NL9300174A - Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten. - Google Patents

Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten. Download PDF

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Publication number
NL9300174A
NL9300174A NL9300174A NL9300174A NL9300174A NL 9300174 A NL9300174 A NL 9300174A NL 9300174 A NL9300174 A NL 9300174A NL 9300174 A NL9300174 A NL 9300174A NL 9300174 A NL9300174 A NL 9300174A
Authority
NL
Netherlands
Prior art keywords
products
metal
photoresist layer
apertured
applying
Prior art date
Application number
NL9300174A
Other languages
English (en)
Dutch (nl)
Original Assignee
Meco Equip Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meco Equip Eng filed Critical Meco Equip Eng
Priority to NL9300174A priority Critical patent/NL9300174A/nl
Priority to DE69403926T priority patent/DE69403926T2/de
Priority to SG1996009031A priority patent/SG48345A1/en
Priority to EP94200090A priority patent/EP0616052B1/de
Priority to AT94200090T priority patent/ATE154835T1/de
Priority to TW087202387U priority patent/TW410818U/zh
Priority to MYPI94000207A priority patent/MY110836A/en
Priority to JP6007773A priority patent/JP2780920B2/ja
Priority to US08/186,907 priority patent/US5512154A/en
Priority to KR1019940001575A priority patent/KR100314946B1/ko
Publication of NL9300174A publication Critical patent/NL9300174A/nl
Priority to US08/533,324 priority patent/US5702583A/en
Priority to HK97101647A priority patent/HK1000135A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
NL9300174A 1993-01-28 1993-01-28 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten. NL9300174A (nl)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL9300174A NL9300174A (nl) 1993-01-28 1993-01-28 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.
DE69403926T DE69403926T2 (de) 1993-01-28 1994-01-17 Verfahren und Vorrichtung zur selektiven Elektroplattierung von gelochtem Metall oder metallisierten Gegenständen
SG1996009031A SG48345A1 (en) 1993-01-28 1994-01-17 A method and an apparatus for selectively electroplating apertured metal or metallized products
EP94200090A EP0616052B1 (de) 1993-01-28 1994-01-17 Verfahren und Vorrichtung zur selektiven Elektroplattierung von gelochtem Metall oder metallisierten Gegenständen
AT94200090T ATE154835T1 (de) 1993-01-28 1994-01-17 Verfahren und vorrichtung zur selektiven elektroplattierung von gelochtem metall oder metallisierten gegenständen
TW087202387U TW410818U (en) 1993-01-28 1994-01-19 An apparatus for selectively electroplating aperturerd metal or metallized products
MYPI94000207A MY110836A (en) 1993-01-28 1994-01-26 Method and an apparatus for selectively electroplanting apertured metal or metallized products
JP6007773A JP2780920B2 (ja) 1993-01-28 1994-01-27 孔あきの金属ストリップ形状製品又は金属被覆ストリップ形状製品を選択的に電気メッキする方法及び装置
US08/186,907 US5512154A (en) 1993-01-28 1994-01-27 Apparatus for selectively electroplating apertured metal or metallized products
KR1019940001575A KR100314946B1 (ko) 1993-01-28 1994-01-28 구멍이있는금속또는금속화된물건을선택적으로전기도금하는방법및장치
US08/533,324 US5702583A (en) 1993-01-28 1995-09-25 Method for selectively electroplating apertured metal or metallized products
HK97101647A HK1000135A1 (en) 1993-01-28 1997-08-08 A method and an apparatus for selectively electroplating apertured metal or metallized products

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9300174A NL9300174A (nl) 1993-01-28 1993-01-28 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.
NL9300174 1993-01-28

Publications (1)

Publication Number Publication Date
NL9300174A true NL9300174A (nl) 1994-08-16

Family

ID=19861992

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9300174A NL9300174A (nl) 1993-01-28 1993-01-28 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.

Country Status (11)

Country Link
US (2) US5512154A (de)
EP (1) EP0616052B1 (de)
JP (1) JP2780920B2 (de)
KR (1) KR100314946B1 (de)
AT (1) ATE154835T1 (de)
DE (1) DE69403926T2 (de)
HK (1) HK1000135A1 (de)
MY (1) MY110836A (de)
NL (1) NL9300174A (de)
SG (1) SG48345A1 (de)
TW (1) TW410818U (de)

Cited By (1)

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CN111455438A (zh) * 2020-03-11 2020-07-28 贵州振华群英电器有限公司（国营第八九一厂） 一种继电器基座局部电镀夹具

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US5925410A (en) * 1997-05-06 1999-07-20 Micron Technology, Inc. Vibration-enhanced spin-on film techniques for semiconductor device processing
US5985123A (en) * 1997-07-09 1999-11-16 Koon; Kam Kwan Continuous vertical plating system and method of plating
TW522455B (en) * 1998-11-09 2003-03-01 Ebara Corp Plating method and apparatus therefor
EP1071000A1 (de) * 1999-07-23 2001-01-24 Damian Rickenbach Verfahren zur Oberflächengestaltung von Uhrwerkteilen
DE10135349A1 (de) † 2001-07-20 2003-02-06 Imo Ingo Mueller E K Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials
EP1563119A4 (de) * 2001-08-31 2006-03-22 Semitool Inc Apparatur und verfahren zur abscheidung einer elektrophoretischen emulsion
US20040055893A1 (en) * 2002-09-23 2004-03-25 Applied Materials, Inc. Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing
DE102005031948B3 (de) 2005-07-08 2006-06-14 Höllmüller Maschinenbau GmbH Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle
JP4836628B2 (ja) * 2006-03-27 2011-12-14 株式会社中央製作所 長尺シートのめっき方法及び装置
US7887687B2 (en) * 2006-08-22 2011-02-15 Deere & Company Method and system for coating a workpiece
DE102007009671A1 (de) * 2007-02-28 2008-09-04 Hirschmann Automotive Gmbh Verfahren zum Ummanteln von mehreren Stanzgittern
NL1035265C2 (nl) * 2008-04-07 2009-10-08 Meco Equip Eng Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten.
KR101268297B1 (ko) * 2011-07-12 2013-05-28 주식회사 에이에스티젯텍 스트립 형태 부품의 이송용 벨트
KR101288347B1 (ko) * 2011-09-29 2013-07-22 주식회사 에이에스티젯텍 스트립 형태 부품의 이송용 벨트
JP6736395B2 (ja) * 2016-07-12 2020-08-05 ヒロセ電機株式会社 端子製造方法、コネクタ製造方法、端子製造装置およびコネクタ製造装置
US20180088628A1 (en) * 2016-09-28 2018-03-29 Intel Corporation Leadframe for surface mounted contact fingers
JP2021021126A (ja) * 2019-07-30 2021-02-18 三共株式会社 メッキ治具及びメッキ方法
CN113652733A (zh) * 2021-08-18 2021-11-16 刘智 一种用于集成电路生产可节省电镀材料的电路板镀银设备

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Publication number Priority date Publication date Assignee Title
CN111455438A (zh) * 2020-03-11 2020-07-28 贵州振华群英电器有限公司（国营第八九一厂） 一种继电器基座局部电镀夹具
CN111455438B (zh) * 2020-03-11 2022-07-15 贵州振华群英电器有限公司（国营第八九一厂） 一种继电器基座局部电镀夹具

Also Published As

Publication number Publication date
KR100314946B1 (ko) 2002-02-19
US5702583A (en) 1997-12-30
MY110836A (en) 1999-05-31
HK1000135A1 (en) 1997-12-19
JP2780920B2 (ja) 1998-07-30
KR940018487A (ko) 1994-08-18
EP0616052A1 (de) 1994-09-21
US5512154A (en) 1996-04-30
DE69403926D1 (de) 1997-07-31
TW410818U (en) 2000-11-01
EP0616052B1 (de) 1997-06-25
DE69403926T2 (de) 1998-01-02
SG48345A1 (en) 1998-04-17
JPH0774300A (ja) 1995-03-17
ATE154835T1 (de) 1997-07-15

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BV The patent application has lapsed