JP2009080415A - Method of processing conductive material, method of forming conductive material, and processing device of conductive material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress a defect such as bleeding or burr at a silver wire edge part of a conductive material by local runaway of developing after developing processing. <P>SOLUTION: A developing stop processing tank 18 is provided between a developing processing tank 16 storing a developer 16A and a fixing tank 20 storing a fixing solution 20A along a carrying direction of a photosensitive web 12. The developing stop processing tank 18 stores a stop solution of pH 5 or less. According to this, the photosensitive web 12 leaving the processing tank 16 is carried to the developing stop processing tank 18 and subjected to developing stop processing therein. Therefore, the developer 16A accompanied by the photosensitive web 12 never contacts with the fixing solution 20A, and a defect such as bleeding or burr at the silver line edge part of the conductive material by local runaway of developing can be suppressed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a conductive material processing method and a conductive material forming method for forming a conductive pattern by exposing and developing a conductive material precursor having at least one silver salt-containing layer on a support. And an apparatus for processing a conductive material.

  In recent years, an electromagnetic wave shielding film of a plasma display panel (PDP) has been known as a light-transmitting conductive film that has been subjected to exposure processing of a silver salt photosensitive material and development processing and then subjected to surface resistance reduction processing.

  Patent Document 1 discloses a method of obtaining a conductive film by exposing a silver salt photosensitive material to a pattern such as a fine line, developing, and plating. In this method, it is described that the development processing is performed in the order of a development step, a fixing step, and a washing / stabilization processing step. Further, it is described that the obtained developed material is processed by activation treatment, electroless copper plating, and continuous electrolytic plating to finally obtain a transparent conductive film having desired conductivity.

Patent Document 2 discloses a light-sensitive material in which an emulsion layer is substantially disposed on the uppermost layer and the emulsion layer contains an antioxidant. In this photosensitive material, it is described that it is advantageous not to provide a protective layer on the emulsion layer because the physical development and the plating treatment are performed quickly. Further, it has been suggested that the adverse effect of not providing a protective layer is that it is easily affected by external pressure and fog is likely to occur, and by containing an antioxidant in the emulsion layer, the effect of external pressure is reduced.
JP 2006-352073 A JP 2006-228469 A

  However, the above technique has the following problems.

  When developing with the developing method described in Patent Document 1 (Japanese Patent Laid-Open No. 2006-352073) using the photosensitive material described in Patent Document 2 (Japanese Patent Laid-Open No. 2006-228469), it is generally A transparent conductive film precursor having a good silver line pattern (meaning developed product before plating) can be obtained, but unexpected development may occur at the initial stage of fixing after development or at the squeeze portion at the inlet of the fixing tank after development. Bleeding, jaggedness, dendritic silver deposition, and streaks occur at the edge of the silver wire due to local runaway. These silver wire edge blurs and jagged defects are not well understood even when viewed with transmitted light after development. However, when the transparent conductive film precursor is plated, the defects at the silver wire edge are amplified by the plating and become visible even when transmitted, resulting in a failure. When the speed of conveying the photosensitive material in the developing device is increased to 2 m / min, 3 m / min, and 12 m / min in order to improve the production capacity, stripes are particularly noticeable. In order to obtain an electromagnetic wave shielding film for a PDP (plasma display panel), unevenness that is visible through transmission becomes a failure and needs to be improved.

  Here, “development local runaway” means that a small amount of silver halide is dissolved in the developing solution accompanied by the photosensitive material from the developing tank without being squeezed, and this developing solution meets the fixing solution. Thus, it is presumed that the silver in the developer is one type of dissolution physical development in which the silver is locally deposited on the silver wire of the photosensitive material. In the light-sensitive material having no protective layer, local runaway of development is particularly prominent, and when the transport speed is increased, the developer cannot be squeezed and the accompanying developer increases, so that unevenness tends to become severe.

  The present invention has been made in view of such circumstances, and a method for treating a conductive material, a method for forming a conductive material, and a conductive material capable of suppressing the occurrence of defects such as bleeding and jaggedness of silver wire edge portions. It is providing the processing apparatus.

  In order to solve the above-mentioned problems, the invention according to claim 1 forms a conductive pattern by exposing and developing a conductive material precursor having at least one silver salt-containing layer on a support. A method of processing a conductive material to be developed, wherein after the development process and before the conductive material is fixed, the conductive material is introduced into a development stop treatment tank filled with a stop solution having a pH of 5 or less, and the development is stopped. It is characterized by processing.

  According to the first aspect of the present invention, there is provided a conductive material having a conductive pattern formed by exposing and developing a conductive material precursor having at least one silver salt-containing layer on a support. obtain. In this conductive material processing method, after the development process and before the conductive material is fixed, the conductive material is introduced into a development stop treatment tank filled with a stop solution having a pH of 5 or less, and the development stop process is performed.

  Generally, in the squeeze part at the fixing initial stage after development or at the fixing tank inlet after development, the developer encounters the fixer and the silver in the developer is locally deposited on the silver wire of the conductive material. Bleeding, jagged edges, dendritic silver deposits, and uneven stripes are likely to occur due to local runaway of development. In the present invention, before the conductive material is fixed, the conductive material is introduced into the development stop processing tank filled with the stop solution, and the development stop processing is performed, so that the silver wire edge portion due to local runaway of the development is caused. Generation of defects such as bleeding and jaggedness can be suppressed.

  Further, the stop solution preferably has a pH of 5 or less. If the stop solution is higher than 5, it is not possible to effectively prevent the silver in the developer from locally depositing on the silver wire edge of the conductive material.

  According to a second aspect of the present invention, in the method for treating a conductive material according to the first aspect, the pH is 1 to 4.

  According to the second aspect of the present invention, since the pH of the stop solution is 1 to 4, it is more effectively suppressed that the silver in the developer is locally deposited on the silver wire edge portion of the conductive material. can do.

  According to a third aspect of the present invention, in the method for treating a conductive material according to the first or second aspect, the conductive material precursor having a silver salt-containing layer that is substantially not provided with a protective layer on the surface is exposed. And developing.

  When a conductive material precursor having a silver salt-containing layer that does not substantially have a protective layer on the surface is exposed and developed, silver in the developer is locally deposited on the silver wire of the conductive material, so-called Although local runaway of the development is likely to occur, in the invention according to claim 3, even when the conductive material precursor having substantially no protective layer on the surface is processed, the silver line edge portion due to the local runaway of the development is processed. Generation of defects such as bleeding and jaggedness can be suppressed. Here, “substantially has no protective layer on the surface” means that the thickness of the protective layer on the surface is 0.5 μm or less or has no protective layer on the surface.

  The method for forming a conductive material according to a fourth aspect of the present invention is manifested by processing a conductive material precursor by the method for processing a conductive material according to any one of the first to third aspects. A predetermined amount of metal is imparted to the silver pattern by plating.

  According to the invention described in claim 4, the silver pattern expressed by processing the conductive material precursor by the conductive material processing method according to any one of claims 1 to 3, By applying a predetermined amount of metal by a plating process, a surface resistance reduction process is performed to form an electromagnetic wave shielding film.

  In general, in the squeeze part at the initial stage of fixing after development or at the inlet of the fixing tank after development, if the silver wire edge blurs, jagged, dendritic silver deposits, or streaks occur due to local runaway of development, Although defects such as blurring and jagged edges can be seen with the transmitted light after development, when the silver pattern is plated, defects at the edge of the silver wire are amplified by plating and can be seen through. In the present invention, since the development stop process after the development process can suppress the occurrence of defects at the silver wire edge portion, the plating process can prevent the defects at the silver wire edge portion from becoming visible. .

  The invention according to claim 5 is an apparatus for processing a conductive material that forms a conductive pattern by exposing and developing a conductive material precursor having at least one silver salt-containing layer on a support. A development processing tank that is provided between a development processing tank for performing a development process and a fixing processing tank for fixing the conductive material, and in which the conductive material is immersed in a stop solution having a pH of 5 or less, and development is stopped. It has a stop processing tank.

  According to the invention described in claim 5, the conductive material having a conductive pattern formed by exposing and developing a conductive material precursor having at least one silver salt-containing layer on a support. obtain. In this conductive material processing apparatus, after the development process, before the conductive material is fixed, the conductive material is immersed in a stop solution having a pH of 5 or less in the development stop processing tank to stop the development.

  Generally, in the squeeze part at the fixing initial stage after development or at the fixing tank inlet after development, the developer encounters the fixer and the silver in the developer is locally deposited on the silver wire of the conductive material. Bleeding, jagged edges, dendritic silver deposits, and uneven stripes are likely to occur due to local runaway of development. In the present invention, before the conductive material is fixed, the conductive material is introduced into the development stop processing tank filled with the stop solution, and the development stop processing is performed, so that the silver wire edge portion due to local runaway of the development is caused. Generation of defects such as bleeding and jaggedness can be suppressed.

  Further, the stop solution preferably has a pH of 5 or less, more preferably 4 or less. When the pH is higher than 5, it is impossible to effectively suppress the silver in the developer from locally depositing on the edge of the silver wire of the conductive material.

  According to a sixth aspect of the present invention, in the conductive material processing apparatus according to the fifth aspect, the conductive material precursor having a silver salt-containing layer substantially not provided with a protective layer on the surface is exposed and developed. It is characterized by doing.

  When a conductive material precursor having a silver salt-containing layer that does not substantially have a protective layer on the surface is exposed and developed, silver in the developer is locally deposited on the silver wire of the conductive material, so-called Although local runaway of the development is likely to occur, in the invention according to claim 6, even when the conductive material precursor having substantially no protective layer on the surface is processed, the silver line edge portion due to the local runaway of the development is processed. Generation of defects such as bleeding and jaggedness can be suppressed.

  As described above, according to the present invention, after development processing, it is possible to suppress the occurrence of defects such as jaggedness due to local runaway of development due to bleeding in the silver wire edge portion of the conductive material.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a conductive material processing apparatus to which a conductive material processing method according to the present invention is applied. This processing apparatus is disposed after exposing a conductive material precursor having a silver halide emulsion layer as a silver salt-containing layer on a support film, and developing, fixing, washing, etc. of the exposed conductive material precursor It is a device that performs.

  As shown in FIG. 1, in the processing apparatus 10, a photosensitive web 12 having a silver halide emulsion layer on a belt-like support film is conveyed in a fixed direction while being guided by a plurality of support rolls 14. The photosensitive web 12 has been subjected to a desired fine line pattern exposure by an exposure apparatus (not shown).

  The processing apparatus 10 includes, in order from the upstream side to the downstream side in the conveyance direction of the photosensitive web 12, a development processing tank 16 in which the developer 16A is stored, a development stop processing tank 18 in which the stop liquid 18A is stored, The fixing tank 20 in which the fixing liquid 20A is stored, the first water washing tank 22 in which pure water (cleaning liquid) 22A is stored, the second water washing tank 24 in which pure water (cleaning liquid) 24A is stored, and the photosensitive web 12. And a drying device 26 for drying. In the drying device 26, the photosensitive web 12 is wound around three support rolls 14 arranged in a staggered manner, and the photosensitive web 12 is disposed upstream and downstream in the transport direction from the three support rolls 14. A hot air generator 28 for blowing hot air on the surface is disposed.

  In the processing apparatus 10, the photosensitive web 12 is conveyed to the development processing tank 16 through a support roll 14 disposed on the upper part of the development processing tank 16. In the developing tank 16, two lower liquid turn bars 30 and two upper support rolls 32 are arranged in a staggered manner. The photosensitive web 12 is supported in a state of being stretched over the submerged turn bar 30 on the upstream side in the transport direction, the two support rolls 32, and the submerged turn bar 30 on the downstream side in the transport direction. At this time, the photosensitive web 12 is supported by the two submerged turn bars 30 so that the silver halide emulsion layer is not in contact with the turn bar 30, and the direction is changed.

  The submerged turn bar 30 is formed with a plurality of slits (not shown) in the axial direction on the peripheral surface, and a predetermined amount of developer 16A is ejected from the plurality of slits, so that the photosensitive web 12 is submerged in the submerged turn bar. It floats from 30 and becomes non-contact. Since the silver halide emulsion layer of the photosensitive web 12 is a soft film in the wet state, it is desirable that the amount of the developer 16A sprayed from the slit is too strong to be adjusted to a predetermined spray amount so as not to break the soft film. The photosensitive web 12 conveyed in the development processing tank 16 is introduced into the next development stop processing tank 18 through two support rolls 34 disposed on the upper part of the development processing tank 16 and the development stop processing tank 18. The A pressing roll 36 is disposed at a position facing the support roll 34 and the photosensitive web 12 therebetween.

  A submerged turn bar 38 is disposed in the development stop processing tank 18 on the lower side, and the submerged turn bar 38 supports and changes the direction of the photosensitive web 12 so that the silver halide emulsion layer is not in contact. . The submerged turn bar 38 is formed with a plurality of slits (not shown) in the axial direction on the peripheral surface, and a predetermined amount of stop liquid 18A is ejected from the plurality of slits, whereby the photosensitive web 12 is submerged in the submerged turn bar. It floats from 38 and becomes non-contact. The photosensitive web 12 conveyed in the development stop processing tank 18 is introduced into the next fixing tank 20 through two support rolls 34 disposed on the top of the development stop processing tank 18 and the fixing tank 20.

  Thereafter, similar to the development processing tank 16 described above, the photosensitive web 12 is redirected by two submerged turn bars 40 disposed in the fixing tank 20 so that the silver halide emulsion layer is not contacted, It is introduced into the next first washing tank 22 through the support roll 34. The submerged turn bar 40 is configured such that a predetermined amount of the fixing solution 20A is ejected from a plurality of slits formed in the axial direction on the peripheral surface, whereby the photosensitive web 12 floats from the submerged turn bar 40 and is not contacted. Become.

  Thereafter, the photosensitive web 12 is redirected by the submerged turn bar 42 in the first washing tank 22 in a non-contact state with the silver halide emulsion layer, and passes through a support roll 34 disposed on the upper part of the first washing tank 22. It is introduced into the second water washing tank 24. Further, the direction of the photosensitive web 12 is changed by the submerged turn bar 44 in the second washing tank 24 while the silver halide emulsion layer is not in contact. The submerged turn bars 42 and 44 are configured such that a predetermined amount of pure water 22A and 24A is ejected from a plurality of slits formed in the axial direction on the peripheral surface, whereby the photosensitive web 12 is ejected from the submerged turn bars 42 and 44. Levitation and non-contact.

  A plurality of (two pairs in this embodiment) air knives 46 are arranged at the outlet of the second water rinsing tank 24 so as to face both surfaces of the photosensitive web 12. The pure water 24A is scraped off by the air blown from the air knife 46 from the photosensitive web 12 that has come out of the second water washing tank 24, and is conveyed to the drying device 26 through the support roll 34 that is disposed at the top.

  In the drying device 26, both surfaces of the photosensitive web 12 are dried by the warm air generated from the warm air generating device 28, and the photosensitive web 12 is conveyed through the support roll 14 disposed on the upper portion of the drying device 26. Although not shown, the processing apparatus 10 has a torque adjusting mechanism so that the photosensitive web 12 can be conveyed with a constant tension.

  In such a processing apparatus 10, the photosensitive web 12 is developed into the development processing tank 16, the development stop processing tank 18, and the fixing tank by a plurality of support rolls 14, 32, 34 and submerged turn bars 30, 38, 40, 42, 44. 20, development, development stop, fixing, and washing are performed by being conveyed through the first washing tank 22 and the second washing tank 24. As a result, a photosensitive web 12 on which a fine-line mesh developed silver image (conductive film) is formed is obtained.

  In the processing apparatus 10, a development stop processing tank 18 in which a stop liquid 18 </ b> A is stored is disposed between the development processing tank 16 and the fixing tank 20. The stop solution 18A has a pH of 5 or less, preferably from pH 1 to pH 4, and more preferably from pH 2 to pH 3. If the pH of the stop solution is out of the range of pH 1 or more and pH 5 or less, it becomes impossible to effectively suppress the silver in the developer from locally depositing on the silver wire edge portion of the conductive material. For example, acetic acid, succinic acid, maleic acid, citric acid or the like is used as the stop liquid 18A. In this embodiment, 5% acetic acid is used.

  Here, development processing techniques used for silver salt photographic films, printing plate-making films, photomask emulsion masks, and the like can be applied to the development, fixing, and washing processes. A developing solution, a fixing solution, and a cleaning solution can be appropriately applied according to these. For example, the developer is not particularly limited, but PQ developer, MQ developer, MAA developer and the like can also be used. For example, CN-16, CR-56, CP45X, FD-3 manufactured by FUJIFILM Corporation. Developers such as C-41, E-6, RA-4, D-19, and D-72 manufactured by KODAK, Papitol, or a developer included in the kit, and a lith developer such as D-85 Can be used. The fixing process is performed for the purpose of removing and stabilizing the silver salt in the unexposed part.

  In this embodiment, a protective layer is not provided on the surface of the silver halide emulsion layer of the photosensitive web 12. Further, the tension when the photosensitive web 12 is conveyed is preferably 3 N / m or more and 150 N / m or less. If the tension is less than 3 N / m, the support rolls 14, 34, etc. may not rotate, and the film may be damaged. On the other hand, if it exceeds 150 N / m, wrinkles may occur on the photosensitive web 12, and the film may come into contact with the surface of the turnbar in the liquid and damage the developed silver image.

  Next, the operation of the processing apparatus 10 to which the conductive material processing method of the present embodiment is applied will be described.

  In the processing apparatus 10, the photosensitive web 12 is developed into a development processing tank 16, a development stop processing tank 18, a fixing tank 20, and a first tank by a plurality of support rolls 14, 32, 34 and submerged turn bars 30, 38, 40, 42, 44, etc. The inside of the 1 water washing tank 22 and the 2nd water washing tank 24 is conveyed. As a result, each process of development, development stop, fixing, and washing is performed on the photosensitive web 12. Then, the photosensitive web 12 is dried by the drying device 26 to obtain the photosensitive web 12 (conductive material) on which a fine-line mesh-shaped developed silver image (conductive film) is formed. The photosensitive web 12 obtained by processing by the processing apparatus 10 can be suitably used for a light-transmitting electromagnetic wave shielding film. That is, a light-transmitting electromagnetic wave shielding film is formed by applying a predetermined amount of metal to a thin-line mesh silver pattern expressed by processing the photosensitive web 12 by the processing apparatus 10 by plating treatment of Cu, Ag or the like. The

  In this processing apparatus 10, a development stop processing tank 18 in which a stop solution 18 A is stored is disposed between the development processing tank 16 and the fixing tank 20, and the photosensitive web 12 that has exited the development processing tank 16 is developed. It is conveyed into the stop processing tank 18 and development stop processing is performed.

  In the case where the development stop processing tank 18 is not provided between the development processing tank 16 and the fixing tank 20, local runaway of development (1 of dissolution physics phenomenon) in the squeeze part at the initial stage of fixing after development or at the inlet of the fixing tank after development. Depending on the type, bleeding of the edge of the silver wire, jaggedness, dendritic silver deposition, and uneven stripes are likely to occur. Blemish and jagged defects on these silver wire edges can be seen with the transmitted light after development, but when the transparent conductive film precursor (developed product before plating) is plated, the above silver wire Edge defects are amplified by plating and can be seen through. In order to obtain an electromagnetic wave shielding film for a PDP (plasma display panel), unevenness that is visible through transmission becomes a failure. In particular, in a photosensitive web without a protective layer, local runaway of development develops remarkably, and as the transport speed increases, the developer that can be squeezed and increases, the unevenness tends to become severe.

  In the processing apparatus 10 of the present embodiment, a development stop processing tank 18 is disposed between the development processing tank 16 and the fixing tank 20, and the photosensitive web 12 that has exited the development processing tank 16 is in the development stop processing tank 18. The development stop process is performed. As a result, local runaway of the development, that is, a phenomenon in which a small amount of silver halide dissolved in the developer comes into contact with the fixing solution and silver in the developer is locally deposited on the silver wire of the photosensitive web 12 can be suppressed. . For this reason, it is possible to suppress the occurrence of defects such as blurring and jaggedness of the silver wire edge portion of the photosensitive web 12, and a smooth silver wire edge portion can be obtained.

  The photosensitive web 12 is not provided with a protective layer on the surface of the silver halide emulsion layer. When a protective layer is not substantially provided on the surface of the silver halide emulsion layer, so-called local runaway of development is likely to occur, in which silver in the developer is locally deposited on the silver wire of the conductive material. However, in the processing apparatus 10, even if the photosensitive web 12 has no protective layer on the surface, or the photosensitive web has a very thin thickness (for example, the protective layer has a thickness of 0.5 μm or less), it is caused by local runaway of development. It is possible to suppress the occurrence of defects such as bleeding and jaggedness at the edge of the silver wire.

  Next, an experiment for examining the state of the silver wire edge portion on the photosensitive web 12 using the processing apparatus 10 was performed.

  Each process such as development, development stop, fixing, water washing, and drying of the processing apparatus 10 was set to the conditions shown in Table 1 (level 1). Under these conditions, development, development stop, fixing, washing, drying, etc. are performed, the jaggedness of the silver wire edge (edge) after development, and the silver wire edge (edge) after plating The state of occurrence of jaggedness was examined. In this experiment, the stop solution has a pH of 2.5. The photosensitive web 12 used was a silver halide emulsion layer having no protective layer on the surface. Note that Cu was deposited by electrolytic plating.

  In addition, as a comparative example, the case where the development stop tank 18 is not provided between the development tank 16 and the fixing tank 20 and the development stop process is not performed after the development process is also performed. The occurrence state of jagged edges of the edges and the occurrence state of jagged edges of the silver wire edges (edges) after plating were examined (level 2).

  As shown in Table 1, it was confirmed that when the development stop process was performed after the development process (level 1), the jagged edges of the silver wire edge (edge) did not occur both after development and after plating. On the other hand, when the development stop process was not performed after the development process (level 2), it was confirmed that the jagged edges of the silver wire edge (edge) occurred both after development and after plating. Therefore, it has been found that the processing apparatus 10 can suppress the generation of jagged edges of the silver wire edge of the photosensitive web 12 due to local runaway of development.

  On the other hand, Japanese Patent Application Laid-Open No. 2000-352826 discloses a configuration in which a development processing apparatus for an original plate for lithographic printing is provided with means for stopping or washing the original plate that has undergone the development process. However, in an automatic developing device that obtains a silver image by developing, fixing, washing and drying a photosensitive material coated with a silver halide emulsion, such as an X-ray sensitive material, a lithographic film, or a black and white negative sensitive material, development and fixing There is no known automatic developing apparatus that puts a stop in between, and there is no known document. In the structure of the present invention in which the silver salt photosensitive material is developed to obtain a precursor of the plating process, it is not particularly found.

  In photographic photosensitive materials, there is no post-process to apply a conductive material such as metal on the silver wire pattern obtained after processing by plating. Even if development (development local runaway) occurs, it is not amplified in a later process. Since there is a protective layer, even if there is a squimminess of the developing solution, the dissolved physical development unevenness is alleviated and is not noticeable. In addition, when dissolved physical development occurs uniformly, there is a merit that the development density is improved, and when entering the fixing tank, it is substantially stopped by the fixing solution, so conventionally, the X-ray sensitive material and the lith film are developed. No stop bath was inserted between the development and fixing of the automatic developing device.

  However, since the post-development process is a plating process, and slight development unevenness is amplified in the plating process and is visually recognized by visual inspection using transmitted light, the development stop processing tank 18 as in the processing apparatus 10 of the present invention. It became effective to provide.

  Next, the photosensitive web 12 will be described. The photosensitive web 12 is, for example, a long and wide flexible base material made of a photosensitive material provided with a silver salt-containing layer (in this embodiment, a silver halide emulsion layer) containing a silver salt on a light-transmitting support. is there. In this embodiment, a protective layer is not substantially provided on the silver salt-containing layer. However, a protective layer may be provided on the silver salt-containing layer. And a layer made of a binder such as a polymer, and is formed on the silver salt-containing layer in order to exhibit the effects of preventing scratches and improving mechanical properties. It is preferable that the thickness of a protective layer is 0.02-20 micrometers, More preferably, it is 0.1-10 micrometers, More preferably, it is 0.3-3 micrometers.

  The composition of these silver salt-containing layers and protective layers includes silver halide emulsion layers (silver salt-containing layers) and protective layers applied to silver salt photographic films, photographic paper, printing plate-making films, emulsion masks for photomasks, etc. Layers can be applied as appropriate.

  In particular, as the photosensitive web 12 (photosensitive material), a silver salt photographic film (silver salt photosensitive material) is preferable, and a black and white silver salt photographic film (black and white silver salt photosensitive material) is the best. The silver salt applied to the silver salt-containing layer is most preferably silver halide.

  On the other hand, as the light-transmitting support, a single-layer plastic film or a multilayer film in which two or more layers are combined can be applied. Examples of the raw material for the plastic film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA; polyvinyl chloride, polyvinylidene chloride, and the like. In addition, use polyetheretherketone (PEEK), polysulfone (PSF), polyethersulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetylcellulose (TAC), etc. Can do.

  Among these, from the viewpoint of transparency, heat resistance, ease of handling, and cost, the plastic film as the support is a polyethylene terephthalate film or cellulose triacetate film that is usually applied to silver salt photographic films (silver salt photosensitive materials). In addition, a polyimide film is preferable. Particularly preferred is a polyethylene terephthalate film.

  Moreover, since the electromagnetic shielding material for displays requires transparency, it is desirable that the support has high transparency. In this case, the total visible light transmittance of the light transmissive support is preferably 70 to 100%, more preferably 85 to 100%, and particularly preferably 90 to 100%.

  The width of the photosensitive web 12 is, for example, 50 cm or more, and the thickness is preferably 50 to 200 μm.

  In addition, although this embodiment demonstrated the apparatus and manufacturing method which manufacture a light-transmitting electromagnetic wave shielding material, it is not restricted to this, For example, it has a fine line pattern which consists of fine electroconductive metal parts, such as other industrial goods The present invention can also be applied as a manufacturing apparatus and a manufacturing method of a light transmissive conductive material.

It is a schematic block diagram which shows the processing apparatus with which the processing method of the electroconductive material in one Embodiment of this invention was applied.

Explanation of symbols

10 Processing Device 12 Photosensitive Web (Conductive Material Precursor, Conductive Material)
16 Development processing tank 16A Developer 18 Development stop processing tank 18A Stopping liquid 20 Fixing tank 20A Fixing liquid

Claims (6)

A conductive material processing method for forming a conductive pattern by exposing and developing a conductive material precursor having at least one silver salt-containing layer on a support,
After the development process, before the conductive material is fixed, the conductive material is introduced into a development stop treatment tank filled with a stop solution having a pH of 5 or lower, and the development stop process is performed. Processing method.   The said pH is 1-4, The processing method of the electroconductive material of Claim 1 characterized by the above-mentioned.   The method for treating a conductive material according to claim 1 or 2, wherein the conductive material precursor having a silver salt-containing layer substantially not provided with a protective layer is exposed and developed.   Applying a predetermined amount of metal to the silver pattern expressed by processing the conductive material precursor by the conductive material processing method according to any one of claims 1 to 3 by plating. A method for forming a conductive material. A conductive material processing apparatus for forming a conductive pattern by exposing and developing a conductive material precursor having at least one silver salt-containing layer on a support,
A development stop processing tank provided between a development processing tank for performing a development process and a fixing processing tank for fixing the conductive material, wherein the conductive material is immersed in a stop solution having a pH of 5 or less, and the development stop processing is performed. An apparatus for treating a conductive material, comprising:   6. The conductive material processing apparatus according to claim 5, wherein the conductive material precursor having a silver salt-containing layer substantially not provided with a protective layer is exposed and developed.

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