JP2006348351A - Device and method for producing film with plated coating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To produce a film with a plated coating, which is uniform in thickness and less in defects due to abnormal projections and recesses, by preventing unevenness in plating surface roughness when an electrically conductive face is plated. <P>SOLUTION: While a photosensitive web 18 is carried to the direction of the arrow, moisture stuck to the photosensitive web 18 is removed by air knife apparatuses 42, 44, the photosensitive web 18 is made incontact with a cathode feeding roll 50A and is carried to an electroplating tank 60A, and power is fed by a d.c. power source 66A. Then, a plating liquid in the photosensitive web 18 is cleaned, and the similar process is thereafter repeated for a plurality of times, thus copper plating is formed on a metal silver part of the photosensitive web 18. Then, an elastic roll 52A of pressing the photosensitive web 18 against the cathode feeding roll 50A is arranged at a confronted position with the cathode feeding roll 50A and the photosensitive web 18 held. The photosensitive web 18 is pressed against the cathode feeding roll A by the elastic roll 52A, and the contact of a nip part is stabilized, thus the unevenness in the surface roughness of the plating is prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an apparatus and a method for producing a film with a plating film by forming a plating film on the film while conveying the belt-like long film, and particularly for producing a film with a plating film suitable for the belt-like long resin film. The present invention relates to an apparatus and a manufacturing method. In particular, it shields electromagnetic waves generated from the front of displays such as CRT (cathode ray tube), PDP (plasma display panel), liquid crystal, EL (electroluminescence), and FED (field emission display), microwave ovens, electronic devices, and printed wiring boards. In addition, the present invention relates to a manufacturing apparatus and a manufacturing method of an electromagnetic shielding material having transparency.

  This production apparatus and production method are suitable for producing these conductive films. After pattern exposure of a photographic photosensitive silver salt film, development processing is performed to form a pattern of developed silver fine particles on the surface, and then electroplating is performed. Manufacture of laminated film of electroplated film to form a film, after depositing metal on the film, then deposit metal deposited film / metal plated film to form plated film, electroless plating on film, It is suitable for the production of laminated films of electroless plating / electroplating coatings that form plating coatings. In addition to the electromagnetic shielding materials described above, these devices can reduce the size, weight, and cost of electronic devices and parts. Adhesive-less two-layer flexible printed wiring board, flexible printing suitable for TAB, COF, PGA, etc. in semiconductor packaging It is also suitable for the preparation of the wiring board.

  As described in Patent Document 1 and Patent Document 2, a method of continuously forming a plating film while transporting a film involves bringing a conductive surface of a film or a metal film into contact with a cathode roll, or forming a film conductive surface with a liquid. There is known a method in which a plating bath in which an anode is introduced before or after contact with a cathode roll through a film is disposed, and a plating film is formed in the plating bath. If a plating film is continuously formed on a film by such a method, it is possible to easily form a plating film having a desired thickness on the film by repeatedly passing a unit in which a cathode and an anode are arranged. It is.

  However, the conductive metal part of the translucent conductive film formed by patterning the conductive metal part and the visible light transmissive part on a transparent support often used in PDP (plasma display panel) is silver halide. When developed photographic light-sensitive material is developed silver and the mesh pattern is formed from fine mesh wires of 1 μm to 40 μm, even if it is said to be conductive, it is about 50Ω / □ to 500Ω / □. In addition, the conductive portion does not cover the film surface uniformly and uniformly. For this reason, in the method of directly contacting the cathode roll and the film described in Patent Document 1, the contact tends to be unstable, and the power feeding is unstable.

  In recent years, in order to solve the above problems, when electroplating a long film having conductivity as described in Patent Document 2, the width direction of the film from one side of the film that contacts the power supply roll unit A method has been developed in which spherical or roll balls are placed in contact with each other and conveyed while pressing the film surface with one or several spherical or roll balls. However, in this method, the entire width direction of the belt-shaped film is not uniformly pressed, so that a difference in contact resistance occurs, it is difficult to maintain a uniform power supply state, power supply becomes unstable, and the plating film thickness is reduced. Unevenness and unevenness of plating surface roughness occurred.

  From the above situation, translucent conductivity formed by patterning a conductive metal portion and a visible light transmissive portion on a transparent support using developed silver obtained by developing a silver halide photographic light-sensitive material. In the case of plating a conductive film, it is difficult to apply electroplating suddenly. Therefore, after electroless copper plating is first performed so that the surface resistance of the film becomes about 2Ω / □, the method described in Patent Document 1 or Patent Copper plating was performed by the method described in documents 2-4.

However, in such a method using electroless copper plating, the process becomes long, and the chemical aging time during production is short, and a large amount of chemicals is consumed.
Japanese Patent Laid-Open No. 7-22473 JP 2004-263215 A JP 2004-18949 A JP 2004-18948 A

  The present invention has been made in view of such circumstances, and the purpose thereof is a uniform plating film thickness without occurrence of uneven plating surface roughness even on a material to be plated having a long width and high electrical resistance. It is providing the manufacturing apparatus and method of a film with a plating film which can plate by.

  That is, an object of the present invention is to pattern a conductive metal portion and a visible light transmissive portion on a transparent support using a conductive film, particularly developed silver obtained by developing a silver halide photographic light-sensitive material. Even the light-transmitting conductive film to be formed is to obtain a film with a plating film having good thickness uniformity and few abnormal protrusions and dent defects.

  In order to solve the above-mentioned problems, an apparatus for manufacturing a film with a plating film according to claim 1 is configured to bring a film conductive surface into contact with a cathode feeding roll while conveying a film having a conductive surface, and to provide an electrolytic plating bath. The apparatus for producing a film with a plating film that forms a plating film on the conductive surface of the film, comprising an elastic roll that presses and contacts the conductive film surface with the cathode feeding roll and conveys it to the electrolytic plating bath It is characterized by.

  According to the first aspect of the present invention, since the film conductive surface is pressed and brought into contact with the cathode power supply roll by the elastic roll, power is supplied with the film conductive surface in close contact with the cathode power supply roll, and the film is transported to the electrolytic plating bath. Is done. For this reason, the contact between the film conductive surface and the cathode power supply roll is stabilized, and wrinkles do not enter the film conductive surface. Therefore, the occurrence of unevenness of the plating surface roughness is prevented, and plating can be performed with a uniform plating film thickness.

  According to a second aspect of the present invention, in the apparatus for producing a film with a plating film according to the first aspect, after removing moisture on the film surface, the conductive surface of the film is brought into contact with the cathode power supply roll with the elastic roll. It is characterized by that.

  According to the second aspect of the present invention, after the moisture on the film surface is removed, the film conductive surface is pressed and brought into contact with the cathode power supply roll with the elastic roll. It stabilizes and water does not intervene in a contact part. Therefore, the occurrence of unevenness of the plating surface roughness is prevented, and plating can be performed with a uniform plating film thickness.

  Invention of Claim 3 is a manufacturing apparatus of the film with a plating film of Claim 1 or Claim 2, The said electrolytic plating bath performs copper plating, After passing the said electrolytic plating bath, A plating solution removing device for removing the plating solution of the film is provided, the film conductive surface is washed with water by the plating solution removing device, the moisture adhering to the film conductive surface is removed by moisture removing means, and the elastic roll is used to It is characterized in that the film conductive surface is pressed against the cathode feeding roll and conveyed to the electrolytic plating bath repeatedly.

  According to the third aspect of the present invention, after passing through the electrolytic plating bath and copper plating on the conductive film surface, the conductive film surface is washed with a plating solution removing device, and the adhering water is removed by the water removing means. Then, the film conductive surface is pressed and brought into contact with the cathode power supply roll with an elastic roll, and conveyed to the electrolytic plating bath. By repeating this, a copper plating film having a desired thickness can be formed on the film conductive surface. For this reason, the copper plating film excellent in surface quality can be formed, the uniformity of thickness is good, and the film with a plating film with few abnormal protrusions and dent defects can be obtained.

  Invention of Claim 4 is a manufacturing apparatus of the film with a plating film of any one of Claim 1- Claim 3, In the manufacturing apparatus of the film with a plating film, as for the said elastic roll, hardness is 10 degrees-on the outer peripheral surface of a metal core. It is characterized by forming a rubber layer of 70 degrees. Here, the hardness is a value measured by ASKER C type manufactured by Kobunshi Keiki Co., Ltd.

  According to the invention described in claim 4, since the rubber layer having a hardness of 10 degrees to 70 degrees is formed on the outer peripheral surface of the core metal in the elastic roll, the film conductive surface is made into the cathode power supply roll with the elastic roll. By pressing, it is possible to stably contact the conductive surface of the film.

  Invention of Claim 5 is a manufacturing apparatus of the film with a plating film of any one of Claim 1- Claim 4. WHEREIN: The said elastic roll has a damper function in the both ends of a spindle. A spring material is provided, and a pressing force for pressing the film conductive surface is adjusted by a weight attached to the spring material.

  According to the fifth aspect of the present invention, since the pressing force for pressing the film conductive surface is adjusted by the weights attached to the spring members at both ends of the support shaft, the film conductive surface is applied to the cathode feeding roll as desired. It is possible to make contact by pressure.

  A sixth aspect of the invention is characterized in that, in the apparatus for manufacturing a film with a plating film according to the fourth or fifth aspect, the thickness of the rubber layer is 10 mm or more.

  According to the invention described in claim 6, by using the elastic roll having a rubber layer thickness of 10 mm or more, the film conductive surface can be stably brought into contact with the cathode power feeding roll.

  The invention according to claim 7 is the apparatus for producing a film with a plating film according to any one of claims 1 to 6, wherein the film conductive surface is subjected to copper plating and washed with water, An electrolytic nickel plating bath for nickel plating to blacken the surface of the copper plating is provided. After removing moisture adhering to the conductive film surface, the conductive film surface is pressed against the cathode power supply roll with the elastic roll. And transporting to the electrolytic nickel plating bath.

  According to the seventh aspect of the present invention, the film conductive surface subjected to copper plating is washed with water to remove moisture adhering to the film conductive surface, and then the film conductive surface is pressed against the cathode power supply roll with an elastic roll. Contact and transport to electrolytic nickel plating bath. This stabilizes the contact between the film conductive surface and the cathode power supply roll, and water does not intervene in the contact portion. For this reason, generation | occurrence | production of nickel plating nonuniformity can be prevented and it becomes possible to obtain the film with a plating film of a uniform plating film thickness.

  Invention of Claim 8 is a manufacturing apparatus of the film with a plating film of any one of Claim 1- Claim 7. WHEREIN: The said film with a plating film is an electroconductive metal part on a transparent support body. The light-transmitting conductive film is formed by patterning the visible light transmitting portion.

  According to invention of Claim 8, even if the film with a plating film is a translucent conductive film formed by patterning a conductive metal part and a visible light transmissive part on a transparent support, Can be obtained, and a film with a plating film with few abnormal protrusions and dent defects can be obtained.

  According to a ninth aspect of the present invention, in the apparatus for manufacturing a film with a plating film according to the eighth aspect, the conductive metal portion is formed of a fine mesh wire having a thickness of 1 μm to 40 μm, and the mesh pattern is continuous for 3 m or more. It is characterized by being a translucent conductive film.

  According to the invention described in claim 9, even if the conductive metal part is formed of a mesh-like fine wire and the mesh pattern is continuous for 3 m or more, the thickness uniformity is uniform. It is possible to obtain a film with a plating film with few abnormal protrusions and dent defects.

  The invention according to claim 10 is the developed silver obtained by developing the silver halide photographic light-sensitive material in the conductive metal portion in the apparatus for producing a film with a plating film according to claim 8 or claim 9. It is characterized by that.

  According to the invention described in claim 10, even when the conductive metal portion is developed silver obtained by developing a silver halide photographic light-sensitive material, the thickness is good and the plating has few abnormal protrusions and dent defects. A film with a coating can be obtained.

  Invention of Claim 11 is a manufacturing apparatus of the film with a plating film of any one of Claim 8-10, The said transparent support body consists of a polyimide resin or a polyester resin, It is characterized by the above-mentioned. Yes.

  According to the eleventh aspect of the present invention, even when the transparent support is made of a polyimide resin or a polyester resin, it is possible to obtain a film with a plating film having good thickness uniformity and few abnormal protrusions and dent defects.

  The method for producing a film with a plating film according to the invention of claim 12 is to bring the film conductive surface into contact with the cathode power supply roll while conveying the film having the conductive surface, and to coat the film conductive surface with the electrolytic plating bath. A method for producing a film with a plating film, wherein the film conductive surface is removed by removing moisture from the film conductive surface and pressing the elastic roll to bring the film conductive surface into contact with the cathode power supply roll. It is transported to the electrolytic plating bath.

  According to the twelfth aspect of the present invention, after the film conductive surface is pressed and brought into contact with the cathode power supply roll by the elastic roll, the film conductive surface is conveyed to the electrolytic plating bath. Accordingly, the film conductive surface can be stably adhered to the cathode power supply roll, and wrinkles do not enter the film conductive surface. For this reason, generation | occurrence | production of plating surface roughness nonuniformity is prevented and it becomes possible to plate with a uniform plating film thickness.

  According to the apparatus and method for producing a film with a plating film according to the present invention, it is possible to obtain a film with a plating film excellent in surface quality, having good thickness uniformity and few abnormal protrusions and dent defects.

  BEST MODE FOR CARRYING OUT THE INVENTION The best embodiment of the apparatus and method for producing a film with a plating film according to the present invention will be described with reference to the drawings. In addition, the same code | symbol is provided to the member which has the substantially same function through all the drawings, and the overlapping description may be abbreviate | omitted.

  FIG. 1 is a schematic configuration diagram illustrating an apparatus for manufacturing a light-transmitting electromagnetic wave shielding material according to an embodiment.

  As shown in FIG. 1, the apparatus 10 for producing a film with a plating film according to the present embodiment includes an exposure device 12, a developing device 14, an electrolytic plating device 16, a post-processing device 17, and a winding device 19.

  First, the exposure apparatus 12 will be described. The exposure apparatus 12 transports a light-transmissive photosensitive web 18 made of a long and wide film provided with a silver salt-containing layer as a material to be plated, while a desired fine line pattern (for example, a lattice shape, a honeycomb shape, or the like). This is an apparatus for performing pattern exposure. By this pattern exposure, a patterned fine-line metal silver portion is formed in the exposed portion of the silver salt-containing layer of the photosensitive web 18.

  The exposure device 12 is provided with a plurality of conveyance roller pairs 20 along the conveyance path of the light-transmissive photosensitive web 18, and these conveyance roller pairs 20 are constituted by drive rollers and nip rollers.

  The exposure apparatus 12 is provided with a supply unit at the most upstream part in the transport direction. A magazine 22 for storing a long and wide light-transmitting photosensitive web 18 wound in a roll is set in the supply unit. The light transmissive photosensitive web 18 is provided with a drawing roller 22A for pulling out the light transmissive photosensitive web 18 and transporting it toward the downstream side.

  An exposure unit 24 is provided on the downstream side in the transport direction from the supply unit. The exposure unit 24 exposes the light transmissive photosensitive web 18. The exposure unit 24 may be a continuous surface exposure unit using a photomask or a scanning exposure unit using a laser beam. This scanning exposure unit includes a monochromatic high light source such as a gas laser, a light emitting diode, a semiconductor laser, a semiconductor laser, or a second harmonic light source (SHG) that combines a solid state laser using a semiconductor laser and a nonlinear optical crystal. A scanning exposure method using density light can be preferably applied. Further, as the scanning exposure unit, a scanning exposure method using a KrF excimer laser, ArF excimer laser, F2 laser, or the like can also be applied.

  Further, in order to make the scanning exposure unit compact and inexpensive, a second harmonic generation light source (SHG) combining a semiconductor laser, a semiconductor laser, or a solid-state laser and a nonlinear optical crystal may be applied for exposure. Good. In order to design a device that is particularly compact, inexpensive, long-life, and highly stable, it is preferable to apply a semiconductor laser.

Specifically, as a laser light source of the scanning exposure unit, a blue semiconductor laser having a wavelength of 430 to 460 nm (announced by Nichia Chemical at the 48th Applied Physics Related Conference in March 2001), a semiconductor laser (oscillation wavelength) about 1060 nm) a waveguide-like inverted domain structure about 530nm green laser taken out by wavelength conversion by the SHG crystal of LiNbO ₃ having a wavelength of about 685nm of the red semiconductor laser (Hitachi type No.HL6738MG), a wavelength of about 650nm A red semiconductor laser (Hitachi type No. HL6501MG) or the like can be preferably applied.

  The exposure apparatus 12 is not limited to the above-described configuration, and a normal exposure apparatus used for a silver salt photographic film, photographic paper, a printing plate making film, a photomask emulsion mask, or the like can be applied.

  Next, the developing device 14 will be described. The developing device 14 is disposed on the downstream side in the transport direction of the exposure device 12 and is a device that develops, fixes, and cleans the light-transmitting photosensitive web 18 that has been subjected to a desired fine line pattern exposure.

  The developing device 14 is provided with a developing tank 26, a bleach-fixing tank 28, and a water washing tank 30 in order from the upstream side in the transport direction. The water washing tank 30 includes a first water washing tank 30A, a second water washing tank 30B, It consists of the 3rd water washing tank 30C and the 4th water washing tank 30D. For example, a predetermined amount of developer 26L is stored in the developing tank 26, a predetermined amount of bleach-fixing liquid 28L is stored in the bleach-fixing tank 28, and a cleaning liquid 30L is stored in the first washing tank 30A to the fourth washing tank 30D. Is stored in a predetermined amount. The photosensitive web 18 is conveyed through the liquid in the processing tanks 26 to 30 by the rollers and guides in the processing tanks 26 to 30 so that the development, fixing, and cleaning processes are performed. In addition, on the most upstream side of the developing tank 26, a carry-in roller pair 32 including a driving roller 32A and a driven roller 32B is disposed. The carry-in roller pair 32 is a photosensitive web 18 carried out from the exposure device 12. Is guided into the developer 26L.

  Here, the development, fixing, and washing processes can be performed by ordinary development processing techniques used for silver salt photographic films, printing plate-making films, photomask emulsion masks, and the like. The developing solution 26L, the bleach-fixing solution 28L, and the cleaning solution 30L can be appropriately applied according to these. For example, the developer 26L is not particularly limited, but PQ developer, MQ developer, MAA developer, and the like can also be used. For example, CN-16, CR-56, CP45X, FD- manufactured by Fuji Film Co., Ltd. 3. Developer such as C-41, E-6, RA-4, D-19, D-72 manufactured by Papitor, KODAK, or a developer included in the kit, or lith development such as D-85 A liquid can be used.

  Further, the developer 26L can contain an image quality improver for the purpose of improving the image quality. Examples of the image quality improver include nitrogen-containing heterocyclic compounds such as benzotriazole. In addition, it is also preferable to use polyethylene glycol, particularly when a lith developer is used.

  In the developing device 14, the photosensitive web 18 that has passed through the liquid in each of the processing tanks 26 to 30 is discharged from the developing device 14 without being dried.

  Next, the electroplating apparatus 16 will be described. The electrolytic plating apparatus 16 performs electroplating on the photosensitive web 18 that has been exposed and developed to form a fine-line-shaped metallic silver portion, and carries conductive fine particles on the metallic silver portion to perform plating (conductive property). This is an apparatus for forming a metal part. In the electroplating apparatus 16, a moisture removing device 40 </ b> A that removes moisture from the photosensitive web 18 after passing through the washing tank 30 is disposed on the upstream side in the conveyance direction of the photosensitive web 18. As shown in FIG. 2, in the moisture removing device 40 </ b> A, air knife devices 42 and 44 are arranged on both sides of the photosensitive web 18, and the air knife is sprayed from both sides of the photosensitive web 18 to adhere to the photosensitive web 18. Remove moisture.

  On the downstream side of the moisture removing device 40A in the conveyance direction of the photosensitive web 18, a cathode power supply roll 50A that supplies power while being in contact with the metallic silver portion of the photosensitive web 18 is disposed. As shown in FIGS. 2 and 3, an elastic roll 52A that presses and contacts the metal silver portion of the photosensitive web 18 against the cathode power supply roll 50A is disposed at a position facing the cathode power supply roll 50A across the photosensitive web 18. It is installed. The elastic roll 52A is formed by forming an elastic body layer 53 made of rubber, resin, or the like on the outer peripheral surface of a core metal 53A that is rotatably supported. In the present embodiment, urethane rubber is used as the elastic layer 53.

  A spring material 54 having a damper function is attached to both ends of the core metal 53A so as not to hinder the rotation of the core metal 53A, and weights 55 are attached to the upper part of the spring material 54. The weight 55 adjusts the pressing force (the pressing force of the nip portion) that presses the photosensitive web 18 against the cathode power supply roll 50A. In the present embodiment, the pressing force at the nip portion is 10 g to 400 g, desirably 20 g to 200 g. The hardness of the elastic body layer 53 of the elastic roll 52A is 10 degrees to 70 degrees, desirably 20 degrees to 40 degrees. This is because if the pressing force is large and the rubber hardness is too large, the photosensitive web 18 is wrinkled from the nip surface. Here, the hardness of the elastic layer 53 was measured by ASKER C type manufactured by Kobunshi Keiki Co., Ltd. The thickness of the elastic layer 53 is preferably 10 mm or more in order to obtain a desired elastic force. Thus, the photosensitive web 18 and the cathode power supply roll 50A can be brought into close contact with each other by pressing the photosensitive web 18 against the cathode power supply roll 50A by the elastic roll 52A.

As shown in FIGS. 1 and 2, a support roller 56 for guiding the photosensitive web 18 is disposed downstream of the cathode power supply roll 50A in the conveying direction of the photosensitive web 18, and the downstream side is filled with a plating solution 61. A plated plating rod 60A is disposed. In this step, the metallic silver portion of the photosensitive web 18 brought into contact with the cathode power supply roll 50A is conveyed by the submerged roll 62A in the plating bath of the plating tank 60A. A case 64A in which copper balls are stacked and filled is used as an anode electrode, and the cathode electrode is used as a cathode power supply roll 50A, and power is supplied from a DC power source 66A to form a layered plating film on the photosensitive web 18. In this embodiment, the DC power supply 66A supplies power from the cathode power supply roll 50A to the case 64, which is the anode electrode, and a plating film is formed on the photosensitive web 18 so as to have a current density of 0.2 to 10 A / dm ^2. Let

  Here, as the electroplating treatment, for example, an electroplating technique used in a printed wiring board can be applied, and the electroplating is preferably electrolytic copper plating. In the present embodiment, an electrolytic copper plating bath solution is applied as the plating solution 61. Examples of the electrolytic copper plating bath include a copper sulfate bath, a copper pyrophosphate bath, and a copper borofluoride bath. Chemical species contained in the electrolytic copper plating solution include copper sulfate and copper chloride, sulfuric acid to improve the stability and conductivity of the plating solution, and to increase the uniform electrodeposition, acceleration of dissolution of the anode and auxiliary effect of additives Examples of additives for improving chlorine and bath stabilization and plating denseness include polyethylene oxide and bipyridine.

  As shown in FIG. 1, a circulation pipe 67 is connected to the lower part of the plating rod 60 </ b> A, and a pump 68, a filter 69, and a plurality of on-off valves 65 are disposed on the pipe 67. The plating solution 61 in the plating tub 60A flows through the pipe 67 by the pump 68, passes through the filter 69, and is returned to the plating tub 60A for circulation.

  As shown in FIG. 1, a support roller 58 for guiding the photosensitive web 18 is disposed downstream of the plating basket 60A in the conveying direction of the photosensitive web 18, and a jet water washing device 70A is disposed further downstream thereof. . The jet water washing apparatus 70 </ b> A includes two jetting devices 74 facing the photosensitive web 18 in a chamber 72 arranged so as to surround both sides of the photosensitive web 18. Then, the plating liquid 61 of the photosensitive web 18 is washed with water by jetting water flow from both nozzles 74 to both sides of the photosensitive web 18. A flush water reservoir 76 is disposed below the jet flush device 70 </ b> A, and water washed in the jet flush device 70 </ b> A is stored in the flush water reservoir 76 through a pipe 77. A circulation pipe 78 connected to the injection device 74 is connected to the flush water reservoir 76, and the circulation pipe 78 is provided with a pump 79, a filter 80, and an on-off valve 81. The water in the flush water reservoir 76 flows through the circulation pipe 78 by the pump 79 and is sent to the injection device 74 through the filter 80 for circulation.

  In the electroplating apparatus 16 having such a configuration, as shown in FIG. 2, first, the long and wide photosensitive web 18 is conveyed in the direction of the arrow, and moisture adhering to the photosensitive web 18 is removed by the air knife apparatuses 42 and 44. After that, the metallic silver portion of the photosensitive web 18 is brought into contact with the cathode power supply roll 50A at the nip portion between the cathode power supply roll 50A and the elastic roll 52A, and then conveyed to the plating basket 60A. At this time, the case 64A in which the copper balls are stacked and filled is used as an anode electrode, the cathode power supply roll 50A is used as a cathode electrode, power is supplied from a DC power supply 66A, and copper plating is formed by electrolytic plating of the metallic silver portion of the photosensitive web 18. Further, the photosensitive web 18 is conveyed to the jet water washing apparatus 70A, and the plating solution adhering to the photosensitive web 18 is washed with water. In such a process, since the photosensitive web 18 is pressed against the cathode power supply roll 50A by being pressed by the elastic roll 52A, water is prevented from intervening in the nip portion and the contact at the nip portion is stabilized. . For this reason, generation | occurrence | production of the plating surface roughness unevenness is prevented.

  Here, after removing moisture adhering to the photosensitive web 18 by the air knife devices 42 and 44, the photosensitive web 18 is dried and then fed by the cathode feeding roll 50A, a better result is obtained. Examples of the drying means include a method of blowing warm air or heating with an infrared lamp.

  Although illustration is omitted, in the electroplating apparatus 16, a plurality of units including a water removal apparatus 40A, a cathode power supply roll 50A, an elastic roll 52A, a plating trough 60A, and a jet water washing apparatus 70A are arranged ( In the present embodiment, 8 units), the above-described steps are repeated a plurality of times, whereby copper plating having a predetermined thickness is formed on the photosensitive web 18.

  Further, on the downstream side of the photosensitive web 18 in the conveying direction, a unit including a moisture removing device 40B for performing nickel plating, a cathode power supply roll 50B, an elastic roll 52B, a plating rod 60B, and a jet water washing device 70B. Are arranged (8 units in the present embodiment), and the same process as described above is repeated a plurality of times, whereby nickel plating having a predetermined thickness is formed on the photosensitive web 18.

  Next, as shown in FIG. 1, through the roll 125 capable of detecting the film tension, the water washing part 114 for removing the plating solution, the rust prevention treatment part 116 containing the rust prevention treatment liquid 117 for protecting the plating film, After the water washing part 118 that removes excess rust prevention treatment liquid, the drying process part 120 having a drying furnace that removes moisture, the speed adjustment part 121, the balance roll part 122, the tension is adjusted, A roll film 124 is formed through the accumulator 123. Thus, a film with a plating film is obtained.

  The substantial film transport tension is preferably 5 N / m or more and 200 N / m or less. When the tension was actually less than 5 N / m, the film began to meander and the control of the conveyance path was not successful. On the other hand, if it exceeds 200 / m, the plating film metal on which the film is formed has an internal distortion, which causes problems such as curling of the product.

  The conveyance tension control may be performed by feedback control for detecting the conveyance tension using the tension detection roll 125 and increasing or decreasing the speed by the speed adjustment unit 121 so that the tension value becomes constant.

  In this way, plating (conductive metal portion) is formed on the fine-line metal silver portion of the photosensitive web 18. By such a process, it is possible to obtain a film with a plating coating film having excellent surface quality with good thickness uniformity and few abnormal protrusions and dent defects.

  Here, it is preferable that a conductive metal part contains 50 mass% or more of silver with respect to the total mass of the metal contained in a conductive metal part, and it is further more preferable to contain 60 mass% or more. When silver is contained in an amount of 50% by mass or more, the time required for physical development and / or plating treatment can be shortened, the productivity can be improved, and the cost can be reduced. Furthermore, when copper and palladium are used as the conductive metal particles forming the conductive metal part, the total mass of silver, copper and palladium is 80% by mass or more based on the total mass of the metal contained in the conductive metal part. It is preferable that it is 90 mass% or more.

  Note that the number of plating tanks of the electrolytic plating apparatus 16 may be increased by 8 sets or more according to a desired plating film thickness (thickness of the conductive metal portion). A desired plating film thickness (thickness of the conductive metal portion) can be easily obtained according to this number.

  Next, the photosensitive web 18 will be described. The photosensitive web 18 as a material to be plated is, for example, a long and wide flexible base material made of a photosensitive material in which a silver salt-containing layer containing a silver salt (for example, silver halide) is provided on a light-transmitting support. . Further, a protective layer may be provided on the silver salt-containing layer, and this protective layer means a layer made of a binder such as gelatin or a high molecular polymer, and exhibits an effect of preventing scratches and improving mechanical properties. In order to do so, it is formed on the silver salt-containing layer. The composition of these silver salt-containing layers and protective layers includes silver halide emulsion layers (silver salt-containing layers) and protective layers applied to silver salt photographic films, photographic paper, printing plate-making films, emulsion masks for photomasks, etc. Layers can be applied as appropriate.

  In particular, as the photosensitive web 18 (photosensitive material), a silver salt photographic film (silver salt photosensitive material) is preferable, and a black and white silver salt photographic film (black and white silver salt photosensitive material) is the best. The silver salt applied to the silver salt-containing layer is most preferably silver halide.

  In addition, it is preferable that the thickness of a protective layer is 0.02-10 micrometers, More preferably, it is 0.05-5 micrometers, More preferably, it is 0.1-1 micrometers.

  On the other hand, a plastic film or a multilayer film in which two or more layers thereof are combined can be applied as the light transmissive support. Examples of the raw material include polyethylene terephthalate (PET) and polyethylene naphthalate. Polyesters; Polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, EVA; Vinyl resins such as polyvinyl chloride and polyvinylidene chloride; Others, polyether ether ketone (PEEK), polysulfone (PSF), poly Ether sulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC), and the like can be used.

  Among these, from the viewpoint of transparency, heat resistance, ease of handling, and cost, the plastic film as the support is a polyethylene terephthalate film or cellulose triacetate film that is usually applied to silver salt photographic films (silver salt photosensitive materials). In addition, it is preferably a polyimide film or a polyester film. In particular, a polyester film is most preferable.

  Here, it is desirable that the support has high transparency. In this case, the total visible light transmittance of the light transmissive support is preferably 70 to 100%, more preferably 85 to 100%, and particularly preferably 90 to 100%.

  For example, the width of the photosensitive web 18 is preferably 50 cm or more, and the thickness is preferably 50 to 200 μm.

  Further, after exposure / development, the photosensitive web 18 is formed with a metal gold part in the exposed part, and the mass of the metal silver contained in the metal silver part is contained in the exposed part before the exposure. It is preferable that it is a content rate of 50 mass% or more with respect to the mass of 80 mass% or more. If the mass of silver contained in the exposed portion is 50% by mass or more with respect to the mass of silver contained in the exposed portion before exposure, it is preferable because high electroconductivity can be obtained in subsequent electrolytic plating treatment.

  In the apparatus and method for producing a film with a plating film according to the present embodiment described above, a film with a plating film that can form a plating film with excellent surface quality, has good thickness uniformity, and has few abnormal protrusions and dent defects. Obtainable.

  Moreover, in the manufacturing apparatus and manufacturing method of the film with a plating film of this embodiment, the light-transmitting photosensitive web 18 provided with the silver salt-containing layer is used as the material to be plated, and the silver salt-containing layer is exposed and developed. To form a desired fine-line metal silver portion as a portion to be plated. Since this fine line-shaped metallic silver part is formed by exposing and developing the silver salt-containing layer, it becomes a fine line-shaped metallic silver part patterned with very fine fine lines. When electroplating is performed on such a light-transmitting photosensitive web 18, conductive particles are supported on the fine-line metal silver portion, which becomes the conductive metal portion. For this reason, the electromagnetic wave shielding material obtained has a fine line-shaped metal part patterned with very fine fine lines and a large area light transmission part.

  As described above, in this embodiment, a thin wire pattern is easily formed on the conductive metal part, and a light-transmitting electromagnetic wave shielding material having high electromagnetic wave shielding property and high transparency at the same time and having no moire is inexpensive. Stable production in large quantities.

  In addition, in the electroplating apparatus 16 according to the present embodiment, the metal silver portion of the photosensitive web 18 is energized at the nip portion between the elastic roll 52A and the cathode power supply roll 50A, while the plating rod 60A is used as a case 64A as an anode electrode. Since the electroplating process is performed by energizing and flowing an electroplating current, the photosensitive web 18 is long and wide (for example, 50 cm or more in width), and the electric resistance (for example, 50 Ω / □ or more) of the metal silver portion as the portion to be plated. ) Is high, the conductive metal portion can be formed, that is, electroplating can be performed without causing unevenness of the thickness (plating thickness) of the conductive metal portion and unevenness of the surface roughness of the conductive metal portion (plating).

  In addition, since the electroplating process is conducted without contact with the electrode, the plating metal solution is not deposited on the electrode, improving the stability of the plating bath solution, replacing the electroplating solution, and performing the cleaning work. Can be greatly reduced, and production efficiency can be improved. Furthermore, since the photosensitive web 18 (material to be plated) uses a long and wide flexible substrate, it can be continuously subjected to electrolytic plating treatment, and further productivity can be improved.

  Here, “light transmittance” indicates that the aperture ratio of the material obtained is preferably 85% or more, more preferably 90% or more, and further preferably 95% or more. The aperture ratio indicates the ratio of the portion without fine lines formed by the conductive metal portion (mesh) to the whole. The aperture ratio of a square grid mesh having a line width of 10 μm and a pitch of 200 μm made of a conductive metal portion is 90%. It is.

  Next, in the apparatus for manufacturing a film with a plating film according to the present embodiment, the pressing force of the nip portion between the elastic roll 52A and the cathode power supply roll 50A and the elastic body layer 53 (urethane rubber in the present embodiment) of the elastic roll 52A. An experiment for examining a preferable range of hardness will be described.

  In this experiment, as shown in Table 1, the weight 55 of the elastic roll 52A is adjusted to change the pressing force of the nip portion stepwise, and the hardness of the urethane rubber is changed stepwise, from a long wide film. The transportability of the photosensitive web 18 and the occurrence of wrinkles were investigated. Here, the hardness is a value measured by ASKER C type manufactured by Kobunshi Keiki Co., Ltd.

表１では、搬送性とシワの発生の両方が満足できない場合を×、搬送性とシワの発生の片方が満足できない場合を△、搬送性とシワの発生とも問題のないレベルである場合を○、搬送性が良好でシワの発生が無い場合を◎、として評価した。

In Table 1, when both the transportability and wrinkle generation are not satisfactory, x, when the transportability and wrinkle generation are not satisfactory, △, when the transportability and wrinkle generation are at a level where there is no problem The case where the transportability was good and wrinkles were not generated was evaluated as ◎.

  As a result, it was confirmed that a nip pressing force in the range of 10 g to 400 g can be used. In particular, it has been found that the nip pressing force is preferably in the range of 20 g to 200 g. Moreover, it was confirmed that the hardness of urethane rubber can be used in the range of 10 degrees to 70 degrees. In particular, it was found that the hardness of urethane rubber is preferably in the range of 20 to 40 degrees.

  In addition, although this embodiment demonstrated the form provided with the exposure apparatus 12, the developing device 14, the electrolytic plating apparatus 16, the post-processing apparatus 17, and the winding device 19 as a manufacturing apparatus of the film with a plating film, it is not restricted to this. However, for example, a configuration in which only the electroplating apparatus 16 is configured, and the photosensitive web 18 in which the metal silver portion is formed by performing exposure and development processing in another apparatus in advance may be used.

  Moreover, although this embodiment demonstrated the manufacturing apparatus and manufacturing method of a film with a plating film, it is not restricted to this, For example, the light transmittance which has a fine wire-like pattern which consists of fine electroconductive metal parts, such as other industrial goods The present invention can also be applied as a conductive material manufacturing apparatus and manufacturing method. Similarly, the present embodiment can also be applied as an electrolytic plating apparatus and an electrolytic plating method for applying a fine fine line pattern to a decorative product or other industrial product.

  In the present embodiment, for example, Japanese Patent Application Laid-Open No. 2004-221564, Japanese Patent Application Laid-Open No. 2004-221565, and the like can be appropriately applied as conditions for 18 types of photosensitive webs and their exposure / development / plating.

It is a schematic longitudinal cross-sectional view which shows the manufacturing apparatus of the film with a plating film in one Embodiment of this invention. It is an expansion schematic longitudinal cross-sectional view of the cathode electric power feeding roll part of the electroplating apparatus used with the manufacturing apparatus shown in FIG. It is an expansion schematic perspective view of the cathode electric power feeding roll part of the electroplating apparatus used with the manufacturing apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Film production apparatus 12 with plating film Exposure apparatus 14 Development apparatus 16 Electroplating apparatus 18 Photosensitive web (film)
24 Exposure unit 26 Developing tank 28 Bleach fixing tank 30 Washing tank 32 Carrying roller pair 40A, 40B Moisture removing device 42, 44 Air knife device 50A, 50B Cathode feeding roll 52A, 52B Elastic roll 53 Elastic body layer 53A Core metal 54 Spring material 60A, 60B Electrolytic plating tank 62A Submerged rolls 64A, 64B Case 66A DC power supply 70A, 70B Jet water washing device 74 Injection device 76 Water washing water storage

Claims (12)

While transporting a film having a conductive surface, the film conductive surface is brought into contact with a cathode power supply roll, and a plating film-coated film manufacturing apparatus for forming a plating film on the film conductive surface in an electrolytic plating bath,
An apparatus for producing a film with a plating film, comprising: an elastic roll that presses and contacts the conductive surface of the film against the cathode feeding roll and conveys the film to the electrolytic plating bath.   The apparatus for producing a film with a plating film according to claim 1, wherein after the moisture on the film surface is removed, the conductive surface of the film is brought into contact with the cathode power supply roll with the elastic roll. The electrolytic plating bath is for copper plating,
After passing through the electrolytic plating bath, equipped with a plating solution removal device for removing the plating solution of the film,
The film conductive surface is washed with water by the plating solution removing device, moisture adhering to the film conductive surface is removed by moisture removing means, the film conductive surface is pressed against the cathode power supply roll by the elastic roll, and the electrolysis is performed. The apparatus for producing a film with a plating film according to claim 1 or 2, wherein the transfer to the plating bath is repeated.   4. The elastic roll according to claim 1, wherein the elastic roll is configured by forming a rubber layer having a hardness of 10 degrees to 70 degrees on an outer peripheral surface of a cored bar. 5. Production equipment for film with plating film.   The elastic roll is provided with a spring material having a damper function at both ends of the support shaft, and a pressing force for pressing the film conductive surface is adjusted by a weight attached to the spring material. The manufacturing apparatus of the film with a plating film of any one of Claim 1- Claim 4.   The thickness of the said rubber layer was 10 mm or more, The manufacturing apparatus of the film with a plating film of Claim 4 or Claim 5 characterized by the above-mentioned. An electrolytic nickel plating bath for applying nickel plating to blacken the surface of the copper plating after the copper electroplating on the film conductive surface and washing with water,
The water content adhered to the film conductive surface is removed, and then the film conductive surface is pressed against the cathode power supply roll by the elastic roll and conveyed to the electrolytic nickel plating bath. 7. The apparatus for producing a film with a plating film according to any one of 6 to 6.   8. The translucent conductive film formed by patterning the conductive metal portion and the visible light transmitting portion on the transparent support, the film with a plating film. An apparatus for producing a film with a plating film according to claim 1.   9. The plating film according to claim 8, wherein the conductive metal portion is a light-transmitting conductive film formed of a fine mesh wire having a thickness of 1 μm to 40 μm, and the mesh pattern is continuous for 3 m or more. Film production equipment.   The apparatus for producing a film with a plating film according to claim 8 or 9, wherein the conductive metal portion is developed silver obtained by developing a silver halide photographic light-sensitive material.   The said transparent support body consists of a polyimide resin or a polyester resin, The manufacturing apparatus of the film with a plating film of any one of Claim 8-10 characterized by the above-mentioned. While transporting a film having a conductive surface, the film conductive surface is brought into contact with the cathode power supply roll, and a method for producing a film with a plating film that forms a plating film on the film conductive surface in an electrolytic plating bath,
Removing moisture from the conductive surface of the film,
After pressing the elastic roll to bring the film conductive surface into contact with the cathode power supply roll,
A method for producing a film with a plating film, wherein the film conductive surface is conveyed to the electrolytic plating bath.

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