ATE394381T1 - Saures bad zur elektrolytischen abscheidung eines kupferniederschlags, enthaltend halogenierte oder pseudohalogenierte monomere phenaziniumverbindungen - Google Patents

Saures bad zur elektrolytischen abscheidung eines kupferniederschlags, enthaltend halogenierte oder pseudohalogenierte monomere phenaziniumverbindungen

Info

Publication number
ATE394381T1
ATE394381T1 AT04797858T AT04797858T ATE394381T1 AT E394381 T1 ATE394381 T1 AT E394381T1 AT 04797858 T AT04797858 T AT 04797858T AT 04797858 T AT04797858 T AT 04797858T AT E394381 T1 ATE394381 T1 AT E394381T1
Authority
AT
Austria
Prior art keywords
compounds
electrolytic deposition
copper deposit
containing halogenated
acidic bath
Prior art date
Application number
AT04797858T
Other languages
English (en)
Inventor
Heiko Brunner
Wolfgang Dahms
Udo Grieser
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE394381T1 publication Critical patent/ATE394381T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D241/00—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings
    • C07D241/36—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems
    • C07D241/38—Heterocyclic compounds containing 1,4-diazine or hydrogenated 1,4-diazine rings condensed with carbocyclic rings or ring systems with only hydrogen or carbon atoms directly attached to the ring nitrogen atoms
    • C07D241/46—Phenazines
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
AT04797858T 2003-11-19 2004-11-09 Saures bad zur elektrolytischen abscheidung eines kupferniederschlags, enthaltend halogenierte oder pseudohalogenierte monomere phenaziniumverbindungen ATE394381T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10354860A DE10354860B4 (de) 2003-11-19 2003-11-19 Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages

Publications (1)

Publication Number Publication Date
ATE394381T1 true ATE394381T1 (de) 2008-05-15

Family

ID=34609250

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04797858T ATE394381T1 (de) 2003-11-19 2004-11-09 Saures bad zur elektrolytischen abscheidung eines kupferniederschlags, enthaltend halogenierte oder pseudohalogenierte monomere phenaziniumverbindungen

Country Status (13)

Country Link
US (1) US7786303B2 (de)
EP (1) EP1720842B1 (de)
JP (1) JP4898450B2 (de)
KR (1) KR101168778B1 (de)
CN (1) CN1882550B (de)
AT (1) ATE394381T1 (de)
BR (1) BRPI0416778A (de)
CA (1) CA2542356A1 (de)
DE (2) DE10354860B4 (de)
ES (1) ES2305876T3 (de)
MY (1) MY144228A (de)
TW (1) TWI380982B (de)
WO (1) WO2005049584A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2886643B1 (fr) * 2005-06-06 2007-09-14 Daniel Michelet Nouveau type de jonction moleculaire entre semi-conducteur et un metal
JP4531777B2 (ja) * 2007-01-18 2010-08-25 日本メクトロン株式会社 プリント配線板のめっき前処理方法
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
JP5442188B2 (ja) * 2007-08-10 2014-03-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 銅めっき液組成物
JP2009041097A (ja) * 2007-08-10 2009-02-26 Rohm & Haas Electronic Materials Llc 銅めっき方法
KR101022923B1 (ko) 2008-05-06 2011-03-16 삼성전기주식회사 금속 도금액 중 고분자 첨가제의 정성 분석방법 및분석장치
WO2010112545A1 (en) 2009-04-01 2010-10-07 Basf Se Isoxazoline compounds for combating invertebrate pests
US8309382B2 (en) * 2009-10-29 2012-11-13 Advantest America, Inc. Multi material secondary metallization scheme in MEMS fabrication
KR20140050541A (ko) * 2012-10-18 2014-04-29 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
WO2014061983A1 (ko) * 2012-10-18 2014-04-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
JP2016138301A (ja) * 2015-01-26 2016-08-04 住友金属鉱山株式会社 樹枝状銅粉の製造方法、及びそれを用いた導電性銅ペースト、導電性塗料、導電性シート
JP5907301B1 (ja) * 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
JP5907302B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
CN106558654B (zh) * 2015-09-30 2020-01-14 北京鼎材科技有限公司 一种苯并吩嗪衍生物及其在有机电致发光器件中的应用
CN109900654B (zh) * 2019-04-08 2021-05-18 西北师范大学 水溶性吩嗪染料在识别和吸附去除水样中铜离子的应用
CN111235593B (zh) * 2019-09-26 2020-10-16 南京理工大学 一种仲胺的氮亚硝化产物的合成方法
CN110724983B (zh) * 2019-10-12 2022-02-08 天津大学 一种利用脉冲电沉积法制备纳米铜包覆碳化钨核壳结构粉体的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE520209A (de) * 1952-05-26
NL291575A (de) 1962-04-16
GB1295286A (de) * 1969-06-10 1972-11-08
DE2028803C3 (de) 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymere Phenazoniumverbindungen
JPS6056086A (ja) * 1983-09-06 1985-04-01 Hodogaya Chem Co Ltd 銅メツキ浴
US4647525A (en) * 1984-10-01 1987-03-03 Minnesota Mining And Manufacturing Company Stabilized leuco phenazine dyes and their use in an imaging system
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten

Also Published As

Publication number Publication date
TW200533658A (en) 2005-10-16
DE10354860A1 (de) 2005-07-07
MY144228A (en) 2011-08-15
KR20060121211A (ko) 2006-11-28
US20070108062A1 (en) 2007-05-17
CN1882550A (zh) 2006-12-20
JP2007511562A (ja) 2007-05-10
JP4898450B2 (ja) 2012-03-14
US7786303B2 (en) 2010-08-31
BRPI0416778A (pt) 2007-02-27
KR101168778B1 (ko) 2012-07-25
DE10354860B4 (de) 2008-06-26
ES2305876T3 (es) 2008-11-01
CA2542356A1 (en) 2005-06-02
EP1720842A1 (de) 2006-11-15
TWI380982B (zh) 2013-01-01
DE602004013640D1 (de) 2008-06-19
EP1720842B1 (de) 2008-05-07
CN1882550B (zh) 2012-04-18
WO2005049584A1 (en) 2005-06-02

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