JP2014529516A - 無機ナノコーティングが下塗りされた有機フィルム - Google Patents
無機ナノコーティングが下塗りされた有機フィルム Download PDFInfo
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- JP2014529516A JP2014529516A JP2014524155A JP2014524155A JP2014529516A JP 2014529516 A JP2014529516 A JP 2014529516A JP 2014524155 A JP2014524155 A JP 2014524155A JP 2014524155 A JP2014524155 A JP 2014524155A JP 2014529516 A JP2014529516 A JP 2014529516A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
-
- C—CHEMISTRY; METALLURGY
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/453—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating passing the reaction gases through burners or torches, e.g. atmospheric pressure CVD
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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Abstract
Description
一例において、ポリプロピレンフィルムをフィルム製造ラインにおいて押し出して、配向させた。70ゲージの総厚(18μmの厚さ)のフィルムは、トータル ペトロケミカル(Total Petrochemical)8573ポリプロピレンのスキン層と、トータル ペトロケミカル3371ポリプロピレンのコアと、トータル ペトロケミカル3371ポリプロピレンの対向スキン層とから構成した。前記押出し配向フィルムの最終的な巻回の前に、8573スキン層に対して火炎処理を実施した。このフィルムは、火炎処理単独に由来する金属化性能のわずかな改善を示す。
比較の目的のために、シリカ(CCVD)のオンライン火炎堆積(flame deposition)を、同じ70ゲージの合計の膜厚(18μmの厚さ)の実施例1からのものと同一の8573/3371/3371配向ポリプロピレンフィルムの8573スキン層上において実施した。設備は、シリカ前駆体を導入するために用いた付加的なマスフローコントローラおよびバブラーを唯一の例外として、実施例1に記載したものと同一であった。シリカ堆積および火炎処理は実施例1と同じ8573スキン側に施した。火炎のための空気は2cfm(0.056m3/分)で送出した。2台のアリキャット サイエンティフィック フローコントローラ(双方ともモデルMC−10SLPM)によって火炎に対するメタン流を計量供給した。火炎に対する主要なメタンは6.9SLPMで計量供給され、前駆体バブラーに進入するガスは1.4SLPMのメタン流設定を有した。バブラーメタンガス流は、シリカ前駆体として作用するテトラエトキシシラン(TEOS、98%、オールドリッチ)を収容している加熱されたバブラーに流入した。前記バブラーは適当な蒸気圧を提供するために40℃に加熱され、また前記バブラーを退出するラインはTEOS蒸気の凝結を防止するために45℃に加熱した。バブラーメタンガス流、バイパスメタンガス流、および空気ガス流は、バーナーの前で混合され、バーナー出口において燃焼された。
実施例として、また比較の目的のために、二軸配向PLAポリマーフィルム基材を最初にロールの内側表面上において火炎処理した。以下の典型的な処理条件が液体燃料供給火炎に用いられ、前記火炎はそれを通って流される液体をミクロン以下の液滴に霧化させた。トルエンまたはアルコール系溶媒を含有する可燃性溶媒は、4mL/分の流量で噴霧装置を介して流された。次に、霧化した溶媒をポリマー基材の付近で火炎に燃焼させた。前記ポリマーフィルム表面を、550℃のその表面における火炎ガス温度、2000インチ(50.8m)/分の運動速度、および0.64cm(0.25インチ)のステップサイズで、3周(3 laps)、火炎処理した。次に、Al金属化層を、熱蒸着によって火炎処理面の上部に堆積させた。OTRを23℃および100%乾燥酸素で試験した。7.18cc/m2・日のOTRが得られ、これは350cc/m2・日を超えるOTRを有するベア二軸配向PLAポリマー、および14.09cc/m2・日を超えるOTRを有した、ロールの内側表面上においてAlで金属化されたベア二軸配向PLAポリマーと比較して有意の改善であった。
金属化のために二軸配向PLAポリマー基材上へSiO2系プライマーナノコーティング界面層を液体燃料堆積(liquid fuel deposit)させる実施例として、以下の典型的な処理条件を用いた。可燃性溶媒および9.0mMの濃度のTEOS前駆体を含有するCCVD堆積溶液は、ミクロン以下のサイズの液滴を生じるようにエネルギーを与えられた噴霧装置を介して4mL/分の流量で流された。霧化した溶液をポリマーフィルム基材の前で火炎に燃焼させた。次に、400℃の表面におけるガス温度、1000インチ(25.4m)/分の運動速度、および0.64cm(0.25インチ)のステップサイズで、2周にわたって、SiO2系ナノコーティングを堆積させた。SiO2堆積の前に、PLAポリマーフィルム基材を、シリカ前駆体を有さないこと以外は、同一の条件で1周、火炎処理した。次に、Al金属化層を熱蒸着によってSiO2界面層の上部に堆積させた。OTRを23℃および100%乾燥酸素で試験した。2.78cc/m2・日のOTRが得られた。これは、350cc/m2・日を超えるOTRを有するAlで金属化されたベア二軸配向PLAポリマー、および、14.09cc/m2・日のOTRを有した、ロールの内側表面上のAlで金属化されたベア二軸配向PLAポリマー、および、7.18cc/m2・日のOTRを有した、ロールの内側表面上の火炎処理されたベア二軸配向PLAポリマーと比較して有意の改善であった。
実施例1および実施例2と同じライン上で製造された、巻回に後続したOPPポリマー上におけるSiO2系金属化プライマー層の実施例として、トータル ペトロケミカルのポリプロピレン上に換気フード内において長さ30.5cm(12”)および幅1.9cm(0.75”)を有する直線状火炎バーナーヘッドに対して、以下の典型的な堆積条件を用いた。前記バーナーヘッドはフリン バーナー コーポレイション(Flynn Burner Corporation)(モデル番号T−534)製である。メタンは、40℃の温度のTEOS前駆体と、約13.8L/分のメタンバイパスラインとを含むバブラーを介して約0.67L/分で流された。次に、前記バイパスラインを流れるメタンは、約4.2slpmの流量の空気と混合された。その空気/メタン混合物は、TEOS前駆体を含有するメタンと共に、線状バーナーを介して流され、ポリマー基材の近くで火炎を形成した。次に、SiO2界面層を、前記バーナーの近くで測定された1122℃の火炎温度および184フィート(56.08m)/分の運動速度で、37mmの距離において、1周、ポリマー表面上に堆積させた。次に、Al金属化層(結晶センサーによる測定で70nm)を電子ビーム蒸着(e−beam evaporation)によってSiO2界面層の上部に堆積させた。OTRを23℃および100%乾燥酸素で試験した。43.35cc/m2・日のOTRが得られた(AAT−03D1)。これは、1000cc/m2・日を超えるOTRを有するベアOPPポリマーと比較して、有意の改善である。WVTRも38℃および89%RHで試験し、9.3g/m2・日のWVTRを有するベアOPPポリマーと比較して、0.35g/m2・日のWVTRが得られた。
SiO2堆積の前にポリマー基材を火炎処理するための実施例として、システム、基材および条件は実施例5と同一であった。相違は、22.9cm(9”)×30.5cm(12”)のOPPポリマー基材を、最初に、13.8L/分のメタン流、4.2slpmの空気流、39mmのバーナー−試料距離、184フィート(56.08m)/分の運動速度、および1180℃の温度で、1周、火炎処理したことである。次に、火炎処理されたポリマーは、約1190℃の火炎温度、184フィート(56.08m)/分の運動速度、および39mmのバーナー−試料距離で、2周のSiO2を堆積された。換気フード内において長さ30.5cm(12”)および幅1.9cm(0.75”)を有する直線状火炎バーナーヘッドを用いたSiO2堆積のために、以下の典型的な処理条件を用いた。前記バーナーヘッドはフリン バーナー コーポレイション製(モデル番号T−534バーナー)である。メタンは、40℃の温度のTEOS前駆体および約13.8L/分のメタンバイパスラインを含むバブラーを介して約0.2L/分で流された。次に、前記バイパスラインを流れるメタンは、約4.2slpmの流量の空気と混合された。空気/メタン混合物は、TEOS前駆体を含有するメタンと共に、直線状バーナーを介して流され、ポリマー基材の近くで火炎を形成した。次に、Al金属化層を電子ビーム蒸着によってSiO2界面層の上部に堆積させた。OTRを23℃および100%乾燥酸素で試験した。4.44cc/m2・日のOTRが得られた(AAT06C)。これは、1000cc/m2・日を超えるOTRを有するベアOPPポリマーと比較して、有意の改善である。またWVTRも38℃および89%RHで試験し、9.3g/m2・日のWVTRを有するベアOPPポリマーと比較して、0.10g/m2・日のWVTRが得られた。
この実施例では、CCVDによってシリカプライマーコーティングを堆積させるための実験を図3Bに示すような火炎再配向構成を有するパイロット二軸配向フィルムラインにおいてインラインで行った。火炎アセンブリによって生成される反応性プラズマをフィルム基材表面に比較的近接して維持するように該反応性プラズマを指向させるために、シールドを設置した。より長時間にわたってフィルム表面を堆積ガスに曝露するために、拡張された堆積ボックスは、前記シールドの端部に位置した。ガスは堆積区域を越えたところで排出された。
Claims (41)
- a)有機フィルム基材を形成することと、
b)金属化のためにフィルム基材の濡れ性を増強するために、開放雰囲気において、フィルム基材の表面上に第1無機ナノコーティング層を堆積させることと、を含む、方法。 - 前記無機ナノコーティング層は、前記フィルム基材の少なくとも1つの表面上に、燃焼化学蒸着によって堆積される、請求項1に記載の方法。
- 前記無機ナノコーティング層は、前記フィルム基材の少なくとも1つの表面上に、プラズマ強化化学蒸着によって堆積される、請求項1に記載の方法。
- 前記無機ナノコーティング層は、火炎の再配向によって実質的に堆積される、請求項1に記載の方法。
- 前記無機ナノコーティング層は、プラズマ場の電気再配向によって実質的に堆積される、請求項1に記載の方法。
- 前記無機ナノコーティング層は、巻回の前に、前記フィルム基材の少なくとも1つの表面上に堆積される、請求項1に記載の方法。
- 前記無機ナノコーティング層は、インラインのフィルム製造環境において、前記フィルム基材の少なくとも1つの表面上に、燃焼化学蒸着によって堆積される、請求項1に記載の方法。
- 前記無機ナノコーティング層は、インラインのフィルム変換環境において、巻回の前に、前記フィルム基材の少なくとも1つの表面上に堆積される、請求項1に記載の方法。
- 前記無機ナノコーティングは酸化物を含有する、請求項1に記載の方法。
- 前記無機ナノコーティングは、金属酸化物を含有する、請求項1に記載の方法。
- 無機ナノコーティング層は100nm以下の厚さを有する、請求項1に記載の方法。
- 前記フィルム基材は共押出しフィルムである、請求項1に記載の方法。
- 前記フィルム基材は、キャストフィルム、一軸配向キャストフィルム、または二軸配向キャストフィルムである、請求項1に記載の方法。
- 前記フィルム基材はブローンフィルムである、請求項1に記載の方法。
- 前記フィルム基材は二軸フィルムである、請求項1に記載の方法。
- 前記フィルム基材は、バイオベースポリマーフィルムである、請求項1に記載の方法。
- 前記フィルム基材は、ポリエチレン、ポリプロピレン、ポリスチレン、ポリ乳酸、ポリエチレンテレフタレート、ポリエステル、およびそれらのコポリマー、並びにそれらの混合物のうちから選択されるコアポリマー層を含む、請求項1に記載の方法。
- 前記第1無機ナノコーティング層上に第2無機ナノコーティング層を堆積させて、被覆フィルム基材を生成することをさらに含む、請求項1に記載の方法。
- 前記被覆フィルム基材は、2.0g/m2/日以下の水蒸気透過率を有する、請求項18に記載の方法。
- 前記被覆フィルム基材は、10cc/m2・日以下の酸素透過率を有する、請求項18に記載の方法。
- 前記第2無機ナノコーティング層は、金属、金属酸化物、酸化アルミニウム、シリカ酸化物、酸化亜鉛、酸化マンガン、酸化銅、酸化アルミニウムまたは酸化スズからなる群より選択される、請求項18に記載の方法。
- 透明なバリア層を形成するために、少なくとも1つの付加的な無機ナノコーティング層が施される、請求項18に記載の方法。
- a)有機フィルム基材を形成することと、
b)フィルム基材のブロッキングを実質的に阻害するために、開放雰囲気においてフィルム基材の表面上に第1無機ナノコーティング層を堆積させることと、を含む、方法。 - 前記無機ナノコーティング層は、前記フィルム基材の少なくとも1つの表面上に、燃焼化学蒸着によって堆積される、請求項23に記載の方法。
- 前記無機ナノコーティング層は、前記フィルム基材の少なくとも1つの表面上に、プラズマ強化化学蒸着によって実質的に堆積される、請求項23に記載の方法。
- 前記無機ナノコーティング層は、火炎の再配向によって実質的に堆積される、請求項23に記載の方法。
- 前記無機ナノコーティング層は、プラズマ場の電気再配向によって実質的に堆積される、請求項23に記載の方法。
- 前記無機ナノコーティング層は、巻回の前に、前記フィルム基材の少なくとも1つの表面上に実質的に堆積される、請求項23に記載の方法。
- 前記無機ナノコーティング層は、ラミネーションの前に、前記フィルム基材の少なくとも1つの表面上に実質的に堆積される、請求項23に記載の方法。
- 前記無機ナノコーティングは酸化物を含有する、請求項23に記載の方法。
- 前記無機ナノコーティングは、金属酸化物を含有する、請求項23に記載の方法。
- 前記無機ナノコーティング層は20nm以下の厚さを有する、請求項23に記載の方法。
- 前記フィルム基材は共押出しフィルムである、請求項23に記載の方法。
- 前記フィルム基材は、キャストフィルム、一軸配向キャストフィルム、または二軸配向キャストフィルムである、請求項23に記載の方法。
- 前記フィルム基材はブローンフィルムである、請求項23に記載の方法。
- 前記フィルム基材は、バイオベースポリマーフィルムである、請求項23に記載の方法。
- 前記フィルム基材は、ポリエチレン、ポリプロピレン、ポリスチレン、ポリ乳酸、ポリエチレンテレフタレート、ポリエステル、およびそれらのコポリマー、並びにそれらの混合物のうちから選択されるコアポリマー層を含む、請求項23に記載の方法。
- 前記第1無機物コーティング層上に付加的な無機ナノコーティング層を堆積させて、バリア層を形成することをさらに含む、請求項23に記載の方法。
- 前記付加的な無機ナノコーティング層は、金属を含有する、請求項38に記載の方法。
- 前記無機ナノコーティングは、金属酸化物を含有する、請求項38に記載の方法。
- 前記第2無機ナノコーティング層は、金属、金属酸化物、酸化アルミニウム、シリカ酸化物、酸化亜鉛、酸化マンガン、酸化銅、酸化アルミニウムまたは酸化スズのうちから選択される、請求項38に記載の方法。
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KR20180125946A (ko) | 2016-03-22 | 2018-11-26 | 미쓰비시 마테리알 가부시키가이샤 | 스퍼터링 타깃 |
KR20190120167A (ko) | 2017-03-01 | 2019-10-23 | 미쓰비시 마테리알 가부시키가이샤 | 스퍼터링 타깃 및 스퍼터링 타깃의 제조 방법 |
KR20200131216A (ko) | 2018-03-15 | 2020-11-23 | 미쓰비시 마테리알 가부시키가이샤 | 원통형 스퍼터링 타깃, 스퍼터링 타깃재, 및 원통형 스퍼터링 타깃의 제조 방법 |
KR20200034874A (ko) * | 2018-09-21 | 2020-04-01 | 한국과학기술연구원 | 폴리케톤계 포장재용 다층 필름 및 그 제조방법 |
KR102201166B1 (ko) * | 2018-09-21 | 2021-01-13 | 한국과학기술연구원 | 폴리케톤계 포장재용 다층 필름 및 그 제조방법 |
KR20210135516A (ko) | 2019-03-11 | 2021-11-15 | 미쓰비시 마테리알 가부시키가이샤 | 금속구리/산화구리 함유 분말, 금속구리/산화구리 함유 분말의 제조 방법, 및 스퍼터링 타깃재, 스퍼터링 타깃재의 제조 방법 |
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WO2013022830A1 (en) | 2013-02-14 |
RU2578148C2 (ru) | 2016-03-20 |
CA2843154A1 (en) | 2013-02-14 |
CN103917361A (zh) | 2014-07-09 |
CN103917361B (zh) | 2016-08-24 |
JP5923606B2 (ja) | 2016-05-24 |
US9040120B2 (en) | 2015-05-26 |
BR112014002654A8 (pt) | 2017-06-20 |
EP2739470A1 (en) | 2014-06-11 |
BR112014002654A2 (pt) | 2017-06-13 |
CA2843154C (en) | 2015-12-08 |
KR101612644B1 (ko) | 2016-04-14 |
AU2012294579B2 (en) | 2015-08-06 |
AU2012294579A1 (en) | 2014-02-06 |
KR20140068049A (ko) | 2014-06-05 |
RU2014104503A (ru) | 2015-09-20 |
US20130034667A1 (en) | 2013-02-07 |
BR112014002654B1 (pt) | 2022-01-18 |
EP2739470A4 (en) | 2015-05-06 |
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