WO2009077146A3 - Galvanisches bad, verfahren zur galvanischen abscheidung und verwendung einer bipolaren membran zur separation in einem galvanischen bad - Google Patents
Galvanisches bad, verfahren zur galvanischen abscheidung und verwendung einer bipolaren membran zur separation in einem galvanischen bad Download PDFInfo
- Publication number
- WO2009077146A3 WO2009077146A3 PCT/EP2008/010635 EP2008010635W WO2009077146A3 WO 2009077146 A3 WO2009077146 A3 WO 2009077146A3 EP 2008010635 W EP2008010635 W EP 2008010635W WO 2009077146 A3 WO2009077146 A3 WO 2009077146A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- galvanic
- zinc
- bath
- galvanic bath
- separating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Cosmetics (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08861431A EP2235236B1 (de) | 2007-12-14 | 2008-12-15 | Galvanisches bad, verfahren zur galvanischen abscheidung und verwendung einer bipolaren membran zur separation in einem galvanischen bad |
ES08861431T ES2396801T3 (es) | 2007-12-14 | 2008-12-15 | Baño galvánico, procedimiento para la deposición galvánica y uso de una membrana bipolar para la separación en un baño galvánico |
PL08861431T PL2235236T3 (pl) | 2007-12-14 | 2008-12-15 | Kąpiel galwaniczna, sposób galwanicznego osadzania i zastosowanie bipolarnej membrany do separacji w kąpieli galwanicznej |
BRPI0820988A BRPI0820988B1 (pt) | 2007-12-14 | 2008-12-15 | banho galvânico, processo para a separação galvânica e emprego de um diafragma bipolar para a separação em um banho galvânico e emprego de um diafragma bipolar para evitar a decomposição anódica |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007060200.8 | 2007-12-14 | ||
DE102007060200A DE102007060200A1 (de) | 2007-12-14 | 2007-12-14 | Galvanisches Bad, Verfahren zur galvanischen Abscheidung und Verwendung einer bipolaren Membran zur Separation in einem galvanischen Bad |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009077146A2 WO2009077146A2 (de) | 2009-06-25 |
WO2009077146A3 true WO2009077146A3 (de) | 2010-01-14 |
Family
ID=40394014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/010635 WO2009077146A2 (de) | 2007-12-14 | 2008-12-15 | Galvanisches bad, verfahren zur galvanischen abscheidung und verwendung einer bipolaren membran zur separation in einem galvanischen bad |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2235236B1 (de) |
BR (1) | BRPI0820988B1 (de) |
DE (1) | DE102007060200A1 (de) |
ES (1) | ES2396801T3 (de) |
PL (1) | PL2235236T3 (de) |
WO (1) | WO2009077146A2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2489763A1 (de) * | 2011-02-15 | 2012-08-22 | Atotech Deutschland GmbH | Zink-Eisen-Legierungsschichtmaterial |
JP5805055B2 (ja) * | 2012-11-24 | 2015-11-04 | 丸仲工業株式会社 | 水平搬送式電解メッキ装置 |
JP5995906B2 (ja) | 2014-05-19 | 2016-09-21 | 株式会社豊田中央研究所 | 隔膜の製造方法、及び金属被膜の製造方法 |
WO2016075964A1 (ja) | 2015-07-22 | 2016-05-19 | ディップソール株式会社 | 亜鉛合金めっき方法 |
KR101622527B1 (ko) | 2015-07-22 | 2016-05-18 | 딥솔 가부시키가이샤 | 아연 합금 도금 방법 |
CN106987879A (zh) * | 2016-11-23 | 2017-07-28 | 瑞尔太阳能投资有限公司 | 电沉积装置及其电沉积方法 |
EP3696299A1 (de) * | 2019-02-15 | 2020-08-19 | Coventya GmbH | Verfahren zur herstellung eines korrosionsbeständigen aluminium-silicium-legierungs-gusses, korrosionsbeständiger aluminium-silicium-legierungs-guss und dessen verwendung |
CN111663167A (zh) * | 2020-06-16 | 2020-09-15 | 合肥工业大学 | 一种基于bpe技术的金属线制备方法 |
CN113025829B (zh) * | 2021-04-26 | 2022-12-06 | 福建师范大学 | 一种应用双极膜电渗析处理铜矿石冶炼废渣的方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4122543A1 (de) * | 1991-03-18 | 1992-10-08 | Hans Josef May | Verfahren zur elektrochemischen beschichtung von metallbaendern |
WO2001096631A1 (en) * | 2000-06-15 | 2001-12-20 | Taskem Inc. | Zinc-nickel electroplating |
US20020160222A1 (en) * | 2001-02-28 | 2002-10-31 | Man Hau-Chung | Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles |
US20030089622A1 (en) * | 1999-12-22 | 2003-05-15 | Henuset Yves Michel | Electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths |
GB2383337A (en) * | 2001-12-21 | 2003-06-25 | Accentus Plc | Electroplating plant and method |
US20050189231A1 (en) * | 2004-02-26 | 2005-09-01 | Capper Lee D. | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
US20050274620A1 (en) * | 2004-06-15 | 2005-12-15 | Kovarsky Nicolay Y | Copper replenishment system for interconnect applications |
US20060173084A1 (en) * | 2004-06-25 | 2006-08-03 | Yongchang Zheng | Bipolar membrane and method of making same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29615084U1 (de) * | 1996-08-29 | 1996-10-24 | Ko, Chien-Hsin, Taipeh/T`ai-pei | Vorrichtung zum kontinuierlichen Galvanisieren von Platten |
DE19834353C2 (de) | 1998-07-30 | 2000-08-17 | Hillebrand Walter Gmbh & Co Kg | Alkalisches Zink-Nickelbad |
DE10225203A1 (de) | 2002-06-06 | 2003-12-18 | Goema Ag | Verfahren und Vorrichtung zur Spülwasserrückführung und Reinigung eines Prozessbades |
-
2007
- 2007-12-14 DE DE102007060200A patent/DE102007060200A1/de not_active Ceased
-
2008
- 2008-12-15 EP EP08861431A patent/EP2235236B1/de active Active
- 2008-12-15 WO PCT/EP2008/010635 patent/WO2009077146A2/de active Application Filing
- 2008-12-15 PL PL08861431T patent/PL2235236T3/pl unknown
- 2008-12-15 ES ES08861431T patent/ES2396801T3/es active Active
- 2008-12-15 BR BRPI0820988A patent/BRPI0820988B1/pt active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4122543A1 (de) * | 1991-03-18 | 1992-10-08 | Hans Josef May | Verfahren zur elektrochemischen beschichtung von metallbaendern |
US20030089622A1 (en) * | 1999-12-22 | 2003-05-15 | Henuset Yves Michel | Electrochemical cell and process for reducing the amount of organic contaminants in metal plating baths |
WO2001096631A1 (en) * | 2000-06-15 | 2001-12-20 | Taskem Inc. | Zinc-nickel electroplating |
US20020160222A1 (en) * | 2001-02-28 | 2002-10-31 | Man Hau-Chung | Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles |
GB2383337A (en) * | 2001-12-21 | 2003-06-25 | Accentus Plc | Electroplating plant and method |
US20050189231A1 (en) * | 2004-02-26 | 2005-09-01 | Capper Lee D. | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
US20050274620A1 (en) * | 2004-06-15 | 2005-12-15 | Kovarsky Nicolay Y | Copper replenishment system for interconnect applications |
US20060173084A1 (en) * | 2004-06-25 | 2006-08-03 | Yongchang Zheng | Bipolar membrane and method of making same |
Also Published As
Publication number | Publication date |
---|---|
EP2235236A2 (de) | 2010-10-06 |
DE102007060200A1 (de) | 2009-06-18 |
ES2396801T3 (es) | 2013-02-27 |
BRPI0820988A2 (pt) | 2015-08-04 |
BRPI0820988B1 (pt) | 2018-12-04 |
PL2235236T3 (pl) | 2013-03-29 |
EP2235236B1 (de) | 2012-10-03 |
WO2009077146A2 (de) | 2009-06-25 |
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