SG10201405722WA - Metal oxide etching solution composition and etching method - Google Patents

Metal oxide etching solution composition and etching method

Info

Publication number
SG10201405722WA
SG10201405722WA SG10201405722WA SG10201405722WA SG10201405722WA SG 10201405722W A SG10201405722W A SG 10201405722WA SG 10201405722W A SG10201405722W A SG 10201405722WA SG 10201405722W A SG10201405722W A SG 10201405722WA SG 10201405722W A SG10201405722W A SG 10201405722WA
Authority
SG
Singapore
Prior art keywords
metal oxide
solution composition
etching
etching solution
etching method
Prior art date
Application number
SG10201405722WA
Other languages
English (en)
Inventor
Takuo Ohwada
Toshikazu Shimizu
Original Assignee
Kanto Kagaku
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Kagaku filed Critical Kanto Kagaku
Publication of SG10201405722WA publication Critical patent/SG10201405722WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/465—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Liquid Crystal (AREA)
SG10201405722WA 2013-09-18 2014-09-15 Metal oxide etching solution composition and etching method SG10201405722WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013193440A JP6261926B2 (ja) 2013-09-18 2013-09-18 金属酸化物エッチング液組成物およびエッチング方法

Publications (1)

Publication Number Publication Date
SG10201405722WA true SG10201405722WA (en) 2015-04-29

Family

ID=52666935

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201405722WA SG10201405722WA (en) 2013-09-18 2014-09-15 Metal oxide etching solution composition and etching method

Country Status (6)

Country Link
US (1) US20150075850A1 (zh)
JP (1) JP6261926B2 (zh)
KR (1) KR102319261B1 (zh)
CN (2) CN111286333A (zh)
SG (1) SG10201405722WA (zh)
TW (1) TWI645018B (zh)

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JP6417612B2 (ja) * 2014-12-01 2018-11-07 メック株式会社 エッチング剤およびその補給液、マグネシウム部品の表面粗化方法、ならびにマグネシウム−樹脂複合体の製造方法
WO2017098369A1 (en) * 2015-12-11 2017-06-15 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film, semiconductor device, and display device
CN105369251A (zh) * 2015-12-16 2016-03-02 无锡吉进环保科技有限公司 一种基于纳米二氧化硫的电路板用蚀刻液
KR101725204B1 (ko) * 2016-01-15 2017-04-12 풍원화학(주) 금속 산화물의 선택적 식각액
KR102362556B1 (ko) * 2016-03-25 2022-02-14 동우 화인켐 주식회사 인듐 산화막용 식각 조성물
JP2017216444A (ja) * 2016-05-31 2017-12-07 ナガセケムテックス株式会社 エッチング液
KR102459686B1 (ko) * 2016-06-24 2022-10-27 동우 화인켐 주식회사 식각액 조성물 및 이를 이용한 표시 장치용 어레이 기판의 제조방법
JP6769760B2 (ja) 2016-07-08 2020-10-14 関東化学株式会社 エッチング液組成物およびエッチング方法
US20180358468A1 (en) * 2017-06-08 2018-12-13 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Fabrication method of thin film transistor, array substrate, and liquid crystal display panel
CN107564809B (zh) * 2017-08-04 2019-11-12 深圳市华星光电半导体显示技术有限公司 Igzo膜层的蚀刻液及其蚀刻方法
CN108650801B (zh) * 2018-04-02 2020-07-10 皆利士多层线路版(中山)有限公司 厚铜线路板的沉金方法
US20230274946A1 (en) * 2022-02-28 2023-08-31 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions

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Also Published As

Publication number Publication date
JP6261926B2 (ja) 2018-01-17
TWI645018B (zh) 2018-12-21
CN104449739B (zh) 2020-04-21
KR20150032487A (ko) 2015-03-26
US20150075850A1 (en) 2015-03-19
JP2015060937A (ja) 2015-03-30
CN111286333A (zh) 2020-06-16
KR102319261B1 (ko) 2021-10-29
CN104449739A (zh) 2015-03-25
TW201520309A (zh) 2015-06-01

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