JP2009534525A - 電解コーティング装置及び電解コーティング方法 - Google Patents

電解コーティング装置及び電解コーティング方法 Download PDF

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Publication number
JP2009534525A
JP2009534525A JP2009505839A JP2009505839A JP2009534525A JP 2009534525 A JP2009534525 A JP 2009534525A JP 2009505839 A JP2009505839 A JP 2009505839A JP 2009505839 A JP2009505839 A JP 2009505839A JP 2009534525 A JP2009534525 A JP 2009534525A
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Japan
Prior art keywords
support
conductive
disk
shaft
contact
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JP2009505839A
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English (en)
Japanese (ja)
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JP2009534525A5 (fr
Inventor
ロホトマン，レネ
カクツン，ユルゲン
シュナイダー，ノルベルト
プフィスター，ユルゲン
ポール，ゲルト
ヴァーグナー，ノルベルト
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BASF SE
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BASF SE
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Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of JP2009534525A publication Critical patent/JP2009534525A/ja
Publication of JP2009534525A5 publication Critical patent/JP2009534525A5/ja
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2009505839A 2006-04-18 2007-04-05 電解コーティング装置及び電解コーティング方法 Withdrawn JP2009534525A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112724 2006-04-18
PCT/EP2007/053401 WO2007118810A2 (fr) 2006-04-18 2007-04-05 Procédé et dispositif de revêtement galvanique

Publications (2)

Publication Number Publication Date
JP2009534525A true JP2009534525A (ja) 2009-09-24
JP2009534525A5 JP2009534525A5 (fr) 2010-05-06

Family

ID=38236501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009505839A Withdrawn JP2009534525A (ja) 2006-04-18 2007-04-05 電解コーティング装置及び電解コーティング方法

Country Status (13)

Country Link
US (1) US20090178930A1 (fr)
EP (1) EP2010700B1 (fr)
JP (1) JP2009534525A (fr)
KR (1) KR20080110658A (fr)
CN (1) CN101426962A (fr)
AT (1) ATE455879T1 (fr)
BR (1) BRPI0710662A2 (fr)
CA (1) CA2647969A1 (fr)
DE (1) DE502007002680D1 (fr)
IL (1) IL194505A0 (fr)
RU (1) RU2008145105A (fr)
TW (1) TW200813263A (fr)
WO (1) WO2007118810A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
CN101970720B (zh) * 2008-03-13 2014-10-15 巴斯夫欧洲公司 施加金属层至基质的方法和分散体及可金属化热塑性模塑组合物
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
EP2799939A1 (fr) * 2013-04-30 2014-11-05 Universo S.A. Support pour le traitement de pièces de micromécanique
CN103343371A (zh) * 2013-07-09 2013-10-09 中国铝业股份有限公司 一种聚合物薄膜的连续电沉积方法
JP5967034B2 (ja) * 2013-08-20 2016-08-10 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
US9847576B2 (en) * 2013-11-11 2017-12-19 Nxp B.V. UHF-RFID antenna for point of sales application
JP6197813B2 (ja) * 2015-03-11 2017-09-20 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
RU2643050C2 (ru) * 2015-11-09 2018-01-30 Фарит Фазитович Мухамедьянов Кислотный поверхностно-активный состав для обработки призабойной зоны нефтяных и газовых скважин
EP3884084A4 (fr) * 2018-11-22 2022-08-24 A-Plas Genel Otomotiv Mamulleri Sanayi Ve Ticaret Anonim Sirketi Dispositif de suspension de placage pour obtenir un placage homogène
CN114790565B (zh) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1437003A (en) * 1921-10-08 1922-11-28 American Nickeloid Company Electroplating apparatus and process
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
WO2003038158A2 (fr) * 2001-10-25 2003-05-08 Infineon Technologies Ag Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Also Published As

Publication number Publication date
KR20080110658A (ko) 2008-12-18
IL194505A0 (en) 2009-08-03
CN101426962A (zh) 2009-05-06
CA2647969A1 (fr) 2007-10-25
EP2010700A2 (fr) 2009-01-07
ATE455879T1 (de) 2010-02-15
EP2010700B1 (fr) 2010-01-20
DE502007002680D1 (de) 2010-03-11
US20090178930A1 (en) 2009-07-16
RU2008145105A (ru) 2010-05-27
WO2007118810A3 (fr) 2008-05-22
TW200813263A (en) 2008-03-16
WO2007118810A2 (fr) 2007-10-25
BRPI0710662A2 (pt) 2011-08-16

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