HK1143194A1 - Method to electrodeposit metals using ionic liquids in the presence of an additive - Google Patents
Method to electrodeposit metals using ionic liquids in the presence of an additiveInfo
- Publication number
- HK1143194A1 HK1143194A1 HK10109690.2A HK10109690A HK1143194A1 HK 1143194 A1 HK1143194 A1 HK 1143194A1 HK 10109690 A HK10109690 A HK 10109690A HK 1143194 A1 HK1143194 A1 HK 1143194A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- metal
- additive
- ionic liquid
- ionic liquids
- electrodeposit metals
- Prior art date
Links
- 239000002184 metal Substances 0.000 title abstract 8
- 229910052751 metal Inorganic materials 0.000 title abstract 8
- 239000002608 ionic liquid Substances 0.000 title abstract 5
- 239000000654 additive Substances 0.000 title abstract 3
- 230000000996 additive effect Effects 0.000 title abstract 3
- 239000002659 electrodeposit Substances 0.000 title 1
- 150000002739 metals Chemical class 0.000 title 1
- 239000003792 electrolyte Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
Abstract
The present invention pertains to the use of an additive selected from the group consisting of amorphous silica, graphite powder, and a mixture thereof in a process to electroplate or electropolish a metal on a substrate using an ionic liquid as the electrolyte to increase metal layer thickness. It furthermore pertains to a method to electroplate or electropolish a metal on a metal substrate wherein an ionic liquid is employed as electrolyte, wherein a metal salt added to said ionic liquid or a metal anode is employed as metal source, and wherein said ionic liquid comprises said additive.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07113717 | 2007-08-02 | ||
US95443407P | 2007-08-07 | 2007-08-07 | |
PCT/EP2008/059962 WO2009016189A1 (en) | 2007-08-02 | 2008-07-30 | Method to electrodeposit metals using ionic liquids in the presence of an additive |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1143194A1 true HK1143194A1 (en) | 2010-12-24 |
Family
ID=38870310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK10109690.2A HK1143194A1 (en) | 2007-08-02 | 2010-10-13 | Method to electrodeposit metals using ionic liquids in the presence of an additive |
Country Status (12)
Country | Link |
---|---|
US (1) | US20100252446A1 (en) |
EP (1) | EP2171131B1 (en) |
JP (1) | JP2010535283A (en) |
CN (1) | CN101765681B (en) |
AT (1) | ATE493523T1 (en) |
CA (1) | CA2695488A1 (en) |
DE (1) | DE602008004255D1 (en) |
ES (1) | ES2358967T3 (en) |
HK (1) | HK1143194A1 (en) |
PL (1) | PL2171131T3 (en) |
TW (1) | TWI359880B (en) |
WO (1) | WO2009016189A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2010225457B2 (en) * | 2009-03-17 | 2015-08-20 | Commonwealth Scientific And Industrial Research Organisation | Electrorecovery of metals |
DE102009035660A1 (en) | 2009-07-30 | 2011-02-03 | Ewald Dörken Ag | Process for the electrochemical coating of a workpiece |
US20120189778A1 (en) * | 2011-01-26 | 2012-07-26 | Riewe Curtis H | Coating method using ionic liquid |
CN102888630B (en) * | 2011-07-20 | 2015-11-18 | 中国科学院过程工程研究所 | A kind of ionic liquid/additive system Low-temperature electro-deposition prepares the method for nano aluminum or nano aluminum coating |
US9758884B2 (en) | 2012-02-16 | 2017-09-12 | Stacey Hingley | Color control of trivalent chromium deposits |
DE102012104707A1 (en) * | 2012-05-31 | 2013-12-05 | Benteler Automobiltechnik Gmbh | Method for producing an exhaust gas heat exchanger |
WO2013182631A1 (en) | 2012-06-08 | 2013-12-12 | Onderzoekscentrum Voor Aanwending Van Staal N.V. | Method for producing a metal coating |
CN102839403B (en) * | 2012-09-10 | 2015-02-25 | 太原理工大学 | Method for electroplating aluminum in ionic liquid |
CN103484900A (en) * | 2013-09-18 | 2014-01-01 | 湖南工业大学 | Method for preparing crystalline nanocrystal micro-crack-free chromium coating in ionic liquid in direct electro-deposition mode |
EP3080338B1 (en) | 2013-12-10 | 2018-10-03 | Lei Chen | Nickel-chromium-aluminum composite by electrodeposition |
US10669867B2 (en) | 2013-12-10 | 2020-06-02 | Raytheon Technologies Corporation | Electrodeposited nickel-chromium alloy |
EP3080323B1 (en) * | 2013-12-11 | 2019-05-15 | United Technologies Corporation | Electroformed nickel-chromium alloy |
CN104294327B (en) * | 2014-10-20 | 2016-07-13 | 中国科学院过程工程研究所 | A kind of il electrolyte and the method preparing light aluminium coat with this electrolyte |
CN105220216B (en) * | 2015-09-28 | 2017-08-25 | 中国科学院兰州化学物理研究所 | A kind of aluminum or aluminum alloy electrochemical polishing method |
TWI662162B (en) * | 2016-11-15 | 2019-06-11 | 財團法人工業技術研究院 | Electroplating method and system thereof |
JP7072796B2 (en) * | 2018-02-19 | 2022-05-23 | 国立大学法人 名古屋工業大学 | Dimming member |
US20210156041A1 (en) * | 2019-11-22 | 2021-05-27 | Hamilton Sundstrand Corporation | Metallic coating and method of application |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5265120A (en) * | 1975-11-26 | 1977-05-30 | Sony Corp | Electro plating method of aluminium or aluminium alloy |
JPH01132571A (en) * | 1987-11-18 | 1989-05-25 | Aguro Kanesho Kk | Agricultural and horticultural fungicide |
GB0023706D0 (en) * | 2000-09-27 | 2000-11-08 | Scionix Ltd | Ionic liquids |
GB0023708D0 (en) * | 2000-09-27 | 2000-11-08 | Scionix Ltd | Hydrated salt mixtures |
US6552843B1 (en) * | 2002-01-31 | 2003-04-22 | Innovative Technology Licensing Llc | Reversible electrodeposition device with ionic liquid electrolyte |
US20050205425A1 (en) * | 2002-06-25 | 2005-09-22 | Integran Technologies | Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
US6721080B1 (en) * | 2002-09-27 | 2004-04-13 | D Morgan Tench | Optimum switching of a reversible electrochemical mirror device |
US6798556B2 (en) * | 2003-01-31 | 2004-09-28 | Rockwell Scientific Licensing, Llc. | Locally-switched reversible electrodeposition optical modulator |
DE102004059520A1 (en) * | 2004-12-10 | 2006-06-14 | Merck Patent Gmbh | Electrochemical deposition of tantalum and / or copper in ionic liquids |
US7320832B2 (en) * | 2004-12-17 | 2008-01-22 | Integran Technologies Inc. | Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate |
JP2007070698A (en) * | 2005-09-07 | 2007-03-22 | Kyoto Univ | Method for electrodepositing metal |
JP5134553B2 (en) * | 2006-02-15 | 2013-01-30 | アクゾ ノーベル ナムローゼ フェンノートシャップ | Metal electrodeposition using ionic liquid |
-
2008
- 2008-07-30 AT AT08786597T patent/ATE493523T1/en active
- 2008-07-30 US US12/671,830 patent/US20100252446A1/en not_active Abandoned
- 2008-07-30 ES ES08786597T patent/ES2358967T3/en active Active
- 2008-07-30 WO PCT/EP2008/059962 patent/WO2009016189A1/en active Application Filing
- 2008-07-30 EP EP08786597A patent/EP2171131B1/en not_active Not-in-force
- 2008-07-30 CN CN2008801010499A patent/CN101765681B/en not_active Expired - Fee Related
- 2008-07-30 CA CA2695488A patent/CA2695488A1/en not_active Abandoned
- 2008-07-30 DE DE602008004255T patent/DE602008004255D1/en active Active
- 2008-07-30 PL PL08786597T patent/PL2171131T3/en unknown
- 2008-07-30 JP JP2010518655A patent/JP2010535283A/en active Pending
- 2008-08-01 TW TW097129448A patent/TWI359880B/en not_active IP Right Cessation
-
2010
- 2010-10-13 HK HK10109690.2A patent/HK1143194A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE493523T1 (en) | 2011-01-15 |
ES2358967T3 (en) | 2011-05-17 |
TWI359880B (en) | 2012-03-11 |
CN101765681A (en) | 2010-06-30 |
EP2171131B1 (en) | 2010-12-29 |
DE602008004255D1 (en) | 2011-02-10 |
PL2171131T3 (en) | 2011-05-31 |
CA2695488A1 (en) | 2009-02-05 |
CN101765681B (en) | 2013-03-20 |
TW200925334A (en) | 2009-06-16 |
WO2009016189A1 (en) | 2009-02-05 |
EP2171131A1 (en) | 2010-04-07 |
JP2010535283A (en) | 2010-11-18 |
US20100252446A1 (en) | 2010-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20170730 |