HK1069607A1 - Method for selectively electroplating a strip-shaped, metal support material - Google Patents

Method for selectively electroplating a strip-shaped, metal support material

Info

Publication number
HK1069607A1
HK1069607A1 HK05102087A HK05102087A HK1069607A1 HK 1069607 A1 HK1069607 A1 HK 1069607A1 HK 05102087 A HK05102087 A HK 05102087A HK 05102087 A HK05102087 A HK 05102087A HK 1069607 A1 HK1069607 A1 HK 1069607A1
Authority
HK
Hong Kong
Prior art keywords
strip
composition
shaped
support material
electroplating
Prior art date
Application number
HK05102087A
Other languages
English (en)
Inventor
Michail Kotsias
Original Assignee
Imo Ingo Mueller
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imo Ingo Mueller filed Critical Imo Ingo Mueller
Publication of HK1069607A1 publication Critical patent/HK1069607A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
HK05102087A 2001-07-20 2005-03-10 Method for selectively electroplating a strip-shaped, metal support material HK1069607A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10135349A DE10135349A1 (de) 2001-07-20 2001-07-20 Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials
PCT/EP2002/006824 WO2003012175A2 (de) 2001-07-20 2002-06-20 Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials

Publications (1)

Publication Number Publication Date
HK1069607A1 true HK1069607A1 (en) 2005-05-27

Family

ID=7692468

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05102087A HK1069607A1 (en) 2001-07-20 2005-03-10 Method for selectively electroplating a strip-shaped, metal support material

Country Status (8)

Country Link
US (1) US6972082B2 (xx)
EP (1) EP1409772B2 (xx)
JP (1) JP2004536971A (xx)
CN (1) CN1250777C (xx)
AT (1) ATE291110T1 (xx)
DE (2) DE10135349A1 (xx)
HK (1) HK1069607A1 (xx)
WO (1) WO2003012175A2 (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4660231B2 (ja) * 2005-03-10 2011-03-30 株式会社シミズ 表面処理方法およびそれを用いる電子部品の製造方法
CN103732803A (zh) * 2010-12-23 2014-04-16 Fci公司 电镀方法和装置以及通过该方法获得的带材
CN102888632B (zh) * 2012-09-14 2014-12-03 艾蒂盟斯（苏州）压铸电子技术有限公司 一种选择性电镀的防护工装和方法
CN103173839B (zh) * 2013-03-22 2015-11-18 湖南永盛新材料股份有限公司 一种金属带材单面连续电泳沉积的方法及装置
CN105239118B (zh) * 2014-06-17 2017-10-31 于长弘 电镀治具
CN107059078B (zh) * 2017-04-21 2020-02-18 东莞领益精密制造科技有限公司 一种金属零件局部精密镀锡加工工艺
JP7221003B2 (ja) * 2017-08-31 2023-02-13 Ｄｏｗａメタルテック株式会社 部分めっき方法
CN110923783B (zh) * 2019-11-20 2021-05-25 娄底市安地亚斯电子陶瓷有限公司 一种轮毂型电镀超薄金刚石切割片的制作方法
CN112934582B (zh) * 2021-02-08 2022-04-26 浙江东尼电子股份有限公司 一种毛毡涂漆装置及漆包线
CN113089063A (zh) * 2021-04-14 2021-07-09 王曼曼 连续电镀装置及连续电镀方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4432855A (en) † 1982-09-30 1984-02-21 International Business Machines Corporation Automated system for laser mask definition for laser enhanced and conventional plating and etching
DD246575A1 (de) † 1986-03-14 1987-06-10 Seghers A Mikroelektronik Veb Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern
US4877644A (en) † 1988-04-12 1989-10-31 Amp Incorporated Selective plating by laser ablation
US5035918A (en) 1989-04-26 1991-07-30 Amp Incorporated Non-flammable and strippable plating resist and method of using same
NL9300174A (nl) † 1993-01-28 1994-08-16 Meco Equip Eng Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.
US6143145A (en) * 1997-10-02 2000-11-07 Precious Plate Inc. Apparatus for continuous masking for selective electroplating and method
SG76591A1 (en) 1999-02-27 2000-11-21 Aem Tech Engineers Pte Ltd Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
DE19934584A1 (de) 1999-07-23 2001-01-25 Inovan Stroebe Verfahren zum Herstellen von Kontakten

Also Published As

Publication number Publication date
JP2004536971A (ja) 2004-12-09
EP1409772B2 (de) 2008-08-13
EP1409772B1 (de) 2005-03-16
US6972082B2 (en) 2005-12-06
US20040206629A1 (en) 2004-10-21
DE10135349A1 (de) 2003-02-06
ATE291110T1 (de) 2005-04-15
WO2003012175A3 (de) 2003-10-30
DE50202493D1 (de) 2005-04-21
WO2003012175A2 (de) 2003-02-13
CN1250777C (zh) 2006-04-12
EP1409772A2 (de) 2004-04-21
CN1533449A (zh) 2004-09-29

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20120620