EP1468127B1 - Procede et systeme pour recouvrir de maniere selective des surfaces metalliques par galvanisation - Google Patents

Procede et systeme pour recouvrir de maniere selective des surfaces metalliques par galvanisation Download PDF

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Publication number
EP1468127B1
EP1468127B1 EP02779151A EP02779151A EP1468127B1 EP 1468127 B1 EP1468127 B1 EP 1468127B1 EP 02779151 A EP02779151 A EP 02779151A EP 02779151 A EP02779151 A EP 02779151A EP 1468127 B1 EP1468127 B1 EP 1468127B1
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EP
European Patent Office
Prior art keywords
dielectric
metal
process according
electroplating
spotting
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EP02779151A
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German (de)
English (en)
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EP1468127A2 (fr
Inventor
Uwe Landau
Rainer Wiedenbeck
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OTB Oberflaechentechnik in Berlin GmbH and Co
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OTB Oberflaechentechnik in Berlin GmbH and Co
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material

Definitions

  • the present invention relates to a method for selective electroplating of metal surfaces, in particular of smooth, flat-punched or die-cut Metal bands, according to the preamble of claim 1 and a system for implementation this procedure.
  • the base material e.g. E-copper, bronze, brass, nickel silver, iron alloys to achieve the desired good surface properties, such as good contact, bondability, solderability, Wear and corrosion resistance, electroplated.
  • the coating only at selected points of the surface as a strip or spot applied galvanically, all geometric figures are possible. In particular, by the increasing miniaturization of the components is when applying Such coatings have a high selectivity with high precision edge limitation selectively coated surfaces required.
  • Selective galvanic coatings can be achieved by a whole range of different Produce processes in which the non-coated surface areas usually initially covered by a suitable masking and not masked areas are then electroplated. Only in the The simplest selective coating process makes the metal easy even without masking by edge-gripping by controlled partial immersion in a suitable electrolyte galvanically coated. With this simple coating method are on the Surface but no stripes or spots produced.
  • the most widely used selective coating process becomes endless movable masking bands of rubber or other plastic firmly on the pressed surface areas not to be coated and then only the remaining areas galvanically coated.
  • the selective systems can be in wheel form may be formed standing or lying wheels arranged. You can, however be designed as a straight or curved flow cell (Rainbow cell).
  • the achievable precision is more than 0.1 mm in general, however, especially for the Semiconductor technology not sufficient.
  • a special form of this coating process is the so-called MYLAR process in which as a masking for the non-coated surface areas a thin Mylar film is pressed onto the metal strip after the coating pass reusable for a limited time.
  • MYLAR process in which as a masking for the non-coated surface areas a thin Mylar film is pressed onto the metal strip after the coating pass reusable for a limited time.
  • spot coating is a rubber or Plastic mask used. Unlike the moving masking method However, a standing mask is opened to collect a metal band. Subsequently wid the mask closed and pressed firmly on the retracted resting metal band. After galvanic coating with the appropriate coating time is the mask is opened again and a still uncoated new piece of metal band becomes Retracted coating.
  • This process works quasi-continuously as the metal band in front of and behind the so-called spot cell continuously in a memory in or out runs out to him. However, only low belt speeds are achievable, whereby an economical electroplating is often called into question. With gold and silver Although the desired high precision of 0.1 mm can be achieved, tin and tin-lead coatings however, often can not be produced with the desired precision.
  • the metal strip to be coated becomes pressed onto a porous electrolyte absorbing an electrolyte, on the Opposite an insoluble anode sits.
  • the galvanic coating takes place only at the Place that comes in contact with the porous non-conductor. It can be especially good Edges and die-cut metal surfaces are coated. Spots and stripes in the Mitten Scheme a smooth flat metal band are not possible or in stripes not achievable with the desired selectivity.
  • the brush coating process is especially used in the connector area.
  • the laser-assisted coating may also be mentioned, the technologically still completely insignificant.
  • this procedure is a Non-contact work with precision in the micrometer range and highest So far, a technical application fails due to the fact that the This technique required completely new electrolytes not to be available. About that In addition, there are still plenty of powerful solid-state lasers missing.
  • the structured Ressist application is mentioned, however is mainly used only for the selective etching of surfaces.
  • the entire surface is coated with a liquid resist, the then dried, selectively exposed and developed.
  • the resulting exposed metal surfaces may then be electrochemically or chemically etched or else also be electroplated.
  • the organic resist coating removed from the metal surface, so that the structured coating or the etched metal surface remains. Because of this Although very high precision can be achieved in processes, the process is correct expensive.
  • GB-A-2 352 688 describes a method and an apparatus for masking a Substrate, e.g. a circuit board, by spraying a droplet-shaped Masking beam by means of a so-called “drop-on-demand" ink jet method.
  • the masking beam is generated here by an arrangement of numerous nozzles, which are selectively driven to form a desired masking pattern.
  • JP-A-09 087887 discloses a method of applying a resist to a previously selectively plated one Component, in particular e.g. a leadframe, by means of an inkjet process described.
  • the resist is in this case sprayed as a droplet-shaped jet, wherein the individual droplets electrically charged and through an electrical control panel be controlled as needed.
  • the object of the present invention is to provide an improved, novel, simple, flexible and cost-effective coating method for Metal surfaces, in particular smooth, flat-punched or die-cut metal strips, which not only allows high coating or high belt speeds, but also by a high selectivity with high precision of the edge limitation of the selectively coated surfaces.
  • This object is achieved according to a generic coating method according to the invention achieved in that the dielectric in the finest droplets with a substantially same droplet size of 3 - 70 microns and with a contour sharpness less than or equal 80 microns is applied, the droplets being initially charged electrically and then controlled as needed by applying by means of an electric control panel become.
  • the viscosity of the dielectric before applying controlled and at a Deviation from a given setpoint set to this setpoint Because of this Method can be desired masking layers of almost any shape low cost very quickly and extremely precise apply. The method allows a high flexibility and is particularly suitable for three-dimensional applications.
  • Such high droplet application rates are used that laminar Maskings are generated.
  • the droplet application rates are about 40,000 - 60,000 droplets per minute, but especially about 50,000 drops per minute.
  • the dielectric may in this case both in at least one continuous as needed uninterrupted strips and controlled discontinuously applied.
  • the dielectric is short-term exposed to an elevated temperature of less than 200 degrees Celsius, to avoid any impurities become released during drying of the dielectric Aspirated components.
  • a fast-drying dielectric is used which can be applied to the material within seconds Metal surface dries.
  • the dielectric used is also abrasion resistant and at least for several minutes in acids, alkalis and complexing electrolytes and in a flow of current through the metal resistant. These requirements will be particular met by a MEK-containing (methyl ethyl ketone-containing) pigment-free ink.
  • the dielectric is sprayed or sprayed onto the surface to be covered Sprayed or sprayed metal surface at a certain angle of preferably 1 to 10 degrees with respect to the normal to the metal surface.
  • she is with high precision of preferably less than 50 microns parallel to Movable metal surface. When applying the dielectric she will. from the top to positioned down to the metal surface. If necessary, also spray or Spraying device with several juxtaposed and / or successively arranged injection or Spray heads is used.
  • the spray or Spraying device for compensation of an intermediate metal movement automatically at least until the suspension point, to an uninterruptible To achieve stripe application.
  • the speed of the metal determined and transmitted to an associated control device, which at the beginning and at End of a self-examination also receives signals of the spraying or spraying. From the Speed and the known duration of the self-examination or the Interruption of the dielectric order is then the feed of the metal or the Distance of the non-coated surface area determined and the spray or Spraying device corresponding far back to an uninterrupted To reach stripes.
  • the metal in a fixed spray or spray but be moved back by a rocker.
  • the to be coated Metal surface preferably cleaned before applying the dielectric and dried.
  • Metal to be coated is preferably with a positional precision of less than 50 Micrometer positioned or guided, the (belt) speeds 3 - 10 m / min be.
  • the applied dielectric is after galvanization of the uncoated Surface areas preferably in an aqueous solution with microdispersions Substances removed substantially residue-free. It will be a particular aqueous solution used by the metal surface and applied to it galvanic coating can not be chemically attacked.
  • the detachment or removal of the deposited dielectric is preferably by exposure to ultrasound favored.
  • a galvanizing system for carrying out this method comprises a holding or Guide device for a metal to be coated, a masking device for Masking the non-coated surface areas, a galvanizer for plating the unmasked surface areas and a control device.
  • the masking device here according to the invention comprises a spray or Spray device for a liquid dielectric, which is designed so that the dielectric in the finest droplets with a narrow droplet size distribution or substantially same droplet size between 3 and 70 microns and a contour sharpness smaller equal to 80 microns can be sprayed or sprayed on.
  • the spray or Sprayer allows a high flexibility and is especially for three-dimensional applications suitable.
  • the masking device also comprises a Device for electrically charging the droplets and a device for generating an electric control panel for the droplets so that desired Masking layers of almost any shape at low cost very quickly and extremely precise orderable. It also includes a facility for Detection and adjustment of the viscosity of the dielectric to meet the requirements to ensure the desired high precision.
  • the spraying or spraying device is preferably for high droplet application rates for Generation of a surface dielectric order of in particular 40,000 - 60,000 designed per minute. It is so controllable or is driven so that the Dielectric in at least one continuously uninterrupted strip and / or discontinuous is applicable or applied.
  • the spraying or spraying device is preferably at a certain angle of in particular 1 - 10 degrees with respect to the normal to be coated Tilted metal surface, and depending on the purpose of use also several secondary and / or cascaded spray heads. It is preferable above the holding or scientistsseinrichtng arranged to the coating from above to carry out.
  • the spraying or spraying device is preferably high Precision of less than about 50 microns parallel to the metal surface movable. she is controllable by the control device is or is driven so that they in the event of suspension in the course of a self-examination automatically before the Suspension point accordingly.
  • the holding or guiding device is preferably designed so that it coating metal with a positional precision of less than about 50 microns or holds leads and belt speeds of 3 - 10 m / min allows. She can also do one Device for measuring the belt speed and one by the control device controllable or controlled rocker device to demand resetting the Include metal after an interruption of the coating process.
  • the masking device is in particular at least one cleaning and Drying device upstream of the metal to be coated, preferably for Generation of an increased drying temperature of a maximum of 200 degrees Celsius designed in order to achieve high coating or drying times by To be able to reach belt speeds. It also includes a suction device for dissolving dielectric material to prevent unwanted contamination of the Exclude metal surface.
  • the electroplating device is also preferably a release device for residue-free detachment of the dielectric downstream of the metal surface, the to favor the detachment process preferably comprises an ultrasonic device.
  • a flat, flat-punched or stamped metal strip to be galvanically coated is firstly subjected to a hot-cleaning (HOT SOAK CLEANING) in a first cleaning device.
  • a hot-cleaning HAT SOAK CLEANING
  • an electrolytic degreasing EELECTROLYTIC CLEANING
  • a suitable metal such as copper, nickel or silver.
  • ground-plated metal strip is then subjected to pure water purification (CYCLING WATER, CLEAR WATER or CW CLEANING) in a third purification device with circulating water, which is passed through an ion exchanger, and subsequently dried in a first drying device (DRYING).
  • a selective dielectric masking layer is applied to the completely pre-plated, cleaned and dried metal strip in the manner described in more detail below with reference to FIG. 2 with a masking device according to the invention by means of an ink jet on the non-electroplated surface areas (SPINJET DIELECTRIC COATING, FIG SPINJET stands for S elective P lating In k Jet or selective plating by inkjet technique).
  • the applied dielectric masking layer is dried in a second drying device (DRYING), wherein higher temperatures of up to 200 degrees Celsius are set to accelerate the drying process.
  • DRYING second drying device
  • higher temperatures of up to 200 degrees Celsius are set to accelerate the drying process.
  • the unmasked surface areas of the metal strip are then coated or plated in a conventional manner in a second electroplating apparatus, for example with gold, silver or tin. Subsequently, the applied dielectric masking coating is completely removed or removed again in a downstream release device.
  • the metal strip 10 to be coated is here by means of a (not shown) holding or guiding device with a high Positional precision of less than about 50 microns in Pfelraum under one above the Metal strip 10 arranged spray or spray head 12 passed.
  • the Belt speed is about 3 - 10 m / min.
  • the spray or spray head 12 is for Achieving better coating results at an angle of about 3 degrees the vertical or the normal inclined to the metal strip 10.
  • MEK-containing (methyl ethyl ketone-containing) pigment-free ink is sharpened from above onto the metal strip 10.
  • This ink is for the present application sufficiently resistant to abrasion, drying fast enough and in Acids, alkalis complexing electrolytes and in a current flow through the Metal for at least the duration of the subsequent plating process, i. at least for several minutes, sufficiently resistant.
  • this ink is in fine dielectric droplets 14 with a narrow droplet size distribution between 3 and 70 microns and a suitable for a surface coating high Droplet application rate of about 50,000 per minute from the top to the surface of the Metal strip 12 sprayed on.
  • the droplets 14 are in the spray or spray head 12th electrically charged by means of a suitable device (not shown) and by means of a generated by an applied voltage electric control field as needed so controlled that on the metal surface a continuous uninterrupted broader Strip 16 is created.
  • a suitable device not shown
  • an applied voltage electric control field as needed so controlled that on the metal surface a continuous uninterrupted broader Strip 16 is created.
  • the edge acuity is in the present embodiment about 80 microns. However, there are also higher edge accuracies of 30 microns or less accessible.
  • the spraying or spraying device 12 performs - like any writing head of an inkjet printer also - at certain intervals a self-examination or so-called facing by, in which the ink jet briefly stops, so that the coating process interrupted and the strip 16 is not applied continuously.
  • a self-examination sends the spray or spray 12 automatically a signal coming from an associated control device (not shown) is detected. Accordingly, the end of the self-examination and the renewed Spray or spray readiness of the ink jet head 12 registered.
  • a (not shown) measuring device the current belt speed of the metal strip measured and also transmitted via a measuring line to the control device.
  • the metal band but also via a (not shown rocker) correspondingly far automatically be reset to the short term exposure of the ink jet in the context of a Self-examination or to compensate for any other interruption.
  • the coating method according to the invention is for example for the production of PCB contacts, for coating semiconductor-stamped components with high Edge tolerance or for internal coating of dovetail contacts used.
  • the latter embodiment will be described below with reference to FIG. 3 illustrates, on the right side in a partially broken-away representation of the top a sash-tail contact 18 with an inserted mating contact 20 shows. in which the two contacts 18, 20 substantially only at their contact points 18a and 20a are selectively clad.
  • the dovetail contact 18 was this in two inventive Coating operations from next to the two inner contact points 18a first dielectrically coated and then at the uncoated points by a conventional galvanizing galvanized.
  • the precision in the illustrated galvanic inner coating according to the invention of a dovetail contact 18 is not achievable by any conventional method.
  • the left-hand view in FIG. 3 shows once again two associated connectors with a large number of corresponding contacts 18 and 20 respectively.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)

Claims (44)

  1. Procédé pour recouvrir sélectivement des surfaces métalliques par galvanisation, en particulier dans le cas de rubans métalliques plats, estampés à plat ou estampés par moulage, parles étapes qui consistent à :
    apporter sans contact d'un diélectrique liquide qui masque les zones de surface qu'il ne faut pas recouvrir et
    galvaniser les zones non masquées de la surface,
    caractérisé en ce que la viscosité du diélectrique est contrôlée avant l'apport et est ramenée à une valeur cible prédéterminée en cas d'écart par rapport à cette valeur cible et en ce que le diélectrique est apporté en gouttelettes de taille essentiellement identique comprise entre 3 et 70 micromètres et à une netteté de contour inférieure ou égale à 80 micromètres, les gouttelettes étant lors de l'apport d'abord chargées électriquement et ensuite guidées par un champ électrique en fonction des besoins.
  2. Procédé selon la revendication 1, caractérisé en ce que le diélectrique est apporté à une vitesse d'application des gouttelettes suffisamment élevée pour pouvoir réaliser des masques continus.
  3. Procédé selon la revendication 2, caractérisé en ce que la vitesse d'application de gouttelettes est comprise entre 40 000 et 60 000 par minute.
  4. Procédé selon l'une des revendications précédentes, caractérisé en ce que le diélectrique est apporté au moins en une bande continue et non interrompue et/ou de façon discontinue.
  5. Procédé selon l'une des revendications précédentes, caractérisé en ce qu'après l'apport, le diélectrique est brièvement soumis à une température élevée d'au plus 200 degrés Celsius.
  6. Procédé selon l'une des revendications précédentes, caractérisé en ce que les composants libérés sont aspirés lors du séchage du diélectrique.
  7. Procédé selon l'une des revendications précédentes, caractérisé en ce que l'on utilise un diélectrique à séchage rapide qui sèche en quelques secondes sur la surface métallique.
  8. Procédé selon l'une des revendications précédentes, caractérisé en ce que l'on utilise un diélectrique qui résiste au moins pendant plusieurs minutes aux acides, aux bases et aux électrolytes qui contiennent des agents complexants et qui résiste à un passage de courant à travers le métal.
  9. Procédé selon l'une des revendications précédentes, caractérisé en ce que le diélectrique utilisé est une encre sans pigment qui contient de la MEC (méthyléthylcétone).
  10. Procédé selon l'une des revendications précédentes, caractérisé en ce que le diélectrique est pulvérisé ou projeté sur les surfaces à recouvrir par un dispositif de pulvérisation ou de projection qui forme un angle défini par rapport à la perpendiculaire à la surface métallique.
  11. Procédé selon la revendication 10, caractérisé en ce que l'angle est compris entre 1 et 10 degrés.
  12. Procédé selon les revendications 10 ou 11, caractérisé en ce que le diélectrique est pulvérisé ou projeté par le haut sur la surface métallique.
  13. Procédé selon l'une des revendications 10 à 12, caractérisé en ce que le dispositif de pulvérisation ou de projection est déplacé avec une précision élevée parallèlement à 1a surface métallique.
  14. Procédé selon la revendication 13, caractérisé en ce que ce déplacement parallèle est effectué avec une tolérance inférieure à 50 micromètres.
  15. Procédé selon les revendications 13 ou 14, caractérisé en ce qu'après un bref arrêt destiné à compenser un déplacement du métal qui a eu lieu entre-temps, le dispositif de pulvérisation ou de projection est automatiquement reculé.
  16. Procédé selon l'une des revendications 10 à 12, caractérisé en ce que, lorsque le dispositif de pulvérisation ou de projection est fixe, le métal est reculé au moyen d'un dispositif basculant pour compenser un bref arrêt du dispositif de pulvérisation ou de projection.
  17. Procédé selon l'une des revendications 10 à 16, caractérisé en ce que l'on utilise un dispositif de pulvérisation ou de projection doté de plusieurs têtes de pulvérisation ou de projection agencées les unes à cotés des autres et/ou les unes derrière les autres.
  18. Procédé selon l'une des revendications précédentes, caractérisé en ce que la surface métallique est nettoyée et séchée avant l'apport du diélectrique.
  19. Procédé selon l'une des revendications précédentes, caractérisé en ce que le métal est positionné ou guidé avec une tolérance de positionnement inférieure à 50 micromètres.
  20. Procédé selon l'une des revendications précédentes, caractérisé en ce que l'on recouvre un ruban métallique déplacé à une vitesse comprise entre 3 et 10 m/min.
  21. Procédé selon la revendication 20, caractérisé en ce que la vitesse du ruban métallique est déterminée et est transmise à un dispositif de commande.
  22. Procédé selon l'une des revendications précédentes, caractérisé en ce qu'une fois la galvanisation effectuée, le diélectrique apporté est évacué dans une solution aqueuse sans laisser de résidus.
  23. Procédé selon la revendication 22, caractérisé en ce que l'on utilise une solution aqueuse qui n'attaque pas chimiquement la surface métallique et son revêtement galvanique.
  24. Procédé selon la revendication 22 ou 23, caractérisé en ce que le diélectrique subit l'action d'ultrasons lors de son enlèvement.
  25. Système de galvanisation pour recouvrir sélectivement des surfaces métalliques par galvanisation, en particulier dans le cas de rubans métalliques plats estampés à plat ou estampés par moulage, qui présente :
    un dispositif de maintien ou de guidage d'un métal à recouvrir,
    un dispositif de masquage des zones de surfaces qui ne doivent pas être recouvertes,
    un dispositif de galvanisation des zones de surfaces non masquées et
    un dispositif de commande,
    caractérisé en ce que le dispositif de masquage comprend :
    un dispositif de saisie et de régulation de la viscosité d'un diélectrique fluide,
    un dispositif de pulvérisation ou de projection du diélectrique, configuré de façon à pouvoir projeter ou à projeter le diélectrique en gouttelettes de taille essentiellement identique comprise entre 3 et 70 micromètres et à une tolérance de contour inférieure ou égale à 80 micromètres,
    un dispositif de chargement électrique des gouttelettes et
    un dispositif de création d'un champ électrique de commande pour les gouttelettes.
  26. Système de galvanisation selon la revendication 25, caractérisé en ce que le dispositif de pulvérisation ou de projection est conçu pour des vitesses élevées d'application de gouttelettes pour appliquer le diélectrique sur une surface continue.
  27. Système de galvanisation selon la revendication 26, caractérisé en ce que le taux d'application des gouttelettes est compris entre 40 000 et 60 000.
  28. Système de galvanisation selon l'une des revendications 25 à 27, caractérisé en ce que le dispositif de pulvérisation ou de projection peut être commandé ou est commandé de façon à apporter le diélectrique au moins en une bande continue et ininterrompue et/ou de façon discontinue.
  29. Système de galvanisation selon l'une des revendications 25 à 28, caractérisé en ce que le dispositif de pulvérisation ou de projection forme un angle déterminé par rapport à la perpendiculaire à une surface métallique à recouvrir.
  30. Système de galvanisation selon la revendication 29, caractérisé en ce que l'angle est compris entre 1 et 10 degrés.
  31. Système de galvanisation selon l'une des revendications 25 à 30, caractérisé en ce que le dispositif de pulvérisation ou de projection peut être déplacé ou est déplacé avec une précision élevée parallèlement à la surface métallique.
  32. Système de galvanisation selon la revendication 31, caractérisé en ce que la tolérance est inférieure à 50 micromètres.
  33. Système de galvanisation selon l'une des revendications 25 à 32, caractérisé en ce que le dispositif de commande est conçu de telle sorte qu'une brève interruption d'une opération de recouvrement soit détectée et compensée par un recul automatique du dispositif de pulvérisation ou de projection.
  34. Système de galvanisation selon l'une des revendications 25 à 33, caractérisé en ce que le dispositif de pulvérisation ou de projection est agencé au-dessus du dispositif de maintien ou de guidage.
  35. Système de galvanisation selon l'une des revendications 25 à 34, caractérisé en ce que le dispositif de pulvérisation ou de projection comprend plusieurs têtes de pulvérisation ou têtes de projection agencées les unes à côté des autres et/ou les unes derrière les autres.
  36. Système de galvanisation selon l'une des revendications 25 à 35, caractérisé en ce que le dispositif de maintien ou de guidage maintient ou guide le métal à recouvrir avec une tolérance de positionnement inférieure à 50 micromètres.
  37. Système de galvanisation selon l'une des revendications 25 à 36, caractérisé en ce que le dispositif de maintien ou de guidage guide ou peut guider le métal à recouvrir à une vitesse comprise entre 3 et 10 m/min.
  38. Système de galvanisation selon la revendication 37, caractérisé en ce qu'un dispositif de détermination de la vitesse de déplacement du métal est associé au dispositif de maintien ou de guidage.
  39. Système de galvanisation selon l'une des revendications 25 à 38, caractérisé en ce que le dispositif de maintien ou le dispositif de guidage comprennent un dispositif basculant pour le recul automatique du métal.
  40. Système de galvanisation selon l'une des revendications 25 à 39, caractérisé en ce que le dispositif de masquage est placé en aval d'un premier dispositif de nettoyage et de séchage du métal à recouvrir.
  41. Système de galvanisation selon l'une des revendications 25 à 40, caractérisé en ce que le dispositif de masquage est disposé en amont d'un deuxième dispositif de séchage qui délivre une température élevée, d'au plus 200 degrés Celsius.
  42. Système de galvanisation selon la revendication 41, caractérisé en ce que le deuxième dispositif de séchage contient un dispositif d'aspiration.
  43. Système de galvanisation selon l'une des revendications 25 à 42, caractérisé en ce que le dispositif de galvanisation est placé en amont d'un dispositif d'enlèvement du diélectrique apporté.
  44. Système de galvanisation selon la revendication 43, caractérisé en ce que le dispositif d'enlèvement contient un dispositif à ultrasons.
EP02779151A 2001-10-11 2002-10-11 Procede et systeme pour recouvrir de maniere selective des surfaces metalliques par galvanisation Expired - Lifetime EP1468127B1 (fr)

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DE10149998 2001-10-11
DE10149998A DE10149998C2 (de) 2001-10-11 2001-10-11 Verfahren und System zur selektiven galvanischen Beschichtung von Metalloberflächen
PCT/DE2002/003833 WO2003033771A2 (fr) 2001-10-11 2002-10-11 Procede et systeme pour recouvrir de maniere selective des surfaces metalliques par galvanisation

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EP1468127A2 EP1468127A2 (fr) 2004-10-20
EP1468127B1 true EP1468127B1 (fr) 2005-05-04

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AT (1) ATE294880T1 (fr)
AU (1) AU2002342532A1 (fr)
DE (2) DE10149998C2 (fr)
HK (1) HK1072787A1 (fr)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010050106A1 (de) * 2010-11-03 2012-05-03 Manfred Band Verfahren und Vorrichtung zum partiellen Galvanisieren eines Substrats
DE102009036171B4 (de) * 2008-08-08 2015-10-22 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Verfahren zur galvanischen Abscheidung einer Beschichtung auf eine bipolare Platte einer Brennstoffzelle

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947851A (en) * 1974-06-27 1976-03-30 International Business Machines Corporation Drop charging method for liquid drop recording
US4409071A (en) * 1982-12-27 1983-10-11 International Business Machines Corporation Masking for selective electroplating jet method
US4839665A (en) * 1987-07-20 1989-06-13 Carl Hellmuth Hertz Method and apparatus for controlling the electrical charging of drops in an ink jet recording apparatus
JPH0987887A (ja) * 1995-09-21 1997-03-31 Riidomitsuku Kk 部分めっき方法
US6143145A (en) * 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method
GB2350321A (en) * 1999-05-27 2000-11-29 Patterning Technologies Ltd Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition
US6299749B1 (en) * 1999-10-25 2001-10-09 Molex Incorporated Method of fabricating an electrical component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009036171B4 (de) * 2008-08-08 2015-10-22 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Verfahren zur galvanischen Abscheidung einer Beschichtung auf eine bipolare Platte einer Brennstoffzelle
DE102010050106A1 (de) * 2010-11-03 2012-05-03 Manfred Band Verfahren und Vorrichtung zum partiellen Galvanisieren eines Substrats

Also Published As

Publication number Publication date
ATE294880T1 (de) 2005-05-15
WO2003033771A3 (fr) 2003-12-24
HK1072787A1 (en) 2005-09-09
AU2002342532A1 (en) 2003-04-28
DE10149998C2 (de) 2003-08-14
EP1468127A2 (fr) 2004-10-20
DE50203040D1 (de) 2005-06-09
WO2003033771A2 (fr) 2003-04-24
DE10149998A1 (de) 2003-04-30

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