SG11201606071WA - Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor - Google Patents
Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensorInfo
- Publication number
- SG11201606071WA SG11201606071WA SG11201606071WA SG11201606071WA SG11201606071WA SG 11201606071W A SG11201606071W A SG 11201606071WA SG 11201606071W A SG11201606071W A SG 11201606071WA SG 11201606071W A SG11201606071W A SG 11201606071WA SG 11201606071W A SG11201606071W A SG 11201606071WA
- Authority
- SG
- Singapore
- Prior art keywords
- cured film
- backside
- resin composition
- image sensor
- optical device
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Materials For Photolithography (AREA)
- Graft Or Block Polymers (AREA)
- Optical Filters (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014010948 | 2014-01-24 | ||
PCT/JP2015/051490 WO2015111607A1 (ja) | 2014-01-24 | 2015-01-21 | ネガ型感光性樹脂組成物、それを硬化させてなる硬化膜およびその製造方法ならびにそれを具備する光学デバイスおよび裏面照射型cmosイメージセンサ |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201606071WA true SG11201606071WA (en) | 2016-09-29 |
Family
ID=53681409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201606071WA SG11201606071WA (en) | 2014-01-24 | 2015-01-21 | Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor |
Country Status (8)
Country | Link |
---|---|
US (1) | US9977329B2 (ja) |
EP (1) | EP3098653B1 (ja) |
JP (1) | JP6572769B2 (ja) |
KR (1) | KR102300782B1 (ja) |
CN (1) | CN106415393B (ja) |
SG (1) | SG11201606071WA (ja) |
TW (1) | TWI666511B (ja) |
WO (1) | WO2015111607A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201510719YA (en) * | 2013-07-02 | 2016-01-28 | Toray Industries | Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same |
CN109071742B (zh) * | 2016-04-25 | 2021-07-09 | 东丽株式会社 | 树脂组合物、其固化膜及其制造方法以及固体摄像器件 |
JP7194492B2 (ja) * | 2016-10-24 | 2022-12-22 | 東京応化工業株式会社 | 感光性組成物、感光性組成物の製造方法、光重合開始剤、及び光重合開始剤の調製方法 |
JP6877202B2 (ja) * | 2016-12-28 | 2021-05-26 | 太陽インキ製造株式会社 | ネガ型光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
US20210080829A1 (en) * | 2017-05-24 | 2021-03-18 | Toray Industries, Inc. | Negative photosensitive resin composition and cured film |
WO2019064993A1 (ja) * | 2017-09-26 | 2019-04-04 | 富士フイルム株式会社 | 構造体、隔壁形成用組成物、固体撮像素子および画像表示装置 |
KR102649087B1 (ko) * | 2018-03-30 | 2024-03-20 | 도레이 카부시키가이샤 | 포지티브형 감광성 수지 조성물, 그의 경화막 및 그것을 구비하는 고체 촬상 소자 |
WO2019230616A1 (ja) * | 2018-06-01 | 2019-12-05 | 互応化学工業株式会社 | 感光性樹脂組成物、ドライフィルム、及びプリント配線板 |
JP7249119B2 (ja) * | 2018-09-27 | 2023-03-30 | 東京応化工業株式会社 | 感光性樹脂組成物、パターニングされた硬化膜の製造方法及び硬化膜 |
KR20210068431A (ko) * | 2018-10-03 | 2021-06-09 | 에이치디 마이크로시스템즈 가부시키가이샤 | 감광성 수지 조성물, 패턴 경화물의 제조 방법, 경화물, 층간 절연막, 커버 코트층, 표면 보호막 및 전자 부품 |
CN109722033B (zh) * | 2018-12-10 | 2021-08-06 | 沈阳化工大学 | 一种二蒽基二苯醚乙烯基硅橡胶制备方法 |
US11851557B2 (en) * | 2019-02-15 | 2023-12-26 | AGC Inc. | Curable composition, cured product and laminate |
KR102331157B1 (ko) * | 2019-10-23 | 2021-11-26 | (주)휴넷플러스 | 폴리실록산 공중합체, 이의 제조방법 및 이를 포함하는 수지 조성물 |
CN113448171B (zh) * | 2020-03-27 | 2024-04-16 | 赫拉化学科技有限公司 | 光敏树脂组合物、图案形成方法及基板保护用覆膜的制备方法 |
WO2022211070A1 (ja) * | 2021-03-31 | 2022-10-06 | 日産化学株式会社 | 反応性シルセスキオキサン化合物を含有した光導波路用の重合性組成物 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001081404A (ja) | 1999-09-17 | 2001-03-27 | Jsr Corp | コーティング組成物および硬化体 |
JP4310968B2 (ja) | 2001-06-22 | 2009-08-12 | 東レ株式会社 | ポジ型感光性樹脂組成物を用いて得られるレンズおよび光導波路 |
JP4273894B2 (ja) * | 2003-09-18 | 2009-06-03 | 日立化成工業株式会社 | 樹脂組成物 |
JP4256806B2 (ja) * | 2004-03-17 | 2009-04-22 | 日東電工株式会社 | 感光性樹脂組成物とその利用 |
JP4670693B2 (ja) | 2005-03-18 | 2011-04-13 | 東レ株式会社 | 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子 |
JP5296297B2 (ja) | 2005-04-04 | 2013-09-25 | 東レ・ファインケミカル株式会社 | 縮合多環式炭化水素基を有するシリコーン共重合体及びその製造方法 |
JP4973093B2 (ja) | 2005-10-03 | 2012-07-11 | 東レ株式会社 | シロキサン系樹脂組成物、光学物品およびシロキサン系樹脂組成物の製造方法 |
JP2007224877A (ja) | 2006-02-27 | 2007-09-06 | Denso Corp | 内燃機関の排気管への排気センサ取付け構造 |
JP5586820B2 (ja) | 2006-07-21 | 2014-09-10 | 東京応化工業株式会社 | 高屈折率材料 |
JP2008105999A (ja) * | 2006-10-25 | 2008-05-08 | Idemitsu Kosan Co Ltd | アダマンタン誘導体、その製造方法、樹脂組成物およびその硬化物 |
JP2009179678A (ja) | 2008-01-30 | 2009-08-13 | Jsr Corp | 光硬化性組成物及び、その硬化膜 |
JP2010037425A (ja) * | 2008-08-05 | 2010-02-18 | Jsr Corp | 樹脂組成物、光学膜及び光学用部材 |
JP5423004B2 (ja) * | 2009-01-08 | 2014-02-19 | 東レ株式会社 | ネガ型感光性樹脂組成物およびそれを用いたタッチパネル用材料 |
JP5298956B2 (ja) * | 2009-03-02 | 2013-09-25 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線用基板 |
KR101726897B1 (ko) | 2009-09-29 | 2017-04-13 | 도레이 카부시키가이샤 | 포지티브형 감광성 수지 조성물, 그것을 이용한 경화막 및 광학 디바이스 |
KR20110040248A (ko) | 2009-10-13 | 2011-04-20 | 삼성전자주식회사 | 디지털 영상 처리기에서 소비 전력 저감 장치 및 방법 |
JP5540689B2 (ja) * | 2009-12-18 | 2014-07-02 | Jsr株式会社 | 感放射線性組成物、硬化膜及びこの形成方法 |
JP5428910B2 (ja) | 2010-02-05 | 2014-02-26 | 三菱化学株式会社 | アクティブ駆動型有機電界発光素子の隔壁用感光性組成物およびアクティブ駆動型有機電界発光表示装置 |
KR101807641B1 (ko) * | 2010-04-14 | 2017-12-11 | 도레이 카부시키가이샤 | 네거티브형 감광성 수지 조성물, 그것을 사용한 보호막 및 터치 패널 부재 |
JP2012023251A (ja) * | 2010-07-15 | 2012-02-02 | Sony Corp | 固体撮像素子及び固体撮像素子の製造方法、電子機器 |
JP2012082393A (ja) * | 2010-09-17 | 2012-04-26 | Jsr Corp | ポリシロキサン組成物、並びにその硬化膜及びその形成方法 |
CN103348289B (zh) * | 2011-03-22 | 2016-04-13 | Jsr株式会社 | 感放射线性组成物以及硬化膜及其形成方法 |
JP5729329B2 (ja) * | 2011-03-31 | 2015-06-03 | Jsr株式会社 | 感放射線性組成物、並びに硬化膜及びその形成方法 |
CN104040432B (zh) | 2012-01-19 | 2018-09-14 | 日产化学工业株式会社 | 负型感光性树脂组合物 |
JP6317253B2 (ja) * | 2012-05-17 | 2018-04-25 | 太陽インキ製造株式会社 | 液状現像型のマレイミド組成物、プリント配線板 |
JP2014084360A (ja) | 2012-10-22 | 2014-05-12 | Toagosei Co Ltd | 活性エネルギー線硬化型アンダーコート用組成物及び積層体 |
TWI479269B (zh) * | 2012-12-25 | 2015-04-01 | Chi Mei Corp | 感光性聚矽氧烷組成物及其應用 |
JP6417669B2 (ja) | 2013-03-05 | 2018-11-07 | 東レ株式会社 | 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネルの製造方法 |
JP6049521B2 (ja) * | 2013-03-29 | 2016-12-21 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、画像形成方法、固体撮像素子、カラーフィルタおよび紫外線吸収剤 |
JP5804336B2 (ja) * | 2014-04-16 | 2015-11-04 | 日立化成株式会社 | 感光性樹脂組成物及び感光性フィルム、永久レジスト |
-
2015
- 2015-01-21 SG SG11201606071WA patent/SG11201606071WA/en unknown
- 2015-01-21 US US15/113,119 patent/US9977329B2/en active Active
- 2015-01-21 CN CN201580005547.3A patent/CN106415393B/zh active Active
- 2015-01-21 KR KR1020167021968A patent/KR102300782B1/ko active IP Right Grant
- 2015-01-21 WO PCT/JP2015/051490 patent/WO2015111607A1/ja active Application Filing
- 2015-01-21 JP JP2015504792A patent/JP6572769B2/ja active Active
- 2015-01-21 EP EP15740612.5A patent/EP3098653B1/en active Active
- 2015-01-23 TW TW104102170A patent/TWI666511B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPWO2015111607A1 (ja) | 2017-03-23 |
US9977329B2 (en) | 2018-05-22 |
JP6572769B2 (ja) | 2019-09-11 |
EP3098653B1 (en) | 2020-07-29 |
TWI666511B (zh) | 2019-07-21 |
KR102300782B1 (ko) | 2021-09-13 |
US20170010532A1 (en) | 2017-01-12 |
CN106415393A (zh) | 2017-02-15 |
EP3098653A4 (en) | 2017-10-04 |
KR20160113155A (ko) | 2016-09-28 |
CN106415393B (zh) | 2020-04-07 |
TW201533529A (zh) | 2015-09-01 |
WO2015111607A1 (ja) | 2015-07-30 |
EP3098653A1 (en) | 2016-11-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201606071WA (en) | Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor | |
SG11201802076PA (en) | Negative photosensitive resin composition, cured film, element and display device each provided with cured film, and method for manufacturing display device | |
SG11201807941YA (en) | Negative-type photosensitive resin composition, cured film, display device provided with cured film, and production method therefor | |
PT3492982T (pt) | Composição de resina fotossensível, película curada, laminado, método para produzir película curada, método para produzir laminado, e dispositivo semicondutor | |
EP3203320A4 (en) | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | |
EP3505545A4 (en) | CURABLE COMPOSITION AND METHOD OF PREPARATION THEREOF, CURED LAYER AND METHOD OF PREPARATION THEREOF, COLOR FILTER, SOLID-BODY IMAGING ELEMENT, SOLID-BODY IMAGING DEVICE AND INFRARED SENSOR | |
SG11201706733UA (en) | Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device | |
EP3342792A4 (en) | Photosensitive composition, image forming method, film forming method, resin, image, and film | |
SG11201806952SA (en) | Negative-type photosensitive resin composition, cured film, display device that includes the cured film, and production method therefor | |
PT3339352T (pt) | Resina, composição, película curada, método para o fabrico de película curada e dispositivo semicondutor | |
EP3279733A4 (en) | Coloring photosensitive composition, cured film, pattern forming method, infrared blocking filter with light shielding film, solid-state imaging element, image display device and infrared sensor | |
EP3202855A4 (en) | Near-infrared absorbing composition, curable composition, cured film, near-infrared blocking filter, solid-state imaging element, infrared sensor, camera module, processed dye and method for producing processed dye | |
SG11201510123VA (en) | Curable composition, cured film, near infrared cut filter, camera module and method for manufacturing camera module | |
EP3182205A4 (en) | Photosensitive resin composition, lithographic printing original plate, method for producing lithographic printing plate, and polymer compound | |
SG11201505047WA (en) | Curable resin composition for forming infrared reflective film, infrared reflective film and manufacturing method thereof, infrared ray cutoff filter and solid-state imaging device using the same | |
SG11201501594UA (en) | Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition | |
SG11201802613SA (en) | Negative type coloring photosensitive resin composition, cured film, element, and display device | |
EP2829915A4 (en) | DYED RADIATION-SENSITIVE COMPOSITION, COLORED HARDENED FILM, COLOR FILTER, PATTERN MOLDING METHOD, METHOD FOR PRODUCING THE COLOR FILTER, SOLID-BODY IMAGING ELEMENT, AND IMAGE IMAGING APPARATUS | |
KR102005682B9 (ko) | 감광성 수지 조성물, 경화막, 표시장치, 및 패턴 형성 방법 | |
EP3061773A4 (en) | Method and device for manufacturing cured light-curing resin composition | |
EP3202804A4 (en) | Polymerizable composition, transparent resin, optical material, plastic lens, and method for manufacturing transparent resin | |
SG11201809227TA (en) | Resin composition, cured film of same and method for manufacturing same, and solid-state imaging element | |
EP3202805A4 (en) | Polymerizable composition, transparent resin, optical material, plastic lens, and method for manufacturing transparent resin | |
EP3648084A4 (en) | METHOD OF MANUFACTURING AN IMAGE DISPLAY DEVICE, LIGHT-CURING RESIN COMPOSITION, AND LIGHT-TRANSLUCENT CURED RESIN COMPOSITION | |
EP3633455A4 (en) | PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, HARDENED FILM, LAMINATE, PROCESS FOR PRODUCING HARDENED FILM, AND SEMICONDUCTOR DEVICE |