DE68910864T2 - Selektive Plattierung durch Abtragen mittels eines Lasers. - Google Patents

Selektive Plattierung durch Abtragen mittels eines Lasers.

Info

Publication number
DE68910864T2
DE68910864T2 DE68910864T DE68910864T DE68910864T2 DE 68910864 T2 DE68910864 T2 DE 68910864T2 DE 68910864 T DE68910864 T DE 68910864T DE 68910864 T DE68910864 T DE 68910864T DE 68910864 T2 DE68910864 T2 DE 68910864T2
Authority
DE
Germany
Prior art keywords
laser ablation
selective plating
plating
selective
ablation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68910864T
Other languages
English (en)
Other versions
DE68910864D1 (de
Inventor
Jeff Cherng-Chou Wu
Richard Taylor Williams
John Robert Rowlette
Charles Parsons Brooks
Richard Henry Zimmerman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Application granted granted Critical
Publication of DE68910864D1 publication Critical patent/DE68910864D1/de
Publication of DE68910864T2 publication Critical patent/DE68910864T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
    • C23C18/182—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
DE68910864T 1988-04-12 1989-04-06 Selektive Plattierung durch Abtragen mittels eines Lasers. Expired - Lifetime DE68910864T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/180,417 US4877644A (en) 1988-04-12 1988-04-12 Selective plating by laser ablation

Publications (2)

Publication Number Publication Date
DE68910864D1 DE68910864D1 (de) 1994-01-05
DE68910864T2 true DE68910864T2 (de) 1994-06-01

Family

ID=22660385

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68910864T Expired - Lifetime DE68910864T2 (de) 1988-04-12 1989-04-06 Selektive Plattierung durch Abtragen mittels eines Lasers.

Country Status (4)

Country Link
US (1) US4877644A (de)
EP (1) EP0337658B1 (de)
JP (1) JP2683696B2 (de)
DE (1) DE68910864T2 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1409772B2 (de) † 2001-07-20 2008-08-13 Imo Ingo Müller E.K. Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials
DE102018218265A1 (de) * 2018-10-25 2020-04-30 MTU Aero Engines AG Verfahren zum Herstellen einer Spitzenpanzerung an einer Laufschaufel einer Strömungsmaschine
DE102020107904A1 (de) 2020-03-23 2021-09-23 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur Herstellung von Leiterbahnstrukturen auf einem nichtleitenden Trägersubstrat
DE102020215293A1 (de) 2020-12-03 2022-06-09 Continental Teves Ag & Co. Ohg Verfahren zur selektiven Nickelplattierung und Substrat

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL84255A (en) * 1987-10-23 1993-02-21 Galram Technology Ind Ltd Process for removal of post- baked photoresist layer
EP0400070A1 (de) * 1988-02-05 1990-12-05 Raychem Limited Laserbearbeitete polymere
US5171709A (en) * 1988-07-25 1992-12-15 International Business Machines Corporation Laser methods for circuit repair on integrated circuits and substrates
US5182230A (en) * 1988-07-25 1993-01-26 International Business Machines Corporation Laser methods for circuit repair on integrated circuits and substrates
DE69112277T2 (de) * 1990-05-31 1996-03-07 Toshiba Tungaloy Co Ltd Mehrfarbiges Produkt und Verfahren zur Herstellung desselben.
JP2862637B2 (ja) * 1990-06-01 1999-03-03 株式会社東芝 サーマルヘッドの製造方法
US5182188A (en) * 1990-06-29 1993-01-26 General Electric Company Method of developing a self-developing resist
US5147680A (en) * 1990-11-13 1992-09-15 Paul Slysh Laser assisted masking process
US5259311A (en) * 1992-07-15 1993-11-09 Mark/Trece Inc. Laser engraving of photopolymer printing plates
US5380474A (en) * 1993-05-20 1995-01-10 Sandia Corporation Methods for patterned deposition on a substrate
US5403627A (en) * 1993-06-04 1995-04-04 Xerox Corporation Process and apparatus for treating a photoreceptor coating
WO1995007152A1 (en) * 1993-09-08 1995-03-16 Uvtech Systems, Inc. Surface processing
US5814156A (en) * 1993-09-08 1998-09-29 Uvtech Systems Inc. Photoreactive surface cleaning
JP2951215B2 (ja) * 1993-09-10 1999-09-20 レイセオン・カンパニー 位相マスクレーザによる微細なパターンの電子相互接続構造の製造方法
US5424508A (en) * 1994-01-06 1995-06-13 Xerox Corporation Laser ablation system
US5496985A (en) * 1994-04-01 1996-03-05 Xerox Corporation Laser ablation nozzle
US5460284A (en) * 1994-04-01 1995-10-24 Xerox Corporation Capture system employing annular fluid stream
US5485935A (en) * 1994-04-01 1996-01-23 Xerox Corporation Capture system employing diverter fluid nozzle
US5562840A (en) * 1995-01-23 1996-10-08 Xerox Corporation Substrate reclaim method
JP3040957B2 (ja) * 1995-11-27 2000-05-15 ヴィエルティー コーポレーション 透磁性コアの製造方法及びその装置
US5725706A (en) * 1996-03-12 1998-03-10 The Whitaker Corporation Laser transfer deposition
US5887324A (en) * 1996-08-30 1999-03-30 The Whitaker Corporation Electrical terminal with integral capacitive filter
WO2002004705A1 (fr) * 1999-01-20 2002-01-17 National Institute Of Advanced Industrial Science And Technology Procede de traitement preliminaire d'un materiau devant etre soumis a un depot autocatalytique
SG76591A1 (en) * 1999-02-27 2000-11-21 Aem Tech Engineers Pte Ltd Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
DE19934584A1 (de) * 1999-07-23 2001-01-25 Inovan Stroebe Verfahren zum Herstellen von Kontakten
JP2003535426A (ja) 2000-06-01 2003-11-25 シーゲイト テクノロジー エルエルシー 誘電層を備えた磁気記録ヘッド
SG98017A1 (en) * 2000-12-19 2003-08-20 Inst Materials Research & Eng Method of forming selective electronics plating on polymer surfaces
DE50109889D1 (de) * 2001-10-11 2006-06-29 Franz Oberflaechentechnik Gmbh Erzeugung metallisch leitfähiger Oberflächenbereiche auf beschichteten Leichtmetalllegierungen
JP4521228B2 (ja) * 2003-07-28 2010-08-11 正也 市村 光析出による金メッキ法及び金メッキ膜形成装置
US7084014B2 (en) * 2003-10-07 2006-08-01 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate
GB0400982D0 (en) 2004-01-16 2004-02-18 Fujifilm Electronic Imaging Method of forming a pattern on a substrate
US20050279453A1 (en) 2004-06-17 2005-12-22 Uvtech Systems, Inc. System and methods for surface cleaning
US7600527B2 (en) 2005-04-01 2009-10-13 Fike Corporation Reverse acting rupture disc with laser-defined electropolished line of weakness and method of forming the line of weakness
US7655972B2 (en) * 2005-11-21 2010-02-02 International Business Machines Corporation Structure and method for MOSFET with reduced extension resistance
US20070231541A1 (en) * 2006-03-31 2007-10-04 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
US20070235902A1 (en) * 2006-03-31 2007-10-11 3M Innovative Properties Company Microstructured tool and method of making same using laser ablation
US8420978B2 (en) * 2007-01-18 2013-04-16 The Board Of Trustees Of The University Of Illinois High throughput, low cost dual-mode patterning method for large area substrates
US8003300B2 (en) * 2007-04-12 2011-08-23 The Board Of Trustees Of The University Of Illinois Methods for fabricating complex micro and nanoscale structures and electronic devices and components made by the same
US8652763B2 (en) * 2007-07-16 2014-02-18 The Board Of Trustees Of The University Of Illinois Method for fabricating dual damascene profiles using sub pixel-voting lithography and devices made by same
US8546067B2 (en) * 2008-03-21 2013-10-01 The Board Of Trustees Of The University Of Illinois Material assisted laser ablation
WO2009124180A2 (en) * 2008-04-02 2009-10-08 The Trustees Of Columbia University In The City Of New York In situ plating and soldering of materials covered with a surface film
US8187795B2 (en) * 2008-12-09 2012-05-29 The Board Of Trustees Of The University Of Illinois Patterning methods for stretchable structures
US8197037B2 (en) 2009-12-15 2012-06-12 Xerox Corporation Method of removing thermoset polymer from piezoelectric transducers in a print head
US8621749B2 (en) 2010-03-12 2014-01-07 Taiwan Green Point Enterprises Co., Ltd Non-deleterious technique for creating continuous conductive circuits
US8952919B2 (en) 2011-02-25 2015-02-10 Taiwan Green Point Enterprises Co., Ltd. Capacitive touch sensitive housing and method for making the same
US20120273261A1 (en) 2010-10-20 2012-11-01 Taiwan Green Point Enterprises Co., Ltd. Circuit substrate having a circuit pattern and method for making the same
ITVI20110122A1 (it) 2011-05-13 2012-11-14 St Microelectronics Srl Metodo e apparato per la fabbricazione di lead frames
CN108136543A (zh) * 2015-10-07 2018-06-08 康宁股份有限公司 将要被激光切割的经过涂覆的基材的激光预处理方法
CN107904577B (zh) * 2017-11-20 2019-11-12 北京理工大学 一种基于电子动态调控的浸润性可控的表面制备方法
CN112495451A (zh) * 2020-11-24 2021-03-16 大连理工大学 一种利用激光加工技术制造固体催化剂的方法
JP2022127486A (ja) 2021-02-19 2022-08-31 トヨタ自動車株式会社 配線基板の製造方法
US11859092B2 (en) 2021-03-26 2024-01-02 Te Connectivity Solutions Gmbh Printable non-curable thixotropic hot melt composition
US11859093B2 (en) 2021-03-26 2024-01-02 Te Connectivity Solutions Gmbh Printable non-curable thixotropic hot melt composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4348263A (en) * 1980-09-12 1982-09-07 Western Electric Company, Inc. Surface melting of a substrate prior to plating
US4432855A (en) * 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
US4414059A (en) * 1982-12-09 1983-11-08 International Business Machines Corporation Far UV patterning of resist materials
US4671848A (en) * 1984-12-17 1987-06-09 General Laser, Inc. Method for laser-induced removal of a surface coating
EP0260514B1 (de) * 1986-09-15 1991-06-19 General Electric Company Verfahren zur photoselektiven Metallisierung
US4780177A (en) * 1988-02-05 1988-10-25 General Electric Company Excimer laser patterning of a novel resist

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1409772B2 (de) † 2001-07-20 2008-08-13 Imo Ingo Müller E.K. Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials
DE102018218265A1 (de) * 2018-10-25 2020-04-30 MTU Aero Engines AG Verfahren zum Herstellen einer Spitzenpanzerung an einer Laufschaufel einer Strömungsmaschine
DE102020107904A1 (de) 2020-03-23 2021-09-23 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur Herstellung von Leiterbahnstrukturen auf einem nichtleitenden Trägersubstrat
WO2021190690A1 (de) 2020-03-23 2021-09-30 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur herstellung von leiterbahnstrukturen auf einem nichtleitenden trägersubstrat
DE102020107904B4 (de) 2020-03-23 2022-04-28 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur Herstellung von Leiterbahnstrukturen auf einem nichtleitenden Trägersubstrat
DE102020215293A1 (de) 2020-12-03 2022-06-09 Continental Teves Ag & Co. Ohg Verfahren zur selektiven Nickelplattierung und Substrat

Also Published As

Publication number Publication date
JP2683696B2 (ja) 1997-12-03
EP0337658B1 (de) 1993-11-24
JPH0211773A (ja) 1990-01-16
US4877644A (en) 1989-10-31
DE68910864D1 (de) 1994-01-05
EP0337658A1 (de) 1989-10-18

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