DE3873778D1 - Vorrichtung zum schwalloeten. - Google Patents

Vorrichtung zum schwalloeten.

Info

Publication number
DE3873778D1
DE3873778D1 DE8888910014T DE3873778T DE3873778D1 DE 3873778 D1 DE3873778 D1 DE 3873778D1 DE 8888910014 T DE8888910014 T DE 8888910014T DE 3873778 T DE3873778 T DE 3873778T DE 3873778 D1 DE3873778 D1 DE 3873778D1
Authority
DE
Germany
Prior art keywords
swallowing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888910014T
Other languages
English (en)
Other versions
DE3873778T2 (de
Inventor
Roberto Scorta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Italtel SpA
Original Assignee
Italtel SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Italtel SpA filed Critical Italtel SpA
Application granted granted Critical
Publication of DE3873778D1 publication Critical patent/DE3873778D1/de
Publication of DE3873778T2 publication Critical patent/DE3873778T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE8888910014T 1988-04-19 1988-10-28 Vorrichtung zum schwalloeten. Expired - Fee Related DE3873778T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT8820244A IT1216594B (it) 1988-04-19 1988-04-19 Metodo e dispositivo per la saldatura ad onda.
PCT/EP1988/000989 WO1989010230A1 (en) 1988-04-19 1988-10-28 Wavesoldering device and procedure

Publications (2)

Publication Number Publication Date
DE3873778D1 true DE3873778D1 (de) 1992-09-17
DE3873778T2 DE3873778T2 (de) 1993-03-18

Family

ID=11165093

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888910014T Expired - Fee Related DE3873778T2 (de) 1988-04-19 1988-10-28 Vorrichtung zum schwalloeten.

Country Status (8)

Country Link
US (1) US5368222A (de)
EP (1) EP0413689B1 (de)
KR (1) KR900700231A (de)
CN (1) CN1041377C (de)
CA (1) CA1311064C (de)
DE (1) DE3873778T2 (de)
IT (1) IT1216594B (de)
WO (1) WO1989010230A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132029A1 (de) * 2001-07-03 2003-01-16 Seho Systemtechnik Gmbh Lötdüse zum Wellenlöten von Leiterplatten
CN101557900A (zh) * 2006-05-16 2009-10-14 塞拉斯提卡国际公司 层流井
US20080302861A1 (en) * 2007-06-11 2008-12-11 Szymanowski Richard A Method and apparatus for wave soldering an electronic substrate
US8146792B2 (en) * 2010-03-16 2012-04-03 Flextronics Ap, Llc Solder return for wave solder nozzle
TWM454066U (zh) * 2013-01-25 2013-05-21 Inventec Corp 自動焊接設備
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten
DE102014110720A1 (de) * 2014-07-29 2016-02-04 Illinois Tool Works Inc. Lötmodul

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1572306A (en) * 1924-11-13 1926-02-09 Northcutt Florence Churn
NZ200043A (en) * 1981-04-15 1986-01-24 W Maurer Producing soft ice-cream by fragmenting frozen block under gas-pressure
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
EP0159425B1 (de) * 1984-04-17 1988-06-15 Nihon Den-Netsu Keiki Co., Ltd. Lötvorrichtung
IT1200402B (it) * 1985-03-06 1989-01-18 Roberto Scorta Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati
US4684056A (en) * 1985-05-03 1987-08-04 Electrovert Limited Vibratory wave soldering

Also Published As

Publication number Publication date
CA1311064C (en) 1992-12-01
CN1038007A (zh) 1989-12-13
IT1216594B (it) 1990-03-08
WO1989010230A1 (en) 1989-11-02
DE3873778T2 (de) 1993-03-18
EP0413689B1 (de) 1992-08-12
EP0413689A1 (de) 1991-02-27
US5368222A (en) 1994-11-29
IT8820244A0 (it) 1988-04-19
KR900700231A (ko) 1990-08-11
CN1041377C (zh) 1998-12-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee