SG10201405722WA - Metal oxide etching solution composition and etching method - Google Patents

Metal oxide etching solution composition and etching method

Info

Publication number
SG10201405722WA
SG10201405722WA SG10201405722WA SG10201405722WA SG10201405722WA SG 10201405722W A SG10201405722W A SG 10201405722WA SG 10201405722W A SG10201405722W A SG 10201405722WA SG 10201405722W A SG10201405722W A SG 10201405722WA SG 10201405722W A SG10201405722W A SG 10201405722WA
Authority
SG
Singapore
Prior art keywords
metal oxide
solution composition
etching
etching solution
etching method
Prior art date
Application number
SG10201405722WA
Inventor
Takuo Ohwada
Toshikazu Shimizu
Original Assignee
Kanto Kagaku
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Kagaku filed Critical Kanto Kagaku
Publication of SG10201405722WA publication Critical patent/SG10201405722WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/465—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
SG10201405722WA 2013-09-18 2014-09-15 Metal oxide etching solution composition and etching method SG10201405722WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013193440A JP6261926B2 (en) 2013-09-18 2013-09-18 Metal oxide etchant composition and etching method

Publications (1)

Publication Number Publication Date
SG10201405722WA true SG10201405722WA (en) 2015-04-29

Family

ID=52666935

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201405722WA SG10201405722WA (en) 2013-09-18 2014-09-15 Metal oxide etching solution composition and etching method

Country Status (6)

Country Link
US (1) US20150075850A1 (en)
JP (1) JP6261926B2 (en)
KR (1) KR102319261B1 (en)
CN (2) CN104449739B (en)
SG (1) SG10201405722WA (en)
TW (1) TWI645018B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558850B (en) * 2014-03-29 2016-11-21 精密聚合物股份有限公司 The processing liquid for electronic components and the production method of electronic components
JP6417612B2 (en) * 2014-12-01 2018-11-07 メック株式会社 Etching agent and replenisher thereof, method for roughening surface of magnesium component, and method for producing magnesium-resin composite
WO2017098369A1 (en) * 2015-12-11 2017-06-15 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film, semiconductor device, and display device
CN105369251A (en) * 2015-12-16 2016-03-02 无锡吉进环保科技有限公司 Etching liquid for circuit board based on nano sulfur dioxide
KR101725204B1 (en) * 2016-01-15 2017-04-12 풍원화학(주) Selective etchant for metal oxide
KR102362556B1 (en) * 2016-03-25 2022-02-14 동우 화인켐 주식회사 Composition for Etching Indium Oxide Layer
JP2017216444A (en) * 2016-05-31 2017-12-07 ナガセケムテックス株式会社 Etchant
KR102459686B1 (en) * 2016-06-24 2022-10-27 동우 화인켐 주식회사 Etching solution composition and preparing method of an array substrate for display using the same
JP6769760B2 (en) 2016-07-08 2020-10-14 関東化学株式会社 Etching liquid composition and etching method
US20180358468A1 (en) * 2017-06-08 2018-12-13 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Fabrication method of thin film transistor, array substrate, and liquid crystal display panel
CN107564809B (en) * 2017-08-04 2019-11-12 深圳市华星光电半导体显示技术有限公司 The etching solution and its engraving method of IGZO film layer
CN108650801B (en) * 2018-04-02 2020-07-10 皆利士多层线路版(中山)有限公司 Gold immersion method of thick copper circuit board
TW202336214A (en) * 2022-02-28 2023-09-16 美商富士軟片電子材料美國股份有限公司 Etching compositions

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448631A (en) * 1990-06-14 1992-02-18 Fujitsu Ltd Etching method for transparent conductive film
JPH07141932A (en) * 1993-11-18 1995-06-02 Kanto Chem Co Inc Etching liquid composition for transparent conductive film
KR100381054B1 (en) * 1999-12-28 2003-04-18 엘지.필립스 엘시디 주식회사 Transparent Electrode Composed of Indium-Zinc-Oxide and Etchant For Etching The Same
JP2002033304A (en) * 2000-07-14 2002-01-31 Mitsubishi Gas Chem Co Inc Composition for etching
JP2002033303A (en) * 2000-07-14 2002-01-31 Mitsubishi Gas Chem Co Inc Composition for etching
JP3345408B2 (en) 2000-09-08 2002-11-18 関東化学株式会社 Etching solution composition
DE60124473T2 (en) * 2000-09-08 2007-09-06 Kanto Kagaku K.K. etching liquid
JP2002217164A (en) * 2001-01-17 2002-08-02 Nagase Kasei Kogyo Kk Composition of etching solution
JP2005116542A (en) * 2002-03-25 2005-04-28 Nagase Chemtex Corp Etchant composition
JP2004048631A (en) * 2002-09-12 2004-02-12 Toyo Commun Equip Co Ltd Piezoelectric oscillator
JP2004137586A (en) * 2002-10-21 2004-05-13 Mitsubishi Chemicals Corp Etching liquid, and etching method
JP2004240091A (en) * 2003-02-05 2004-08-26 Idemitsu Kosan Co Ltd Method for manufacturing transflective type electrode substrate
JP2004356616A (en) * 2003-05-28 2004-12-16 Samsung Electronics Co Ltd Etchant for wiring and method for manufacturing thin film transistor display panel using the same
JP2005277402A (en) * 2004-02-25 2005-10-06 Mitsubishi Gas Chem Co Inc Etching composition for laminated film including reflective electrode film and method for forming laminated wiring structure
US7329365B2 (en) * 2004-08-25 2008-02-12 Samsung Electronics Co., Ltd. Etchant composition for indium oxide layer and etching method using the same
DE102005035255A1 (en) * 2005-07-25 2007-02-01 Merck Patent Gmbh Etching media for oxide, transparent, conductive layers
KR20070017762A (en) * 2005-08-08 2007-02-13 엘지.필립스 엘시디 주식회사 Etchant composition, method of patterning electroconductive film using the same and method of fabricating flat panel display using the same
EP1953766A4 (en) * 2005-11-21 2009-11-11 Idemitsu Kosan Co Transparent conductive film, and substrate, electronic device and liquid crystal display using same
KR101299131B1 (en) * 2006-05-10 2013-08-22 주식회사 동진쎄미켐 Etching composition for tft lcd
JP5028033B2 (en) 2006-06-13 2012-09-19 キヤノン株式会社 Oxide semiconductor film dry etching method
JP5328083B2 (en) 2006-08-01 2013-10-30 キヤノン株式会社 Oxide etching method
JP4999400B2 (en) 2006-08-09 2012-08-15 キヤノン株式会社 Oxide semiconductor film dry etching method
TWI421937B (en) 2006-09-13 2014-01-01 Nagase Chemtex Corp Etchant composition
JP4961251B2 (en) * 2007-04-19 2012-06-27 林純薬工業株式会社 Etching composition for conductive film
KR101402189B1 (en) 2007-06-22 2014-06-02 삼성전자주식회사 Oxide thin film transistor and etchant of Zn oxide
JP5642967B2 (en) 2007-11-22 2014-12-17 関東化学株式会社 Etching solution composition
KR20090082772A (en) 2008-01-28 2009-07-31 주식회사 동진쎄미켐 Etchant composition for indium tin oxide layer and etching method using the same
JP5354989B2 (en) 2008-08-14 2013-11-27 関東化学株式会社 Etching composition for transparent conductive film
JP2010067823A (en) 2008-09-11 2010-03-25 Asahi Kasei Electronics Co Ltd Etching liquid composition
JP2010103214A (en) 2008-10-22 2010-05-06 Hayashi Junyaku Kogyo Kk Composition of etching liquid for conductor film
JP2011138937A (en) 2009-12-28 2011-07-14 Showa Denko Kk Etchant for transparent conductive film
TWI451539B (en) * 2010-08-05 2014-09-01 Advanced Semiconductor Eng Semiconductor package and manufacturing method thereof
JP5700784B2 (en) 2010-12-15 2015-04-15 株式会社Adeka Etching solution composition
JP5845501B2 (en) * 2011-10-06 2016-01-20 日本表面化学株式会社 Etching solution for transparent conductive thin film laminate
KR101922625B1 (en) * 2012-07-03 2018-11-28 삼성디스플레이 주식회사 Etchant for metal wire and method for manufacturing metal wire using the same
JP6044337B2 (en) * 2012-12-28 2016-12-14 三菱瓦斯化学株式会社 Etching solution and etching method for oxide of indium and gallium and oxygen or indium and gallium, zinc and oxygen
KR102087791B1 (en) * 2013-03-27 2020-03-12 삼성디스플레이 주식회사 Etchant composition, method of forming a metal pattern and method of manufacturing a display substrate using the same

Also Published As

Publication number Publication date
KR20150032487A (en) 2015-03-26
JP6261926B2 (en) 2018-01-17
CN104449739A (en) 2015-03-25
US20150075850A1 (en) 2015-03-19
JP2015060937A (en) 2015-03-30
TWI645018B (en) 2018-12-21
KR102319261B1 (en) 2021-10-29
CN104449739B (en) 2020-04-21
CN111286333A (en) 2020-06-16
TW201520309A (en) 2015-06-01

Similar Documents

Publication Publication Date Title
SG10201405722WA (en) Metal oxide etching solution composition and etching method
ZA201508189B (en) Doped metal oxide nanoparticles of and uses thereof
HUE053410T2 (en) Application method and application facility
SG10201710610PA (en) Etching agent, etching method and etching agent preparation liquid
EP2952097A4 (en) Pest-control composition and pest-control method
EP2952100A4 (en) Pest-control composition and pest-control method
EP2801862A4 (en) Transparent substrate including fine metal line and method for manufacturing same
EP2952099A4 (en) Pest-control composition and pest-control method
GB201305414D0 (en) Method and composition
EP2886589A4 (en) Soft metal laminate and method for manufacturing same
GB2588536B (en) Metal oxide cement
EP2982042A4 (en) Terminal and control method thereof
GB201300376D0 (en) Method and compound
HK1204697A1 (en) Method for form processing and terminal thereof
SG11201601261SA (en) Etching method
EP2827363A4 (en) Etching solution composition and etching method
SG11201600696PA (en) Etching method
EP2971241A4 (en) Anisotropic conductor and method of fabrication thereof
GB201302726D0 (en) Method for producing titanium oxide and iron oxide
HK1205207A1 (en) Silver alloy compositions and processes
EP3007180A4 (en) Oxide superconductor and method for manufacturing same
GB201322931D0 (en) Method of etching
TWI562198B (en) Forming method and substrate
ZA201505570B (en) Method and composition for preventing oxidation
HK1198183A1 (en) Method for producing metal oxide film and metal oxide film