EP1409772B1 - Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials - Google Patents
Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials Download PDFInfo
- Publication number
- EP1409772B1 EP1409772B1 EP02754718A EP02754718A EP1409772B1 EP 1409772 B1 EP1409772 B1 EP 1409772B1 EP 02754718 A EP02754718 A EP 02754718A EP 02754718 A EP02754718 A EP 02754718A EP 1409772 B1 EP1409772 B1 EP 1409772B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- paint
- strip
- base material
- strips
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000000463 material Substances 0.000 title claims abstract description 22
- 238000009713 electroplating Methods 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 5
- 239000002184 metal Substances 0.000 title claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims abstract description 5
- 239000003973 paint Substances 0.000 claims description 85
- 230000008021 deposition Effects 0.000 claims description 10
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 230000004913 activation Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000003792 electrolyte Substances 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims 2
- 238000007598 dipping method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 21
- 239000008199 coating composition Substances 0.000 abstract 1
- 239000012876 carrier material Substances 0.000 description 25
- 239000004922 lacquer Substances 0.000 description 21
- 239000010410 layer Substances 0.000 description 20
- 238000005246 galvanizing Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000035508 accumulation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
Definitions
- the invention relates to a method for selective galvanization a band-like, metallic carrier material in continuous flow, in particular for electroplating a carrier tape with pre-punched contact elements.
- Another disadvantage of the known method is that even if only very small areas must be galvanized, very large amounts of paint are required for the complete coating of the carrier material with a coating layer.
- the required relatively large thickness of the lacquer layer to achieve a closed lacquer layer and in particular the extreme paint accumulations in three-dimensional support materials are made even more aggravating. It should be noted that the paint materials required for such an experience are relatively expensive.
- An object of the present invention is that to develop known methods so that a faster Passage of the strip-like carrier material through the galvanization line achieved at much lower paint requirement becomes.
- the inventive method has the advantage that in the electrophoretic lacquer coating already at much lower Paint thicknesses achieved a closed paint layer can, which has a very constant paint thickness. This can be done by removing the lacquer layer Laser treatment Damage to the substrate effective be prevented. In addition, the very thin paint layer be removed faster and with less power, which means a higher throughput speed of the carrier material allows. The deposition of the electrophoretic Varnish on the substrate happens very fast, which in turn higher throughput speeds of the carrier material allows.
- These advantages are reinforced by that only a selective lacquer layer is applied, for example a paint strip or several paint strips. These Paint strips are applied only in areas where to apply a galvanizing layer. In addition to saving on expensive paint material is thus a faster Removal of the varnish possible at the end of the treatment.
- the electrophoretic paint coating also performs at three-dimensional Carrier materials to uniform thin lacquer layers, so that even a selective galvanization at this is possible.
- As the paint removal by laser action Virtually arbitrarily controllable, in addition to strip-like Galvanisations also punctual galvanizations achieved become.
- the ribbon-like carrier material passes through before the coating expediently a cleaning and / or activation and / or rinsing to optimum initial conditions create.
- the lacquer layer thickness can vary depending on the applied Tension, the paint composition and the speed of the Be set carrier material, in particular a cataphoretic or anaphoretic lacquer deposition takes place.
- precisely adjustable lacquer layer thickness can also by appropriate adjustment of the laser beam, this lacquer layer completely removed in the required places while still causing damage to the substrate is avoided.
- the support material is expediently rinsed and dried, especially in an oven or by UV light. Furthermore, the carrier material is expediently rinsed after laser removal.
- the laser-painted areas can now by a or more of the following selective plating methods galvanized: selective immersion in a plating bath, Cover the areas outside the at least one Paint strip by means of mechanical Abdeckmasken, in particular Belt tools, applying the electrolyte agent by means of wheel technique, spotter or brush technique.
- the electroplating plant shown in Fig. 1 for selective Galvanization of a carrier tape is called as Reel-to-reel system formed, with the metallic carrier tape 10 of a first roll or spool 11 continuously unwound, passed through the system and behind it again on a second roll or spool 12 as finished processed tape is wound up.
- the substrate tape 10 passes through a preparation station 13, in which it cleaned, activated and rinsed becomes.
- the lacquering station 14 may be one or several Belackungszellen have 15, as shown in Fig. 2 schematically are shown.
- Such a coating cell exists principle of an example encapsulated housing, the so shielded is that an uncontrolled paint deposition is avoided on undesirable areas. These are dimming 17, 18, like the other housing areas, for example Teflon or other non-conductive Made of plastic, arranged so that they are not to be coated Regions of the substrate strip 10 opposite cover a flat anode 19.
- the Anode 19 consists of stainless steel, but can also be made Titanium should be platinum plated.
- the illustrated coating cell 15 is for anaphoretic Paint deposition formed, including an anaphoretic paint is used.
- a lacquer layer is resistant to acid media, such as a nickel, gold or tin bath, and let dissolve in an alkaline environment.
- acid media such as a nickel, gold or tin bath
- anaphoretic paint deposition is the anode 19 with the positive pole of a galvanizing connected while powered by the power supply Carrier tape 10 in front of the cell a contacting unit 21 is arranged.
- it is also a cataphoretic Lacquer deposition with cataphoretic lacquer possible.
- the cataphoretic lacquer is resistant to alkaline Media and can be replaced in an acidic environment.
- the Polarity is reversed, that is, instead of the anode 19 occurs a cathode.
- the coating cell 15 is formed so that the formed Paint strips or lacquer-coated areas no longer damaged after the coating process become. This is for example by not shown Guide rollers scored, in front of and behind the coating cell 15 are attached and the substrate in both Position exactly as vertically as well as horizontally that coated with the paint strip 22 area does not come in contact with areas of the housing 16.
- the distance between the substrate tape 10 and the dimming 17, 18 is chosen so that on the one hand sufficient dimming effect is present, but that no points of contact arise.
- the paint located in a storage tank, not shown is supplied via nozzles of the coating cell 15.
- An im Storage tank located pump is via a pipe with connected to the paint cell, with a likewise not shown Interposed throttle valve the amount of supplied paint can be set or controlled can.
- a filter assembly may also be provided be.
- the Paint Transfer Pump is designed to be usable by use of easily sliding materials on all moving Parts surrounded with paint, electric boots be prevented, otherwise a deposition of the paint on moving parts that can be charged electrically and with can come into contact with the paint.
- FIGS. 3 to 10 show various types of carrier tapes presented as examples that vary with arranged paint strips are provided.
- the carrier material strip 27 shown in FIGS. 5 and 6 is so pre-punched that already formed individual contacts are canceled or cut off after completion can be. There are two paint strips 28, 29 applied.
- the carrier material strip 30 shown in FIGS. 7 and 8 is also pre-cut to form individual contacts, these contacts being on one side of a retaining strip 31, which holds them together, semicircular formations 32 so that the substrate tape 30 three-dimensional is trained.
- a paint strip 33 is at the Outside of the formations 32 applied.
- the carrier material strip 34 shown in FIGS. 9 and 10 is also three-dimensional, with retaining strips 35 connect the individual contact elements 36 at their ends. These contact elements 36 are in the middle region formed box-like, wherein a paint strip 37 on the middle area of the box-like formations runs.
- the selective paint strip (or more) is in 3D-carrier tapes applied over the entire spatial depth, as can be seen in FIGS. 7 to 10.
- the carrier material strip 10 of FIG. 1 After the application of one or more paint strips is the carrier material strip 10 of FIG. 1 by a drying station 38 led.
- the drying and thus a partial polymerization is done in an oven of the drying station 38, in which a uniform temperature distribution exists is.
- the paint strips with UV light are dried and partially polymerized.
- the substrate tape 10 is passed through a selective de-paint laser station 39.
- a selective de-paint laser station 39 By means of the laser beam of a laser 40 those lacquer areas are removed from the paint strip or stripes, which are to be galvanized later.
- both a strip-like Entlakkung and the Entlackung on singular surfaces is possible, for example, by the laser oscillating processed these surfaces.
- a plurality of strip-shaped paint erosions can be made by means of the laser within a paint strip.
- the tolerances of Lackabtrags and the subsequent electroplating are low and amount to about 50 ⁇ m.
- the substrate is not damaged by the laser beam and paint removal is complete. This is ensured by the exact setting of the laser energy, wavelength, strength and duration of the pulses.
- FIGS. 11 and 12 show that a strip-shaped region 42 in the laser station 39 has been stripped of the paint strip 22 applied to the carrier strip 10.
- the substrate tape 10 will now pass through a plating station 43 passed, in which a galvanization of the laser-stripped area 42 takes place. This is done by one per se known selective galvanization achieved.
- the regions of the carrier material strip are thereby 10 outside of the paint strip 20 by means of two covered continuously circulating belt 44.
- the speed the belt 44 is the throughput speed of the carrier material strip 10, so that the belt 44th follow suit.
- the released area between The two belts 44 will now be using a cloth, a brush or the like wetted with galvanizing solution and thereby galvanized. This can vary depending on the desired layer thickness done in several stages.
- the substrate tape 10 in a Entlackungsstation 45 completely stripped by passing through a corresponding aqueous solution is performed.
- the aqueous solution is acidic or alkaline.
- brass, Copper or copper alloy existing carrier tape 10 also different materials, such as gold, palladium, Silver and zinc, to be galvanized. Different plating layers can also be superimposed, with this take the necessary steps one after the other.
- the inventive method can - as described - with Carrier material bands are performed, which in accordance with FIGS. 5 to 10 already pre-punched contacts or other elements or which are still full-surface, for example according to Figs. 3, 4, 11 and 12. In the latter case can also after galvanizing still punching done, however this requires a larger amount of paint and galvanizing metals.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Description
Die erforderliche relativ große Dicke der Lackschicht zur Erzielung einer geschlossenen Lackschicht und insbesondere die extremen Lackansammlungen bei drei-dimensionalen Trägermaterialien kommen noch erschwerend hinzu. Dabei ist zu berücksichtigen, dass die für ein solches Erfahren erforderlichen Lackmaterialien relativ teuer sind.
- Fig. 1
- eine schematische Darstellung der einzelnen Stationen einer Anlage zur selektiven Galvanisierung zur Durchführung des erfindungsgemäßen Verfahrens,
- Fig. 2
- eine schematische Darstellung einer Lackbeschichtungszelle zur Aufbringung eines Lackstreifens gewünschter Breite,
- Fig. 3
- eine Stirnansicht eines Trägermaterialbands mit drei Lackstreifen an Vorder- und Rückseite,
- Fig. 4
- eine perspektivische Darstellung des in Fig. 3 dargestellten Trägermaterialbands,
- Fig. 5
- eine Stirnansicht eines gestanzten Trägermaterialbands mit zwei Lackstreifen,
- Fig. 6
- eine perspektivische Darstellung des in Fig. 4 dargestellten Trägermaterialbands,
- Fig. 7
- eine Stirnansicht eines drei-dimensionalen Trägermaterialbands mit einem Lackstreifen am ausgeformten Bereich,
- Fig. 8
- eine perspektivische Darstellung des in Fig. 7 dargestellten Trägermaterialbands,
- Fig. 9
- eine Stirnansicht eines weiteren drei-dimensionalen Trägermaterialbands mit einem Lackstreifen,
- Fig. 10
- eine perspektivische Darstellung des in Fig. 9 dargestellten Trägermaterialbands,
- Fig. 11
- eine Stirnansicht eines Trägermaterialbands mit einem Lackstreifen, in dem durch Laserbehandlung ein streifenförmiger Bereich entlackt ist, und mit einer Abdeckung zur selektiven Galvanisierung und
- Fig. 12
- eine perspektivische Darstellung des in Fig. 11 dargestellten Trägermaterialbands.
Claims (10)
- Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials im kontinuierlichen Durchlauf, insbesondere eines Trägermaterialbands mit vorgestanzten Kontaktelementen, wobeia) das Trägermaterial (10, 23, 27, 30, 34) in einer elektrophoretischen Lackbeschichtungseinrichtung (14, 15) mit einem elektrophoretischen Lack selektiv mit wenigstens einem Lackstreifen (22, 24 - 26, 28, 29, 33, 37) beschichtet wird,b) der wenigstens eine Lackstreifen (22, 24 - 26, 28, 29, 33, 37) an denjenigen Stellen (42) mittels eines Lasers (40) entlackt wird, die galvanisiert werden sollen,c) in einem Galvanisierungsprozess eine Metallschicht auf die entlackten Stellen (42) im wenigstens einen Lackstreifen (22, 24 - 26, 28, 29, 33, 37) mittels selektiver Galvanisierung aufgebracht wird, undd) der wenigstens eine Lackstreifen'(22, 24 - 26, 28, 29, 33, 37) anschließend entfernt wird.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass das bandartige Trägermaterial (10, 23, 27, 30, 34) vor dem Belacken einen Reinigungs- und/oder Aktivierungs- und/oder Spülvorgang durchläuft.
- Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass mehrere Lackstreifen (24 - 26, 28, 29) in gleicher oder unterschiedlicher Breite auf derselben Seite oder auf beiden Seiten des bandartigen Trägermaterials (23, 27) aufgebracht werden.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Lackschichtdicke in Abhängigkeit der angelegten Spannung, der Lackzusammensetzung und der Geschwindigkeit des Trägermaterials eingestellt wird, wobei insbesondere eine kataphoretische oder anaphoretische Lackabscheidung erfolgt.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass Elektroden (19) in einem Gehäuse (16) der Lackbeschichtungseinrichtung (14, 15) gegenüber dem Trägermaterial (10) durch eine schlitzartige Abblendung (17, 18) abgedeckt werden, wobei in Abhängigkeit der Schlitzbreite (20) und des Abstands zwischen Abblendung (17, 18) und Trägermaterial (10) die Lackstreifenbreite eingestellt wird.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägermaterial (10, 23, 27, 30, 34) nach der Belackung gespült und getrocknet wird, insbesondere in einem Ofen (28) oder durch UV-Licht.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass durch die Laserentlackung Streifen und/oder singuläre Galvanisierungsstellen (42) gebildet werden.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägermaterial (10, 23, 27, 30, 34) nach der Laserentlackung gespült wird.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die durch Laser (40) entlackten Stellen (42) durch eines oder mehrere der folgenden selektiven Galvanisierungsverfahren galvanisiert werden: Selektivtauchen in ein Galvanisierungsbad, Abdeckung der Bereiche außerhalb des wenigstens einen Lackstreifens mittels mechanischer Abdeckmasken (44), insbesondere Riemenwerkzeugen, Aufbringung des Elektrolyts mittels Radtechnik, Spottertechnik oder Brushtechnik.
- Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der wenigstens eine Lackstreifen (22, 24 - 26, 28, 29, 33, 37) nach der Galvanisierung in einer alkalischen oder sauren wässrigen Lösung vollständig entfernt wird.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10135349 | 2001-07-20 | ||
| DE10135349A DE10135349A1 (de) | 2001-07-20 | 2001-07-20 | Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials |
| PCT/EP2002/006824 WO2003012175A2 (de) | 2001-07-20 | 2002-06-20 | Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP1409772A2 EP1409772A2 (de) | 2004-04-21 |
| EP1409772B1 true EP1409772B1 (de) | 2005-03-16 |
| EP1409772B2 EP1409772B2 (de) | 2008-08-13 |
Family
ID=7692468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP02754718A Expired - Lifetime EP1409772B2 (de) | 2001-07-20 | 2002-06-20 | Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6972082B2 (de) |
| EP (1) | EP1409772B2 (de) |
| JP (1) | JP2004536971A (de) |
| CN (1) | CN1250777C (de) |
| AT (1) | ATE291110T1 (de) |
| DE (2) | DE10135349A1 (de) |
| WO (1) | WO2003012175A2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102888632A (zh) * | 2012-09-14 | 2013-01-23 | 艾蒂盟斯(苏州)压铸电子技术有限公司 | 一种选择性电镀的防护工装和方法 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4660231B2 (ja) * | 2005-03-10 | 2011-03-30 | 株式会社シミズ | 表面処理方法およびそれを用いる電子部品の製造方法 |
| WO2012085682A2 (en) * | 2010-12-23 | 2012-06-28 | Fci | Plating method and apparatus, and strip obtained by this method |
| CN103173839B (zh) * | 2013-03-22 | 2015-11-18 | 湖南永盛新材料股份有限公司 | 一种金属带材单面连续电泳沉积的方法及装置 |
| CN105239118B (zh) * | 2014-06-17 | 2017-10-31 | 于长弘 | 电镀治具 |
| CN107059078B (zh) * | 2017-04-21 | 2020-02-18 | 东莞领益精密制造科技有限公司 | 一种金属零件局部精密镀锡加工工艺 |
| JP7221003B2 (ja) * | 2017-08-31 | 2023-02-13 | Dowaメタルテック株式会社 | 部分めっき方法 |
| CN110923783B (zh) * | 2019-11-20 | 2021-05-25 | 娄底市安地亚斯电子陶瓷有限公司 | 一种轮毂型电镀超薄金刚石切割片的制作方法 |
| FR3117131B1 (fr) * | 2020-12-03 | 2022-12-09 | Safran Electronics & Defense | Procede de protection d’une piece en alliage a base d’aluminium |
| CN112934582B (zh) * | 2021-02-08 | 2022-04-26 | 浙江东尼电子股份有限公司 | 一种毛毡涂漆装置及漆包线 |
| CN113089063A (zh) * | 2021-04-14 | 2021-07-09 | 王曼曼 | 连续电镀装置及连续电镀方法 |
| CN116180175A (zh) * | 2023-01-06 | 2023-05-30 | 长春捷翼汽车科技股份有限公司 | 一种插拔件端子的孔内局部电镀工艺 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4432855A (en) † | 1982-09-30 | 1984-02-21 | International Business Machines Corporation | Automated system for laser mask definition for laser enhanced and conventional plating and etching |
| DD246575A1 (de) † | 1986-03-14 | 1987-06-10 | Seghers A Mikroelektronik Veb | Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern |
| US4877644A (en) † | 1988-04-12 | 1989-10-31 | Amp Incorporated | Selective plating by laser ablation |
| US5035918A (en) | 1989-04-26 | 1991-07-30 | Amp Incorporated | Non-flammable and strippable plating resist and method of using same |
| NL9300174A (nl) † | 1993-01-28 | 1994-08-16 | Meco Equip Eng | Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten. |
| US6143145A (en) * | 1997-10-02 | 2000-11-07 | Precious Plate Inc. | Apparatus for continuous masking for selective electroplating and method |
| SG76591A1 (en) * | 1999-02-27 | 2000-11-21 | Aem Tech Engineers Pte Ltd | Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
| DE19934584A1 (de) * | 1999-07-23 | 2001-01-25 | Inovan Stroebe | Verfahren zum Herstellen von Kontakten |
-
2001
- 2001-07-20 DE DE10135349A patent/DE10135349A1/de not_active Withdrawn
-
2002
- 2002-06-20 CN CNB02814614XA patent/CN1250777C/zh not_active Expired - Fee Related
- 2002-06-20 EP EP02754718A patent/EP1409772B2/de not_active Expired - Lifetime
- 2002-06-20 AT AT02754718T patent/ATE291110T1/de active
- 2002-06-20 US US10/484,205 patent/US6972082B2/en not_active Expired - Fee Related
- 2002-06-20 DE DE50202493T patent/DE50202493D1/de not_active Expired - Lifetime
- 2002-06-20 WO PCT/EP2002/006824 patent/WO2003012175A2/de not_active Ceased
- 2002-06-20 JP JP2003517344A patent/JP2004536971A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102888632A (zh) * | 2012-09-14 | 2013-01-23 | 艾蒂盟斯(苏州)压铸电子技术有限公司 | 一种选择性电镀的防护工装和方法 |
| CN102888632B (zh) * | 2012-09-14 | 2014-12-03 | 艾蒂盟斯(苏州)压铸电子技术有限公司 | 一种选择性电镀的防护工装和方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003012175A3 (de) | 2003-10-30 |
| CN1533449A (zh) | 2004-09-29 |
| US6972082B2 (en) | 2005-12-06 |
| EP1409772B2 (de) | 2008-08-13 |
| WO2003012175A2 (de) | 2003-02-13 |
| US20040206629A1 (en) | 2004-10-21 |
| ATE291110T1 (de) | 2005-04-15 |
| DE10135349A1 (de) | 2003-02-06 |
| HK1069607A1 (en) | 2005-05-27 |
| DE50202493D1 (de) | 2005-04-21 |
| CN1250777C (zh) | 2006-04-12 |
| JP2004536971A (ja) | 2004-12-09 |
| EP1409772A2 (de) | 2004-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0254962B1 (de) | Galvanisiereinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten | |
| EP1409772B1 (de) | Verfahren zur selektiven galvanisierung eines bandartigen, metallischen trägermaterials | |
| EP0059787B1 (de) | Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefassten Teilen im Durchlaufverfahren | |
| EP1051886A2 (de) | Vorrichtung zum elektrolytischen behandeln von leiterplatten und leiterfolien | |
| DE3149519A1 (de) | Verfahren und vorrichtung zur galvanisierung /verzinkung) von metallband | |
| WO2003038158A2 (de) | Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen | |
| DE3317564A1 (de) | Vorrichtung und verfahren zur metallbandbeschichtung | |
| DE68923467T2 (de) | Vorrichtung zum selektiven Metallisieren. | |
| DE10234705B4 (de) | Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen | |
| DE3413511C2 (de) | ||
| EP0030334A1 (de) | Elektrolyseanlage zur galvanischen Verstärkung von leitend vorbeschichteten bandförmigen Kunststoff-Folien | |
| DE1816645A1 (de) | Verfahren und Vorrichtung zur selektiven galvanischen Beschichtung von endlosen Baendern aus galvanisierbarem Werkstoff | |
| DE1446214A1 (de) | Verfahren zum Aufbringen von metallischen UEberzuegen auf Dielektrika | |
| DE19633797B4 (de) | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen | |
| DE2508777A1 (de) | Verfahren zur spruehgalvanisierung eines substrats | |
| DE3151557C2 (de) | ||
| DE19548198C2 (de) | Verfahren und Vorrichtung zur Nach- und/oder Ausbesserung von kleinen Oberflächenschäden in einer großformatigen Preßplatte oder einem Endlosband aus Blech mit einer strukturierten Oberfläche zur Oberflächenprägung kunststoffbeschichteter Holzwerkstoff- oder Laminatplatten | |
| EP0859071B1 (de) | Verfahren zum selektiven galvanischen Beschichten von elektrischen Kontaktelementen | |
| DE3011005A1 (de) | Vorrichtung und verfahren zum aufbringen eines galvanischen ueberzugs auf eine oder auf beide seiten eines metallischen streifens | |
| DE4008482A1 (de) | Galvanisierungsverfahren | |
| DE3839972C1 (de) | ||
| EP0276264B1 (de) | Verfahren zum elektrochemischen bearbeiten von werkstücken sowie vorrichtung zur durchführung des verfahrens | |
| DE68908089T2 (de) | Eintauchbare elektrische Stromversorgungsvorrichtung für die Elektroplattierung von Bändern. | |
| DE10142530A1 (de) | Verfahren zur Herstellung partiell galvanisierter Kunststoffbauteile und partiell galvanisiertes Kunststoffbauteil | |
| DE1945586A1 (de) | Fortlaufende oertliche Galvanisierung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20031031 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
| GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050316 Ref country code: IE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050316 Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050316 |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: TROESCH SCHEIDEGGER WERNER AG Ref country code: CH Ref legal event code: EP |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: GERMAN |
|
| REF | Corresponds to: |
Ref document number: 50202493 Country of ref document: DE Date of ref document: 20050421 Kind code of ref document: P |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050616 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050616 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050620 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20050620 |
|
| GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 20050527 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050627 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20050630 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050907 |
|
| PLBI | Opposition filed |
Free format text: ORIGINAL CODE: 0009260 |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: FD4D |
|
| 26 | Opposition filed |
Opponent name: INOVAN GMBH & CO. KG METALLE UND BAUELEMENTE Effective date: 20050915 |
|
| PLBI | Opposition filed |
Free format text: ORIGINAL CODE: 0009260 |
|
| ET | Fr: translation filed | ||
| NLR1 | Nl: opposition has been filed with the epo |
Opponent name: INOVAN GMBH & CO. KG METALLE UND BAUELEMENTE |
|
| PLAX | Notice of opposition and request to file observation + time limit sent |
Free format text: ORIGINAL CODE: EPIDOSNOBS2 |
|
| 26 | Opposition filed |
Opponent name: SCHEMPP & DECKER PRAEZIONSTELLE UND OBERFLAECHENTE Effective date: 20051214 Opponent name: INOVAN GMBH & CO. KG METALLE UND BAUELEMENTE Effective date: 20050915 |
|
| NLR1 | Nl: opposition has been filed with the epo |
Opponent name: INOVAN GMBH & CO. KG METALLE UND BAUELEMENTE Opponent name: SCHEMPP & DECKER PRAEZIONSTELLE UND OBERFLAECHENTE |
|
| PLBB | Reply of patent proprietor to notice(s) of opposition received |
Free format text: ORIGINAL CODE: EPIDOSNOBS3 |
|
| PLBP | Opposition withdrawn |
Free format text: ORIGINAL CODE: 0009264 |
|
| PLBP | Opposition withdrawn |
Free format text: ORIGINAL CODE: 0009264 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050616 |
|
| PUAH | Patent maintained in amended form |
Free format text: ORIGINAL CODE: 0009272 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: PATENT MAINTAINED AS AMENDED |
|
| 27A | Patent maintained in amended form |
Effective date: 20080813 |
|
| AK | Designated contracting states |
Kind code of ref document: B2 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: AEN Free format text: AUFRECHTERHALTUNG DES PATENTES IN GEAENDERTER FORM |
|
| REG | Reference to a national code |
Ref country code: ES Ref legal event code: FD2A Effective date: 20050621 |
|
| NLR2 | Nl: decision of opposition |
Effective date: 20080813 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20050621 |
|
| PLAB | Opposition data, opponent's data or that of the opponent's representative modified |
Free format text: ORIGINAL CODE: 0009299OPPO |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20110630 Year of fee payment: 10 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20110609 Year of fee payment: 10 Ref country code: NL Payment date: 20110616 Year of fee payment: 10 Ref country code: BE Payment date: 20110525 Year of fee payment: 10 Ref country code: AT Payment date: 20110609 Year of fee payment: 10 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20110615 Year of fee payment: 10 Ref country code: DE Payment date: 20110525 Year of fee payment: 10 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 20110728 Year of fee payment: 10 |
|
| BERE | Be: lapsed |
Owner name: *IMO INGO MULLER E.K. Effective date: 20120630 |
|
| REG | Reference to a national code |
Ref country code: NL Ref legal event code: V1 Effective date: 20130101 |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL Ref country code: AT Ref legal event code: MM01 Ref document number: 291110 Country of ref document: AT Kind code of ref document: T Effective date: 20120620 |
|
| GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20120620 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120620 |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20130228 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 50202493 Country of ref document: DE Effective date: 20130101 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130101 Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120702 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120630 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120620 Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20130101 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120630 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120630 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120620 |