TW410818U - An apparatus for selectively electroplating aperturerd metal or metallized products - Google Patents

An apparatus for selectively electroplating aperturerd metal or metallized products

Info

Publication number
TW410818U
TW410818U TW087202387U TW87202387U TW410818U TW 410818 U TW410818 U TW 410818U TW 087202387 U TW087202387 U TW 087202387U TW 87202387 U TW87202387 U TW 87202387U TW 410818 U TW410818 U TW 410818U
Authority
TW
Taiwan
Prior art keywords
products
photoresist layer
metal
aperturerd
electroplating
Prior art date
Application number
TW087202387U
Other languages
English (en)
Inventor
Jorg Werner Rischke
Sprang W G Leona Van
Original Assignee
Meco Equip Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meco Equip Eng filed Critical Meco Equip Eng
Publication of TW410818U publication Critical patent/TW410818U/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/22—Servicing or operating apparatus or multistep processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
TW087202387U 1993-01-28 1994-01-19 An apparatus for selectively electroplating aperturerd metal or metallized products TW410818U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL9300174A NL9300174A (nl) 1993-01-28 1993-01-28 Werkwijze en inrichting voor het langs electrolytische weg plaatselijk aanbrengen van metaalbedekkingen op van openingen voorziene metalen of gemetalliseerde producten.

Publications (1)

Publication Number Publication Date
TW410818U true TW410818U (en) 2000-11-01

Family

ID=19861992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087202387U TW410818U (en) 1993-01-28 1994-01-19 An apparatus for selectively electroplating aperturerd metal or metallized products

Country Status (11)

Country Link
US (2) US5512154A (zh)
EP (1) EP0616052B1 (zh)
JP (1) JP2780920B2 (zh)
KR (1) KR100314946B1 (zh)
AT (1) ATE154835T1 (zh)
DE (1) DE69403926T2 (zh)
HK (1) HK1000135A1 (zh)
MY (1) MY110836A (zh)
NL (1) NL9300174A (zh)
SG (1) SG48345A1 (zh)
TW (1) TW410818U (zh)

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US5609995A (en) * 1995-08-30 1997-03-11 Micron Technology, Inc. Method for forming a thin uniform layer of resist for lithography
US5925410A (en) * 1997-05-06 1999-07-20 Micron Technology, Inc. Vibration-enhanced spin-on film techniques for semiconductor device processing
US5985123A (en) * 1997-07-09 1999-11-16 Koon; Kam Kwan Continuous vertical plating system and method of plating
TW522455B (en) * 1998-11-09 2003-03-01 Ebara Corp Plating method and apparatus therefor
EP1071000A1 (de) * 1999-07-23 2001-01-24 Damian Rickenbach Verfahren zur Oberflächengestaltung von Uhrwerkteilen
DE10135349A1 (de) † 2001-07-20 2003-02-06 Imo Ingo Mueller E K Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials
US7147765B2 (en) * 2001-08-31 2006-12-12 Semitool, Inc. Apparatus and method for deposition of an electrophoretic emulsion
US20040055893A1 (en) * 2002-09-23 2004-03-25 Applied Materials, Inc. Wafer backside electrical contact for electrochemical deposition and electrochemical mechanical polishing
DE102005031948B3 (de) 2005-07-08 2006-06-14 Höllmüller Maschinenbau GmbH Vorrichtungen und Verfahren zur elektrolytischen Behandlung von Folien von Rolle zu Rolle
JP4836628B2 (ja) * 2006-03-27 2011-12-14 株式会社中央製作所 長尺シートのめっき方法及び装置
US7887687B2 (en) * 2006-08-22 2011-02-15 Deere & Company Method and system for coating a workpiece
DE102007009671A1 (de) * 2007-02-28 2008-09-04 Hirschmann Automotive Gmbh Verfahren zum Ummanteln von mehreren Stanzgittern
NL1035265C2 (nl) * 2008-04-07 2009-10-08 Meco Equip Eng Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten.
KR101268297B1 (ko) * 2011-07-12 2013-05-28 주식회사 에이에스티젯텍 스트립 형태 부품의 이송용 벨트
KR101288347B1 (ko) * 2011-09-29 2013-07-22 주식회사 에이에스티젯텍 스트립 형태 부품의 이송용 벨트
JP6736395B2 (ja) * 2016-07-12 2020-08-05 ヒロセ電機株式会社 端子製造方法、コネクタ製造方法、端子製造装置およびコネクタ製造装置
US20180088628A1 (en) * 2016-09-28 2018-03-29 Intel Corporation Leadframe for surface mounted contact fingers
JP2021021126A (ja) * 2019-07-30 2021-02-18 三共株式会社 メッキ治具及びメッキ方法
CN111455438B (zh) * 2020-03-11 2022-07-15 贵州振华群英电器有限公司（国营第八九一厂） 一种继电器基座局部电镀夹具
CN113652733A (zh) * 2021-08-18 2021-11-16 刘智 一种用于集成电路生产可节省电镀材料的电路板镀银设备

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3471389A (en) * 1966-08-26 1969-10-07 Du Pont Electrocoating process wherein the initial amperage surge is controlled
NL170027C (nl) * 1971-05-25 1982-09-16 Galentan Ag Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting.
US3879277A (en) * 1973-04-27 1975-04-22 Armco Steel Corp Method and apparatus for electropainting small articles
DE2324834C2 (de) * 1973-05-17 1978-09-07 Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren
JPS5648198A (en) * 1979-09-26 1981-05-01 Matsushita Electric Ind Co Ltd Method of manufacturing flexible printed circuit board
EP0055130B1 (en) * 1980-12-23 1984-07-25 S.G. Owen Limited Improvements in or relating to selective plating
NL8101106A (nl) * 1981-03-07 1982-10-01 Galentan Ag Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen.
US4376017A (en) * 1982-01-04 1983-03-08 Western Electric Co., Inc. Methods of electrolytically treating portions of digitated strips and treating cell
US4404079A (en) * 1982-02-08 1983-09-13 National Semiconductor Corporation Plating mask support
DE3230660C1 (de) * 1982-08-02 1984-01-26 Basf Farben + Fasern Ag, 2000 Hamburg Verfahren und Vorrichtung zur Durchfuehrung einer Elektrotauchlackierung sowie Anwendung
US4600491A (en) * 1984-05-17 1986-07-15 Urquhart Thomas N Workpiece drying apparatus
JPH0660440B2 (ja) * 1986-07-22 1994-08-10 トヨタ自動車株式会社 電着塗装方法
NL8900229A (nl) * 1989-01-31 1990-08-16 Meco Equip Eng Inrichting voor het behandelen van strookvormige elementen.
JPH0774475B2 (ja) * 1989-09-20 1995-08-09 株式会社ジャパンエナジー 銀めっきの前処理液
JPH03229893A (ja) * 1990-02-02 1991-10-11 Seiko Epson Corp 電着塗装方法
JPH04206957A (ja) * 1990-11-30 1992-07-28 Toppan Printing Co Ltd リードフレームの製造方法
US5183724A (en) * 1990-12-18 1993-02-02 Amkor Electronics, Inc. Method of producing a strip of lead frames for integrated circuit dies in a continuous system
US5202222A (en) * 1991-03-01 1993-04-13 Shipley Company Inc. Selective and precise etching and plating of conductive substrates

Also Published As

Publication number Publication date
ATE154835T1 (de) 1997-07-15
EP0616052A1 (en) 1994-09-21
JPH0774300A (ja) 1995-03-17
US5512154A (en) 1996-04-30
NL9300174A (nl) 1994-08-16
KR940018487A (ko) 1994-08-18
SG48345A1 (en) 1998-04-17
JP2780920B2 (ja) 1998-07-30
DE69403926D1 (de) 1997-07-31
HK1000135A1 (en) 1997-12-19
EP0616052B1 (en) 1997-06-25
DE69403926T2 (de) 1998-01-02
US5702583A (en) 1997-12-30
MY110836A (en) 1999-05-31
KR100314946B1 (ko) 2002-02-19

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model