SG102032A1 - Semiconductor device and method of its manufacture - Google Patents

Semiconductor device and method of its manufacture

Info

Publication number
SG102032A1
SG102032A1 SG200200598A SG200200598A SG102032A1 SG 102032 A1 SG102032 A1 SG 102032A1 SG 200200598 A SG200200598 A SG 200200598A SG 200200598 A SG200200598 A SG 200200598A SG 102032 A1 SG102032 A1 SG 102032A1
Authority
SG
Singapore
Prior art keywords
semiconductor chip
semiconductor device
region
conductive material
anisotropic conductive
Prior art date
Application number
SG200200598A
Other languages
English (en)
Inventor
Nobuaki Hashimoto
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of SG102032A1 publication Critical patent/SG102032A1/en

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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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    • Y10T29/49002—Electrical device making
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
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  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
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  • Electromagnetism (AREA)
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SG200200598A 1998-07-01 1999-06-25 Semiconductor device and method of its manufacture SG102032A1 (en)

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