PL2171131T3 - Sposób elektroosadzania metali przy użyciu cieczy jonowych w obecności dodatku - Google Patents
Sposób elektroosadzania metali przy użyciu cieczy jonowych w obecności dodatkuInfo
- Publication number
- PL2171131T3 PL2171131T3 PL08786597T PL08786597T PL2171131T3 PL 2171131 T3 PL2171131 T3 PL 2171131T3 PL 08786597 T PL08786597 T PL 08786597T PL 08786597 T PL08786597 T PL 08786597T PL 2171131 T3 PL2171131 T3 PL 2171131T3
- Authority
- PL
- Poland
- Prior art keywords
- metal
- additive
- ionic liquid
- ionic liquids
- electrodeposit metals
- Prior art date
Links
- 239000002184 metal Substances 0.000 title abstract 8
- 229910052751 metal Inorganic materials 0.000 title abstract 8
- 239000002608 ionic liquid Substances 0.000 title abstract 5
- 239000000654 additive Substances 0.000 title abstract 3
- 230000000996 additive effect Effects 0.000 title abstract 3
- 239000002659 electrodeposit Substances 0.000 title 1
- 150000002739 metals Chemical class 0.000 title 1
- 239000003792 electrolyte Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Catalysts (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07113717 | 2007-08-02 | ||
| US95443407P | 2007-08-07 | 2007-08-07 | |
| PCT/EP2008/059962 WO2009016189A1 (en) | 2007-08-02 | 2008-07-30 | Method to electrodeposit metals using ionic liquids in the presence of an additive |
| EP08786597A EP2171131B1 (en) | 2007-08-02 | 2008-07-30 | Method to electrodeposit metals using ionic liquids in the presence of an additive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2171131T3 true PL2171131T3 (pl) | 2011-05-31 |
Family
ID=38870310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL08786597T PL2171131T3 (pl) | 2007-08-02 | 2008-07-30 | Sposób elektroosadzania metali przy użyciu cieczy jonowych w obecności dodatku |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20100252446A1 (pl) |
| EP (1) | EP2171131B1 (pl) |
| JP (1) | JP2010535283A (pl) |
| CN (1) | CN101765681B (pl) |
| AT (1) | ATE493523T1 (pl) |
| CA (1) | CA2695488A1 (pl) |
| DE (1) | DE602008004255D1 (pl) |
| ES (1) | ES2358967T3 (pl) |
| PL (1) | PL2171131T3 (pl) |
| TW (1) | TWI359880B (pl) |
| WO (1) | WO2009016189A1 (pl) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2408950A4 (en) | 2009-03-17 | 2015-05-20 | Commw Scient Ind Res Org | ELECTRO-RECOVERY OF METALS |
| DE102009035660A1 (de) | 2009-07-30 | 2011-02-03 | Ewald Dörken Ag | Verfahren zur elektrochemischen Beschichtung eines Werkstücks |
| US20120189778A1 (en) * | 2011-01-26 | 2012-07-26 | Riewe Curtis H | Coating method using ionic liquid |
| CN102888630B (zh) * | 2011-07-20 | 2015-11-18 | 中国科学院过程工程研究所 | 一种离子液体/添加剂体系低温电沉积制备纳米铝或纳米铝镀层的方法 |
| US9758884B2 (en) * | 2012-02-16 | 2017-09-12 | Stacey Hingley | Color control of trivalent chromium deposits |
| DE102012104707A1 (de) * | 2012-05-31 | 2013-12-05 | Benteler Automobiltechnik Gmbh | Verfahren zum Herstellen eines Abgaswärmetauschers |
| PL2859138T3 (pl) | 2012-06-08 | 2017-05-31 | Onderzoekscentrum Voor Aanwending Van Staal N.V. | Sposób wytwarzania powłoki metalowej |
| CN102839403B (zh) * | 2012-09-10 | 2015-02-25 | 太原理工大学 | 一种离子液体中电镀铝的方法 |
| CN103484900A (zh) * | 2013-09-18 | 2014-01-01 | 湖南工业大学 | 一种离子液体中直接电沉积晶态纳米晶无微裂纹铬镀层的方法 |
| EP3080321B1 (en) | 2013-12-10 | 2019-07-31 | United Technologies Corporation | Method for electrodepositing a nickel-chromium alloy |
| US10669851B2 (en) | 2013-12-10 | 2020-06-02 | Raytheon Technologies Corporation | Nickel-chromium-aluminum composite by electrodeposition |
| EP3080323B1 (en) | 2013-12-11 | 2019-05-15 | United Technologies Corporation | Electroformed nickel-chromium alloy |
| CN104294327B (zh) * | 2014-10-20 | 2016-07-13 | 中国科学院过程工程研究所 | 一种离子液体电解液及用该电解液制备光亮铝镀层的方法 |
| CN105220216B (zh) * | 2015-09-28 | 2017-08-25 | 中国科学院兰州化学物理研究所 | 一种铝或铝合金电化学抛光方法 |
| TWI662162B (zh) * | 2016-11-15 | 2019-06-11 | 財團法人工業技術研究院 | 一種電鍍方法及其系統 |
| JP7072796B2 (ja) * | 2018-02-19 | 2022-05-23 | 国立大学法人 名古屋工業大学 | 調光部材 |
| US20210156041A1 (en) * | 2019-11-22 | 2021-05-27 | Hamilton Sundstrand Corporation | Metallic coating and method of application |
| US12050389B2 (en) | 2020-10-23 | 2024-07-30 | The Regents Of The University Of Colorado, A Body Corporate | Electrolyte additive for controlling morphology and optics of reversible metal films |
| CN118028962B (zh) * | 2024-02-23 | 2024-12-10 | 广东倍亮科技有限公司 | 离子液体在金属固体电解抛光中的应用 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5265120A (en) * | 1975-11-26 | 1977-05-30 | Sony Corp | Electro plating method of aluminium or aluminium alloy |
| JPH01132571A (ja) * | 1987-11-18 | 1989-05-25 | Aguro Kanesho Kk | 農園芸用殺菌剤 |
| GB0023708D0 (en) * | 2000-09-27 | 2000-11-08 | Scionix Ltd | Hydrated salt mixtures |
| GB0023706D0 (en) * | 2000-09-27 | 2000-11-08 | Scionix Ltd | Ionic liquids |
| US6552843B1 (en) * | 2002-01-31 | 2003-04-22 | Innovative Technology Licensing Llc | Reversible electrodeposition device with ionic liquid electrolyte |
| US20050205425A1 (en) * | 2002-06-25 | 2005-09-22 | Integran Technologies | Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| US6721080B1 (en) * | 2002-09-27 | 2004-04-13 | D Morgan Tench | Optimum switching of a reversible electrochemical mirror device |
| US6798556B2 (en) * | 2003-01-31 | 2004-09-28 | Rockwell Scientific Licensing, Llc. | Locally-switched reversible electrodeposition optical modulator |
| DE102004059520A1 (de) * | 2004-12-10 | 2006-06-14 | Merck Patent Gmbh | Elektrochemische Abscheidung von Tantal und/oder Kupfer in ionischen Flüssigkeiten |
| US7320832B2 (en) * | 2004-12-17 | 2008-01-22 | Integran Technologies Inc. | Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate |
| JP2007070698A (ja) * | 2005-09-07 | 2007-03-22 | Kyoto Univ | 金属の電析方法 |
| WO2007093574A2 (en) * | 2006-02-15 | 2007-08-23 | Akzo Nobel N.V. | Method to electrodeposit metals using ionic liquids |
-
2008
- 2008-07-30 CA CA2695488A patent/CA2695488A1/en not_active Abandoned
- 2008-07-30 CN CN2008801010499A patent/CN101765681B/zh not_active Expired - Fee Related
- 2008-07-30 AT AT08786597T patent/ATE493523T1/de active
- 2008-07-30 ES ES08786597T patent/ES2358967T3/es active Active
- 2008-07-30 PL PL08786597T patent/PL2171131T3/pl unknown
- 2008-07-30 JP JP2010518655A patent/JP2010535283A/ja active Pending
- 2008-07-30 EP EP08786597A patent/EP2171131B1/en not_active Not-in-force
- 2008-07-30 WO PCT/EP2008/059962 patent/WO2009016189A1/en not_active Ceased
- 2008-07-30 DE DE602008004255T patent/DE602008004255D1/de active Active
- 2008-07-30 US US12/671,830 patent/US20100252446A1/en not_active Abandoned
- 2008-08-01 TW TW097129448A patent/TWI359880B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| HK1143194A1 (en) | 2010-12-24 |
| CN101765681A (zh) | 2010-06-30 |
| EP2171131B1 (en) | 2010-12-29 |
| TWI359880B (en) | 2012-03-11 |
| CN101765681B (zh) | 2013-03-20 |
| JP2010535283A (ja) | 2010-11-18 |
| WO2009016189A1 (en) | 2009-02-05 |
| EP2171131A1 (en) | 2010-04-07 |
| ATE493523T1 (de) | 2011-01-15 |
| CA2695488A1 (en) | 2009-02-05 |
| ES2358967T3 (es) | 2011-05-17 |
| DE602008004255D1 (de) | 2011-02-10 |
| TW200925334A (en) | 2009-06-16 |
| US20100252446A1 (en) | 2010-10-07 |
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