DE68923467D1 - Vorrichtung zum selektiven Metallisieren. - Google Patents
Vorrichtung zum selektiven Metallisieren.Info
- Publication number
- DE68923467D1 DE68923467D1 DE68923467T DE68923467T DE68923467D1 DE 68923467 D1 DE68923467 D1 DE 68923467D1 DE 68923467 T DE68923467 T DE 68923467T DE 68923467 T DE68923467 T DE 68923467T DE 68923467 D1 DE68923467 D1 DE 68923467D1
- Authority
- DE
- Germany
- Prior art keywords
- selective metallization
- metallization device
- selective
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/150,879 US4818349A (en) | 1988-02-01 | 1988-02-01 | Selective plating apparatus for zone plating |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68923467D1 true DE68923467D1 (de) | 1995-08-24 |
DE68923467T2 DE68923467T2 (de) | 1996-04-04 |
Family
ID=22536398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68923467T Expired - Fee Related DE68923467T2 (de) | 1988-02-01 | 1989-01-31 | Vorrichtung zum selektiven Metallisieren. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4818349A (de) |
EP (1) | EP0330316B1 (de) |
JP (1) | JPH01242796A (de) |
DE (1) | DE68923467T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5116480A (en) * | 1990-03-26 | 1992-05-26 | The Carolinch Company | Method and apparatus for electrolytic plating |
US5045167A (en) * | 1990-03-30 | 1991-09-03 | The Carolinch Company | Continuous electroplating apparatus |
CA2093812C (en) * | 1990-10-16 | 1998-04-21 | James E. Heath | Fluidized bed apparatus and method using same |
US5375058A (en) * | 1991-12-20 | 1994-12-20 | University Of Central Florida | Surface detection system for airports |
US6176985B1 (en) | 1998-10-23 | 2001-01-23 | International Business Machines Corporation | Laminated electroplating rack and connection system for optimized plating |
US6775098B2 (en) | 2000-06-01 | 2004-08-10 | Seagate Technology Llc | Magnetic recording head with dielectric layer separating magnetic pole tips extensions from the zero throat coil insulator |
JP2002220694A (ja) * | 2001-01-30 | 2002-08-09 | Tokyo Electron Ltd | メッキ処理装置、半導体装置の製造方法 |
US7655117B2 (en) * | 2005-04-06 | 2010-02-02 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
US7744732B2 (en) | 2005-04-06 | 2010-06-29 | Leviton Manufacturing Company, Inc. | Continuous plating system and method with mask registration |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4405410A (en) * | 1982-01-15 | 1983-09-20 | Northern Telecom Limited | Masking of elongate three dimensional objects for the exposure of preselected areas for surface treatment |
JPS58189761A (ja) * | 1982-04-30 | 1983-11-05 | Casio Comput Co Ltd | 表デ−タ集計処理装置 |
US4595464A (en) * | 1984-09-25 | 1986-06-17 | Robbins & Craig Welding & Mfg. Co. | Continuous contact method for electrolytic fluid working of parts |
US4564430A (en) * | 1984-09-25 | 1986-01-14 | Robbins & Craig Welding & Mfg. Co. | Continuous contact plating apparatus |
JPS62139895A (ja) * | 1985-12-16 | 1987-06-23 | Electroplating Eng Of Japan Co | 部分メツキ装置 |
JPS62211396A (ja) * | 1985-11-11 | 1987-09-17 | Electroplating Eng Of Japan Co | コネクタ−端子の微小部分のメツキ装置 |
JPH103389A (ja) * | 1996-06-14 | 1998-01-06 | Oki Electric Ind Co Ltd | 並列計算機 |
-
1988
- 1988-02-01 US US07/150,879 patent/US4818349A/en not_active Expired - Lifetime
-
1989
- 1989-01-31 EP EP89300920A patent/EP0330316B1/de not_active Expired - Lifetime
- 1989-01-31 DE DE68923467T patent/DE68923467T2/de not_active Expired - Fee Related
- 1989-02-01 JP JP1023655A patent/JPH01242796A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0330316B1 (de) | 1995-07-19 |
DE68923467T2 (de) | 1996-04-04 |
JPH01242796A (ja) | 1989-09-27 |
US4818349A (en) | 1989-04-04 |
EP0330316A1 (de) | 1989-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |