 50A in the transfer direction of the photosensitive web 18. The surface of the cathode power feeding roller 50A is subjected to electric discharge processing and has a surface roughness Ry of preferably ≥5 and <30 μm, more preferably 10-25 μm. At a position opposing to the cathode power feeding roller 50A across the photosensitive web 18, an elastic roller 52A for pressing the conductive metal part of the photosensitive web 18 toward the cathode power feeding roller 50A is arranged nearly horizontally with respect to the cathode power feeding roller 50A. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an energization processing apparatus that supplies power to an energization portion of a strip-shaped material to be energized, and an apparatus for manufacturing a film with a plating film including the energization processing apparatus.

  Conventionally, methods for continuously forming a plating film while conveying a long film are disclosed in JP-A-7-22473 (Patent Document 1), JP-A-2004-263215 (Patent Document 2), and JP-A-2004-2004. As described in Japanese Patent No. 18949 (Patent Document 3) and Japanese Patent Application Laid-Open No. 2004-18948 (Patent Document 4), the conductive surface of the film or the metal film is brought into contact with the cathode roller, or the conductive surface of the film is liquid. There is known a method in which a plating bath in which an anode is put in contact with a cathode roller through a film and before or after that is disposed, and a plating film is formed in the plating bath. If a plating film is continuously formed on a film by such a method, it is possible to easily form a plating film having a desired thickness on the film by repeatedly passing a unit in which a cathode and an anode are arranged. It is.

  However, the conductive metal part of the translucent conductive film formed by patterning the conductive metal part and the visible light transmissive part on a transparent support often used in PDP (plasma display panel) is silver halide. When developing photographic light-sensitive material and developing silver, and the mesh pattern is formed from fine mesh-like wires with a thickness of 1 to 40 μm, the surface electrical resistance is 50Ω / □ to 500Ω even though it has conductivity. In addition, the conductive part does not cover the film surface uniformly. For this reason, in the method of directly contacting the cathode roller and the film described in Patent Document 1, the contact tends to be unstable, and the power feeding is unstable.

  In recent years, in order to solve the above-described problems, when electroplating a long film having conductivity as described in Patent Document 2, from one side of the film in contact with the power supply roller portion to the film width direction A method and apparatus for conveying a spherical or roller-like object while pressing the film surface with one or several pieces have been developed. However, this method does not press the entire width direction of the belt-like film uniformly, resulting in a difference in contact resistance, making it difficult to maintain a uniform power supply state, unstable power supply, and uneven plating film thickness. And unevenness of the plating surface roughness.

  From the above situation, translucent conductivity formed by patterning a conductive metal portion and a visible light transmissive portion on a transparent support using developed silver obtained by developing a silver halide photographic light-sensitive material. In the case of plating a conductive film, since it is difficult to apply electroplating suddenly, after electroless copper plating is first performed so that the surface resistance of the film becomes about 1 to 30Ω / □, the method described in Patent Document 1, Or copper plating was given by the method described in patent documents 2-4. However, in such a method using electroless copper plating, the process becomes long, and the chemical aging time during production is short, and a large amount of chemicals is consumed.

  Further, even if there is a slight difference between the rotation speed of the power supply roller and the conveyance speed of the belt-like film, there is a problem that a scratch defect is generated on the plated surface due to slip or wrinkles are generated on the film. In order to solve this problem, in Japanese Patent Laid-Open No. 2006-307338 (Patent Document 5), the maximum roughness Rmax is set to 30 μm or more on the effective surface of the roller surface, and the particle size of 0.03 is applied to the entire effective surface of the roller surface. It is disclosed that irregularities are formed by spraying particles of mm or more and 1.5 mm or less, and the surface is polished with an abrasive cloth of P40 or more and P600 or less and then polished. Here, Rmax corresponds to the surface roughness Ry defined in JIS B 0601-1994.

  However, when plating the mesh-like or grid-like conductive layer, if the maximum roughness Rmax is 30 μm or more on the effective surface of the roller surface of the power supply roller, it is impossible to uniformly supply power to the substrate to be plated. In the method of spraying particles having a particle size of 0.03 mm or more and 1.5 mm or less to form irregularities on the roller surface, it is difficult to form irregularities on the surface with good reproducibility. It has been found that it is difficult to obtain a surface state with good reproducibility by polishing the surface with abrasive cloth of P600 or less. In addition, buffing after polishing the surface with abrasive cloth may cause the buffing powder to bite into the surface of the roller material, and a material different from the roller material may cover the surface, resulting in plating unevenness.

  Further, in order to carry the belt-like film without causing the feeding roller to slip, FIG. 11 of Japanese Patent Application Laid-Open No. 2006-144121 (Patent Document 6) shows a plating apparatus that contacts and feeds a long substrate to be plated. As the power supply roller, two or more, preferably three or more pressure rollers arranged in parallel at least on both sides of the pressure roller and the outer end region on the roller portion on both sides of the pressure roller are in contact with each other. A loop-like endless belt wound so as to rotate with the rotation of the pressure roller, and the endless belt includes a cushion layer including rubber on the inner peripheral side thereof, and an outer peripheral side provided on the cushion layer. The metal conductive layer on the outer peripheral side is applied in contact with both side ends of the film-like substrate to be plated by power feeding from the power feeding bar. DOO power feeding roller is disclosed as possible.

  However, installing at least four or more rotating rollers on both surfaces of the plating base so as to synchronize with the passing speed of the plating base made of a film-like conductor requires a precise drive system and increases the apparatus cost. The load of maintenance and management of the device increases. Further, it is difficult to adjust the pressure of the pressure roller with respect to the change in the conveyance tension of the film-like substrate, which is not practical.

In order to eliminate the above problems and scratches on the contact surface of the plating substrate caused by slip due to the speed difference between the feeding roller (cathode feeding electrode) and the film-like substrate to be plated, JP-A-2005-248269 ( Patent Document 7) discloses that a cathode elastic electrode is not a roller but a conductive elastic body made of an extremely thin plate-like piece is elastically brought into contact with a long substrate to be plated on a transport film to supply power. However, if the fixed object is in contact with the long substrate to be plated for plating the mesh-like or lattice-like conductive layer being conveyed, even if it is an elastic body, scratches and scratches will occur. It is difficult to produce a stable plating film.
Japanese Patent Laid-Open No. 7-22473 JP 2004-263215 A JP 2004-18949 A JP 2004-18948 A JP 2006-307338 A JP 2006-144121 A JP 2005-248269 A

  The present invention has been made in view of such circumstances, and an energization processing apparatus and a film with a plating film that can stably supply power without causing scratches or scratches on the energized portion of the belt-shaped energized material. An object of the present invention is to provide a manufacturing apparatus.

  In order to solve the above-mentioned problem, the invention according to claim 1 is characterized in that a feed roll that feeds power in contact with a belt-like energized treatment material having a current-carrying portion formed on a support film, and the energized power from the feed roll. An energization processing apparatus including an energization treatment tank that energizes the energization part in an electrolyte solution on the downstream side in the conveyance direction of the processing material, wherein the power supply roll has a surface roughness Ry of 5 μm or more and less than 30 μm It is characterized by being made. Here, Ry is the surface roughness specified in JIS B 0601-1994.

  According to the first aspect of the present invention, power is supplied to the energization unit by the power supply roll that contacts the belt-shaped material to be energized and energized by the energization treatment tank disposed downstream of the power supply roll in the transport direction of the material to be energized. The part is energized in the electrolyte. Since the power supply roller is processed to have a surface roughness Ry of 5 μm or more and less than 30 μm, occurrence of slip with the current-carrying treatment material is suppressed when power is supplied in contact with the belt-like material to be treated. In addition, the occurrence of scratches and scratches in the energized portion is suppressed. In addition, since the surface of the power supply roller is not too rough, the surface of the power supply roller and the material to be energized can be brought into stable contact, and a substantially uniform power supply process can be performed. On the other hand, when the surface roughness Ry is smaller than 5 μm, the surface of the power supply roller is slippery, and the slip and scratches are likely to occur in the energized portion due to the slip. If the surface roughness Ry is 30 μm or more, the surface of the power supply roller is rough, so that the contact between the surface of the power supply roller and the material to be energized cannot be stabilized, and the current supply process becomes unstable.

  Invention of Claim 2 is an electricity supply processing apparatus provided with the power supply roll which contacts and supplies power to the strip | belt-shaped to-be-energized processing material in which the electricity supply part was formed on the support film, Comprising: The said power supply roll is surface roughness. Ry is processed to be 5 μm or more and less than 30 μm.

  According to invention of Claim 2, it supplies with electricity to an electricity supply part by the electric power supply roll which contacts a strip | belt-shaped to-be-energized material. Since the power supply roller is processed to have a surface roughness Ry of 5 μm or more and less than 30 μm, occurrence of slip with the current-carrying treatment material is suppressed when power is supplied in contact with the belt-like material to be treated. In addition, the occurrence of scratches and scratches in the energized portion is suppressed. In addition, since the surface of the power supply roller is not too rough, the surface of the power supply roller and the material to be energized can be stably contacted, and power can be stably supplied to the power supply unit. As a result, when the electrolytic plating tank or the electroreduction treatment tank is disposed downstream of the power supply roll in the conveyance direction of the material to be energized, the energization part can be uniformly processed in the electrolytic solution. On the other hand, when the surface roughness Ry is smaller than 5 μm, the surface of the power supply roller is slippery, and the slip and scratches are likely to occur in the energized portion due to the slip. Further, if the surface roughness Ry is 30 μm or more, the surface of the power supply roller is rough, so that the contact between the surface of the power supply roller and the material to be energized cannot be stabilized, and the amount of electricity supplied to the current-carrying part is increased. It becomes unstable and the processing in the energizing part becomes non-uniform.

  According to a third aspect of the present invention, in the energization processing apparatus according to the first or second aspect, the power supply roll has a surface subjected to electric discharge machining. According to the invention described in claim 3, since the surface of the power supply roller is subjected to electric discharge machining, it is difficult to generate sharp edge-shaped protrusions and corner edges of the uneven surface on the surface of the power supply roller. The surface roughness can be set. For this reason, generation | occurrence | production of the slip with the to-be-energized material by the surface of a feed roller being slippery is suppressed, and it is further suppressed that an abrasion and a scratch are generated in an electricity supply part. Further, since the power supply roller is not too rough, the surface of the power supply roller and the material to be energized can be brought into more stable contact.

  According to a fourth aspect of the present invention, in the energization processing apparatus according to any one of the first to third aspects, the conductive film in which the conductive material is formed on the support film. It is characterized by being. According to the invention of claim 4, since the material to be energized is a conductive film in which a conductive metal portion is formed on a support film, the occurrence of scratches and scratches on the conductive film is suppressed, and substantially A uniform energization process can be performed.

  According to a fifth aspect of the present invention, in the energization processing apparatus according to the fourth aspect, the energized processing material is exposed to a silver salt photosensitive film and developed to form a metallic silver portion. Yes. According to the invention described in claim 5, since the material to be energized is a silver salt photosensitive film exposed to light and developed to form a metallic silver part, the occurrence of scratches and scratches on the metallic silver part is suppressed. In addition, a substantially uniform energization process can be performed.

  According to a sixth aspect of the present invention, in the energization processing apparatus according to the first, third, fourth, or fifth aspect, the energization treatment forms a plating film from the electrolytic plating bath on the energization portion. Electrolytic plating to be performed, or electroreduction treatment to reduce oxide in the current-carrying portion. According to the invention described in claim 6, when the energization treatment is electrolytic plating in which a plating film is formed on the energization portion from the electroplating bath, generation of scratches and scratches on the energization portion is suppressed, An almost uniform and non-uniform plating film can be formed. In addition, when the energization process is an electroreduction process that reduces the oxide of the energization part, the occurrence of scratches or scratches on the energization part is suppressed, and an almost uniform and non-uniform electric reduction process is performed. Can do.

  According to a seventh aspect of the present invention, in the energization processing apparatus according to the first, third, fourth, fifth, or sixth aspect, the energization processing tank is disposed below the power supply roller. And an elastic roller that faces the power supply roller in the horizontal direction and presses the power supply portion against the power supply roller. According to the seventh aspect of the present invention, the energization treatment tank is disposed below the power supply roller, and the material to be energized is conveyed downward from the power supply roller and elastically opposed to the power supply roller in the horizontal direction. The energizing portion of the material to be energized is pressed against the power supply roller by the roller. Thus, the distance from the sandwiched portion between the power supply roller and the elastic roller to the liquid level of the electrolyte solution in the energization processing tank, that is, from the position where the material to be energized is peeled from the power supply roller to the liquid level of the electrolyte solution in the energization process tank It is possible to set a short distance. The high-electric-resistance energization part is difficult for current to flow, but it is possible to stabilize the subsequent process by shortening the distance from the position peeled off from the power supply roller to the electrolyte surface of the electrolysis treatment tank. .

  The invention according to an eighth aspect is characterized in that, in the energization processing apparatus according to the seventh aspect, the elastic roller and the power feeding roller are in contact with each other at 0.2 to 0.6 MPa. According to the invention described in claim 8, since the elastic roller and the power supply roller are in contact with each other at 0.2 to 0.6 MPa, the power supply portion of the material to be energized can be stably contacted by the power supply roller. . For this reason, a more uniform energization process can be performed.

  The manufacturing apparatus of the film with a plating film which concerns on invention of Claim 9 is provided with the electricity supply processing apparatus of any one of Claim 1 to Claim 8, It is characterized by the above-mentioned. According to the ninth aspect of the present invention, since the energization processing device according to any one of the first to seventh aspects is provided, scratches or scratches on the energized portion of the material to be energized occur. It is possible to form a substantially uniform and non-uniform plating film.

  As described above, according to the present invention, it is possible to suppress the occurrence of scratches and scratches on the energization portion of the long-band energized treatment material, and to perform a substantially uniform and stable energization process. . Therefore, when the plating film is formed on the energization portion of the strip-shaped material to be energized by the electrolytic plating bath, a substantially uniform and non-uniform plating film can be formed. Moreover, when reducing the oxide in the energized portion of the strip-shaped material to be energized, it is possible to perform a substantially uniform and non-uniform electrical reduction process.

  Embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is provided to the member which has the substantially same function throughout all the drawings, and the overlapping description may be abbreviate | omitted.

  FIG. 1 is a schematic configuration diagram showing a film-coated film manufacturing apparatus 10 on which an energization processing apparatus according to a first embodiment of the present invention is mounted. As shown in FIG. 1, the film-coated film manufacturing apparatus 10 includes an exposure device 12, a developing device 14, an electrolytic plating device 16, a post-processing device 17, and a winding device 19.

  First, the exposure apparatus 12 will be described. While the exposure apparatus 12 conveys a photosensitive web 18 made of a strip-like long wide film provided with a silver salt-containing layer as a material to be plated, a desired fine line pattern (for example, a pattern such as a lattice or a honeycomb) ) An apparatus for performing exposure. By this pattern exposure, a patterned fine-line metal silver portion is formed in the exposed portion of the silver salt-containing layer of the photosensitive web 18.

  The exposure device 12 is provided with a plurality of conveyance roller pairs 20 along the conveyance path of the photosensitive web 18, and these conveyance roller pairs 20 are constituted by drive rollers and nip rollers. The exposure apparatus 12 is provided with a supply unit 21 at the most upstream part in the transport direction. In the supply unit 21, a magazine 22 for storing a long and wide photosensitive web 18 wound in a roller shape is set. The photosensitive web 18 is provided with a drawing roller 22A for pulling out the photosensitive web 18 and transporting it toward the downstream side.

  An exposure unit 24 is provided on the downstream side in the conveyance direction of the photosensitive web 18 from the supply unit 21. The exposure unit 24 exposes the photosensitive web 18. The exposure unit 24 may be a continuous surface exposure unit using a photomask or a scanning exposure unit using a laser beam. This scanning exposure unit includes a monochromatic high light source such as a gas laser, a light emitting diode, a semiconductor laser, a semiconductor laser, or a second harmonic light source (SHG) that combines a solid state laser using a semiconductor laser and a nonlinear optical crystal. A scanning exposure method using density light can be preferably applied, and a scanning exposure method using a KrF excimer laser, ArF excimer laser, F2 laser, or the like can also be applied.

  The exposure apparatus 12 is not limited to the above-described configuration, and a normal exposure apparatus used for a silver salt photographic film, photographic paper, a printing plate making film, a photomask emulsion mask, or the like can be applied.

  Next, the developing device 14 will be described. The developing device 14 is a device that is arranged on the downstream side in the transport direction of the exposure device 12 and develops, fixes, and cleans the photosensitive web 18 that has been subjected to the desired fine line pattern exposure.

  The developing device 14 is provided with a developing tank 26, a bleach-fixing tank 28, and a water washing tank 30 in order from the upstream side in the transport direction. The water washing tank 30 includes a first water washing tank 30A, a second water washing tank 30B, It consists of the 3rd water washing tank 30C and the 4th water washing tank 30D. For example, a predetermined amount of developer 26L is stored in the developing tank 26, a predetermined amount of bleach-fixing liquid 28L is stored in the bleach-fixing tank 28, and a cleaning liquid 30L is stored in the first washing tank 30A to the fourth washing tank 30D. Is stored in a predetermined amount. The photosensitive web 18 is conveyed through the liquid in the processing tanks 26 to 30 by the rollers and guides in the processing tanks 26 to 30 so that the development, fixing, and cleaning processes are performed. In addition, on the most upstream side of the developing tank 26, a carry-in roller pair 32 including a driving roller 32A and a driven roller 32B is disposed. The carry-in roller pair 32 is a photosensitive web 18 carried out from the exposure device 12. Is guided into the developer 26L.

  Here, the development, fixing, and washing processes can be performed by ordinary development processing techniques used for silver salt photographic films, printing plate-making films, photomask emulsion masks, and the like. The developing solution 26L, the bleach-fixing solution 28L, and the cleaning solution 30L can be appropriately applied according to these. For example, the developer 26L is not particularly limited, but PQ developer, MQ developer, MAA developer, and the like can also be used. For example, CN-16, CR-56, CP45X, FD- manufactured by Fuji Film Co., Ltd. 3. Developer such as C-41, E-6, RA-4, D-19, D-72 manufactured by Papitor, KODAK, or a developer included in the kit, or lith development such as D-85 A liquid can be used. The fixing process is performed for the purpose of removing and stabilizing the silver salt in the unexposed part.

  In the developing device 14, the photosensitive web 18 that has passed through the liquid in each of the processing tanks 26 to 30 is discharged from the developing device 14 without being dried.

  Next, the electroplating apparatus 16 will be described. The electroplating apparatus 16 performs an electroplating process on the photosensitive web 18 that has been exposed and developed to form a fine-line-mesh metal silver portion (conductive metal portion), and conductive fine particles are applied to the metal silver portion. Is a device for forming a plating (conductive metal part). In the electroplating apparatus 16, a moisture removing device 40 </ b> A that removes moisture from the photosensitive web 18 after passing through the washing tank 30 is disposed on the upstream side in the conveyance direction of the photosensitive web 18. In the moisture removing device 40A, air knife devices 42 and 44 are arranged on both sides of the photosensitive web 18, and the air knife is blown from both sides of the photosensitive web 18 to remove moisture adhering to the photosensitive web 18.

  An energization processing device 48A is disposed downstream of the moisture removing device 40A in the conveying direction of the photosensitive web 18. The energization processing device 48A includes a cathode power supply roller 50A that supplies power while being in contact with the metallic silver portion of the photosensitive web 18, and a plating filled with the plating solution 61 on the downstream side in the transport direction of the photosensitive web 18 from the cathode power supply roller 50A. And a tank 60A.

  As shown in FIG. 2, the photosensitive web 18 that has passed through the moisture removing device 40 </ b> A is conveyed to the cathode power supply roller 50 </ b> A that contacts the metallic silver portion of the photosensitive web 18. An elastic roller 52A that presses the metallic silver portion of the photosensitive web 18 against the cathode power supply roller 50A is disposed substantially horizontally with respect to the cathode power supply roller 50A at a position facing the cathode power supply roller 50A across the photosensitive web 18. Has been. The elastic roller 52A includes a shaft 150 that is rotatably supported and an elastic body layer 152 on the surface. Urethane rubber or the like is used as the elastic body layer 152. At both ends of the shaft 150 constituting the elastic roller 52A, a pressing device 54 is disposed so as not to inhibit the rotation of the shaft 150. In the pressing device 54, a spring material 156 is provided inside the housing 154, and the spring material 156 presses the contact member 158 that contacts the shaft 150 toward the shaft 150. Further, an adjustment screw 160 provided in the housing 154 is in contact with the back surface side of the spring material 156. By adjusting the screwing position of the adjustment screw 160, the photosensitive web 18 is attached to the cathode power supply roller 50A. The pressing force to be pressed is adjusted.

A plating tank 60A filled with a plating solution 61 is disposed downstream of the cathode power supply roller 50A in the conveyance direction of the photosensitive web 18. A submerged roller 62A is provided in the plating solution 61 of the plating tank 60A, and the photosensitive web 18 is wound around the peripheral surface of the submerged roller 62A. A partition wall 63 extends from the upper end of the plating tank 60A between the cathode power supply roller 50A and the plating solution 61 in the plating tank 60A. In this step, the metallic silver portion of the photosensitive web 18 in contact with the cathode power supply roller 50A is conveyed by the submerged roller 62A in the plating solution 61 of the plating tank 60A. The case 64A in which copper balls are stacked and filled is used as the anode electrode, the cathode electrode is used as the cathode power supply roller 50A, power is supplied from the DC power supply 66, and a plating film (for example, a plating film made of copper) is formed on the metallic silver portion of the photosensitive web 18. Form. In this embodiment, the DC power supply 66 supplies power from the cathode power supply roller 50A to the case 64A that is an anode electrode, and a plating film is formed on the photosensitive web 18 so as to have a current density of 0.2 to 10 A / dm ^2. To do.

  The cathode power supply roller 50A is made of SUS316, SUS316J1, SUS317, or SUS317L, or has a surface coated with a copper material. Further, the surface of the cathode power supply roller 50A is subjected to electric discharge machining. The surface roughness Ry of the cathode power supply roller 50A is preferably 5 μm or more and less than 30 μm, more preferably 8 to 27 μm, still more preferably 10 to 20 μm. Further, the surface roughness Ra of the cathode power supply roller 50A is preferably 0.5 to 5 μm, and more preferably 1 to 2.5 μm. Here, Ry and Ra are surface roughness specified in JIS B 0601-1994. The surface roughness Ry and Ra were measured with Mitutoyo SJ-400.

  Here, electrical discharge machining means that electrical energy is applied via a machining fluid that insulates the metal that is the workpiece and the electrode that is the machining tool, and the surface layer of the workpiece is finely divided by the spark energy generated at that time. It is a processing method that removes it. There are two types of electrical discharge machining: die-sinking electrical discharge machining and wire-cut electrical discharge machining, which can be processed from precision machining to curved surface machining and sphere machining even with super hard and difficult-to-cut materials that cannot be cut by general machining. is there. In the die-sinking electric discharge machining, fine machining such as a 0.03 mm width slit or shape machining in an oblique direction is possible. Further, in wire cut electric discharge machining, it is possible to cut a foil of dozens of microns or torsion shape machining.

  As the electric discharge machine, for example, a large edging electric discharge machine such as a model EDNC207W, a model EDNC157W, a model EDNC156W, or a model M85K manufactured by Mitsubishi Electric, a model EDNC106W manufactured by Makino Mills, or a model EX30 manufactured by Mitsubishi Electric. , M65J or model M55J, etc. Medium-size sculpture EDM, Makino milling model EDGE2, Mitsubishi Electric model EA12V, Sodick model AQ35L, Mitsubishi Electric model M35J, or M25K Electric wire machine, large wire cutting machine such as Mitsubishi Electric model FA30V Z600, model FX30, or model DWC400HA, Mitsubishi Electric model FA20P, Makino milling machine model U53, Mitsubishi Electric model CX20, or model DWC110SA Medium sized Katto machine, Mitsubishi types FX10, Makino made of type V77GRAPHITE, or type V56GRAPHITE and small wire cutting machine, such as is available. When the cathode power supply roller 50A was roughened, it was processed to a desired surface roughness by adjusting the current and voltage of the electric discharge machine.

  The reproducibility of the machining accuracy of the surface roughness of the cathode power supply roller 50A by electric discharge machining is superior to the mechanical machining method disclosed in Japanese Patent Laid-Open No. 2006-307338 (Patent Document 5).

  When the surface state of the cathode power supply roller 50A was observed with a laser microscope model VK-9510 manufactured by Keyence Corporation, as shown in FIG. The corner edge of the uneven surface was not seen. For this reason, the rounding process shown in Japanese Patent Laid-Open No. 2006-307338 (Patent Document 5) is not necessary, and there is a concern that uneven plating due to fine metal powder or abrasive powder generated by the rounding process may occur. Disappears.

  Since the cathode power supply roller 50A is set to have a surface roughness Ry of 5 μm or more and less than 30 μm, when power is supplied while being in contact with the photosensitive web 18, the occurrence of slip with the photosensitive web 18 is suppressed, and the photosensitive web is suppressed. The occurrence of scratches or scratches on the metallic silver portion on the surface 18 is suppressed. In addition, the surface of the cathode power supply roller 50A and the photosensitive web 18 can be stably brought into contact with each other, and a substantially uniform plating film without uneven plating can be formed. On the other hand, when the surface roughness Ry is less than 5 μm, the surface of the cathode power supply roller 50A is slippery, and the metal silver portion on the surface of the photosensitive web 18 is easily scratched or scratched by the slip. Further, if the surface roughness Ry is 30 μm or more, the contact between the surface of the cathode power supply roller 50A and the photosensitive web 18 cannot be stabilized due to the unevenness of the surface of the cathode power supply roller 50A, and the current supply becomes unstable. Uneven plating is likely to occur.

  The elastic body layer 152 of the elastic roller 52A is made of conductive rubber having a hardness of 10 to 70 degrees and a thickness of about 5 mm. The hardness of the elastic layer 152 was measured with ASKER C type manufactured by Kobunshi Keiki Co., Ltd.

  The distance from the nip portion between the cathode power supply roller 50A and the elastic roller 52A to the surface of the plating solution 61 in the plating tank 60A, that is, the position where the photosensitive web 18 is peeled from the cathode power supply roller 50A, the plating solution 61 in the plating tank 60A. The distance from the liquid surface is preferably set as short as possible. The metallic silver portion of the photosensitive web 18 is thin and does not flow easily, but the plating treatment is performed by shortening the distance from the position peeled from the cathode power supply roller 50A to the surface of the plating solution 61 in the plating tank 60A. It can be more stabilized. Further, in order to increase the contact area between the cathode power supply roller 50A and the photosensitive web 18 and to facilitate the flow of current, a tension roll may be provided immediately before the cathode power supply roller 50A.

  Further, by adjusting the screwing position of the adjustment screw 160 attached to the back surface of the spring material 156 of the elastic roller 52A, the pressure for pressing the photosensitive web 18 against the cathode power supply roller 50A can be set to a predetermined value. it can. The pressure at the nip portion between the cathode power supply roller 50A and the elastic roller 52A is preferably 0.2 to 0.6 MPa, and more preferably 0.3 to 0.5 MPa. This pressure was measured using a Fuji Prescale (manufactured by FUJIFILM Corporation) for two-sheet type ultra-low pressure. This Fuji Prescale is composed of two types of film. One film is coated with a color former (microcapsule) on the support, and the other film is coated with a developer. The microcapsules in the layer are broken by the pressure at the nip, and the color former in the layer is adsorbed by the developer and develops a red color by a chemical reaction.

  By pressing the elastic roller 52A toward the cathode power supply roller 50A, the photosensitive web 18 and the cathode power supply roller 50A can be brought into substantially uniform contact. When the pressure at the nip portion between the cathode power supply roller 50A and the elastic roller 52A is smaller than 0.2 MPa, it is difficult to make the photosensitive web 18 and the cathode power supply roller 50A contact each other almost uniformly. On the other hand, when the pressure at the nip portion is larger than 0.6 MPa, the conveyance resistance of the photosensitive web 18 between the cathode power supply roller 50A and the elastic roller 52A increases, and it becomes difficult to stably convey the photosensitive web 18. .

  In addition, when using the silicone rubber roller used in Japanese Patent Application Laid-Open No. 2006-307338 (Patent Document 5), the generation of wrinkles from the nip surface was large, and although not described, the hardness of the rubber was large. In addition, it is presumed that the surface of the power supply roller easily slips.

  Here, as the electroplating treatment, for example, an electroplating technique used in a printed wiring board can be applied, and the electroplating is preferably electrolytic copper plating. In the present embodiment, an electrolytic copper plating solution is applied as the plating solution 61. Examples of the electrolytic copper plating bath include a copper sulfate bath, a copper pyrophosphate bath, and a copper borofluoride bath. Chemical species contained in the electrolytic copper plating solution include copper sulfate and copper chloride, sulfuric acid to improve the stability and conductivity of the plating solution, and to increase the uniform electrodeposition, acceleration of dissolution of the anode and auxiliary effect of additives Examples of additives for improving chlorine and bath stabilization and plating denseness include polyethylene oxide and bipyridine.

  As shown in FIG. 1, a circulation pipe 67 is connected to the lower part of the plating tank 60 </ b> A, and a pump 68, a filter 69, and a plurality of on-off valves 65 are disposed on the circulation pipe 67. The plating solution 61 in the plating tank 60A is supplied to the circulation pipe 67 by the pump 68, and the foreign matter in the plating solution 61 is removed by passing through the filter 69, and returned to the plating tank 60A.

  As shown in FIG. 1, a support roller 58 for guiding the photosensitive web 18 is disposed downstream of the plating tank 60A in the conveying direction of the photosensitive web 18, and further, the downstream of the conveying direction is filled with the cleaning liquid 71. A cleaning tank 70A is provided. The photosensitive web 18 that has passed through the plating tank 60A is transported to the cleaning tank 70A after the plating solution is drained by a liquid squeezing roller, blade, air knife, or the like. A submerged roller 72A is disposed in the cleaning tank 70A, and the photosensitive web 18 is wound around the submerged roller 72A.

  In the cleaning tank 70A, a plurality of long pipes 86 facing the front and back of the photosensitive web 18 on the upstream side and the downstream side in the transport direction of the photosensitive web 18 wound around the submerged roller 72A, 87 is arranged substantially parallel to the width direction. A plurality of nozzles (not shown) are formed on the long pipes 86 and 87 at positions facing the photosensitive web 18, and a cleaning solution is ejected to the front and back of the photosensitive web 18. An outflow pipe 88 for flowing the cleaning liquid 71 is connected to the bottom of the cleaning tank 70 </ b> A, and the outflow pipe 88 is branched into two supply pipes 90. The two supply pipes 90 are branched and connected to long pipes 86 and 87 facing the front and back of the photosensitive web 18. The outflow pipe 88 is provided with a circulation pump 92, and the supply pipe 90 is provided with an open / close valve 94. When the circulation pump 92 is driven, the cleaning liquid 71 in the cleaning tank 70 </ b> A is introduced into the supply pipe 90 through the outflow pipe 88 and supplied to the plurality of long pipes 86 and 87. The cleaning liquid is ejected from the plurality of long pipes 86 and 87 to the front and back of the photosensitive web 18.

  In this example, pure water is used as the cleaning liquid 71, but the present invention is not limited to this, and other liquids can be used as long as the liquid can clean the photosensitive web 18.

  A pair of liquid squeezing rollers that are pressed against the front and back of the photosensitive web 18 at a position where the photosensitive web 18 is unloaded from the surface of the cleaning liquid 71 in the cleaning tank 70A downstream of the cleaning tank 70A in the conveying direction of the photosensitive web 18. 202. In addition, a pair of liquid squeezing rollers 230 that are pressed against the front and back of the photosensitive web 18 are provided in the air downstream of the liquid squeezing roller 202 in the conveying direction of the photosensitive web 18. The liquid squeezing roller 202 is driven and rotated while the photosensitive web 18 is sandwiched, so that the cleaning liquid adhering to the photosensitive web 18 is drained. Further, the liquid squeezing roller 230 is driven to rotate as the photosensitive web 18 moves, so that the cleaning liquid adhering to the photosensitive web 18 is further drained.

  On the downstream side of the photosensitive web 18 in the conveyance direction of the photosensitive web 18 with respect to the liquid squeezing roller 230, a hot air drying device 240A for spraying dry hot air to the front and back of the photosensitive web 18 to dry the photosensitive web 18 is provided. In the hot air drying device 240A, three conveyance guide rollers 246 for guiding the photosensitive web 18 are arranged in a staggered manner in a box-shaped hood 242. The photosensitive web 18 is disposed on the three conveyance guide rollers 246. It is wrapped around. On the upstream side and the downstream side in the transport direction of the three transport guide rollers 246, hot air ejectors 248 and 250 for ejecting dry warm air are disposed at positions facing the front and back of the photosensitive web 18. In the hood 242 of the warm air drying device 240A, the warm air ejector 248 and the warm air ejector 250 blow dry hot air on the front and back of the photosensitive web 18, so that the photosensitive web 18 is sufficiently dried.

  Although not shown in FIG. 1, the electroplating apparatus 16 includes a plurality of units including a cathode power supply roller 50A, an energization processing apparatus 48A including a plating tank 60A, a cleaning tank 70A, and a hot air drying apparatus 240A. In addition, by repeating the above-described process a plurality of times, copper plating having a predetermined thickness is formed on the photosensitive web 18.

  Further, in order to blacken the copper plating surface of the photosensitive web 18, electrolytic nickel plating is performed. That is, on the downstream side in the conveyance direction of the photosensitive web 18, a cathode power supply roller 50B for performing nickel plating, an energization processing device 48B provided with a plating tank 60B, a cleaning tank 70B, and a hot air drying device 240A were provided. A plurality of units are arranged, and the same process as described above is repeated a plurality of times, whereby nickel plating having a predetermined thickness is formed on the photosensitive web 18.

  Next, as shown in FIG. 1, the photosensitive web 18 that has been plated is subjected to a washing unit 114 containing a cleaning solution 115 (water) for removing the plating solution and a plating film through a roller 125 that can detect the film tension. After passing through the rust prevention treatment part 116 containing the rust prevention treatment liquid 117 to be protected, it is conveyed to the water washing part 118 containing the cleaning liquid 119 (water) for removing the excessive rust prevention treatment liquid. Further, the plated photosensitive web 18 passes through a drying process section 120 having a drying furnace for removing moisture, passes through a speed adjusting section 121, passes through a balance roller section 122, and is adjusted in tension, and then passed through an accumulator 123. Let it be a roller-shaped film 124A. In this way, plating is formed on the fine-line metal silver portion of the photosensitive web 18. By such a process, a film with a plating film can be obtained.

  The substantial film transport tension is preferably 5 N / m or more and 200 N / m or less. When the tension was actually less than 5 N / m, the film began to meander and the control of the conveyance path was not successful. On the other hand, when it exceeds 200 N / m, the plated film metal on which the film is formed has internal distortion, which causes problems such as curling of the product.

  Note that a plurality of sets of plating tanks of the electrolytic plating apparatus 16 may be added in accordance with a desired plating film thickness (thickness of the conductive metal portion). A desired plating film thickness (thickness of the conductive metal portion) can be easily obtained according to this number.

  Here, the surface roughness of the cathode power supply roller 50A provided in the electrolytic plating apparatus 16 will be described. Table 1 shows the evaluation results for the scratches, plating unevenness, and scratches (peeling) of the photosensitive web 18 when the surface roughness Ra and Ry of the cathode power supply roller 50A are changed.

  As shown in Table 1, as Examples 1 to 5, four types of cathode power supply rollers 50A whose surface roughness Ra and Ry were changed by electric discharge machining and cathode power supply rollers buffed without using electric discharge machining were prepared, Each was evaluated for scratches, uneven plating, and scratches (peeling) of the photosensitive web 18.

  Table 1 shows an actual measurement recording chart of the surface of the cathode power supply roller 50A of Examples 1 to 4. This actual measurement recording chart is obtained by measuring the surface state of the cathode power supply roller 50A using an SJ-400 measuring apparatus manufactured by Mitutoyo Corporation.

  FIG. 4 shows a photograph of the surface state of the cathode power supply roller 50A when the surface roughness Ry of Examples 1 to 4 is set.

  In Table 1, scratches, plating unevenness, and scratches (peeling) of the photosensitive web 18 are visually observed, and scratches, plating unevenness, scratches (peeling), or a comprehensive evaluation thereof is very good. In some cases, it was evaluated as ◯, when scratches, uneven plating, and scratches (peeling) were observed, and when the scratches, plating unevenness, and scratches (peeled) were often observed, ×.

  As shown in Table 1, the cathode power supply roller 50A of Example 2 had extremely good scratches, uneven plating, and scratches (peeling), and the overall evaluation was the best. In the cathode power supply roller 50A of Example 1, scratches, plating unevenness, and scratching (peeling) were all good, and the overall evaluation was good. Further, in the cathode power supply roller 50A of Example 3, although scratching (peeling) was observed, both scratches and plating unevenness were almost good, and the overall evaluation was also good. In contrast, the cathode power supply roller 50A of Example 4 had good scratches, but uneven plating and scratches (peeling) were observed, and the overall evaluation was not good. On the other hand, the buffed cathode power supply roller showed scratches, uneven plating, and scratches (peeling), and the overall evaluation was not good.

  From the results in Table 1, it can be seen that the surface roughness Ry of the cathode power supply roller 50A is preferably 5 μm or more and less than 30 μm.

  Next, the photosensitive web 18 will be described. The photosensitive web 18 as a material to be plated is, for example, a long and wide flexible base material made of a photosensitive material in which a silver salt-containing layer containing a silver salt (for example, silver halide) is provided on a light-transmitting support. . Further, a protective layer may be provided on the silver salt-containing layer, and this protective layer means a layer made of a binder such as gelatin or a high molecular polymer, and exhibits an effect of preventing scratches and improving mechanical properties. In order to do so, it is formed on the silver salt-containing layer. It is preferable that the thickness of a protective layer is 0.02-20 micrometers, More preferably, it is 0.1-10 micrometers, More preferably, it is 0.3-3 micrometers.

  The composition of these silver salt-containing layers and protective layers includes silver halide emulsion layers (silver salt-containing layers) and protective layers applied to silver salt photographic films, photographic paper, printing plate-making films, emulsion masks for photomasks, etc. Layers can be applied as appropriate.

  In particular, as the photosensitive web 18 (photosensitive material), a silver salt photographic film (silver salt photosensitive material) is preferable, and a black and white silver salt photographic film (black and white silver salt photosensitive material) is the best. The silver salt applied to the silver salt-containing layer is most preferably silver halide.

  On the other hand, as the light-transmitting support, a single-layer plastic film or a multilayer film in which two or more layers are combined can be applied. Examples of the raw material for the plastic film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA; polyvinyl chloride, polyvinylidene chloride, and the like. In addition, use polyetheretherketone (PEEK), polysulfone (PSF), polyethersulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetylcellulose (TAC), etc. Can do.

  Among these, from the viewpoint of transparency, heat resistance, ease of handling, and cost, the plastic film as the support is a polyethylene terephthalate film or cellulose triacetate film that is usually applied to silver salt photographic films (silver salt photosensitive materials). In addition, a polyimide film is preferable. Particularly preferred is a polyethylene terephthalate film.

  Moreover, since the electromagnetic shielding material for displays requires transparency, it is desirable that the support has high transparency. In this case, the total visible light transmittance of the light transmissive support is preferably 70 to 100%, more preferably 85 to 100%, and particularly preferably 90 to 100%.

  For example, the width of the photosensitive web 18 is preferably 50 cm or more, and the thickness is preferably 50 to 200 μm.

  Further, after exposure / development, the photosensitive web 18 is formed with a metallic silver portion in the exposed portion. The mass of the metallic silver contained in the metallic silver portion is the silver contained in the exposed portion before the exposure. It is preferable that it is a content rate of 50 mass% or more with respect to the mass of 80 mass% or more. If the mass of silver contained in the exposed portion is 50% by mass or more with respect to the mass of silver contained in the exposed portion before exposure, it is preferable because high electroconductivity can be obtained in subsequent electrolytic plating treatment.

  In order to impart conductivity to the metal silver portion formed by the exposure and development processing, the above-described electrolytic plating apparatus 16 performs an electroplating process for supporting the conductive metal particles on the metal silver portion. That is, in the apparatus 10 for producing a film with a plating film, a photosensitive web 18 provided with a silver salt-containing layer is used as a material to be plated, and the silver salt-containing layer is exposed and developed to obtain a desired portion to be plated. A fine-line metallic silver part is formed. Since this fine line-shaped metallic silver part is formed by exposing and developing the silver salt-containing layer, it becomes a fine line-shaped metallic silver part patterned with very fine fine lines. When such a photosensitive web 18 is subjected to an electrolytic plating process, conductive particles are supported on the fine-line metallic silver portion, which becomes a plating layer. For this reason, the electromagnetic wave shielding material obtained has a fine line-shaped metal part patterned with very fine fine lines and a large area light transmission part.

  Next, an apparatus for producing a film with a plating film on which an energization processing apparatus according to a second embodiment of the present invention is mounted will be described. In addition, the same code | symbol is attached | subjected to the member same as 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 5, the apparatus for producing a film with a plating film includes an energization processing apparatus 300 and an electroless plating apparatus 316 after the exposure apparatus 12 and the development apparatus 14 (see FIG. 1). Further, an electrolytic plating apparatus may be provided after the energization processing apparatus 300 and the electroless plating apparatus 316 to perform the electrolytic plating process.

  The energization processing apparatus 300 is activated by applying an energization process to the photosensitive web 18 that has been exposed and developed to form a thin metal silver portion, and reducing the metal silver portion. . Specifically, the energization processing apparatus 300 includes a cathode power supply roller 302 that supplies power while being in contact with the metal silver portion of the photosensitive web 18, and an electrolyte solution 305 that is downstream of the cathode power supply roller 302 in the transport direction of the photosensitive web 18. And an energization processing tank 304 filled with An elastic roller 52 that presses the metallic silver portion of the photosensitive web 18 against the cathode power supply roller 302 is disposed substantially horizontally with respect to the cathode power supply roller 302 at a position facing the cathode power supply roller 302 with the photosensitive web 18 interposed therebetween. Has been.

As the electrolytic solution 305, an electrolytic solution containing no plating substance is used. The phrase “not containing a plating substance” means a liquid that does not substantially cause a plating reaction, and preferably 10 mg / dm ^{2 of} a substance that deposits on the electrode from the electrolytic solution when a current of 1 A / dm ² is applied for 60 seconds. Or less, more preferably 1 mg / dm ² or less.

  Electrolytes that are preferably contained in the electrolytic solution 305 are alkali metal salts, quaternary alkyl ammonium salts, perchlorates, borates, and the like, preferably sodium sulfate, ammonium sulfate, boric acid, sodium perchlorate, para Such as sodium toluenesulfonate.

  The solvent may be either an aqueous or non-aqueous organic solvent, but water is the best. Among the non-aqueous organic solvents, dimethylformamide, N-methylformamide, N-methylacetamide, N-methylpyrrolidone, acetonitrile, propionitrile, benzonitrile, acetone, methyl ethyl ketone, methyl isobutyl ketone, acetylacetone, and tetrahydrofuran are preferable.

  The cathode power supply roller 302 is made of SUS316, SUS316J1, SUS317, or SUS317L, or has a surface coated with a copper material. Further, the surface of the cathode power supply roller 302 is subjected to electric discharge machining. The surface roughness Ry of the cathode power feeding roller 302 is preferably 5 μm or more and less than 30 μm, and more preferably less than 10 to 25 μm. Further, the surface roughness Ra is preferably 0.5 to 5 μm, and more preferably 1 to 2.5 μm.

In the energization processing apparatus 300, the metallic silver portion of the photosensitive web 18 brought into contact with the cathode power supply roller 302 is conveyed by the submerged roller 62 in the electrolytic solution 305 of the energization processing tank 304. An anode electrode 306 is disposed in the electrolytic solution 305 in the energization treatment tank 304, and power is supplied from a DC power supply 308 using the cathode electrode as the cathode power supply roller 302. Thereby, an energization process for reducing the metallic silver portion of the photosensitive web 18 is performed. That is, by this energization treatment, the oxide formed on the metallic silver portion of the photosensitive web 18 is removed (for example, Ag ₂ S and Ag ₂ O are reduced to Ag), and the metallic silver portion is activated. By this energization treatment, the plating rate in the electroless plating in the subsequent process can be promoted.

  In such energization treatment, if the energization time for activation is too short, electroless activity cannot be obtained, and if it is too long, the electrolysis activity is lost and deactivated. Therefore, the energization time is preferably 0.1 seconds to 360 seconds, 0.5 The second to 120 seconds are more preferable, and the most preferable is 1 second to 60 seconds.

  The plating apparatus 316 is an apparatus that performs plating on the photosensitive web 18 on which a fine-line metal silver portion is formed, and carries conductive fine particles on the metal silver portion to form plating (conductive metal portion). . Specifically, the plating apparatus 316 includes a plating bath 334 filled with a plating solution 335, and a plurality of (two in this embodiment) support rollers 336 arranged in the plating bath 334, and the plating bath 334 is a device of a system that horizontally conveys the photosensitive web 18. The plating apparatus 316 is provided with a plurality of transport support rollers 338 and 340 that support and transport the photosensitive web 18 before and after entering the plating bath 334.

  Here, as the plating treatment, a known electroless plating technique can be applied. For example, an electroless plating technique used in a printed wiring board can be applied, and the electroless plating is an electroless copper plating. It is preferable that Specifically, it is preferable to apply an electroless copper plating solution as the plating solution 335. Chemical species contained in the electroless copper plating solution include copper sulfate and copper chloride, formalin and glyoxylic acid as the reducing agent, EDTA, TIPA and triethanolamine as the copper ligand, and other bath stabilization and plating films Examples of additives for improving the smoothness of polyethylene include polyethylene glycol, yellow blood salt, bipyridine, and thiourea compounds. Moreover, various additives, such as ligands, such as EDTA, can also be used for a plating solution from a viewpoint of improving the stability of a plating solution.

  Below the photosensitive web 18 that is horizontally conveyed between the support rollers 336 and 336 in the plating bath 334, a plurality of fine bubble gas-liquid mixed fluids are ejected to the photosensitive web 18 along the conveyance path of the photosensitive web 18. An ejection member 342 is provided. The fine bubble gas-liquid mixed fluid (plating solution containing fine bubbles) is a mixed fluid of the plating solution 335 and air, and the gas-liquid mixture supply device 344 for supplying the fine bubble gas-liquid mixed fluid to the ejection member 342. Is arranged.

  The gas-liquid mixture supply device 344 includes a pipe 348 that connects the bottom of the supply unit 346 partitioned by the plating bath 334 and the partition plate 334A and the plurality of ejection members 342. The pipe 348 includes a circulation pump 350 and a filter 352. Is arranged. The gas-liquid mixture supply device 344 includes a bubble separation tank 354 at the top of the plating bath 334 and pipes 356 and 357 that connect the bottom of the plating bath 334 to the supply unit 346 via the bubble separation tank 354. ing. The pipe 356 is provided with a circulation pump 358 and a gas-liquid mixer 360.

  As shown in FIG. 6, the gas-liquid mixer 360 (venturi tube) includes a venturi nozzle 366 disposed in the flow tube 362, and an air supply tube 368 connected downstream of the venturi nozzle 366 disposed portion. Further, a plurality of nail-like protrusions 370 are disposed on the downstream side. The air supply pipe 368 is provided with a valve 372.

  In the gas-liquid mixer 360, the plating solution 335 that has flowed into the flow pipe 362 passes through the venturi nozzle 366 to increase the flow velocity, and the liquid pressure in the flow pipe 362 changes before and after that, that is, before passing through the venturi nozzle 366. The pressure in the flow pipe 362 after passing further decreases. Since the pressure in the flow pipe 362 after passing through the venturi nozzle 366 decreases, the air is sucked into the plating solution 335 just by opening the air supply pipe 368 by the valve 372, and air (air) is mixed with the plating solution. When the gas-liquid mixed fluid passes through the flow pipe 362 provided with the nail-like projections 370, it becomes a fine bubble gas-liquid mixed fluid.

  Here, the mixing ratio (air: plating solution) of air (air) and plating solution 335 in the fine bubble gas-liquid mixed fluid is preferably 1: 0.2 to 1: 2, more preferably 1: 0.5. ~ 1: 1.5.

  Then, as shown in FIG. 5, the fine bubble gas-liquid mixed fluid that has passed through the gas-liquid mixer 360 is supplied to the bubble separation tank 354 through the pipe 356. The pipe 356 is connected to the bottom of the bubble separation tank 354, and a dam plate 354A is disposed in the bubble separation tank 354 at a position where it does not come out of the liquid level. A pipe 357 connected to the bottom of the bubble separation tank 354 with the dam plate 354A interposed therebetween is inserted into the supply unit 346 from above. By supplying the fine bubble gas-liquid mixed fluid through the pipe 356 to the bubble separation tank 354 from the bottom, the bubbles contained in the fine bubble gas-liquid mixed fluid rise to the liquid surface. As a result, bubbles are separated from the fine bubble gas-liquid mixed fluid, and the fine bubble gas-liquid mixed fluid from which the bubbles are separated passes through the dam plate 354A and passes through the pipe 357 connected to the bottom of the bubble separation tank 354. 346.

  The fine bubble gas-liquid mixed fluid supplied to the supply unit 346 passes through the filter 352 through the pipe 348 connected to the bottom of the supply unit 346 and is supplied to the plurality of ejection members 342. Then, the fine bubble gas-liquid mixed fluid is ejected from the plurality of ejection members 342 to the photosensitive web 18. When the photosensitive web 18 is conveyed through the plating solution 335 in the plating bath 334, the metal silver portion of the photosensitive web 18 is subjected to plating. Further, by ejecting the fine bubble mixed liquid, the plating solution 335 in the plating bath 334 is agitated and mixed, and the liquid can be made uniform.

  The electroless plating time is preferably 15 seconds to 10 minutes, more preferably 30 seconds to 8 minutes, and even more preferably 1 to 7 minutes. If it is longer than 10 minutes, the transparency of the light-transmitting part is markedly deteriorated, which is considered to be caused by the alteration of the gelatin film by being immersed in a high alkali bath for a long time. On the other hand, if it is shorter than 30 seconds, severe thickness unevenness occurs. The plating temperature is preferably 10 to 40 ° C, more preferably 15 to 40 ° C, and still more preferably 18 to 35 ° C.

  The photosensitive web 18 that has been subjected to the plating treatment is subjected to removal of the plating solution 335 adhering after bathing in the plating solution 335 by an air knife (not shown), and is carried into a cleaning tank (not shown) and subjected to rust prevention after washing. It is dried and wound up. In this way, an electromagnetic wave shielding material can be obtained. The plating rate can be performed under moderate conditions, and high-speed plating of 5 μm / hr or more is also possible.

  In this way, plating (conductive metal portion) is formed on the fine-line metal silver portion of the photosensitive web 18. Here, it is preferable that a conductive metal part contains 50 mass% or more of silver with respect to the total mass of the metal contained in a conductive metal part, and it is further more preferable to contain 60 mass% or more. When silver is contained in an amount of 50% by mass or more, the time required for physical development and / or plating treatment can be shortened, the productivity can be improved, and the cost can be reduced. Furthermore, when copper and palladium are used as the conductive metal particles forming the conductive metal part, the total mass of silver, copper and palladium is 80% by mass or more based on the total mass of the metal contained in the conductive metal part. It is preferable that it is 90 mass% or more.

  In the apparatus for manufacturing a light-transmitting electromagnetic wave shielding material according to the present embodiment described above, a light-transmitting photosensitive web 18 provided with a silver halide-containing layer is used as a material to be plated, and the silver halide-containing layer is exposed. Development is performed to form a desired fine wire mesh-shaped metallic silver portion as a portion to be plated. Since this fine-line mesh-shaped metallic silver part is formed by exposing and developing the silver halide-containing layer, it becomes a fine-line-shaped metallic silver part patterned with very fine fine lines. When such a light-transmitting photosensitive web 18 is plated, conductive particles are supported on the fine-line mesh-shaped metallic silver portion, which becomes the conductive metallic portion. For this reason, the electromagnetic wave shielding material obtained has a fine line-shaped metal part patterned with very fine fine lines and a large area light transmission part.

  In addition, although this embodiment demonstrated the apparatus and manufacturing method which manufacture a light-transmitting electromagnetic wave shielding material, it is not restricted to this, For example, it has a fine line pattern which consists of fine electroconductive metal parts, such as other industrial goods The present invention can also be applied as a manufacturing apparatus and a manufacturing method of a light transmissive conductive material.

It is a schematic block diagram which shows the manufacturing apparatus of the film with a plating film provided with the electricity supply processing apparatus in 1st Embodiment of this invention. It is a schematic block diagram which shows the electricity supply processing apparatus used with the manufacturing apparatus shown in FIG. It is the photograph which observed the surface state of the cathode electric power feeding roller used for an electricity processing apparatus with the laser microscope. It is a photograph which shows the surface state of the cathode electric power feeding roller in Examples 1-4. It is a schematic block diagram which shows the manufacturing apparatus of the film with a plating film provided with the electricity supply processing apparatus in 2nd Embodiment of this invention. It is a fragmentary sectional view which shows the gas-liquid mixer used with the manufacturing apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Film-coated film production equipment 16 Electrolytic plating equipment 18 Photosensitive web (band-shaped energized material)
48A Energizing device 50A Cathode feed roller (feed roller)
50B Cathode feed roller (feed roller)
52A Elastic roller 60A Plating tank (energization tank)
60B plating tank (energization treatment tank)
61 Plating solution 300 Energizing device 302 Cathode feeding roller (feeding roller)
304 Energizing treatment tank 305 Electrolytic solution 316 Plating apparatus 334A Plating solution 334 Plating bath

Claims (9)

A power supply roll that contacts and supplies power to a belt-shaped current-carrying material having a current-carrying part formed on a support film; An energization processing apparatus comprising: an energization processing tank for processing;
The energization processing apparatus, wherein the power supply roll is processed to have a surface roughness Ry of 5 μm or more and less than 30 μm. An energization processing apparatus comprising a power supply roll that contacts and supplies power to a belt-shaped energized processing material having an energization portion formed on a support film,
The energization processing apparatus, wherein the power supply roll is processed to have a surface roughness Ry of 5 μm or more and less than 30 μm.   The energization processing apparatus according to claim 1, wherein the power supply roll has a surface subjected to electric discharge machining.   The energization processing apparatus according to any one of claims 1 to 3, wherein the material to be energized is a conductive film in which a conductive metal portion is formed on a support film.   The energization processing apparatus according to claim 4, wherein the energization processing material is a silver salt photosensitive film exposed to light and developed to form a metallic silver portion.   The said energization process is the electroplating which forms a plating film in the said electricity supply part from an electroplating bath, or the electrical reduction process which reduces the oxide of the said electricity supply part, Claim 3, The claim | item 3 characterized by the above-mentioned. Claim | item 4 or the electricity supply processing apparatus of Claim 5. The energization processing tank is disposed below the power supply roller,
An elastic roller that faces the power supply roller in a horizontal direction and presses the current-carrying portion against the power supply roller is provided. The claim 1, claim 3, claim 4, claim 5, or claim 6 The energization processing apparatus described in 1.   The energization processing apparatus according to claim 7, wherein the elastic roller and the power supply roller are in contact with each other at 0.2 to 0.6 MPa.   An apparatus for producing a film with a plating film, comprising the energization processing apparatus according to any one of claims 1 to 8.