JP2009256757A - Film support device and apparatus for forming film with plated coating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film support device which can decrease a stain on a film even though a transportation speed of the film is increased, and to provide an apparatus for forming a film provided with a plated coating. <P>SOLUTION: The support device 200A is installed between a plating tank 60A and a cleaning tank 70A, and is used for transporting a photoreceptor web 18 in the air. The support device 200A includes conductive surface support rollers 202 and 204 which come in contact with the conductive surface 18A of the photoreceptor web 18, and a back side support roller 206 which is provided between the rollers 202 and 204 and comes in contact with the back side 18B of the photoreceptor web 18. Washing devices 210, 212 and 214 are arranged at the conductive surface support rollers 202 and 204 and the back side support roller 206 respectively. The washing devices have washing liquid receiving tanks 218, 220 and 222 in which the lower part of the conductive surface support rollers 202 and 204 and the back side support roller 206 are immersed in washing liquids 217, and an overflow weir 226, 228 and 230 which keep the surfaces of the washing liquids 217 constant. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  INDUSTRIAL APPLICABILITY The present invention is used in a production apparatus for a film with a plating film that forms a plating film on a film conductive surface while conveying a strip-like long film, and supports a film that is conveyed in the air to the next process through a plating bath. The present invention relates to a film support device and an apparatus for producing a film with a plating film provided with the film support device.

  Conventionally, when continuous plating is performed on a strip-like long film, the film is stretched around a plurality of rollers, and the film is conveyed in a certain direction by rotation of the rollers and passed through a plating bath. Thus, when conveying a film with a some roller, there exists a problem that the deposit and stain | pollution | contamination of a plating solution component adhere to a roller in the downstream of a plating bath.

In order to clean the rollers, the following Patent Document 1 discloses a configuration in which a cleaning device is provided on two rollers in contact with the conductive surface of the film. In this configuration, the two rollers can be cleaned by the cleaning device, so that contamination of the rollers can be reduced.
JP 2007-270322 A

  In recent years, when continuously plating a film, it has become necessary to increase the film conveyance speed in order to improve productivity. However, in the aspect described in Patent Document 1, when the conveyance speed is increased, the contamination of the film is deteriorated and it is difficult to increase the productivity.

  When the present inventors diligently investigated about this reason, the following factors are known. That is, the conventional dirt is fixed to the conductive surface of the film, and the two rollers in contact with the conductive surface may be cleaned with the cleaning device described in Patent Document 1, and when the conveyance speed is increased, I thought it would be possible to increase the washing amount of the two rollers. However, the stain on the film increased even when the amount of washing was increased. As a result of intensive studies, the increase in film contamination when the conveyance speed is increased is due to an increase in the amount of plating solution taken out from the plating bath in which the film is conveyed, thereby increasing the contamination of the liquid in the downstream liquid tank. It has been found that this is the main cause.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a film supporting apparatus and a film-coated film manufacturing apparatus that can reduce film contamination even when the film transport speed is increased. It is to be.

  In order to solve the above-mentioned problem, the invention according to claim 1 is disposed downstream of an electrolytic plating bath in which a conductive surface of a film is brought into contact with a cathode power supply roller and a plating film is formed on the conductive surface. A film supporting device for supporting the film conveyed in the air, wherein the conductive film is disposed between at least two film conductive surface supporting members that are in contact with the conductive surface of the film and the conductive surface supporting member. It has at least 1 film back surface support member which contacts the back surface of the said film on the opposite side to a surface, and the washing | cleaning means which each wash | cleans the said film electroconductive surface support member and the said film back surface support member, It is characterized by the above-mentioned.

  According to the first aspect of the present invention, at least two film conductive surface support members are in contact with the conductive surface of the film on the downstream side of the electrolytic plating bath, and at least one film is interposed between the film conductive surface support members. The back surface support member is in contact with the back surface of the film on the side opposite to the conductive surface, and the film is conveyed in the air to the next step while being supported by the film conductive surface support member and the film back surface support member. The film conductive surface support member that contacts the conductive surface of the film and the film back surface support member that contacts the back surface of the film are cleaned by the cleaning means. Thereby, it is reduced that the plating solution adhering not only to the conductive surface of the film but also to the back surface of the film is brought into the next process. Therefore, it is reduced that the plating solution reacts with the next step or a solution on the downstream side thereof (for example, a rust preventive agent) to increase the contamination component. For this reason, even if the conveyance speed of a film is raised, the stain | pollution | contamination of a film can be reduced.

  According to a second aspect of the present invention, in the film support device of the first aspect, each of the film conductive surface support member and the film back surface support member is constituted by a roller, and the cleaning means is filled with a cleaning liquid. And a cleaning liquid receiving tank in which the lower part of the roller is immersed in the cleaning liquid, and a cleaning liquid supply / discharge means for supplying new cleaning liquid to the cleaning liquid receiving tank and discharging the cleaning liquid in the cleaning liquid receiving tank; It is characterized by having.

  According to the second aspect of the present invention, the film conductive surface support member and the film back surface support member are each composed of a roller, and the lower part of the roller is immersed in the cleaning liquid filled in the cleaning liquid receiving tank. A new cleaning liquid is supplied to the cleaning liquid receiving tank by the cleaning liquid supply / discharge means, and the cleaning liquid in the cleaning liquid receiving tank is discharged. Thereby, with the rotation of the roller, the lower part of the roller is cleaned with the cleaning liquid, and the peripheral surface of the roller is kept clean. For this reason, it is further reduced that the plating solution adhering not only to the conductive surface of the film but also to the back surface of the film is brought into the next process.

  An apparatus for producing a film with a plating film according to a third aspect of the invention includes an electrolytic plating bath in which a conductive surface of the film is brought into contact with a cathode feeding roller to form a plating film on the conductive surface, and a downstream of the electrolytic plating bath. And a film support device according to claim 1, which is disposed on the side.

  According to the invention described in claim 3, the film support device according to claim 1 or 2 is provided on the downstream side of the electroplating bath, and the film support device according to claim 1 or 2 is provided to carry the film to the next process in the air. The member and the film back support member are cleaned by the cleaning means. Thereby, it is reduced that the plating solution adhering not only to the conductive surface of the film but also to the back surface of the film is brought into the next process. For this reason, it is reduced that the plating solution reacts with the next step or a downstream solution (for example, a rust preventive agent) to increase the amount of dirt components, and even if the film conveyance speed is increased, the film dirt is removed. Can be reduced.

  Invention of Claim 4 is a manufacturing apparatus of the film with a plating film of Claim 3, It is provided in the downstream of the said film support apparatus, The washing tank which wash | cleans the said film is provided, The said film is the said film The plating metal concentration of the liquid in the cleaning tank is adjusted to 50 ppm or less by being supported by the support device and being conveyed in the air.

  According to invention of Claim 4, the washing tank which wash | cleans a film is provided in the downstream of the film support apparatus, and a film is supported in a film support apparatus, and is carried in the air, In a washing tank The plating metal concentration of the solution is adjusted to 50 ppm or less (more preferably 50 ppm or less). Thereby, it is further reduced that the plating solution reacts with the liquid (for example, a rust preventive agent) on the downstream side of the cleaning tank and the contamination component increases. Therefore, even if the film conveyance speed is increased, the contamination of the film can be reduced.

  According to a fifth aspect of the present invention, in the apparatus for producing a film with a plating film according to the third or fourth aspect, the wetted surface is configured to supply power by bringing the conductive surface of the film into contact with the cathode power supply roller in a wet state. It has a power supply means.

  According to the fifth aspect of the present invention, the wet power feeding means causes the conductive surface of the film and the cathode power supply roller to be in contact with each other in a wet state, so that the thin wire forming the conductive surface of the film is sparked by discharge. It is suppressed. For this reason, generation | occurrence | production of the disconnection of a thin wire, etc. can be suppressed.

  A sixth aspect of the present invention is the apparatus for manufacturing a film with a plating film according to the fifth aspect, wherein the wet power feeding means is provided upstream of a contact portion between the conductive surface of the film and the cathode power feeding roller. The wet feeding power supply liquid is filled, and a part of the cathode feeding roller has a wet feeding power receiving tank dipped in the wet feeding power solution.

  According to the sixth aspect of the present invention, the wet power feeding liquid in which a part of the cathode power feeding roller is filled in the wet power feeding liquid receiving tank is upstream of the contact portion between the conductive surface of the film and the cathode power feeding roller. It is immersed, and the wetting power supply liquid adheres to the peripheral surface of the cathode power supply roller. As the cathode power supply roller rotates, the peripheral surface of the cathode power supply roller to which the wet power supply liquid adheres comes into contact with the conductive surface of the film, and power is supplied while the conductive surface of the film and the cathode power supply roller are wet. Therefore, the conductive surface of the film and the cathode power supply roller are brought into contact with each other with a simple configuration in which a wet receiving liquid receiving tank is provided upstream of the contact portion between the conductive surface of the film and the cathode power supply roller. Power can be supplied.

  A seventh aspect of the present invention is the apparatus for producing a film with a plating film according to the fourth aspect, further comprising a liquid draining roller for draining the film while pressing the film on the downstream side of the cleaning tank, The material of the roller is any one of polyolefin and polyurethane.

According to the seventh aspect of the present invention, the liquid draining roller for draining liquid while pressing the film is provided on the downstream side of the cleaning tank, and the liquid adhering to the film is drained by the liquid draining roller. At that time, since the material of the liquid draining roller is one of polyolefin and polyurethane, it is more effectively reduced that the plating solution is brought into the process downstream of the cleaning tank. For this reason, it is more effectively reduced that the plating solution reacts with the solution on the downstream side of the cleaning tank to increase the contamination component, and the contamination of the film can be reduced even if the conveyance speed of the film is increased. .
This material has good water absorption, moderate hardness and chemical resistance, and these physical properties are considered to have an effect of reducing dirt.
In addition, the aspect of the present invention can be particularly effective in roll conveyance. This is because, in sheet conveyance, liquid is largely brought in due to the influence of the front end and the rear end, and the effect of the aspect of the present invention is hardly exhibited.

  Since this invention was comprised as mentioned above, it can suppress that the plating solution adhering to the electroconductive surface and back surface of a film is brought into the next process and its downstream process, and a plating solution is the next process or its downstream process. It can reduce that the component of a dirt increases reacting with a liquid. Therefore, even if the film conveyance speed is increased, the contamination of the film can be reduced.

  Embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is provided to the member which has the substantially same function throughout all the drawings, and the overlapping description may be abbreviate | omitted.

FIG. 1: is a schematic block diagram which shows the manufacturing apparatus 10 of the film with a plating film by which the support apparatus 200A as a film support apparatus which concerns on one Embodiment of this invention was mounted.
As shown in FIG. 1, the film-coated film manufacturing apparatus 10 includes an exposure apparatus 12, a developing apparatus 14, an electrolytic plating apparatus 16 including a support apparatus 200 </ b> A, a post-processing apparatus 17, and a winding apparatus 19. Yes.

  First, the exposure apparatus 12 will be described. While exposing the photosensitive web 18 made of a strip-like long film provided with a silver salt-containing layer (preferably, a silver halide emulsion layer) as a material to be plated, the exposure apparatus 12 performs a desired fine line pattern (for example, , A pattern such as a lattice shape or a honeycomb shape). By this pattern exposure, a fine line pattern is formed on the exposed portion of the silver salt-containing layer of the photosensitive web 18.

The exposure device 12 is provided with a plurality of conveyance roller pairs 20 along the conveyance path of the photosensitive web 18, and these conveyance roller pairs 20 are constituted by drive rollers and nip rollers.
The exposure apparatus 12 is provided with a supply unit 21 at the most upstream part in the transport direction. The supply unit 21 is set with a magazine 22 for storing a long photosensitive web 18 wound in a roller shape. The photosensitive web 18 is provided with a drawing roller 22A for pulling out the photosensitive web 18 and transporting it toward the downstream side.

  An exposure unit 24 is provided on the downstream side in the conveyance direction of the photosensitive web 18 from the supply unit 21. The exposure unit 24 exposes the photosensitive web 18. The exposure unit 24 may be a continuous surface exposure unit using a photomask or a scanning exposure unit using a laser beam. The exposure apparatus 12 may be a normal exposure apparatus used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like.

  Next, the developing device 14 will be described. The developing device 14 is a device that is arranged on the downstream side in the transport direction of the exposure device 12 and develops, fixes, and cleans the photosensitive web 18 that has been subjected to the desired fine line pattern exposure.

  The developing device 14 is provided with a developing tank 26, a bleach-fixing tank 28, and a water washing tank 30 in order from the upstream side in the transport direction. The water washing tank 30 includes a first water washing tank 30A, a second water washing tank 30B, It consists of the 3rd water washing tank 30C and the 4th water washing tank 30D. For example, a predetermined amount of developer 26L is stored in the developing tank 26, a predetermined amount of bleach-fixing liquid 28L is stored in the bleach-fixing tank 28, and a cleaning liquid 30L is stored in the first washing tank 30A to the fourth washing tank 30D. Is stored in a predetermined amount. The photosensitive web 18 is conveyed through the liquid in the processing tanks 26 to 30 by the rollers and guides in the processing tanks 26 to 30 so that the development, fixing, and cleaning processes are performed. In addition, on the most upstream side of the developing tank 26, a carry-in roller pair 32 including a driving roller 32A and a driven roller 32B is disposed. The carry-in roller pair 32 is a photosensitive web 18 carried out from the exposure device 12. Is guided into the developer 26L.

Here, the development, fixing, and washing processes can be performed by ordinary development processing techniques used for silver salt photographic films, printing plate-making films, photomask emulsion masks, and the like. The developing solution 26L, the bleach-fixing solution 28L, and the cleaning solution 30L can be appropriately applied according to these. The fixing process is performed for the purpose of removing and stabilizing the silver salt in the unexposed part.
In the developing device 14, the photosensitive web 18 that has passed through the liquid in each of the processing tanks 26 to 30 is discharged from the developing device 14 without being dried.

  Next, the electroplating apparatus 16 will be described. The electroplating apparatus 16 performs an electroplating process on the photosensitive web 18 (film) that has been exposed and developed to form a thin metal silver portion, and forms a conductive metal layer on the metal silver portion. It is an apparatus for forming plating (conductive metal part). That is, the surface of the photosensitive web 18 where the metallic silver portion is formed is the conductive surface 18A, and the opposite side of the surface of the photosensitive web 18 where the metallic silver portion is formed is the back surface 18B (see FIG. 2).

  In the electroplating apparatus 16, a moisture removing device 40 </ b> A that removes moisture from the photosensitive web 18 after passing through the washing tank 30 is disposed on the upstream side in the conveyance direction of the photosensitive web 18. In the moisture removing device 40A, air knife devices 42 and 44 are arranged on both sides of the photosensitive web 18, and the air knife is blown from both sides of the photosensitive web 18 to remove moisture adhering to the photosensitive web 18.

  As shown in FIGS. 1 and 2, the photosensitive web 18 that has passed through the moisture removing device 40 </ b> A is guided by the guide roller 46 and the guide roller 48, while contacting the conductive surface 18 </ b> A (metal silver portion) of the photosensitive web 18. It is conveyed to the cathode power supply roller 50A that supplies power. An elastic roller 52A that presses and contacts the conductive surface 18A of the photosensitive web 18 against the cathode power supply roller 50A is disposed at a position facing the cathode power supply roller 50A across the photosensitive web 18. The elastic roller 52A is provided with an elastic layer made of rubber or the like on the outer peripheral surface of a core metal supported rotatably, and the support member 53 that supports both ends of the elastic roller 52A is pressed by a pressing means (not shown). Thus, the elastic roller 52A is pressed against the cathode power supply roller 50A. By pressing the elastic roller 52A, the photosensitive web 18 and the cathode power supply roller 50A can be brought into close contact with each other.

  Further, the conductive surface 18A of the photosensitive web 18 and the cathode power supply roller 50A are brought into contact with the contact portion between the cathode power supply roller 50A and the photosensitive web 18 on the upstream side in the rotation direction of the cathode power supply roller 50A. 150A is provided. The wet power feeding device 150A will be described in detail later. Wetting power supply liquid is supplied to the peripheral surface of the cathode power supply roller 50A by the wet power supply device 150A, and the cathode power supply roller 50A to which the wet power supply liquid is attached contacts the conductive surface 18A of the photosensitive web 18 by rotation of the cathode power supply roller 50A. To do. As a result, the conductive surface 18A of the photosensitive web 18 and the cathode power supply roller 50A come into contact with each other in a wet state to supply power.

  A plating tank 60A filled with a plating solution 61 is disposed on the downstream side in the transport direction of the photosensitive web 18 from the cathode power supply roller 50A. A submerged roller 62A is provided in the plating solution 61 of the plating tank 60A, and the photosensitive web 18 is wound around the peripheral surface of the submerged roller 62A. In this step, the conductive surface 18A of the photosensitive web 18 in contact with the cathode power supply roller 50A is conveyed by the submerged roller 62A in the plating solution 61 of the plating tank 60A. A case 64A in which copper balls are stacked and filled is used as an anode electrode, and the cathode electrode is used as a cathode power supply roller 50A, and power is supplied from a DC power source (rectifier) 66A to form a layered plating film on the photosensitive web 18. In the present embodiment, the DC power supply 66A supplies power from the cathode power supply roller 50A to the case 64A, which is an anode electrode, and forms a plating film on the photosensitive web 18.

  Here, as the electroplating treatment, for example, an electroplating technique used in a printed wiring board can be applied, and the electroplating is preferably electrolytic copper plating. In the present embodiment, an electrolytic copper plating bath solution is applied as the plating solution 61. Examples of the electrolytic copper plating bath include a copper sulfate bath, a copper pyrophosphate bath, and a copper borofluoride bath. Chemical species contained in the electrolytic copper plating solution include copper sulfate and copper chloride, sulfuric acid to improve the stability and conductivity of the plating solution, and to increase the uniform electrodeposition, acceleration of dissolution of the anode and auxiliary effect of additives Examples of additives for improving chlorine and bath stabilization and plating denseness include polyethylene oxide and bipyridine.

  A circulation pipe (not shown) is connected to the lower part of the plating tank 60A, and the plating solution 61 in the plating tank 60A is supplied to the circulation pipe and passes through a filter (not shown). The foreign matter is removed and returned to the plating tank 60A.

  As shown in FIG. 4, the wet feeding device 150A was filled with the wet feeding liquid 151 on the upstream side in the rotation direction of the cathode feeding roller 50A with respect to the contact portion between the cathode feeding roller 50A and the photosensitive web 18. A wet power feeding liquid receiving tank 152 is provided. The cathode power supply roller 50 </ b> A is disposed so that a part of the peripheral surface is immersed in the wet power supply liquid 151 in the wet power supply liquid receiving tank 152.

  As shown in FIG. 5, the shaft portion 162 of the cathode power feeding roller 50 </ b> A is supported by a frame 164 disposed at both ends via a bearing, and is used to convey the photosensitive web 18 at a contact portion with the photosensitive web 18. It can be rotated by following. A supply pipe 154 is connected to one end in the longitudinal direction of the wet feeding liquid receiving tank 152, and the wet feeding liquid 151 is supplied by a pump 156. An overflow weir 158 that defines the liquid surface of the wet power feeding liquid 151 is provided on the other end side in the longitudinal direction of the wet power feeding liquid receiving tank 152. A discharge pipe 160 is connected to the bottom of the wet power feeding liquid receiving tank 152 outside the overflow weir 158 (the other end in the longitudinal direction). Thus, the wet power feeding liquid 151 is filled at the height of the overflow weir 158, and the wet power feeding liquid 151 overflowed from the upper end of the overflow weir 158 is discharged from the discharge pipe 160. Examples of the wet power feeding solution 151 include Au plating, Ag plating, Cu plating, Ni plating, Fe—Ni plating, Ni—Co plating, Ni—Zn plating, Ni—Cr plating, and Cu—Ni—Cr plating. Etc. can be used. Preferably, it is good to use for the liquid of Cu plating, Ni plating, and Ni-Zn plating.

  In such a wet power supply apparatus 150A, the wet power supply liquid 151 of the wet power supply liquid receiving tank 152 is supplied to the peripheral surface of the cathode power supply roller 50A, and the wet power supply liquid 151 is attached by the rotation of the cathode power supply roller 50A. The cathode power supply roller 50 </ b> A contacts the conductive surface 18 </ b> A of the photosensitive web 18. As a result, the conductive surface 18A of the photosensitive web 18 and the cathode power supply roller 50A come into contact with each other in a wet state to supply power. By such power supply, the fine wire forming the conductive surface 18A of the photosensitive web 18 is suppressed from being sparked by the discharge, and the occurrence of disconnection of the fine wire is suppressed.

  As shown in FIGS. 1 and 2, a cleaning tank 70A filled with the cleaning liquid 71 is disposed downstream of the plating tank 60A in the transport direction of the photosensitive web 18. Above the adjacent portion between the plating tank 60A and the cleaning tank 70A, a support device 200A for supporting the photosensitive web 18 so as to be conveyed in the air is disposed.

  The support device 200A includes two conductive surface support rollers 202 and 204 as film conductive surface support members that are in contact with the conductive surface 18A of the photosensitive web 18 on the upstream side and the downstream side in the conveyance direction of the photosensitive web 18, and two And a back surface support roller 206 as a film back surface support member that contacts the back surface 18B of the photosensitive web 18 between the conductive surface support rollers 202 and 204. The conductive surface support roller 202, the back surface support roller 206, and the conductive surface support roller 204 are arranged in a staggered pattern as viewed from the direction orthogonal to the conveyance direction of the photosensitive web 18 shown in FIG. The conductive surface support roller 202, the back surface support roller 206, and the conductive surface support roller 204 are contacted in this order from the upstream side. That is, the conductive surface 18A of the photosensitive web 18 is wound around the conductive surface support roller 202, the back surface 18B of the photosensitive web 18 is wound around the back surface support roller 206 on the downstream side, and the conductive surface of the photosensitive web 18 on the downstream side. 18A is wound around the conductive surface support roller 204. The conductive surface support roller 202, the back surface support roller 206, and the conductive surface support roller 204 are driven to rotate as the photosensitive web 18 moves.

  Further, a submerged roller 72A is provided in the cleaning tank 70A, and the back surface 18B of the photosensitive web 18 is wound thereon. As a result, the photosensitive web 18 passes through the plating solution 61 of the plating tank 60A, and is then conveyed in the air by the conductive surface support roller 202, the back surface support roller 206, and the conductive surface support roller 204 of the support device 200A. It is transferred into the cleaning liquid 71 of 70A. In the present embodiment, pure water is used as the cleaning liquid 71.

  As shown in FIG. 3, the support device 200 </ b> A serves as cleaning devices 210 and 212 as cleaning units for cleaning the conductive surface support roller 202 and the conductive surface support roller 204, and a cleaning unit for cleaning the back surface support roller 206, respectively. And a cleaning device 214. The cleaning devices 210 and 212 are configured substantially symmetrically on the upstream side and the downstream side of the photosensitive web 18.

  In the cleaning device 210, a bowl-shaped cleaning liquid receiving tank 218 filled with the cleaning liquid 217 is disposed below the conductive surface support roller 202, and the lower part of the conductive surface support roller 202 is immersed in the cleaning liquid 217. Yes. Similarly, the cleaning device 212 is provided with a bowl-shaped cleaning liquid receiving tank 220 filled with the cleaning liquid 217 below the conductive surface support roller 204, and the lower part of the conductive surface support roller 204 is disposed in the cleaning liquid 217. Soaked. The cleaning device 214 is provided with a bowl-shaped cleaning liquid receiving tank 222 filled with the cleaning liquid 217 below the back surface support roller 206, and the lower part of the back surface support roller 206 is immersed in the cleaning liquid 217. Yes. These cleaning liquid receiving tanks 218, 220, and 222 are disposed along the longitudinal direction of the conductive surface support rollers 202 and 204 and the back surface support roller 206, and are long enough to accommodate the entire length of the conductive surface support rollers 202 and 204 and the back surface support roller 206. Is formed.

Supply pipes 224 for supplying the cleaning liquid 217 are connected to the cleaning liquid receiving tanks 218, 220, and 222, respectively. The supply pipe 224 is branched into three pipes from one pipe 225 connected to the cleaning tank 70A, and the cleaning liquid 71 in the cleaning tank 70A is pumped up by the pump 236 as shown in FIG. Are supplied to the cleaning liquid receiving tanks 218, 220, and 222.
In this embodiment, the cleaning liquid 71 in the cleaning tank 70A is pumped up, but a configuration in which the dedicated cleaning liquid 217 is supplied to the cleaning liquid receiving tanks 218, 220, and 222 may be used. For example, pure water can be used as the dedicated cleaning liquid 217.

  An overflow weir 226 that defines the liquid level of the cleaning liquid 217 is provided on the side of the cleaning liquid receiving tank 218. The overflow weir 226 is configured to overflow the cleaning liquid 217 in the cleaning liquid receiving tank 218 to keep the amount of the cleaning liquid 217 constant. Similarly, overflow weirs 228 and 230 that define the liquid level of the cleaning liquid 217 are also provided on the sides of the cleaning liquid receiving tanks 220 and 222, respectively. The overflow weirs 228 and 230 overflow the cleaning liquid 217 in the cleaning liquid receiving tanks 220 and 222 to keep the amount of the cleaning liquid 217 constant. The conductive surface support rollers 202 and 204 and the back surface support roller 206 are set so that approximately 1/2 to 1/10 of the diameter is immersed in the cleaning liquid 217.

  A discharge pipe 232 through which the overflowed cleaning liquid 217 flows is provided outside the overflow weirs 226, 228, and 230 of the cleaning liquid receiving tanks 218, 220, and 222, and the discharge pipe 232 is connected to a single pipe 233. . As a result, the cleaning liquid 217 overflowed from the upper ends of the overflow weirs 226, 228, 230 is discharged through the discharge pipe 232 and the pipe 233. In addition, although illustration is abbreviate | omitted, you may provide the flexible blade which contact | abuts to the surrounding surface of the electroconductive surface support rollers 202 and 204 and the back surface support roller 206 along a longitudinal direction, respectively. As a result, dirt and adhering matter adhering to the peripheral surfaces of the conductive surface support rollers 202 and 204 and the back surface support roller 206 can be scraped off.

  A pair of liquid draining rollers 240 (squeeze rollers) that are in pressure contact with the front and back of the photosensitive web 18 are disposed on the upstream side of the cleaning tank 70 </ b> A on the downstream side (unloading position) of the photosensitive web 18. The liquid draining roller 240 is driven to rotate as the photosensitive web 18 moves. The liquid draining roller 240 is formed of either polyolefin or polyurethane. The cleaning liquid 71 adhering to the photosensitive web 18 is configured to be drained by the liquid draining roller 240. The photosensitive web 18 that has passed through the cleaning tank 70A is guided and conveyed by the submerged roller 72A and the support roller 80 disposed above.

  Although not shown in FIG. 1, the electrolytic plating apparatus 16 includes a unit including a cathode power supply roller 50A and a wet power supply apparatus 150A, a plating tank 60A, a support apparatus 200A, a cleaning tank 70A, and a liquid draining roller 240. Are arranged (9 units in the present embodiment), and a copper plating having a predetermined thickness is formed on the conductive surface 18A of the photosensitive web 18 by repeating the above-described steps a plurality of times.

  Further, on the downstream side of the photosensitive web 18 in the transport direction, a unit including a cathode power supply roller 50B and a wet power supply device 150B for performing nickel plating, a plating tank 60B, a cleaning tank 70B, and a liquid draining roller 240 is provided. A plurality of (9 units in this embodiment) are arranged, and the same process as described above is repeated a plurality of times, whereby nickel plating having a predetermined thickness is formed on the conductive surface 18A of the photosensitive web 18.

  Next, as shown in FIG. 1, the photosensitive web 18 that has been plated is subjected to a washing unit 114 containing a cleaning solution 115 (water) for removing the plating solution through a roller 125 capable of detecting film tension, a plating film. After passing through a rust preventive treatment part 116 containing a rust preventive treatment liquid 117 for protecting the liquid, it is conveyed to a water wash part 118 containing a cleaning liquid 119 (water) for removing excess rust preventive treatment liquid. Further, the plated photosensitive web 18 passes through a drying process section 120 having a drying furnace for removing moisture, passes through a speed adjusting section 121, passes through a balance roller section 122, and is adjusted in tension, and then passed through an accumulator 123. The roll film 124A is used. In this way, plating (conductive metal portion) is formed on the fine-line metal silver portion of the photosensitive web 18. By such a process, a film with a plating film can be obtained.

  The substantial film transport tension is preferably 5 N / m or more and 200 N / m or less. When the tension was actually less than 5 N / m, the film began to meander and the control of the conveyance path was not successful. On the other hand, when it exceeds 200 N / m, the plated film metal on which the film is formed has internal distortion, which causes problems such as curling of the product.

  Note that a plurality of sets of plating tanks of the electrolytic plating apparatus 16 may be added in accordance with a desired plating film thickness (thickness of the conductive metal portion). A desired plating film thickness (thickness of the conductive metal portion) can be easily obtained according to this number.

  In the support device 200A as described above, the photosensitive web 18 is conveyed in the air to the cleaning tank 70A in a state where the photosensitive surface support roller 202, the back surface support roller 206, and the conductive surface support roller 204 are supported in this order on the downstream side of the plating tank 60A. Is done. The lower portions of the conductive surface support rollers 202 and 204 and the back surface support roller 206 are immersed in the cleaning liquid 217 in the cleaning liquid receiving tanks 218, 220, and 222, respectively, and the conductive surface support rollers 202 and 204 and the back surface support roller 206 are rotated. Accordingly, the cleaning liquid 217 is cleaned, and the peripheral surfaces of the conductive surface support rollers 202 and 204 and the back surface support roller 206 are kept clean. This reduces the plating solution 61 adhering not only to the conductive surface 18A of the photosensitive web 18 but also to the back surface 18B of the photosensitive web 18 from being brought into the cleaning bath 70A and the downstream process. For this reason, it can reduce that the component of a dirt reacts with the washing | cleaning tank 70A and the liquid of the process of the downstream is increased. Such an action is the same on the downstream side of the plating tank 60B. For example, in nickel plating, it is possible to reduce an increase in the amount of contamination due to nickel reacting with the downstream rust inhibitor. Therefore, even if the conveyance speed of the photosensitive web 18 is increased, the contamination of the photosensitive web 18 can be reduced.

  In the cleaning devices 210, 212, and 214, the cleaning liquid 217 contacts only the lower portions of the conductive surface support rollers 202 and 204 and the back surface support roller 206. Dirt such as an attached plating solution can be efficiently and reliably cleaned with a small amount of the cleaning solution 217.

  In addition, the photosensitive web 18 is supported by the supporting devices 200A and 200B on the downstream side of the plating tanks 60A and 60B, and is conveyed in the air, and is introduced into the cleaning tanks 70A and 70B, whereby the cleaning liquid 71 in the cleaning tanks 70A and 70B. The plating metal concentration can be adjusted to 50 ppm or less. By reducing the plating metal concentration to 50 ppm or less, the plating solution 61 can be prevented from reacting with the liquid (for example, a rust preventive agent) on the downstream side of the cleaning tanks 70A and 70B to increase the contamination component. Can do.

  Furthermore, in the electroplating apparatus 16, the wet power feeding devices 150A and 150B are used to supply power by bringing the conductive surface 18A of the photosensitive web 18 into contact with the cathode power supply rollers 50A and 50B in a wet state. It is possible to prevent the thin wire forming the spark from being discharged. For this reason, it is possible to suppress the occurrence of disconnection of fine wires forming the conductive surface 18A of the photosensitive web 18.

  Further, a pair of liquid draining rollers 240 are disposed at the carry-out position of the photosensitive web 18 in the cleaning tanks 70A and 70B, and the liquid draining roller 240 is driven to rotate as the photosensitive web 18 is conveyed. When the photosensitive web 18 is sandwiched and conveyed by the liquid squeezing roller 240, the cleaning liquid 71 adhering to the photosensitive web 18 is drained. Since the liquid draining roller 240 is one of polyolefin and polyurethane, the liquid draining of the photosensitive web 18 becomes more reliable. Thereby, it is further reduced that the plating solution 61 is brought into a process downstream of the cleaning tanks 70A and 70B. For this reason, it can be further reduced that the plating solution 61 reacts with the solution on the downstream side of the cleaning tank 70A and the contamination component increases.

In addition, although the liquid cutting roller 240 of the said embodiment performs liquid draining of the photosensitive web 18 immersed in the cleaning liquid of cleaning tank 70A, 70B, it is not limited to this, It was immersed in another cleaning tank. The present invention can also be applied when the photosensitive web 18 is drained. Further, the present invention is not limited to the cleaning tank, and can be applied as long as the liquid is drained.
In the above embodiment, one back surface support roller 206 is provided between the two conductive surface support rollers 202 and 204, but the number of the conductive surface support roller and the back surface support roller is not limited to this. Three or more conductive surface support rollers or two or more back surface support rollers may be provided.
In addition, the cleaning apparatus may use other cleaning means such as a method of spraying a cleaning liquid as long as the conductive surface support roller and the back surface support roller can be cleaned. In addition, the conductive surface support roller and the back surface support roller are not limited to rollers, but may be support members having other shapes as long as they can be cleaned by a cleaning unit.

Next, the photosensitive web 18 will be described. The photosensitive web 18 as a material to be plated is, for example, a long flexible substrate made of a photosensitive material in which a silver salt-containing layer containing a silver salt (for example, silver halide) is provided on a light-transmitting support. Further, a protective layer may be provided on the silver salt-containing layer, and this protective layer means a layer made of a binder such as gelatin or a high molecular polymer, and exhibits an effect of preventing scratches and improving mechanical properties. In order to do so, it is formed on the silver salt-containing layer. The thickness of the protective layer is preferably 0.02 to 20 μm.
The composition of these silver salt-containing layers and protective layers includes silver halide emulsion layers (silver salt-containing layers) and protective layers applied to silver salt photographic films, photographic paper, printing plate-making films, emulsion masks for photomasks, etc. Layers can be applied as appropriate.
In particular, as the photosensitive web 18 (photosensitive material), a silver salt photographic film (silver salt photosensitive material) is preferable, and a black and white silver salt photographic film (black and white silver salt photosensitive material) is the best. The silver salt applied to the silver salt-containing layer is most preferably silver halide.

  On the other hand, as the light-transmitting support, a single-layer plastic film or a multilayer film in which two or more layers are combined can be applied. Examples of the raw material for the plastic film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA; polyvinyl chloride, polyvinylidene chloride, and the like. In addition, use polyetheretherketone (PEEK), polysulfone (PSF), polyethersulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetylcellulose (TAC), etc. Can do.

Moreover, since the electromagnetic shielding material for displays requires transparency, it is desirable that the support has high transparency. In this case, the total visible light transmittance of the light transmissive support is preferably 70 to 100%.
The width of the photosensitive web 18 is, for example, 20 cm or more, and the thickness is preferably 50 to 200 μm.

  Further, after exposure / development, the photosensitive web 18 is formed with a metallic silver portion in the exposed portion. The mass of the metallic silver contained in the metallic silver portion is the silver contained in the exposed portion before the exposure. It is preferable that it is a content rate of 50 mass% or more with respect to the mass of 80 mass% or more. If the mass of silver contained in the exposed portion is 50% by mass or more with respect to the mass of silver contained in the exposed portion before exposure, it is preferable because high electroconductivity can be obtained in subsequent electrolytic plating treatment.

  In order to impart conductivity to the metallic silver portion formed by the exposure and development processing, an electrolytic plating treatment is performed by the above-described electrolytic plating apparatus 16 to form a conductive metallic portion on the metallic silver portion. That is, in the apparatus 10 for producing a film with a plating film, a photosensitive web 18 provided with a silver salt-containing layer is used as a material to be plated, and the silver salt-containing layer is exposed and developed to obtain a desired portion to be plated. A fine-line metallic silver part is formed. Since this fine line-shaped metallic silver part is formed by exposing and developing the silver salt-containing layer, it becomes a fine line-shaped metallic silver part patterned with very fine fine lines. When such a photosensitive web 18 is subjected to an electrolytic plating process, a conductive metal portion is formed on the fine-line metal silver portion. For this reason, the electromagnetic wave shielding material obtained has a fine line-shaped metal part patterned with very fine fine lines and a large area light transmission part.

  In addition, although the film support apparatus of the said embodiment is applied to the manufacturing apparatus of the film with a plating film which electroplats the metal silver part on a film, it is not limited to this. For example, it can also be applied to performing normal electroplating or electroless plating on a film, or to draining and drying a printed wiring board.

  The present invention will be described more specifically with reference to the following examples. In addition, the material, usage-amount, ratio, processing content, processing procedure, etc. which are shown in the following Examples can be changed suitably unless it deviates from the meaning of this invention. Therefore, the scope of the present invention should not be construed as being limited by the specific examples shown below.

[Example 1]
(Preparation of silver halide photosensitive material)
The silver halide light-sensitive material was prepared by preparing the sample described in Example 1 of JP-A-2006-352073 and coating it on a support made of polyethylene terephthalate (PET).
A PET support having a thickness of 90 μm and a width of 75 cm was used. Coating was performed for 10,000 m with a width of 70 cm on a PET support having a width of 75 cm, and both ends were cut off by 5 cm so as to leave a central portion of the coating, and a roll-shaped silver halide photosensitive material was obtained.

(exposure)
In the exposure of the silver halide photosensitive material, exposure heads using DMD (digital mirror device) described in the invention of JP-A-2004-1244 are arranged so as to have a width of 65 cm, and a laser is formed on the photosensitive layer of the photosensitive material The exposure head and exposure stage are curved so that light is imaged, and the photosensitive material feed mechanism and take-up mechanism are attached. The exposure was performed with a continuous exposure apparatus provided with a bend having a buffer action so as not to affect the speed. The wavelength of exposure was 400 nm, the beam shape was approximately 12 μm, and the output of the laser light source was 100 μJ.
The exposure pattern was such that a grid-like pattern with a line width of 8 μm was at an angle of 45 degrees, and the pitch was continuous with a width of 65 cm and a length of 500 m at intervals of 300 μm.

(Development treatment) ・ Developer 1L formulation (same composition for replenisher)
Hydroquinone 22 g
Sodium sulfite 25 g
Potassium carbonate 33 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 4 g
Polyethylene glycol 4000 1 g
Potassium hydroxide 4 g
Sodium erythorbate 3 g
Diethylene glycol 5 g
Adjust to pH 10.2.

・ 1L fixer formulation (same composition for replenisher)
Ammonium thiosulfate solution (75%) 300 ml
Ammonium sulfite monohydrate 25 g
1,3-diaminopropane tetraacetic acid 8 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjust to pH 6.2

The silver halide photosensitive material that has been exposed using the above processing agent is processed using an automatic processor FG-710PTS manufactured by Fuji Film Co., Ltd. as development conditions at development at 32 ° C. for 27 seconds, fixing at 30 ° C. for 27 seconds, and first washing ( Ion-exchanged water (0.75 L / min) was treated at 30 ° C. for 13 seconds, and the second water wash (running water 10 L / min) at 25 ° C. for 13 seconds.
As running processing conditions, the running processing was performed for 3 days at a photosensitive material processing amount of 1300 m ² / day, a developer replenishment amount of 500 ml / m ² , and a fixing solution replenishment amount of 640 ml / m ² .

(Plating treatment)
An electrolytic plating apparatus provided with a total of 18 plating tanks having the same functional tank configuration as the plating tank 60A shown in FIG. 2 for the film (photosensitive web 18) on which the silver mesh pattern is formed by the above processing. Used for electrolytic plating. In that case, the current value of each tank was adjusted as shown in Table 1, and the electrolytic plating process film sample of sample numbers 101-108 was created. The electrolytic plating apparatus has a continuous configuration so as to be a process described later. The film (photosensitive web 18) was attached to an electrolytic plating apparatus so that the silver mesh surface of the film (photosensitive web 18) faced downward (so that the silver mesh surface was in contact with the power supply roller). The size of the plating tank 60A was 80 cm × 80 cm × 80 cm for each bath.

In Table 1, it is a comparative example using two support rollers which contact the conductive surface of the film when the sample numbers 101 to 104 convey the film in the air, and when the sample numbers 105 to 108 convey the film in the air. The present invention uses three support rollers 202, 204, and 206 that are in contact with the conductive and back surfaces of the film.
As the cathode power supply rollers 50A and 50B, mirror-finished stainless steel rollers (10 cmφ, length 100 cm) are used, and as the support rollers 202, 204, 206 and other transport rollers, rollers of 5 cmφ, length 100 cm are used. used. In addition, by adjusting the heights of the support rollers 202, 204, and 206, a constant in-liquid processing time is ensured even if the line speed is different.

  Further, the distance (distance La shown in FIG. 2) between the lowermost part of the surface where the cathode feeding roller 50A on the entrance side is in contact with the silver mesh surface of the film and the plating solution surface was 9 cm. The line conveyance speed was changed to 2 to 3.5 m / min for processing.

The composition of the plating solution and the rust preventive solution and the plating tank in the plating treatment are as follows.
・ Hardener (Replenisher has the same composition)
Glutaraldehyde 25g
Add pure water 1L

・ Composition of copper plating 1-9 liquid (same composition for replenisher)
Copper sulfate pentahydrate 230g
200 mL of sulfuric acid (47%)
20-ml Cu-Brite 21 manufactured by Ebara Eugene
Add pure water 1L
pH -0.1 ^*
・ Composition of copper plating solution 10-18 (replenisher solution is the same composition)
Copper sulfate pentahydrate 230g
200 mL of sulfuric acid (47%)
Add pure water 1L
pH -0.1 ^*
Note *: pH meter reading

・ Blackening 1st liquid (same composition for replenisher)
Nickel sulfate hexahydrate 120g
20g ammonium thiocyanate
Zinc sulfate heptahydrate 4g
Sodium sulfate 16g
Add pure water 1L
pH (pH adjustment with sulfuric acid and sodium hydroxide) 5.0
・ Blackening 2nd liquid (same composition for replenisher)
Nickel sulfate hexahydrate 120g
20g ammonium thiocyanate
Zinc sulfate heptahydrate 30g
Sodium sulfate 16g
Add pure water 1L
pH (pH adjustment with sulfuric acid and sodium hydroxide) 5.0

・ Anti-rust solution 100 ml of Sulcup AT-21 manufactured by Uemura Kogyo
Add pure water 1L

The processing time of the plating tank 60A is shown below. The current values applied in each tank are shown in Table 1 below. In Table 1, the amount of electrolysis was indicated by the current value (A).
Moreover, all copper plating solution, water washing, and the temperature of rust prevention were processed at 25-30 degreeC, the hardening liquid was 35 degreeC, the blackening liquid was 33 degreeC, and the drying temperature was 50 degreeC-70 degreeC.

Dura 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 1 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 2 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 3 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 4 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 5 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 6 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 7 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 8 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 9 40 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 10 60 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 11 60 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 12 60 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 13 60 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 14 60 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 15 60 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 16 60 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 17 60 seconds
30 seconds of water washing
Dry 30 seconds
Copper plating 18 60 seconds
30 seconds of water washing
Dry 30 seconds
Blackening first process 60 seconds
30 seconds of water washing
Dry 30 seconds
Blackening second process 60 seconds
30 seconds of water washing
30 seconds of water washing
Rust prevention 60 seconds
30 seconds of water washing
Dry 1 minute 50 ° C ~ 70 ° C

(Good product rate)
The dot-like defects were NG with a diameter of 1 mm or more, and the line defects were NG with a width of 0.2 mm or more and a length of 10 mm or more. A location where an NG defect occurred was treated as a 1 m defect, and the non-defective rate was calculated by the following formula.
Non-defective product rate (%) = treatment length not missing (m) / treatment length (m) x 100

[Example 2]
(Preparation of conductive film)
As the conductive film, the conductive film a described in Example 2 of JP-A-2006-352073 was produced.

(Plating treatment)
It carried out with the liquid and conditions of the same formulation as Example 1.
The current value applied in each tank was adjusted as shown in Table 2 to prepare electrolytic plating film samples of sample numbers 201-205. The power supply conditions, the material of the squeeze roller (liquid cutting roller), etc. are set as shown in Table 2.

As shown in Table 1, it was confirmed that the electroplated film of the present invention had a high yield rate even when the film conveyance speed was increased as compared with the electroplated film of the comparative example.
As shown in Table 2, it was confirmed that the electroplated film of the present invention subjected to wet power feeding had a higher yield rate than the electroplated film of the comparative example subjected to dry power feeding. Further, it was confirmed that when the material of the squeeze roller was set to PU (polyurethane), the non-defective product rate was higher than when the material was set to PVA (polyvinyl alcohol). This effect is considered to be an effect of reducing the amount of the plating solution brought into the washing tank, and it was confirmed that the non-defective product rate was high when the plating metal concentration in the washing tank was 50 ppm or less.

It is a schematic longitudinal cross-sectional view which shows the manufacturing apparatus of the film with a plating film in one Embodiment of this invention. It is a schematic block diagram which shows the support apparatus arrange | positioned in the downstream of the plating tank of the electroplating apparatus used with the manufacturing apparatus shown in FIG. FIG. 3 is a partially enlarged view showing a configuration in the vicinity of a cleaning liquid receiving tank of the support device shown in FIG. 2. It is a schematic block diagram which shows the wetting electric power feeder arrange | positioned at the electroplating apparatus used with the manufacturing apparatus shown in FIG. It is the schematic sectional drawing seen from the direction orthogonal to the longitudinal direction of the cathode electric power feeding roller of the wet electric power feeding apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Film-coated film manufacturing apparatus 16 Electrolytic plating apparatus 17 Post-processing apparatus 18 Photosensitive web (film)
18A Conductive surface 18B Back surface 21 Supply section 50A Cathode power supply roller 50B Cathode power supply roller 60A Plating tank 60B Plating tank 61 Plating liquid 70A Cleaning tank 70B Cleaning tank 71 Cleaning liquid 150A Wetting power supply apparatus 150B Wetting power supply apparatus 151 Power feeding liquid 152 Wetting power supply liquid Receiving tank 200A Support device (film support device)
202 Conductive surface support roller 204 Conductive surface support roller 206 Back surface support roller 210 Cleaning device 212 Cleaning device 214 Cleaning device 217 Cleaning liquid 218 Cleaning liquid receiving tank 220 Cleaning liquid receiving tank 222 Cleaning liquid receiving tank 224 Supply pipe (cleaning liquid supply / discharge means)
232 Discharge pipe (cleaning liquid supply / discharge means)
236 Pump (cleaning liquid supply / discharge means)
240 Liquid roller

Claims (7)

A film support device for supporting the film, which is disposed on the downstream side of an electroplating bath for bringing a conductive surface of the film into contact with a cathode power feeding roller and forming a plating film on the conductive surface, and is conveyed in the air to the next process,
At least two film conductive surface supporting members in contact with the conductive surface of the film;
At least one film back surface support member disposed between the film conductive surface support members and in contact with the back surface of the film opposite to the conductive surface;
Cleaning means for cleaning the film conductive surface support member and the film back surface support member, respectively.
A film supporting device comprising: The film conductive surface support member and the film back surface support member are each composed of a roller,
The cleaning means includes
A cleaning liquid receiving tank filled with the cleaning liquid and in which the lower part of the roller is immersed in the cleaning liquid;
Cleaning liquid supply and discharge means for supplying a new cleaning liquid to the cleaning liquid receiving tank and discharging the cleaning liquid in the cleaning liquid receiving tank;
The film supporting device according to claim 1, wherein An electroplating bath for bringing the conductive surface of the film into contact with the cathode power supply roller and forming a plating film on the conductive surface;
The film support device according to claim 1 or 2, which is disposed downstream of the electrolytic plating bath,
An apparatus for producing a film with a plating film, comprising: Provided on the downstream side of the film support device, comprising a washing tank for washing the film,
The film with a plating film according to claim 3, wherein the plating metal concentration of the liquid in the cleaning tank is adjusted to 50 ppm or less by being supported by the film support device and being conveyed in the air. Manufacturing equipment.   5. The apparatus for producing a film with a plating film according to claim 3, further comprising a wet feeding unit that feeds power by bringing the conductive surface of the film into contact with the cathode feeding roller in a wet state. The wet power feeding means is
Wet power supply provided upstream of the contact portion between the conductive surface of the film and the cathode power supply roller, filled with a wet power supply liquid, and a portion of the cathode power supply roller immersed in the wet power supply liquid An apparatus for producing a film with a plating film according to claim 5, further comprising a liquid receiving tank. On the downstream side of the washing tank, a liquid draining roller for draining liquid while pressing the film is provided,
5. The apparatus for producing a film with a plating film according to claim 4, wherein a material of the liquid draining roller is any one of polyolefin and polyurethane.

Images