SG11201510719YA - Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same - Google Patents
Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with sameInfo
- Publication number
- SG11201510719YA SG11201510719YA SG11201510719YA SG11201510719YA SG11201510719YA SG 11201510719Y A SG11201510719Y A SG 11201510719YA SG 11201510719Y A SG11201510719Y A SG 11201510719YA SG 11201510719Y A SG11201510719Y A SG 11201510719YA SG 11201510719Y A SG11201510719Y A SG 11201510719YA
- Authority
- SG
- Singapore
- Prior art keywords
- same
- resin composition
- optical device
- film formed
- photosensitive resin
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Ceramic Engineering (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013138754 | 2013-07-02 | ||
PCT/JP2014/067507 WO2015002183A1 (en) | 2013-07-02 | 2014-07-01 | Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201510719YA true SG11201510719YA (en) | 2016-01-28 |
Family
ID=52143755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201510719YA SG11201510719YA (en) | 2013-07-02 | 2014-07-01 | Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same |
Country Status (8)
Country | Link |
---|---|
US (1) | US9989852B2 (en) |
EP (1) | EP3018532B1 (en) |
JP (1) | JP6172150B2 (en) |
KR (1) | KR102245396B1 (en) |
CN (1) | CN105359037B (en) |
SG (1) | SG11201510719YA (en) |
TW (1) | TWI628233B (en) |
WO (1) | WO2015002183A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6605876B2 (en) * | 2015-08-11 | 2019-11-13 | 東京応化工業株式会社 | Resist pattern forming apparatus and resist pattern forming method |
KR102493962B1 (en) | 2016-10-19 | 2023-02-01 | 롬엔드하스전자재료코리아유한회사 | Photosensitive resin composition and cured film prepared therefrom |
JP7269503B2 (en) * | 2018-02-28 | 2023-05-09 | セントラル硝子株式会社 | Silicon-containing layer-forming composition and method for producing patterned substrate using same |
KR102331157B1 (en) * | 2019-10-23 | 2021-11-26 | (주)휴넷플러스 | Polysiloxane copolymer, method for preparing the same and resin composition comprising the same |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63204254A (en) * | 1987-02-20 | 1988-08-23 | Nippon Telegr & Teleph Corp <Ntt> | Method for developing photoresist |
JP2700655B2 (en) * | 1988-03-02 | 1998-01-21 | 富士写真フイルム株式会社 | Photoresist composition |
JP4270708B2 (en) | 1999-04-23 | 2009-06-03 | 富士通株式会社 | Silicon-containing polymer, method for producing the same, resist composition using the same, pattern forming method, and method for producing electronic device |
JP2001081404A (en) | 1999-09-17 | 2001-03-27 | Jsr Corp | Coating composition and cured material |
JP4141625B2 (en) * | 2000-08-09 | 2008-08-27 | 東京応化工業株式会社 | Positive resist composition and substrate provided with the resist layer |
JP4310968B2 (en) | 2001-06-22 | 2009-08-12 | 東レ株式会社 | Lens and optical waveguide obtained using positive photosensitive resin composition |
JP4670693B2 (en) | 2005-03-18 | 2011-04-13 | 東レ株式会社 | Photosensitive siloxane composition, cured film formed therefrom, and device having cured film |
JP5296297B2 (en) | 2005-04-04 | 2013-09-25 | 東レ・ファインケミカル株式会社 | Silicone copolymer having condensed polycyclic hydrocarbon group and process for producing the same |
JP4973093B2 (en) | 2005-10-03 | 2012-07-11 | 東レ株式会社 | Siloxane resin composition, optical article, and method for producing siloxane resin composition |
JP5586820B2 (en) | 2006-07-21 | 2014-09-10 | 東京応化工業株式会社 | High refractive index material |
JP4853228B2 (en) * | 2006-10-25 | 2012-01-11 | 東レ株式会社 | Photosensitive siloxane composition, cured film formed therefrom, element having cured film, and pattern forming method |
JP2008208342A (en) * | 2007-01-31 | 2008-09-11 | Toray Ind Inc | Resin composition, cured film and color filter with cured film |
JP5589387B2 (en) | 2008-11-27 | 2014-09-17 | 東レ株式会社 | Siloxane resin composition and protective film for touch panel using the same |
CN102472964B (en) * | 2009-09-29 | 2013-08-07 | 东丽株式会社 | Positive photosensitive resin composition, cured film obtained using same, and optical device |
TWI432895B (en) * | 2010-12-01 | 2014-04-01 | Chi Mei Corp | Photo-sensitive polysiloxane composition and protecting film formed therefrom |
JP2012158743A (en) * | 2011-01-14 | 2012-08-23 | Toray Ind Inc | Non-photosensitive resin composition, cured film formed therefrom, and element for touch panel having cured film |
DE102011084183A1 (en) * | 2011-03-25 | 2012-09-27 | Evonik Degussa Gmbh | Aqueous silane-based anti-corrosive formulation |
KR101997485B1 (en) * | 2011-12-26 | 2019-07-08 | 도레이 카부시키가이샤 | Photosensitive resin composition and process for producing semiconductor element |
JP6115115B2 (en) * | 2012-12-18 | 2017-04-19 | 東レ株式会社 | Positive photosensitive resin composition, method for producing cured pattern using the same, method for producing convex pattern substrate, and method for producing light-emitting element |
TWI479269B (en) * | 2012-12-25 | 2015-04-01 | Chi Mei Corp | Photosensitive polysiloxane composition and uses thereof |
KR102300782B1 (en) * | 2014-01-24 | 2021-09-13 | 도레이 카부시키가이샤 | Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor |
-
2014
- 2014-07-01 WO PCT/JP2014/067507 patent/WO2015002183A1/en active Application Filing
- 2014-07-01 JP JP2014531799A patent/JP6172150B2/en active Active
- 2014-07-01 US US14/902,411 patent/US9989852B2/en active Active
- 2014-07-01 TW TW103122672A patent/TWI628233B/en active
- 2014-07-01 EP EP14820140.3A patent/EP3018532B1/en active Active
- 2014-07-01 CN CN201480037500.0A patent/CN105359037B/en active Active
- 2014-07-01 KR KR1020157035617A patent/KR102245396B1/en active IP Right Grant
- 2014-07-01 SG SG11201510719YA patent/SG11201510719YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3018532A4 (en) | 2017-03-22 |
US9989852B2 (en) | 2018-06-05 |
EP3018532A1 (en) | 2016-05-11 |
JPWO2015002183A1 (en) | 2017-02-23 |
KR102245396B1 (en) | 2021-04-28 |
JP6172150B2 (en) | 2017-08-02 |
WO2015002183A1 (en) | 2015-01-08 |
US20160370703A1 (en) | 2016-12-22 |
CN105359037A (en) | 2016-02-24 |
CN105359037B (en) | 2020-02-28 |
TW201502207A (en) | 2015-01-16 |
TWI628233B (en) | 2018-07-01 |
KR20160026881A (en) | 2016-03-09 |
EP3018532B1 (en) | 2020-08-19 |
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