RU2014104503A - Получение алкалоидов без выделения промежуточных продуктов - Google Patents

Получение алкалоидов без выделения промежуточных продуктов Download PDF

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RU2014104503A
RU2014104503A RU2014104503/05A RU2014104503A RU2014104503A RU 2014104503 A RU2014104503 A RU 2014104503A RU 2014104503/05 A RU2014104503/05 A RU 2014104503/05A RU 2014104503 A RU2014104503 A RU 2014104503A RU 2014104503 A RU2014104503 A RU 2014104503A
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film substrate
layer
inorganic
deposited
inorganic nanocoating
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Эндрю ХАНТ
Йонгдонг ДЖИАНГ
Энтони Роберт КНОЕРЗЕР
Кеннет Скотт ЛАВЕДЬЮЭ
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Пепсико, Инк.
Нгимат Ко
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C23C16/402—Silicon dioxide
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/453—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating passing the reaction gases through burners or torches, e.g. atmospheric pressure CVD
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges

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Abstract

1. Способ создания пленочной подложки с покрытием, содержащий стадии:формирования органической пленочной подложки;осаждения первого слоя неорганического нанопокрытия на поверхность пленочной подложки в открытой атмосфере для повышения смачиваемости пленочной подложки для металлизации, при этом указанный первый слой неорганического нанопокрытия содержит окись; иметаллизации указанного первого слоя неорганического нанопокрытия для создания металлизированной пленочной подложки.2. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки путем химического осаждения из паровой фазы со сгоранием.3. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки путем плазмохимического осаждения из паровой фазы.4. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают преимущественно путем перенаправления пламени.5. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают преимущественно путем электрического перенаправления плазменного поля.6. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки до ее наматывания.7. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки путем химического осаждения из паровой фазы со сгоранием в условиях поточного изготовления пленки.8. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки до ее наматывания в условиях п

Claims (36)

1. Способ создания пленочной подложки с покрытием, содержащий стадии:
формирования органической пленочной подложки;
осаждения первого слоя неорганического нанопокрытия на поверхность пленочной подложки в открытой атмосфере для повышения смачиваемости пленочной подложки для металлизации, при этом указанный первый слой неорганического нанопокрытия содержит окись; и
металлизации указанного первого слоя неорганического нанопокрытия для создания металлизированной пленочной подложки.
2. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки путем химического осаждения из паровой фазы со сгоранием.
3. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки путем плазмохимического осаждения из паровой фазы.
4. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают преимущественно путем перенаправления пламени.
5. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают преимущественно путем электрического перенаправления плазменного поля.
6. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки до ее наматывания.
7. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки путем химического осаждения из паровой фазы со сгоранием в условиях поточного изготовления пленки.
8. Способ по п. 1, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки до ее наматывания в условиях поточного изготовления пленки.
9. Способ по п. 1, в котором неорганическое нанопокрытие содержит окись металла.
10. Способ по п. 1, в котором слой неорганического нанопокрытия имеет толщину 100 нм или менее.
11. Способ по п. 1, в котором пленочной подложкой является совместно экструдированная пленка.
12. Способ по п. 1, в котором пленочной подложкой является отлитая из раствора, одноосно или двухосноориентированная отлитая из раствора пленка.
13. Способ по п. 1, в котором пленочной подложкой является выдутая пленка.
14. Способ по п. 1, в котором пленочной подложкой является двухосноориентированная пленка.
15. Способ по п. 1, в котором пленочной подложкой является полимерная пленка на биологической основе.
16. Способ по п. 1, в котором пленочная подложка содержит сердцевидный полимерный слой, выбранный из группы, включающей полиэтилен, полипропилен, полистирол, полимолочную кислоту, полиэтилентерефталат, сложные полиэфиры и их сополимеры и смеси.
17. Способ по п. 1, в котором металлизированная пленочная подложка имеет скорость пропускания водяного пара 2,0 г/(м2/сутки) или менее.
18. Способ по п. 1, в котором металлизированная пленочная подложка имеет скорость пропускания кислорода 10 см3/(м2/сутки) или менее.
19. Способ создания пленочной подложки с покрытием, содержащий:
формирование органической пленочной подложки; и
осаждение первого слоя неорганического нанопокрытия на поверхность пленочной подложки в открытой атмосфере для преимущественного предотвращения слипания пленочной подложки, при этом слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки до ее наматывания.
20. Способ по п. 19, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки путем химического осаждения из паровой фазы со сгоранием.
21. Способ по п. 19, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки путем плазмохимического осаждения из паровой фазы.
22. Способ по п. 19, в котором слой неорганического нанопокрытия осаждают преимущественно путем перенаправления пламени.
23. Способ по п. 19, в котором слой неорганического нанопокрытия осаждают преимущественно путем электрического перенаправления плазменного поля.
24. Способ по п. 19, в котором слой неорганического нанопокрытия осаждают по меньшей мере на одну поверхность пленочной подложки до ее наслаивания.
25. Способ по п. 19, в котором неорганическое нанопокрытие содержит окись.
26. Способ по п. 19, в котором неорганическое нанопокрытие содержит окись металла.
27. Способ по п. 19, в котором слой неорганического нанопокрытия имеет толщину 20 нм или менее.
28. Способ по п. 19, в котором пленочной подложкой является совместно экспедированная пленка.
29. Способ по п. 19, в котором пленочной подложкой является отлитая из раствора, одноосно или двухосноориентированная отлитая из раствора пленка.
30. Способ по п. 19, в котором пленочной подложкой является выдутая пленка.
31. Способ по п. 19, в котором пленочной подложкой является полимерная пленка на биологической основе.
32. Способ по п. 19, в котором пленочная подложка содержит сердцевидный полимерный слой, выбранный из группы, включающей полиэтилен, полипропилен, полистирол, полимолочную кислоту, полиэтилентерефталат, сложные полиэфиры и их сополимеры и смеси.
33. Способ по п. 19, дополнительно включающий осаждение дополнительного слоя неорганического нанопокрытия на упомянутый первый слой неорганического нанопокрытия для формирования барьерного слоя.
34. Способ по п. 33, в котором дополнительный слой неорганического нанопокрытия содержит металл.
35. Способ по п. 33, в котором дополнительный слой неорганического нанопокрытия содержит окись металла.
36. Способ по п. 33, в котором второй слой неорганического нанопокрытия выбран из группы, включающей металл, окись металла, окись алюминия, двуокись кремния, окись цинка, окись марганца, окись меди, окись алюминия или окись олова.
RU2014104503/05A 2011-08-05 2012-08-06 Способ создания пленочной подложки с покрытием (варианты) RU2578148C2 (ru)

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US13/204,483 US9040120B2 (en) 2011-08-05 2011-08-05 Inorganic nanocoating primed organic film
US13/204,483 2011-08-05
PCT/US2012/049739 WO2013022830A1 (en) 2011-08-05 2012-08-06 Inorganic nanocoating primed organic film

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US20130034667A1 (en) 2013-02-07
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CN103917361B (zh) 2016-08-24
AU2012294579B2 (en) 2015-08-06
EP2739470A4 (en) 2015-05-06
RU2578148C2 (ru) 2016-03-20
JP2014529516A (ja) 2014-11-13
WO2013022830A1 (en) 2013-02-14
CN103917361A (zh) 2014-07-09
BR112014002654B1 (pt) 2022-01-18
US9040120B2 (en) 2015-05-26
BR112014002654A8 (pt) 2017-06-20
EP2739470A1 (en) 2014-06-11
KR101612644B1 (ko) 2016-04-14
JP5923606B2 (ja) 2016-05-24
CA2843154C (en) 2015-12-08
KR20140068049A (ko) 2014-06-05

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