DE68923467T2 - Vorrichtung zum selektiven Metallisieren. - Google Patents

Vorrichtung zum selektiven Metallisieren.

Info

Publication number
DE68923467T2
DE68923467T2 DE68923467T DE68923467T DE68923467T2 DE 68923467 T2 DE68923467 T2 DE 68923467T2 DE 68923467 T DE68923467 T DE 68923467T DE 68923467 T DE68923467 T DE 68923467T DE 68923467 T2 DE68923467 T2 DE 68923467T2
Authority
DE
Germany
Prior art keywords
selective metallization
metallization device
selective
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68923467T
Other languages
English (en)
Other versions
DE68923467D1 (de
Inventor
Mark Loring Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of DE68923467D1 publication Critical patent/DE68923467D1/de
Application granted granted Critical
Publication of DE68923467T2 publication Critical patent/DE68923467T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
DE68923467T 1988-02-01 1989-01-31 Vorrichtung zum selektiven Metallisieren. Expired - Fee Related DE68923467T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/150,879 US4818349A (en) 1988-02-01 1988-02-01 Selective plating apparatus for zone plating

Publications (2)

Publication Number Publication Date
DE68923467D1 DE68923467D1 (de) 1995-08-24
DE68923467T2 true DE68923467T2 (de) 1996-04-04

Family

ID=22536398

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68923467T Expired - Fee Related DE68923467T2 (de) 1988-02-01 1989-01-31 Vorrichtung zum selektiven Metallisieren.

Country Status (4)

Country Link
US (1) US4818349A (de)
EP (1) EP0330316B1 (de)
JP (1) JPH01242796A (de)
DE (1) DE68923467T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116480A (en) * 1990-03-26 1992-05-26 The Carolinch Company Method and apparatus for electrolytic plating
US5045167A (en) * 1990-03-30 1991-09-03 The Carolinch Company Continuous electroplating apparatus
EP0553243B1 (de) * 1990-10-16 1994-12-07 Bgk Finishing Systems, Inc. Wirbelbettapparat und verfahren
US5375058A (en) * 1991-12-20 1994-12-20 University Of Central Florida Surface detection system for airports
US6176985B1 (en) 1998-10-23 2001-01-23 International Business Machines Corporation Laminated electroplating rack and connection system for optimized plating
GB2379324B (en) 2000-06-01 2004-11-10 Seagate Technology Llc Magnetic recording head with dielectric layer
JP2002220694A (ja) * 2001-01-30 2002-08-09 Tokyo Electron Ltd メッキ処理装置、半導体装置の製造方法
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
US7655117B2 (en) * 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4405410A (en) * 1982-01-15 1983-09-20 Northern Telecom Limited Masking of elongate three dimensional objects for the exposure of preselected areas for surface treatment
JPS58189761A (ja) * 1982-04-30 1983-11-05 Casio Comput Co Ltd 表デ−タ集計処理装置
US4595464A (en) * 1984-09-25 1986-06-17 Robbins & Craig Welding & Mfg. Co. Continuous contact method for electrolytic fluid working of parts
US4564430A (en) * 1984-09-25 1986-01-14 Robbins & Craig Welding & Mfg. Co. Continuous contact plating apparatus
JPS62139895A (ja) * 1985-12-16 1987-06-23 Electroplating Eng Of Japan Co 部分メツキ装置
JPS62211396A (ja) * 1985-11-11 1987-09-17 Electroplating Eng Of Japan Co コネクタ−端子の微小部分のメツキ装置
JPH103389A (ja) * 1996-06-14 1998-01-06 Oki Electric Ind Co Ltd 並列計算機

Also Published As

Publication number Publication date
EP0330316A1 (de) 1989-08-30
US4818349A (en) 1989-04-04
DE68923467D1 (de) 1995-08-24
EP0330316B1 (de) 1995-07-19
JPH01242796A (ja) 1989-09-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee