WO2007118810A2 - Procédé et dispositif de revêtement galvanique - Google Patents

Procédé et dispositif de revêtement galvanique Download PDF

Info

Publication number
WO2007118810A2
WO2007118810A2 PCT/EP2007/053401 EP2007053401W WO2007118810A2 WO 2007118810 A2 WO2007118810 A2 WO 2007118810A2 EP 2007053401 W EP2007053401 W EP 2007053401W WO 2007118810 A2 WO2007118810 A2 WO 2007118810A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electrically conductive
discs
disks
shaft
Prior art date
Application number
PCT/EP2007/053401
Other languages
German (de)
English (en)
Other versions
WO2007118810A3 (fr
Inventor
Rene Lochtman
Jürgen Kaczun
Norbert Schneider
Jürgen PFISTER
Gert Pohl
Norbert Wagner
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Priority to AT07727869T priority Critical patent/ATE455879T1/de
Priority to US12/297,330 priority patent/US20090178930A1/en
Priority to BRPI0710662-9A priority patent/BRPI0710662A2/pt
Priority to JP2009505839A priority patent/JP2009534525A/ja
Priority to EP07727869A priority patent/EP2010700B1/fr
Priority to CA002647969A priority patent/CA2647969A1/fr
Priority to DE502007002680T priority patent/DE502007002680D1/de
Publication of WO2007118810A2 publication Critical patent/WO2007118810A2/fr
Publication of WO2007118810A3 publication Critical patent/WO2007118810A3/fr
Priority to IL194505A priority patent/IL194505A0/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls

Definitions

  • the invention relates to a device for electroplating at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a non-conductive substrate, which comprises at least one bath, an anode and a cathode, wherein the bath contains an electrolyte solution containing at least one metal salt, are deposited from the metal ions on electrically conductive surfaces of the substrate to form a metal layer.
  • the invention further relates to a process for the galvanic coating of at least one substrate, which is carried out in a device designed according to the invention.
  • Galvanic coating methods are used, for example, to coat electrically conductive substrates or structured or full-area electrically conductive surfaces on non-conductive substrates. With these methods, it is possible, for example, to produce conductor tracks on printed circuit boards, RFID antennas, flat cables, thin metal foils, conductor tracks on solar cells, and to galvanically coat other products, such as two- or three-dimensional objects, for example plastic molded parts.
  • DE-B 103 42 512 discloses an apparatus and a method for the electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of band-shaped material to be treated.
  • the material to be treated is conveyed continuously on a transport path and in a transport direction, wherein the material to be treated is contacted with a contact electrode disposed outside an electrolysis region, whereby the electrically conductive structures are subjected to negative voltage.
  • metal ions are deposited on the electrically conductive structures from the treatment liquid to form a metal layer.
  • An electroplating apparatus in which the contacting unit is arranged in the electrolyte bath is disclosed, for example, in DE-A 102 34 705.
  • the galva- Nisier Republic is suitable for coating already conductive formed structures which are arranged on a band-shaped carrier.
  • the contacting takes place via rollers which are in contact with the conductive structures. Since the rollers are in the electrolyte bath, metal also separates out from the electrolyte bath.
  • the rollers are made up of individual segments which are switched cathodically, as long as they are in contact with the structures to be coated and are switched anodically, if there is no contact of roller and electrically conductive structure.
  • the object of the invention is to provide a device which ensures a sufficiently long contact time even for short structures, so that even short structures are provided with a sufficiently thick and homogeneous metal layer. Furthermore, the device should require less space.
  • a device for electroplating at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a non-conductive substrate which comprises at least one bath, an anode and a cathode, wherein the bath at least one metal salt containing electrolytic solution are deposited from the metal ions on electrically conductive surfaces of the substrate to form a metal layer, while the cathode is brought into contact with the surface to be coated of the substrate and the substrate is conveyed through the bath.
  • the cathode comprises at least two disks rotatably mounted on a respective shaft, wherein the disks mesh with one another.
  • the device according to the invention with intermeshing disks as a cathode that also substrates with short electrically conductive structures, especially in the transport direction of the substrate, with a out- reaching thick and homogeneous coating can be provided.
  • This is made possible by the fact that a smaller distance of the contact points of the discs with the electrically conductive structures can be realized by the intermeshing discs than is the case with successively arranged rollers.
  • the disks are designed in a cross-section matched to the respective substrate.
  • the disks preferably have a circular cross section.
  • the waves can have any cross section.
  • the waves are cylindrical.
  • the distance between two disks on a shaft corresponds at least to the width of a disk. This makes it possible that in the distance between two discs on a shaft, a disc can engage another shaft.
  • At least four shafts with disks can be arranged in pairs one behind the other.
  • the arrangement is preferably such that the second pair of shafts arranged offset relative to the first pair of shafts contacts the electrically conductive structure in the region on which the metal was deposited during the contacting with the first pair of shafts.
  • preferably more than two pairs of waves are connected in series.
  • the Einrithmmabshadow can be varied as desired. It is also possible to vary the distances of the individual pairs of waves as desired.
  • the number of juxtaposed slices on the at least one shaft is dependent on the width of the substrate. The wider the substrate to be coated, the more discs must be placed side by side. It is important to ensure that between the discs each have a free gap in which the metal can be deposited on the electrically conductive substrate or the structured or full-surface electrically conductive surface of the substrate and can comb a disk of the underlying wave.
  • the size of the disks used as the cathode depends on the size of the structures to be electroplated. For example, play structures whose length, as seen in the transport direction, greater than or equal to the distance, with the offset successive discs touch the substrate, coated sufficiently, when their width and position on the substrate is such that these of the staggered successive roles also is touched.
  • narrow discs are used with a small diameter.
  • An advantage of narrow disks with small distances from one another is that the contact probability of the smallest structures is thereby greater than with a smaller number of wide disks. Since the contact surface of the disc by covering the structures directly under the disc inhibits the deposition, it is advantageous to minimize this coverage effect through narrow slices.
  • the electrolyte purging of the surface to be coated is more uniform by a multiplicity of smaller surface accesses than with vain surface accesses such as are present with a small number of wide disks.
  • the lowest possible disk width and the smallest possible diameter with which the disks can be manufactured depend, on the one hand, on the manufacturing methods available and, on the other hand, on the fact that the disk is mechanically stable during operation, i. that the disc does not buckle or bend during operation.
  • the distance between two intermeshing discs depends on whether the discs have the same or different polarity. For example, with the same polarity, it is possible for the intermeshing disks to touch each other, while in the case of different polarity a distance must be provided between the disks in order to avoid a short circuit. Furthermore, sufficient flushing of the intermediate spaces between the panes and the space delimited by the surface of the substrate to be coated with the electrolyte solution must also be ensured.
  • the discs are powered by the shaft.
  • a voltage source for example, to connect the shaft outside the bath to a voltage source.
  • This connection is generally made via a slip ring.
  • any other connection is possible with which a voltage transfer from a stationary voltage source is transmitted to a rotating element.
  • the contact disks on their outer circumference with power.
  • sliding contacts such as brushes, may be in contact with the contact disks on the side facing away from the substrate.
  • the shafts and the disks are at least partially made of an electrically conductive material.
  • the shafts from an electrically insulating material and to realize the power supply to the individual disks, for example by electrical conductors, such as wires.
  • electrical conductors such as wires.
  • the individual wires are each connected to the contact discs, so that the contact discs are supplied with voltage.
  • the discs are made of an electrically conductive material only at their outer periphery, then it is necessary to provide an electrical conductor which connects the shaft to the outer periphery of the disc.
  • an electrical conductor can be accommodated inside the pane.
  • the power supply can also be realized via a fastening means, for example a screw, with which the disc is mounted on the shaft.
  • openings are formed in the disks in a preferred embodiment.
  • the electrolyte solution can be transported to the substrate.
  • the mixing of the electrolyte solution is improved over a closed-disk embodiment.
  • the perforated disks can deliver faster electrolyte solution to the substrate than would be possible if the electrolyte solution could only flow through the gaps between the individual disks.
  • discs in which a ring with spokes is mounted on the shaft.
  • the ring In order to enable a galvanic coating, it is necessary that the ring is made on its outer circumference of an electrically conductive material. In a preferred embodiment, the entire ring is made of an electrically conductive material.
  • the spokes with which the ring is fastened to the shaft can be made, for example, of an electrically conductive material or of an electrically insulating material. If the spokes are made of an electrically conductive material, it is preferred that the voltage supply of the ring via the shaft and the spokes takes place.
  • spokes are made of an electrically insulating material
  • a spoke which is electrically conductive so that the voltage from the shaft can be transmitted to the ring.
  • spokes made of an electrically insulating material to connect the ring via a current conductor, for example a cable to the current-carrying shaft.
  • the voltage apply directly to the ring surface.
  • the ring surface is contacted, for example, with a sliding contact, such as a brush.
  • the disks are in each case connected cathodically in the abovementioned exemplary embodiments. Due to the cathodic circuit of the discs also separates on this metal. Therefore, it is necessary to remove the disks to remove the deposited metal, i. for demetallizing, to switch anodically. This can occur, for example, in production interruptions. In order to be able to carry out a demetallization during operation, in a preferred embodiment the disks can be lifted by the substrate and lowered onto the latter.
  • the slices lowered onto the substrate may be switched cathodically while the slices lifted from the substrate are anodically connected.
  • the cathodically connected disks which are lowered onto the substrate, the electrically conductive structures on the substrate are cathodically contacted and thus coated.
  • the anodic circuit of the disks which do not touch the substrate, removes the metal previously deposited thereon.
  • the discs distributed over the circumference individual, electrically isolated from each other sections.
  • the sections which are electrically insulated from one another are preferably switchable both cathodically and anodically. This makes it possible that a portion which is in contact with the substrate, is switched cathodically and as soon as it is no longer in contact with the substrate, is connected anodically. As a result, deposited metal is removed during the cathodic circuit on the portion during the anodic circuit.
  • the voltage supply of the individual segments generally takes place via the shaft.
  • the material from which the electrically conductive parts of the disks are made is preferably an electrically conductive material which does not change into the electrolyte solution during operation of the device.
  • Suitable materials include metals, graphite, conductive polymers such as polythiophenes or metal / plastic composites.
  • Preferred materials are stainless steel and / or titanium.
  • the discs do not dissolve when they are switched anodic to remove the metal deposited on it again, the usual for insoluble anodes and the skilled person known material is used for the discs and the waves.
  • a suitable material is, for example, titanium coated with a conductive mixture of metal oxides.
  • the device for electroplating further comprises a device with which the substrate can be rotated.
  • a device with which the substrate can be rotated By rotating electrically conductive structures, which are initially seen in the transport direction of the substrate, wide and short, aligned so that they are narrow and long after turning - seen in the transport direction. By turning different coating times are compensated, which result from the fact that a coating of the electrically conductive structure already takes place with the first contact with the cathodically connected disc.
  • the substrate either passes through the device a second time or a second corresponding device.
  • the angle through which the substrate is rotated is preferably in the range of 10 ° to 170 °, more preferably in the range of 50 ° to 140 °, in particular in the range of 80 ° to 100 °, and most preferably the angle is the substrate is rotated, substantially 90 °.
  • 90 ° means that the angle through which the substrate is rotated does not deviate more than 5 ° from 90 °.
  • the device for rotating the substrate can be arranged inside or outside the bath. In order to further coat the same side of the substrate in order, for example, to achieve a greater layer thickness of the metal layer, the axis of rotation is aligned perpendicular to the surface to be coated.
  • the rotation axis is arranged so that after rotation, the substrate is positioned so that the surface to be coated next faces the cathode.
  • the layer thickness of the metal layer deposited on the electrically conductive structure by the method according to the invention depends on the contact time, which results from the passage speed of the substrate through the device and the number of waves positioned one behind the other with intermeshing disks arranged thereon, and the current intensity with which the device is operated.
  • a higher contact time can be achieved, for example, by connecting several devices according to the invention in series in at least one bath.
  • a plurality of devices according to the invention are connected in series in each case in individual baths. This makes it possible to hold in each bath a different electrolyte solution to sequentially deposit different metals on the electrically conductive structures. This is advantageous, for example, in decorative applications or in the production of gold contacts.
  • the respective layer thicknesses are adjustable by the choice of the flow rate and the number of devices with the same electrolyte solution.
  • two shafts with the disks mounted thereon are arranged so that the substrate to be coated can be passed between them. According to the invention are then both at the
  • the coating takes place in that the metal layers deposited on the upper side and on the lower side grow together in the hole.
  • a conductive hole wall is at least partially provided, which is coated by the inventive method.
  • the entire wall of the hole can be coated. If not the entire hole wall is electrically conductive, the coating of the entire hole wall is carried out here by growing together of the metal layers.
  • the substrate can either rest on the intermeshing disks, the underside of the substrate being coated or guided along the underside of the disks, coating the top of the substrate.
  • the discs can simultaneously serve to transport the substrate.
  • a sufficient contact of the intermeshing discs with the substrate is achieved by the fact that the substrate is preferably pressed with a pressing device to the intermeshing discs.
  • pressing device are, for example, pressure rollers or belts, which are guided around waves and pressed against the substrate.
  • a transport device with which the substrate is brought into contact with the discs.
  • a transport device is, for example, a belt or rollers on which the substrate runs.
  • the substrate can then either be pressed by means of the device for galvanic coating with a predetermined contact force against the transport device or by means of the transport device against the device for galvanic coating.
  • the intermeshing disks connected to the cathode that contact the substrate can be used simultaneously to transport the substrate through the bath.
  • the drive is preferably outside the bath. If a transport device independent of the cathodically connected disks is provided, the shafts and the disks mounted thereon can be rotated by the substrate so that the peripheral speed of the disks corresponds to the speed with which the substrate is transported.
  • all shafts are driven by a common drive unit.
  • the drive unit is preferably an electric motor.
  • the shafts are preferably connected to the drive unit via a chain or belt transmission. But it is also possible to provide the shafts with gears that mesh and over which the waves are driven. In addition to the possibilities described here, any further, known to those skilled, suitable drive for driving the waves can be used.
  • the anodically connected shafts, disks or portions of the disks electrically insulated from one another can be used, on the other hand it is also possible to additionally provide anodes in the bath. If only cathodically connected shafts and disks are provided, it is necessary to additionally arrange anodes in the bath.
  • the anodes are preferably arranged as close as possible to the structure to be coated. For example, the anodes can each be arranged in front of the first and behind the last of the shafts with intermeshing disks.
  • Suitable material for the anodes is on the one hand any material known to those skilled in the art for insoluble anodes. Preference is given here, for example, stainless steel, graphite, platinum, titanium or metal / plastic composites.
  • soluble anodes can also be provided. These then preferably contain the metal, which is deposited galvanically on the electrically conductive structures.
  • the anodes can take any known form to those skilled in the art. For example, flat bars can be used as anodes, which can be used during operation of the device. tion have a minimum distance from the substrate surface. It is also possible to use flat sheets or elastic wires, such as spiral wires, as anodes.
  • a flexible circuit substrate which is preferably in the form of a tape
  • this is unwound from a roll lying in front of the bath and wound after passing through the bath on a new roll.
  • all electrically conductive surfaces can be coated, regardless of whether electrically insulated structures insulated from one another are to be coated on a nonconductive substrate or a full surface area.
  • the device is used for coating electrically conductive structures on a non-electrically conductive support, for example reinforced or unreinforced polymers, as they are commonly used for printed circuit boards, ceramic materials, glass, silicon, textiles, etc.
  • the thus produced, electroplated electrically conductive structures are, for example, conductor tracks.
  • the electrically conductive structures to be coated can be printed on the printed circuit board, for example, from an electrically conductive material.
  • the electrically conductive structure preferably contains either particles of any geometry of an electrically conductive material in a suitable matrix or consists essentially of the electrically conductive material.
  • Suitable electrically conductive materials are, for example, carbon or graphite, metals, preferably aluminum, iron, gold, copper, nickel, silver and / or alloys or metal mixtures containing at least one of these metals, electrically conductive metal complexes, conductive organic compounds or conductive polymers.
  • a pretreatment is first required to make the structures electrically conductive.
  • This may be, for example, a chemical or a mechanical pretreatment such as a suitable cleaning.
  • a suitable cleaning for example, the oxide layer of metals which disturbs the electroplating is removed beforehand.
  • the electrically conductive structures to be coated can also be applied to the printed circuit boards by any other methods known to those skilled in the art.
  • Such printed circuit boards are for example installed in products such as computers, telephones, televisions, automotive electrical components, keyboards, radios, video, CD, CD-ROM and DVD players, game consoles, measuring and control devices, sensors, electrical kitchen appliances, electric toys, etc .
  • electrically conductive structures can be coated on flexible circuit carriers.
  • Such flexible circuit carriers are, for example, polymer films, such as polyimide films, PET films or polyolefin films, on which electrically conductive structures are printed.
  • the device according to the invention and the method according to the invention are suitable for the production of RFID antennas, transponder antennas or other antenna forms, chip card modules, flat cables, seat heaters, foil conductors, printed conductors in solar cells or in LCD or plasma picture screens or for the production of electroplated products in any desired form , such as thin metal foils, one- or two-sided metal-clad polymer carrier with a defined layer thickness, 3D-molded interconnect devices or even for the production of decorative or functional surfaces on products that are used, for example, to shield electromagnetic radiation, for heat conduction or as packaging , Furthermore, the production of contact points or contact pads or wiring on an integrated electronic component is possible.
  • the substrate After leaving the device for galvanic coating, the substrate can be further processed according to all steps known to the person skilled in the art. For example, existing electrolyte residues can be removed from the substrate by rinsing and / or the substrate can be dried.
  • the device according to the invention for the galvanic coating of electrically conductive substrates or of electrically conductive structures on electrically non-conductive substrates can be equipped with any additional device known to the person skilled in the art as required.
  • ancillary devices include, for example, pumps, filters, chemical feeders, roll-up and roll-down devices, etc.
  • the device according to the invention can also be operated, for example, in the pulse method known from Werner Jillek, Gustl Keller, Handbuch der Porterplattentechnik, Eugen G. Leuze Verlag, 2003, Vol. 4, pages 192, 260, 349, 351, 352, 359.
  • the galvanic coating device can be used for any conventional metal coating.
  • the composition of the electrolyte solution used for the coating depends on which metal the electrically conductive structures are to be coated on the substrate.
  • Usual metals deposited by electroplating on electrically conductive surfaces are, for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium.
  • Suitable electrolyte solutions which can be used for the electroplating of electrically conductive structures are known to those skilled in the art from, for example, Werner Jillek, Gustl Keller, Handbuch der Porterplattentechnik, Eugen G. Leuze Verlag, 2003, Vol. 4, pages 332 to 352.
  • the advantage of the device according to the invention and of the method according to the invention is that the intermeshing disks provide a larger contact surface and thus a longer contact time per unit area than is the case with rollers known from the prior art. As a result, shorter distances can be realized with more metal structure and more homogeneous layer thicknesses. In addition, the plants can be built shorter, enabling higher throughput and lower operating costs. Another significant advantage is that now even very short structures, as they are desired for example in the production of printed circuit boards, faster, more targeted and above all reproducible and can be realized with homogeneous layer thicknesses than with the roll systems known from the prior art is possible.
  • FIG. 1 shows a plan view of a device designed according to the invention
  • FIG. 2 shows a side view of a device designed according to the invention
  • Figure 3 is a side view of an inventive device in a second embodiment
  • FIG. 4 shows a shaft with a single disk mounted thereon
  • FIG. 5 shows a pane designed according to the invention with individual electrically isolated sections distributed over the circumference
  • FIG. 1 shows a plan view of a device designed according to the invention.
  • a number of first discs 2 is arranged on a first shaft 1.
  • the discs 2 are each mounted with a distance 3 on the shaft 1.
  • the distance 3 is chosen so that can engage in these second discs 4, which are mounted on a second shaft 5.
  • the distance 6 of the second disks 4 is chosen so that in each case between two second disks 4, a first disk 2 can engage.
  • the first disks 2 mounted on the first shaft 1 and the second disks 4 mounted on the second shaft 5 each have the same width.
  • disks with different widths disks of the same width can each be provided on a shaft, while disks with a width which deviates from the width of the disks on the first shaft are provided on the second shaft, or disks of different width are mounted on a shaft. If disks of different widths are mounted on a shaft, it is necessary that the distances between two disks on the second shaft, which engage between two disks on the first shaft, be selected accordingly, that the discs of different widths can intervene in the distances.
  • At least two pairs of shafts with intermeshing discs can be connected in series.
  • the wave pairs can then be offset from each other. It is also possible that the disks of the front shaft of the rear pair meshes with the spaces between the disks of the rear shaft of the front pair.
  • the distance 3 between two first disks 2 is at least as large as the width of a second disk 4.
  • the distance 6 of the second disks 4 is at least as large as the width of a first disk 2.
  • the distance 3, 6 see between two disks 2, 4 larger than the width of each engaging in this distance discs 2, 4, so that electrolyte solution can flow through this distance in the direction of the substrate to be coated.
  • the engagement depth 7, with which the second disks 4 engage in the first disks 2 is dependent on the distance at which the first disks 2 and the second disks 4 are to contact the substrate. It is thus possible for the disks 2, 4 to engage with one another in the edge region or for the first disks 2 to engage between the second disks 4 so far that the first disks 2 just touch the second shaft 5.
  • the second disks 4 also touch the first shaft 1.
  • the first disks 2 and the second disks 4 it is not necessary for the first disks 2 and the second disks 4 to be in the same Diameter are executed. Just as well, it is also possible that the diameters of the first disks 2 and the second disks 4 are different.
  • Figure 2 shows a side view of an inventive device.
  • FIG. 2 shows how the first disks 2 engage in the second disks 4.
  • the contact of the disks 2, 4 to be coated with electrically conductive structures 30 on a substrate 31 is carried out with the distance of the axial centers of the first shaft 1 and the second shaft 5.
  • the denser the axis centers of the first shaft 1 and the second shaft 5 are together
  • the contact points of the first disks 2 and the second disks 4 are also closer to the substrate.
  • the distance at which the first disks 2 and the second disks 4 touch the substrate is designated by reference numeral 8.
  • the transport of the substrate 31 through the bath with the electrolyte solution takes place in the embodiment shown here by means of a transport device 32.
  • the transport device 32 comprises an endless belt 33, which rotates two shafts 34, 35.
  • the distance between the band 33 and the discs 2, 4 is selected so that the substrate 31 is pressed with the electrically conductive structures 30 with a defined contact force against the discs 2, 4.
  • the pressing of the electrically conductive structures 30 to the discs 2, 4 can either be done by the transport device 32 is fixedly mounted and, for example, the discs 2, 4 is pressed with a predetermined contact force on the substrate 31 with the electrically conductive structures 30, Why the waves 1, 5 of the discs 2, 4 may be resiliently mounted.
  • the axes 1, 5 of the discs 2, 4 may be fixedly mounted and predetermined contact pressure is exerted by the transport device 32 to the substrate 31.
  • the shafts 34, 35 of the transport device 32 are resiliently mounted.
  • a transport device 32 as shown in Figure 2, a plurality of juxtaposed individual waves can be used as a transport device. It is also possible, instead of the transport device 32, to provide a second device according to the invention which comprises at least two axles with intermeshing disks arranged thereon.
  • both the axes 1, 5 with to drive the discs arranged thereon 2, 4 and the shafts 34, 35.
  • the drive of the shafts 1, 5 and 34, 35 is preferably arranged outside the bath.
  • each shaft 1, 5, 34, 35 can be driven individually, the shafts 1 and 5 are preferred from a first drive and the shafts 34 and 35 driven by a second drive or all shafts 1, 5, 34, 35 are driven by a common drive.
  • the individual shafts 1, 5 and / or 34, 35 are then connected to each other, for example via gears or chain or belt transmission.
  • anodes 36 are provided in the bath.
  • the anodes 36 may be in the form of flat bars, as shown here.
  • the anodes 36 are arranged in the vicinity of the electrically conductive structure 30 to be coated. In this case, care must be taken that the anodes 36 do not touch the electrically conductive structure 30, since otherwise the metal already deposited thereon would be removed again.
  • the anodes 36 can also be designed as flat sheets or as elastic wires, for example spiral wires.
  • any further, known in the art form of anodes can be used.
  • the anodes can be both insoluble and soluble.
  • insoluble anodes 36 The material for insoluble anodes 36 is known to those skilled in the art.
  • the metal is preferably used, which is deposited on the electrically conductive structures 30.
  • FIG. 3 shows a device designed according to the invention in a further embodiment.
  • the device shown in FIG. 3 it is possible with the device shown in FIG. 3 to simultaneously coat electrically conductive structures 30 on the upper side and on the underside of the substrate 31. It is also possible to galvanically coat holes 37 in the substrate and thus to obtain an electrically conductive connection of the electrically conductive structure 30 on the upper side and the electrically conductive structure 30 on the underside of the substrate 31.
  • a device comprising at least two shafts 1, 5 with intermeshing discs 2, 4 arranged thereon on the upper side of the substrate 31 and a device having at least two shafts 1, 5 with intermeshing discs 2, 4 arranged thereon Bottom of the substrate 31 is arranged. The substrate is passed between the devices.
  • the transport of the substrate is preferably carried out by the discs 2, 4, which contact the electrically conductive structures 30.
  • the discs 2, 4 which contact the electrically conductive structures 30.
  • FIG. 4 shows a shaft designed according to the invention with a disk mounted thereon.
  • a disk 10, as shown in FIG. 4, comprises individual sections 1 1.
  • the sections 11 are each electrically insulated from one another by an insulation 12. This makes it possible, for example, to switch side by side sections 1 1 differently.
  • a portion 11 may be cathodically connected while the adjacent portion 11 is anodically connected.
  • the advantage of this embodiment is that metal which deposits on a portion 11 while it is cathodically connected is removed again from this portion 11 while it is connected anodically. This removal of the metal deposited on the individual sections 11 is possible during the operation of the coating device.
  • a continuous power supply 13 is provided, with which each adjacent sections 1 1 of the adjacent discs 10 are contacted.
  • a power supply 13 is for example an insulated cable, which is attached to the outer circumference of the roller.
  • the insulated cable can also run in the interior of the shaft 14.
  • the shaft 14 is formed as a hollow shaft.
  • power can also be supplied directly via the shaft.
  • the shaft 14 in disks 10, which are constructed in individual electrically isolated sections 1 1, also constructed in individual electrically isolated from each other sections.
  • the power supply can then take place in each case via the individual electrically conductive sections of the shaft 14.
  • the sections 11 of the disc 10 are each connected to an electrically conductive portion of the shaft 14.
  • the individual sections 1 1 of the disc 10 is in each case via a power supply 13 in the form of insulated cable
  • the individual sections 1 for example, each with cable connections 15 to the power supply 13.
  • the cable connection 15 can be arranged on the outside of the pane 10, but it is also possible to fertilize the cable connections 15 so as not to cause any lateral broadening of the panes 10, on the outside. Ie 14 facing end of the individual segments 1 1 provide. This can be done for example by a spike, which is inserted into an insulated cable serving as a power supply 13.
  • FIG. 5 shows a side view of a pane according to FIG. 4.
  • 1 1 recesses 16 may be formed in the segments. In this case, the electrolyte solution can flow through the recesses 16.
  • the recesses 16 can each be formed only in individual segments 1 1 of the disc 10 or in all segments 1 1 of the disc 10.
  • the disc 10 instead of the recesses 16 in the disc 10, the disc 10 in the form of a wheel in which an electrically conductive ring with individual spokes is mounted on the shaft 14. In order to enable a galvanic coating of a substrate, it is necessary that the disc 10 is electrically conductive on its outer periphery.
  • the disk 10 with an annular contacting area 18 which is provided on the outer circumference of the disk 10.
  • annular contacting region 18 for example, the known in the art, currently used for insoluble anodes conventional material is. These are, for example, titanium coated with a conductive mixture of metal oxides.
  • the individual segments 11 can be made of an electrically insulating material in the region between the annular contacting region 18 and the shaft 14. In this case, it is only necessary to provide either through the electrically conductive material or on the surface of the individual segments, a conductor through which the voltage from the power supply 13, which in the embodiment shown here as a cable 17, on the outer circumference Resting wave, is executed, lead to the annular contact area 18. If only the annular contacting region 18 is designed to be electrically conductive, it is sufficient to alternately produce an anodic and cathodic circuit. possible, if in each case between individual segments 19 of the annular Kontak- ttechniks Kunststoffes 18, the insulation 12 is provided. As a result of this, the segments 19 of the annular contacting region 18 are sufficiently electrically insulated from one another in order to avoid a short circuit between an anodically connected segment 19 and a cathodically connected segment 19.
  • FIG. 6 shows an embodiment for a current supply of a device designed according to the invention.
  • the power supply to a shaft 14 with disks 10 arranged thereon can be effected, for example, via a further disk 20 arranged outside the bath with the electrolyte solution.
  • the further disc 20 is constructed, for example, like a disc 10, with which the substrate to be coated is contacted.
  • the further disk 20 also comprises an annular contacting region 18, which is divided into individual segments 19. Instead of an annular contacting region 18, it is also possible in each case to manufacture the individual segments 11 of the further disk 20 completely from an electrically conductive material.
  • the further disc 20 to provide 1 1 recesses 16 in the individual segments.
  • the recesses 16 can be formed in each segment 1 1 or only in individual segments 1 1.
  • the individual segments 19 of the annular contacting region 18 are electrically connected to the power supply 13, which in the embodiment shown in FIG. 6 is likewise in the form of cables 17 which are arranged on the outer circumference of the shaft 14.
  • the further disc 20 is provided at its end faces with an electrical insulation, so that only an electrically conductive surface is present on the outer circumference. In this way it can be avoided that injuries occur due to accidental contact with the disc 20.
  • a cathodic sliding contact 21 connected to a cathodic power supply 22 and an anodic sliding contact 23 connected to an anodic power supply 24 are provided.
  • cathodic sliding contact 21 and as anodic sliding contact 23 any sliding contact known to the person skilled in the art can be used.
  • the shaft is made up of individual electrically conductive segments, which are separated by insulation, the power supply can also over Sliding contacts are made directly on the shaft. In this case, another disc 20 is not required.
  • the anodic contact area is preferably larger than the cathodic contact area. This means that preferably more segments are connected anodically than are connected cathodically.
  • the maximum number of cathodically connected segments 19 corresponds to the number of anodically connected segments 19.
  • the substrate to be coated is guided along the underside of the disks 10 with the embodiment shown in FIG. If the substrate is to be guided along the upper side of the disks 10, so that the underside of the substrate is coated, the cathodic sliding contact must be arranged on the upper side of the further disk 20 and the anodic sliding contact on the underside of the further disk 20.
  • the substrate can be guided along the individual devices at any angle. It is not necessary that the substrate is transported horizontally, ie parallel to the liquid surface through the bath. Thus, for example, it is even possible if the substrate to be coated is held sufficiently firmly that it is guided perpendicular to the liquid surface on the disks 10 for contacting. LIST OF REFERENCE NUMBERS

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

L'invention concerne un dispositif de revêtement galvanique d'au moins un substrat électroconducteur ou d'une surface structurée ou entièrement électroconductrice d'un substrat isolant. Ce dispositif comprend au moins un bain, une anode et une cathode. Le bain contient un électrolyte contenant au moins un sel métallique duquel des ions métalliques se détachent et se déposent sur des surfaces électroconductrices du substrat en formant une couche métallique, tandis que la cathode est mise en contact avec la surface de substrat à revêtir et le substrat est transporté de manière à traverser le bain. La cathode comporte au moins deux disques (2, 4, 10) montés rotatifs respectivement sur un arbre (1, 5, 14), ces disques (2, 4, 10) s'engrenant. L'invention concerne également un procédé de revêtement galvanique d'au moins un substrat, ce procédé étant mis en oeuvre dans un dispositif selon l'invention. L'invention concerne enfin une utilisation du dispositif selon l'invention pour le revêtement galvanique de structures électroconductrices sur un support isolant.
PCT/EP2007/053401 2006-04-18 2007-04-05 Procédé et dispositif de revêtement galvanique WO2007118810A2 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
AT07727869T ATE455879T1 (de) 2006-04-18 2007-04-05 Vorrichtung und verfahren zur galvanischen beschichtung
US12/297,330 US20090178930A1 (en) 2006-04-18 2007-04-05 Electroplating device and method
BRPI0710662-9A BRPI0710662A2 (pt) 2006-04-18 2007-04-05 dispositivo e método para o revestimento eletrolìtico de pelo menos um susbtrato eletricamente condutivo ou uma superfìcie eletricamente condutiva, e, uso do dispositivo
JP2009505839A JP2009534525A (ja) 2006-04-18 2007-04-05 電解コーティング装置及び電解コーティング方法
EP07727869A EP2010700B1 (fr) 2006-04-18 2007-04-05 Procédé et dispositif de revêtement galvanique
CA002647969A CA2647969A1 (fr) 2006-04-18 2007-04-05 Procede et dispositif de revetement galvanique
DE502007002680T DE502007002680D1 (de) 2006-04-18 2007-04-05 Vorrichtung und verfahren zur galvanischen beschichtung
IL194505A IL194505A0 (en) 2006-04-18 2008-10-02 Electroplating device and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112724.7 2006-04-18
EP06112724 2006-04-18

Publications (2)

Publication Number Publication Date
WO2007118810A2 true WO2007118810A2 (fr) 2007-10-25
WO2007118810A3 WO2007118810A3 (fr) 2008-05-22

Family

ID=38236501

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/053401 WO2007118810A2 (fr) 2006-04-18 2007-04-05 Procédé et dispositif de revêtement galvanique

Country Status (13)

Country Link
US (1) US20090178930A1 (fr)
EP (1) EP2010700B1 (fr)
JP (1) JP2009534525A (fr)
KR (1) KR20080110658A (fr)
CN (1) CN101426962A (fr)
AT (1) ATE455879T1 (fr)
BR (1) BRPI0710662A2 (fr)
CA (1) CA2647969A1 (fr)
DE (1) DE502007002680D1 (fr)
IL (1) IL194505A0 (fr)
RU (1) RU2008145105A (fr)
TW (1) TW200813263A (fr)
WO (1) WO2007118810A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008065069A1 (fr) * 2006-11-28 2008-06-05 Basf Se Dispositif et procédé de revêtement par électrolyse
WO2020106253A3 (fr) * 2018-11-22 2020-07-30 A-Plas Genel Otomotiv Mamulleri Sanayi Ve Ticaret Limited Sirketi Dispositif de suspension de placage pour obtenir un placage homogène

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110014492A1 (en) * 2008-03-13 2011-01-20 Basf Se Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound
DE102010000211A1 (de) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Vorrichtung zum Transport von plattenförmigen Substraten in einer Anlage zur chemischen und/oder elektrochemischen Behandlung
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
EP2799939A1 (fr) * 2013-04-30 2014-11-05 Universo S.A. Support pour le traitement de pièces de micromécanique
CN103343371A (zh) * 2013-07-09 2013-10-09 中国铝业股份有限公司 一种聚合物薄膜的连续电沉积方法
JP5967034B2 (ja) * 2013-08-20 2016-08-10 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
US9847576B2 (en) * 2013-11-11 2017-12-19 Nxp B.V. UHF-RFID antenna for point of sales application
JP6197813B2 (ja) * 2015-03-11 2017-09-20 トヨタ自動車株式会社 金属皮膜の成膜装置およびその成膜方法
RU2643050C2 (ru) * 2015-11-09 2018-01-30 Фарит Фазитович Мухамедьянов Кислотный поверхностно-активный состав для обработки призабойной зоны нефтяных и газовых скважин
CN114790565B (zh) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 导电装置及水平电镀设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1437003A (en) * 1921-10-08 1922-11-28 American Nickeloid Company Electroplating apparatus and process
DE10234705A1 (de) * 2001-10-25 2003-05-28 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003038158A2 (fr) * 2001-10-25 2003-05-08 Infineon Technologies Ag Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1437003A (en) * 1921-10-08 1922-11-28 American Nickeloid Company Electroplating apparatus and process
DE10234705A1 (de) * 2001-10-25 2003-05-28 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008065069A1 (fr) * 2006-11-28 2008-06-05 Basf Se Dispositif et procédé de revêtement par électrolyse
WO2020106253A3 (fr) * 2018-11-22 2020-07-30 A-Plas Genel Otomotiv Mamulleri Sanayi Ve Ticaret Limited Sirketi Dispositif de suspension de placage pour obtenir un placage homogène
CN113166967A (zh) * 2018-11-22 2021-07-23 A-Plas通用汽车产品工贸股份公司 用于获得均匀镀层的镀覆挂架

Also Published As

Publication number Publication date
TW200813263A (en) 2008-03-16
CN101426962A (zh) 2009-05-06
EP2010700B1 (fr) 2010-01-20
KR20080110658A (ko) 2008-12-18
EP2010700A2 (fr) 2009-01-07
DE502007002680D1 (de) 2010-03-11
US20090178930A1 (en) 2009-07-16
WO2007118810A3 (fr) 2008-05-22
IL194505A0 (en) 2009-08-03
ATE455879T1 (de) 2010-02-15
CA2647969A1 (fr) 2007-10-25
JP2009534525A (ja) 2009-09-24
BRPI0710662A2 (pt) 2011-08-16
RU2008145105A (ru) 2010-05-27

Similar Documents

Publication Publication Date Title
EP2010700B1 (fr) Procédé et dispositif de revêtement galvanique
EP2010699A2 (fr) Dispositif et procédé de revêtement galvanique
DE60212426T2 (de) Verfahren und fördereinrichtung zur elektrolytischen behandlung von werkstücken
DE10342512B3 (de) Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut
EP0760873B1 (fr) Procede et dispositif de metallisation ou d'attaque electrolytique homogene et continue
EP2841628B1 (fr) Procédé et dispositif de dépôt électrolytique de métal sur une pièce
EP0677599B1 (fr) Dispositif de traitement d'articles en particulier de revêtement par électrodéposition de plaques de circuits
WO2001029290A1 (fr) Procede et dispositif de traitement electrolytique de surfaces electroconductrices de pieces en cartes ou en films separees et applications de ce procede
DE10234705B4 (de) Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE102008028104A1 (de) Metallisierungsverfahren für Solarzellen
EP2212452B1 (fr) Dispositif et procédé de connexion électrique d'un article dans des installations de traitement électrolytique en continu
EP2507414A1 (fr) Dispositif et procédé de mise en contact électrique d'un article à traiter dans des installations de galvanisation
DE102004029894B3 (de) Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
DE102006044673B3 (de) Kontaktiereinheit für die galvanische Abscheidung, Galvanisiervorrichtung und Galvanisiersystem
WO2002053807A1 (fr) Dispositif et procede pour le traitement electrochimique d'un produit en forme de bande
EP1865094B1 (fr) Appareil pour placage électrochimique sur des surfaces et système de placage
WO2007009448A1 (fr) Systeme concu pour deposer par voie electrolytique une couche conductrice sur une matiere de support non conductrice
WO2003072855A1 (fr) Procedes et dispositifs de metallisation electrolytique de parois perforees de structures
EP3190212B1 (fr) Dispositif de traitement de surface d'un matériau continu et son utilisation

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07727869

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2647969

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 194505

Country of ref document: IL

WWE Wipo information: entry into national phase

Ref document number: 12008502282

Country of ref document: PH

WWE Wipo information: entry into national phase

Ref document number: 12297330

Country of ref document: US

Ref document number: 5574/CHENP/2008

Country of ref document: IN

WWE Wipo information: entry into national phase

Ref document number: 2009505839

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 200780014144.0

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020087026807

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2007727869

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2008145105

Country of ref document: RU

ENP Entry into the national phase

Ref document number: PI0710662

Country of ref document: BR

Kind code of ref document: A2

Effective date: 20081016