SG11201802076PA - Negative photosensitive resin composition, cured film, element and display device each provided with cured film, and method for manufacturing display device - Google Patents

Negative photosensitive resin composition, cured film, element and display device each provided with cured film, and method for manufacturing display device

Info

Publication number
SG11201802076PA
SG11201802076PA SG11201802076PA SG11201802076PA SG11201802076PA SG 11201802076P A SG11201802076P A SG 11201802076PA SG 11201802076P A SG11201802076P A SG 11201802076PA SG 11201802076P A SG11201802076P A SG 11201802076PA SG 11201802076P A SG11201802076P A SG 11201802076PA
Authority
SG
Singapore
Prior art keywords
display device
cured film
resin composition
photosensitive resin
negative photosensitive
Prior art date
Application number
SG11201802076PA
Inventor
Yugo Tanigaki
Satoshi Kamemoto
Kazuto Miyoshi
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201802076PA publication Critical patent/SG11201802076PA/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
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    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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    • C08G73/22—Polybenzoxazoles
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
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    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
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    • H—ELECTRICITY
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
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Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108885399B (en) * 2016-03-18 2022-03-15 东丽株式会社 Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same
JP6891880B2 (en) * 2017-03-28 2021-06-18 東レ株式会社 A photosensitive resin composition, a cured film, an element having a cured film, an organic EL display device having a cured film, a method for manufacturing a cured film, and a method for manufacturing an organic EL display device.
CN110446974B (en) 2017-03-29 2023-09-12 东丽株式会社 Photosensitive composition, cured film, and organic EL display device
CN108878472B (en) * 2017-05-12 2021-04-06 京东方科技集团股份有限公司 OLED display substrate, manufacturing method thereof and display device
JP6808831B2 (en) * 2017-06-06 2021-01-06 富士フイルム株式会社 Photosensitive resin compositions, cured films, laminates, methods for producing cured films, semiconductor devices and compounds
TWI758519B (en) * 2017-07-27 2022-03-21 南韓商Ｌｇ化學股份有限公司 Substrate and optical device
KR102361604B1 (en) * 2017-08-07 2022-02-10 동우 화인켐 주식회사 A colored photo resist composition, a color filter comprising the same and a display device comprising the same
TWI768111B (en) * 2017-08-28 2022-06-21 日商住友電木股份有限公司 Negative photosensitive resin composition, semiconductor device and electronic device
JP7120022B2 (en) * 2017-09-28 2022-08-17 東レ株式会社 Organic EL display device and method for forming pixel division layer and planarization layer
WO2019065902A1 (en) * 2017-09-29 2019-04-04 東レ株式会社 Photosensitive resin composition, cured film, element having cured film, organic el display, and method for manufacturing organic el display
KR102420415B1 (en) 2017-10-17 2022-07-15 덕산네오룩스 주식회사 Adhesion enhanced photo sensitive resin composition and light blocking layer using the same
DE102017124307A1 (en) * 2017-10-18 2019-04-18 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip
US20210191264A1 (en) * 2017-10-31 2021-06-24 Toray Industries, Inc. Negative photosensitive resin composition, cured film, and organic el display and manufacturing method therefor
CN111656277A (en) * 2018-01-31 2020-09-11 东丽株式会社 Negative photosensitive resin composition, cured film, element and display device provided with cured film, and method for producing same
KR102383518B1 (en) * 2018-02-06 2022-04-06 동우 화인켐 주식회사 Black colored photosensitive resin composition, pixel defining layer, organic light emitting diode and image display device produced using the same
JP7306264B2 (en) * 2018-03-14 2023-07-11 東レ株式会社 Negative photosensitive coloring composition, cured film, and touch panel using the same
JP7252020B2 (en) * 2018-04-16 2023-04-04 旭化成株式会社 Negative photosensitive resin composition and method for producing cured relief pattern
JP7084985B2 (en) * 2018-04-19 2022-06-15 富士フイルム株式会社 Pattern manufacturing method, optical filter manufacturing method, solid-state image sensor manufacturing method, image display device manufacturing method, photocurable composition and film
TWI773782B (en) * 2018-06-28 2022-08-11 奇美實業股份有限公司 Photosensitive resin composition, black matrix, color filter and display
CN115356873A (en) * 2018-07-05 2022-11-18 东丽株式会社 Resin composition, light-shielding film, method for producing light-shielding film, and substrate with partition
CN108983475B (en) * 2018-08-29 2021-10-29 Tcl华星光电技术有限公司 Liquid crystal display and substrate structure thereof
US20210364919A1 (en) * 2019-01-23 2021-11-25 Microcosm Technology Co., Ltd. Photosensitive resin composition and application thereof
WO2020189759A1 (en) * 2019-03-20 2020-09-24 株式会社カネカ Polyamide composition, method for producing same, polyamic acid solution, polyimide, polyimide film, laminate, production method thereof, flexible device, and method for producing flexible device
JP7329344B2 (en) * 2019-03-22 2023-08-18 太陽ホールディングス株式会社 Photosensitive resin composition, dry film, cured product, and electronic component
CN109901335B (en) * 2019-03-27 2023-08-25 京东方科技集团股份有限公司 Display panel and display device
JPWO2020241536A1 (en) * 2019-05-31 2020-12-03
KR20210147013A (en) * 2019-05-31 2021-12-06 후지필름 가부시키가이샤 Resin composition, film, color filter, solid-state image sensor and image display device
KR102511654B1 (en) 2019-07-22 2023-03-17 미쯔비시 케미컬 주식회사 Photosensitive colored resin composition, cured product, barrier rib and image display device
JP6921150B2 (en) 2019-07-24 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス Additional exposure equipment and pattern formation method
TW202112903A (en) * 2019-07-30 2021-04-01 日商富士軟片股份有限公司 Colored resin composition, film, color filter, solid state imaging device and image display device
JP2021026025A (en) * 2019-07-31 2021-02-22 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ Negative type photosensitive composition comprising black colorant
JP7377354B2 (en) * 2019-10-09 2023-11-09 アプライド マテリアルズ インコーポレイテッド Maskless-based lithography method
KR102368697B1 (en) * 2019-10-23 2022-02-28 울산과학기술원 Photosensitive resin composition, pixel define layer prepared by using the same, and electronic device comprising the pixel define layer
KR20210056014A (en) * 2019-11-08 2021-05-18 주식회사 엘지화학 Biner resin, negative-type photosensitive resin composition and display apparatus comprising black bank formed by using same
KR102427008B1 (en) 2019-12-02 2022-08-01 도레이 카부시키가이샤 Photosensitive composition, negative photosensitive composition, pixel dividing layer and organic EL display device
CN114830826A (en) 2019-12-20 2022-07-29 东丽株式会社 Photosensitive resin composition, cured film, organic EL display, display device, and method for producing cured film
KR20210101379A (en) 2020-02-07 2021-08-19 삼성디스플레이 주식회사 display device and electric apparatus
JP7331243B2 (en) * 2020-03-16 2023-08-22 富士フイルム株式会社 Coloring composition, film, optical filter, solid-state imaging device, and image display device
GB2595250B (en) * 2020-05-19 2022-09-28 Plessey Semiconductors Ltd Array of light emitting devices with reduced optical crosstalk
TW202204476A (en) * 2020-06-03 2022-02-01 日商富士軟片股份有限公司 Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device
KR20230078994A (en) * 2020-09-29 2023-06-05 도레이 카부시키가이샤 Photosensitive resin composition, cured product, and display device, and method for producing cured product
JPWO2022085433A1 (en) * 2020-10-23 2022-04-28
JPWO2022085431A1 (en) * 2020-10-23 2022-04-28
KR20220096986A (en) * 2020-12-31 2022-07-07 주식회사 동진쎄미켐 Negative photosensitive resin composition capable of low temperature curing and low refractive index
KR20220166974A (en) * 2021-06-11 2022-12-20 삼성에스디아이 주식회사 Photosensitive resin composition, photosensitive resin using the same, color filter and display device
JPWO2023002728A1 (en) * 2021-07-21 2023-01-26
WO2023021688A1 (en) * 2021-08-20 2023-02-23 住友ベークライト株式会社 Photosensitive resin composition, electronic device manufacturing method, and electronic device
WO2023054116A1 (en) 2021-09-29 2023-04-06 東レ株式会社 Photosensitive composition, cured product, display device, electronic component, and method for producing cured product
CN114156329B (en) * 2021-11-30 2023-07-04 武汉华星光电半导体显示技术有限公司 Display panel, manufacturing method thereof and display device
WO2023171487A1 (en) * 2022-03-07 2023-09-14 東レ株式会社 Photosensitive resin composition, cured article, display device, and method for producing display device

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000098129A (en) * 1998-07-23 2000-04-07 Toshiba Corp Colorant for color filter, color filter substrate and liquid crystal display device
JP2000292783A (en) 1999-02-03 2000-10-20 Dainippon Printing Co Ltd Liquid crystal display device
WO2004009403A1 (en) * 2002-07-24 2004-01-29 Roumen Petkov Interactive headlight control system
JP4225030B2 (en) 2002-10-30 2009-02-18 コニカミノルタホールディングス株式会社 Organic electroluminescence device
DE60318884T2 (en) * 2002-11-06 2009-01-22 Asahi Glass Co., Ltd. Barrier rib and process for its production
WO2004109403A1 (en) 2003-06-02 2004-12-16 Toray Industries, Inc. Photosensitive resin composition, and electronic component and display using same
JP2005075965A (en) * 2003-09-02 2005-03-24 Toray Ind Inc Black coating film composition, resin black matrix, color filter, and liquid crystal display
US7622613B2 (en) 2004-10-26 2009-11-24 Showa Denko K.K. Thiol compound and photosensitive composition using the same
JP2006154775A (en) 2004-10-26 2006-06-15 Showa Denko Kk Black matrix resist composition containing thiol compound
TWI398724B (en) * 2005-03-15 2013-06-11 Toray Industries Photo-sensitive resin composition
JP4802536B2 (en) 2005-03-31 2011-10-26 大日本印刷株式会社 Organic electroluminescent image display device
JP5163899B2 (en) * 2006-06-15 2013-03-13 日産化学工業株式会社 Positive photosensitive resin composition containing a polymer compound having a ring structure
JP5042539B2 (en) 2006-06-22 2012-10-03 東京応化工業株式会社 Photosensitive resin composition and liquid crystal alignment control bump using the same
JP5186857B2 (en) 2006-09-29 2013-04-24 東レ株式会社 Black resin composition, resin black matrix, and color filter
JP5061703B2 (en) * 2007-04-25 2012-10-31 東レ株式会社 Photosensitive resin composition
JP5222624B2 (en) * 2008-05-12 2013-06-26 富士フイルム株式会社 Black photosensitive resin composition, color filter, and method for producing the same
KR101596985B1 (en) * 2009-01-29 2016-02-23 도레이 카부시키가이샤 Resin composition and display device formed using same
JP5471376B2 (en) * 2009-12-04 2014-04-16 東レ株式会社 Photosensitive paste for forming organic-inorganic composite conductive pattern and method for producing organic-inorganic composite conductive pattern
CN102640054B (en) * 2009-12-04 2013-07-24 东丽株式会社 Photosensitive resin composition, laminate utilizing same, and solid-state imaging device
SG181620A1 (en) * 2009-12-11 2012-07-30 Fujifilm Corp Black curable composition, light-shielding color filter, light-shielding film and method for manufacturing the same, wafer level lens, and solid-state imaging device
JP2012003225A (en) * 2010-01-27 2012-01-05 Fujifilm Corp Polymerizable composition for solder resist and method for forming solder resist pattern
SG184526A1 (en) * 2010-04-14 2012-11-29 Toray Industries Negative photosensitive resin composition, and protective film and touch panel member using the same
JP5617476B2 (en) * 2010-09-22 2014-11-05 Jsr株式会社 Siloxane polymer composition, cured film and method of forming cured film
JP5211307B2 (en) * 2011-03-04 2013-06-12 東洋インキＳｃホールディングス株式会社 Photosensitive composition
JP2014122926A (en) * 2011-03-31 2014-07-03 Asahi Glass Co Ltd Photosensitive composition for negative type and coating film
JP2012237864A (en) * 2011-05-11 2012-12-06 Kaneka Corp Novel black photosensitive resin composition and use of the same
EP2725423B1 (en) * 2011-06-24 2021-09-01 Tokyo Ohka Kogyo Co., Ltd. Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, and color filter
JP5858739B2 (en) * 2011-11-15 2016-02-10 株式会社カネカ Novel photosensitive resin composition preparation kit and use thereof
US10030133B2 (en) * 2011-12-06 2018-07-24 Kaneka Corporation Black photosensitive resin composition and use of same
JP5797279B2 (en) 2012-01-25 2015-10-21 株式会社カネカ Printed wiring board with pigment-containing insulating film using novel resin composition for pigment-containing insulating film
JP2013232314A (en) 2012-04-27 2013-11-14 Jsr Corp Radiation-sensitive resin composition, insulation film and organic el element
JP2013250473A (en) 2012-06-01 2013-12-12 Toppan Printing Co Ltd Black photosensitive resin composition, method for producing black matrix, color filter, and liquid crystal display device
JP6170673B2 (en) * 2012-12-27 2017-07-26 富士フイルム株式会社 Composition for color filter, infrared transmission filter, method for producing the same, and infrared sensor
JP5966972B2 (en) * 2013-03-01 2016-08-10 Jsr株式会社 Radiation sensitive resin composition, insulating film and organic EL device
JP6417669B2 (en) * 2013-03-05 2018-11-07 東レ株式会社 Photosensitive resin composition, protective film, insulating film, and method of manufacturing touch panel
KR20140141339A (en) * 2013-05-31 2014-12-10 제일모직주식회사 Photosensitive resin composition, black spacer prepared by using the composition, and color filter having the black spacer
JP2015001655A (en) 2013-06-17 2015-01-05 東レ株式会社 Laminate resin black matrix substrate
CN105308484A (en) * 2013-06-17 2016-02-03 东丽株式会社 Method for manufacturing laminated resin black-matrix substrate
KR101709698B1 (en) * 2013-09-02 2017-02-23 제일모직 주식회사 Black photosensitive resin composition and light blocking layer using the same
WO2015046332A1 (en) * 2013-09-25 2015-04-02 東京応化工業株式会社 Radiation sensitive composition and pattern forming method
JP2015069181A (en) 2013-09-30 2015-04-13 Jsr株式会社 Radiation-sensitive resin composition, cured film, method for forming the same and display element
JP2015081942A (en) * 2013-10-21 2015-04-27 凸版印刷株式会社 Color filter, and manufacturing method of color filter
JP5613851B1 (en) * 2014-02-28 2014-10-29 Jsr株式会社 Display or lighting device
CN105593756B (en) * 2014-07-31 2018-06-29 Jsr株式会社 Display element, photosensitive composite and electric moistening display
JP2016167447A (en) * 2015-03-05 2016-09-15 Jsr株式会社 Light-emitting device and radiation-sensitive material
CN107406673B (en) * 2015-03-30 2019-09-06 东丽株式会社 Colored resin composition, coloring film, decorating board and touch panel
JP6292299B2 (en) * 2015-04-01 2018-03-14 東レ株式会社 Display device
KR101837970B1 (en) * 2015-06-25 2018-03-13 삼성에스디아이 주식회사 Black photosensitive resin composition, photosensitive resin layer, and display device comprising the same
SG11201802613SA (en) * 2015-09-30 2018-04-27 Toray Industries Negative type coloring photosensitive resin composition, cured film, element, and display device
SG11201806952SA (en) * 2016-03-30 2018-09-27 Toray Industries Negative-type photosensitive resin composition, cured film, display device that includes the cured film, and production method therefor
US20190302617A1 (en) * 2016-06-30 2019-10-03 Toray Industries, Inc. Negative photosensitive resin composition, cured film, element provided with cured film, display device provided with element, and organic el display
KR101976660B1 (en) * 2016-07-13 2019-05-09 삼성에스디아이 주식회사 Photosensitive resin composition, photosensitive resin layer using the same and display device
US11822243B2 (en) * 2016-09-30 2023-11-21 Toray Industries, Inc. Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor

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