EP1409772B2 - Procede pour la galvanisation selective d'un materiau support metallique en forme de bande - Google Patents

Procede pour la galvanisation selective d'un materiau support metallique en forme de bande Download PDF

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Publication number
EP1409772B2
EP1409772B2 EP02754718A EP02754718A EP1409772B2 EP 1409772 B2 EP1409772 B2 EP 1409772B2 EP 02754718 A EP02754718 A EP 02754718A EP 02754718 A EP02754718 A EP 02754718A EP 1409772 B2 EP1409772 B2 EP 1409772B2
Authority
EP
European Patent Office
Prior art keywords
paint
strip
base material
strips
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP02754718A
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German (de)
English (en)
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EP1409772B1 (fr
EP1409772A2 (fr
Inventor
Michail Kotsias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Imo Ingo Mueller Ek
Original Assignee
Imo Ingo Mueller Ek
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Filing date
Publication date
Application filed by Imo Ingo Mueller Ek filed Critical Imo Ingo Mueller Ek
Publication of EP1409772A2 publication Critical patent/EP1409772A2/fr
Application granted granted Critical
Publication of EP1409772B1 publication Critical patent/EP1409772B1/fr
Publication of EP1409772B2 publication Critical patent/EP1409772B2/fr
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Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps

Definitions

  • the invention relates to a method for the selective galvanization of a strip-like, metallic carrier material in a continuous pass, in particular for the galvanization of a carrier strip with pre-punched contact elements.
  • the support material is first completely coated with lacquer by either sprayed with lacquer or dipped in lacquer. Then, by means of a laser, those areas are freed from the paint on which contact material is to be galvanized.
  • An object of the present invention is to develop the known method so that a faster passage of the strip-like carrier material is achieved by the galvanization with significantly lower paint requirement.
  • the inventive method has the advantage that in the electrophoretic lacquer coating even at much lower paint thicknesses, a closed lacquer layer can be achieved, which has a very constant paint thickness. As a result, damage to the substrate can be effectively prevented when removing the paint layer by laser treatment. In addition, the very thin paint layer can be removed faster and with less power, which allows a higher throughput speed of the substrate. The deposition of the electrophoretic paint on the substrate is very fast, which in turn allows higher throughput speeds of the substrate. These advantages are further enhanced by the fact that only a selective lacquer layer is applied, for example a lacquer strip or several lacquer strips. These paint strips are applied only in the areas in which a galvanizing layer is applied. In addition to the saving of expensive paint material thus faster removal of the paint at the end of the treatment is possible.
  • the electrophoretic lacquer coating leads to uniform thin lacquer layers even with three-dimensional support materials, so that a selective electroplating is possible in these. Since the paint removal by laser action is virtually arbitrarily controllable, punctiform galvanizations can be achieved in addition to strip-like electroplating.
  • the strip-like carrier material expires before the coating expediently a cleaning and / or activation and / or rinsing process to create optimal initial conditions.
  • paint strips can be applied in the same or different width on the same side or on both sides of the belt-like carrier material.
  • the width of these strips is precisely adjustable by the electrophoretic lacquer coating process, so that by optimizing the strip width, a minimization of the required lacquer material can be achieved.
  • the lacquer layer thickness can be adjusted as a function of the applied voltage, the lacquer composition and the speed of the support material, in particular cataphoretic or anaphoretic lacquer deposition. By thus precisely adjustable coating thickness can be completely removed at the required locations by appropriate adjustment of the laser beam, this paint layer, while still avoiding damage to the substrate is avoided.
  • a housing of the paint coating device expediently compared to the carrier material by a slot-like dimming, depending on the slot width and the distance between dimming and substrate, the paint strip width can be adjusted.
  • dimming with multiple slots can accordingly several paint strips are formed.
  • the support material is expediently rinsed and dried, in particular in an oven or by UV light. Furthermore, the carrier material is expediently rinsed after laser removal.
  • the laser-stripped areas can now be electroplated by one or more of the following selective plating methods: selective dipping in a plating bath, covering the areas outside of the at least one paint strip by means of mechanical mask masks, in particular belt tools, applying the electrolyte agent by means of wheel technology, spotter or brush technique.
  • Fig. 1 illustrated galvanizing plant for selective galvanization of a carrier strip is designed as a so-called reel-to-reel system, wherein the metallic carrier strip 10 unwound continuously from a first roll or spool 11, passed through the system and behind again on a second roll or coil 12 as Finished tape is wound up.
  • Belt speeds of 20 m / min or even higher speeds are possible.
  • the substrate tape 10 passes through a preparation station 13, where it is cleaned, activated and rinsed.
  • the substrate strip 10 is passed through a Belakkungsstation 14, where a selective electrophoretic coating takes place.
  • the lacquering station 14 may have one or more lacquer cells 15, as shown in FIG Fig. 2 are shown schematically.
  • Such a Belackungszelle consists in principle of an example encapsulated housing which is shielded so that an uncontrolled paint deposition is avoided at undesirable areas.
  • shields 17, 18, which, like the other housing areas, consist for example of Teflon or another non-conductive plastic, are arranged such that they cover the regions of the carrier material strip 10 which are not to be coated with respect to a flat anode 19.
  • the anode 19 is made of stainless steel, but may also be platinum plated from titanium.
  • the illustrated coating cell 15 is designed for anaphoretic paint deposition, for which purpose an anaphoretic paint is used.
  • a lacquer layer is resistant to acidic media, such as a nickel, gold or tin bath, and can be removed in an alkaline medium.
  • the anode 19 is connected to the positive pole of a galvanizing voltage, while a contacting unit 21 is arranged in front of the cell by supplying current to the carrier material band 10.
  • a cataphoretic lacquer deposition with cataphoretic lacquer is possible.
  • the cataphoretic lacquer is resistant to alkaline media and can be removed in an acidic environment.
  • the polarity is reversed, that is, instead of the anode 19, a cathode occurs.
  • the varnish cell 15 is designed so that the paint strip formed or the varnish-coated areas are no longer damaged after the coating process. This is achieved for example by guide rollers, not shown, which are mounted in front of and behind the coating cell 15 and which position the carrier material in both vertical and horizontal directions exactly so that the area coated with the paint strip 22 is not in contact with areas of the housing 16 arrives.
  • the distance between the substrate tape 10 and the dimming 17, 18 is chosen so that on the one hand a sufficient dimming effect is present, but that no points of contact arise.
  • the paint located in a storage tank, not shown, is supplied via nozzles of the coating cell 15.
  • a pump located in the storage tank is connected via a pipe to the paint cell, wherein the amount of the supplied paint can be set or controlled via a likewise not shown intermediate throttle valve.
  • a filter arrangement may also be provided.
  • the Paint Conveyor Pump is designed to prevent electrical charges by using light-weight materials on all moving parts surrounded by paint, otherwise the paint will come into contact with moving parts that can become electrically charged and into contact with the paint come, can take place.
  • FIGS. 3 to 10 various carrier material bands are shown as examples, which are provided with differently arranged paint strips.
  • carrier strip three paint strips 24 - 26 of different width on the front and back are applied. This can be carried out either with successively arranged coating cells 15 or with coating cells which has a plurality of slits 20 and dips and anodes or cathodes arranged on both sides of the carrier material band 23.
  • carrier strip 27 is pre-punched so that already individual contacts are formed, which can be canceled or cut off after completion.
  • substrate strip 30 is also pre-punched to form individual contacts, said contacts on one side of a holding strip 31, which holds them together, semi-circular formations 32, so that the carrier material strip 30 is formed three-dimensionally.
  • a paint strip 33 is applied to the outside of the formations 32.
  • carrier material strip 34 is also formed three-dimensional, wherein retaining strips 35 connect the individual contact elements 36 at their ends.
  • These contact elements 36 are box-shaped in the central region, wherein a paint strip 37 extends over the central region of the box-like formations.
  • the selective paint strip (or more) is applied over the entire spatial depth in 3D carrier material bands, as in the Fig. 7 to 10 is recognizable.
  • the substrate tape 10 according to Fig. 1 passed through a drying station 38.
  • the drying and thus a partial polymerization is carried out in an oven of the drying station 38, in which a uniform temperature distribution is present.
  • the paint strips can also be dried with UV light and partially polymerized.
  • the substrate tape 10 is passed through a selective de-paint laser station 39.
  • a selective de-paint laser station 39 By means of the laser beam of a laser 40 those lacquer areas are removed from the paint strip or stripes, which are to be galvanized later.
  • both a strip-like Entlakkung and the Entlackung on singular surfaces is possible, for example, by the laser oscillating processed these surfaces.
  • a plurality of strip-shaped paint erosions can be made by means of the laser within a paint strip.
  • the tolerances of Lackabtrags and the subsequent electroplating are low and amount to about 50 ⁇ m.
  • the substrate is not damaged by the laser beam and paint removal is complete. This is ensured by the exact setting of the laser energy, wavelength, strength and duration of the pulses.
  • FIGS. 11 and 12 It is shown that a strip-shaped region 42 in the laser station 39 has been stripped of the paint strip 22 applied to the substrate tape 10.
  • the substrate strip 10 is then passed through a galvanizing station 43, in which galvanization of the area 42 stripped by the laser takes place.
  • a galvanizing station 43 in which galvanization of the area 42 stripped by the laser takes place.
  • This is achieved by a selective electroplating process known per se.
  • Fig. 12 In this case, the regions of the carrier material strip 10 outside the paint strip 20 are covered by means of two continuously circulating belts 44.
  • the speed of the belt 44 is adapted to the passage speed of the carrier material strip 10, so that the belt 44 run along accordingly.
  • the released area between the two belts 44 is then wetted by means of a cloth, a brush or the like with galvanizing solution and thereby galvanized. This can be done in several stages depending on the desired layer thickness.
  • the selective galvanization can also take place by selective immersion in a plating bath.
  • other mechanical Abdeckmasken can be used, which may be mentioned as further known methods for selective galvanization, the mocking technique and brushing.
  • the substrate tape 10 is completely stripped in a Entlackungsstation 45 by being passed through a corresponding aqueous solution.
  • the aqueous solution is acidic or alkaline.
  • the carrier strip 10 which is usually made of brass, copper or a copper alloy.
  • Different plating layers can also be superimposed, for which purpose the necessary steps take place one after the other.
  • the substrate tape 10 may also already have a plating layer applied in a classical manner, for example selective galvanization without paint coverage.
  • the method according to the invention can be carried out, as described, with carrier material tapes which, in accordance with FIGS Fig. 5 to 10 already pre-punched contacts or other elements or which are still full-surface, for example according to the Fig. 3, 4 . 11 and 12 , In the latter case, stamping operations can still be carried out after the galvanization, but this requires a larger amount of lacquer and galvanization metals.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Claims (9)

  1. Procédé pour la galvanisation sélective d'un matériau de support métallique en forme de bande, en passage continu, plus particulièrement d'une bande de matériau de support avec des éléments de contact préestampés, dans lequel
    a) le matériau de support (10, 23, 27, 30, 34) est recouvert dans un dispositif de revêtement de laque électrophorétique (14, 15) par une laque électrophorétique sélective avec au moins une bande de laque (22, 24 - 26, 28, 29, 33, 37),
    b) la laque d'au moins une bande de laque (22, 24 - 26, 28, 29, 33, 37) est enlevée au moyen d'un laser au niveau des points (42) qui doivent être galvanisés,
    c) des électrodes (19) sont masquées dans un logement (16) du dispositif de revêtement de laque (14, 15) par rapport au matériau de support (10) par un écran en forme de fente (17, 18), la largeur de la bande de laque étant définie en fonction de la largeur de la fente (20) et de la distance entre l'écran (17, 18) et le matériau de support (10),
    d) dans un processus de galvanisation, une couche métallique est disposée sur les points sur lesquels la laque a été enlevée (42) dans au moins une bande de laque (22, 24 - 26, 28, 29, 33, 37) au moyen d'une galvanisation sélective, et
    e) la bande de laque (22, 24 - 26, 28, 29, 33, 37), au nombre d'une au moins, est ensuite enlevée.
  2. Procédé selon la revendication 1, caractérisé en ce que le matériau de support en forme de bande (10, 23, 27, 30, 34) subit, avant le laquage, une opération de nettoyage et/ou d'activation et/ou de rinçage.
  3. Procédé selon la revendication 1 ou 2, caractérisé en ce que plusieurs bandes de laque (24 - 26, 28, 29) sont disposées dans une même largeur ou dans des largeurs différentes du même côté ou sur les deux côtés du matériau de support en forme de bande (23, 27).
  4. Procédé selon l'une des revendications précédentes, caractérisé en ce que l'épaisseur de la couche de laque est définie en fonction de la tension appliquée, de la composition de la laque et de la vitesse du matériau de support, une séparation de la laque cataphorétique ou anaphorétique étant plus particulièrement effectuée.
  5. Procédé selon l'une des revendications précédentes, caractérisé en ce que le matériau de support (10, 23, 27, 30, 34) est rincé et séché après le laquage, plus particulièrement dans un four (28) ou par une lampe à rayons ultraviolets.
  6. Procédé selon l'une des revendications précédentes, caractérisé en ce que des bandes et/ou des points de galvanisation (42) singuliers sont formés par l'enlèvement de la laque au laser.
  7. Procédé selon l'une des revendications précédentes, caractérisé en ce que le matériau de support (10, 23, 27, 30, 34) est rincé après l'enlèvement de la laque au laser.
  8. Procédé selon l'une des revendications précédentes, caractérisé en ce que les points (42) sur lesquels la laque a été enlevée au laser (40) sont galvanisés par un ou plusieurs des procédés de galvanisation sélectifs suivants : immersion sélective dans un bain de galvanisation, revêtement des zones en dehors d'au moins une bande de laque au moyen de masques mécaniques (44), plus particulièrement d'outils à courroie, diffusion de l'électrolyte au moyen d'une technique utilisant une roue, d'une technique de pulvérisation ou d'une technique de balayage.
  9. Procédé selon l'une des revendications précédentes, caractérisé en ce que la bande de laque (22, 24 - 26, 28, 29, 33, 37) au nombre d'une au moins est entièrement éliminée, après la galvanisation, dans une solution aqueuse alcaline ou acide.
EP02754718A 2001-07-20 2002-06-20 Procede pour la galvanisation selective d'un materiau support metallique en forme de bande Expired - Lifetime EP1409772B2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10135349A DE10135349A1 (de) 2001-07-20 2001-07-20 Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials
DE10135349 2001-07-20
PCT/EP2002/006824 WO2003012175A2 (fr) 2001-07-20 2002-06-20 Procede pour la galvanisation selective d'un materiau support metallique en forme de bande

Publications (3)

Publication Number Publication Date
EP1409772A2 EP1409772A2 (fr) 2004-04-21
EP1409772B1 EP1409772B1 (fr) 2005-03-16
EP1409772B2 true EP1409772B2 (fr) 2008-08-13

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EP02754718A Expired - Lifetime EP1409772B2 (fr) 2001-07-20 2002-06-20 Procede pour la galvanisation selective d'un materiau support metallique en forme de bande

Country Status (8)

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US (1) US6972082B2 (fr)
EP (1) EP1409772B2 (fr)
JP (1) JP2004536971A (fr)
CN (1) CN1250777C (fr)
AT (1) ATE291110T1 (fr)
DE (2) DE10135349A1 (fr)
HK (1) HK1069607A1 (fr)
WO (1) WO2003012175A2 (fr)

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JP4660231B2 (ja) * 2005-03-10 2011-03-30 株式会社シミズ 表面処理方法およびそれを用いる電子部品の製造方法
WO2012085682A2 (fr) * 2010-12-23 2012-06-28 Fci Procédé et appareil de placage, et bande obtenue par ce procédé
CN102888632B (zh) * 2012-09-14 2014-12-03 艾蒂盟斯（苏州）压铸电子技术有限公司 一种选择性电镀的防护工装和方法
CN103173839B (zh) * 2013-03-22 2015-11-18 湖南永盛新材料股份有限公司 一种金属带材单面连续电泳沉积的方法及装置
CN105239118B (zh) * 2014-06-17 2017-10-31 于长弘 电镀治具
CN107059078B (zh) * 2017-04-21 2020-02-18 东莞领益精密制造科技有限公司 一种金属零件局部精密镀锡加工工艺
JP7221003B2 (ja) * 2017-08-31 2023-02-13 Ｄｏｗａメタルテック株式会社 部分めっき方法
CN110923783B (zh) * 2019-11-20 2021-05-25 娄底市安地亚斯电子陶瓷有限公司 一种轮毂型电镀超薄金刚石切割片的制作方法
CN112934582B (zh) * 2021-02-08 2022-04-26 浙江东尼电子股份有限公司 一种毛毡涂漆装置及漆包线
CN113089063A (zh) * 2021-04-14 2021-07-09 王曼曼 连续电镀装置及连续电镀方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
EP0106977A2 (fr) † 1982-09-30 1984-05-02 International Business Machines Corporation Procédé et dispositif pour le traitement électrochimique d'un substrat
DD246575A1 (de) † 1986-03-14 1987-06-10 Seghers A Mikroelektronik Veb Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern
EP0337658A1 (fr) † 1988-04-12 1989-10-18 The Whitaker Corporation Plaquage sélectif par ablation au laser
DE69403926T2 (de) † 1993-01-28 1998-01-02 Meco Equip Eng Verfahren und Vorrichtung zur selektiven Elektroplattierung von gelochtem Metall oder metallisierten Gegenständen

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US5035918A (en) * 1989-04-26 1991-07-30 Amp Incorporated Non-flammable and strippable plating resist and method of using same
US6143145A (en) * 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method
SG76591A1 (en) 1999-02-27 2000-11-21 Aem Tech Engineers Pte Ltd Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
DE19934584A1 (de) 1999-07-23 2001-01-25 Inovan Stroebe Verfahren zum Herstellen von Kontakten

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0106977A2 (fr) † 1982-09-30 1984-05-02 International Business Machines Corporation Procédé et dispositif pour le traitement électrochimique d'un substrat
DD246575A1 (de) † 1986-03-14 1987-06-10 Seghers A Mikroelektronik Veb Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern
EP0337658A1 (fr) † 1988-04-12 1989-10-18 The Whitaker Corporation Plaquage sélectif par ablation au laser
DE68910864T2 (de) † 1988-04-12 1994-06-01 Whitaker Corp Selektive Plattierung durch Abtragen mittels eines Lasers.
DE69403926T2 (de) † 1993-01-28 1998-01-02 Meco Equip Eng Verfahren und Vorrichtung zur selektiven Elektroplattierung von gelochtem Metall oder metallisierten Gegenständen

Also Published As

Publication number Publication date
EP1409772B1 (fr) 2005-03-16
DE10135349A1 (de) 2003-02-06
US20040206629A1 (en) 2004-10-21
HK1069607A1 (en) 2005-05-27
US6972082B2 (en) 2005-12-06
WO2003012175A2 (fr) 2003-02-13
ATE291110T1 (de) 2005-04-15
WO2003012175A3 (fr) 2003-10-30
EP1409772A2 (fr) 2004-04-21
JP2004536971A (ja) 2004-12-09
CN1250777C (zh) 2006-04-12
DE50202493D1 (de) 2005-04-21
CN1533449A (zh) 2004-09-29

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