MX9205644A - Composiciones electricamente conductoras y metodos para la preparacion y uso de las mismas. - Google Patents
Composiciones electricamente conductoras y metodos para la preparacion y uso de las mismas.Info
- Publication number
- MX9205644A MX9205644A MX9205644A MX9205644A MX9205644A MX 9205644 A MX9205644 A MX 9205644A MX 9205644 A MX9205644 A MX 9205644A MX 9205644 A MX9205644 A MX 9205644A MX 9205644 A MX9205644 A MX 9205644A
- Authority
- MX
- Mexico
- Prior art keywords
- compositions
- polymer
- linking agent
- reactive monomer
- metal powder
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1035—Liquid phase sintering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Chemically Coating (AREA)
Abstract
Composiciones adhesivas eléctricamente conductoras y métodos para la preparación y uso de las mismas, en las que un polvo de soldadura, un agente entrelazador químicamente protegido con propiedades de fundente y un monómero o polímero reactivos son los principales componentes, dependiendo del uso final pretendido.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/769,892 US5376403A (en) | 1990-02-09 | 1991-10-01 | Electrically conductive compositions and methods for the preparation and use thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9205644A true MX9205644A (es) | 1994-08-31 |
Family
ID=25086815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9205644A MX9205644A (es) | 1991-10-01 | 1992-10-01 | Composiciones electricamente conductoras y metodos para la preparacion y uso de las mismas. |
Country Status (10)
Country | Link |
---|---|
US (2) | US5376403A (es) |
EP (1) | EP0646048B1 (es) |
JP (1) | JP2972338B2 (es) |
KR (1) | KR970010170B1 (es) |
AT (1) | ATE315963T1 (es) |
AU (1) | AU663342B2 (es) |
CA (1) | CA2120523C (es) |
DE (1) | DE69233595T2 (es) |
MX (1) | MX9205644A (es) |
WO (1) | WO1993006943A1 (es) |
Families Citing this family (178)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
US5716663A (en) * | 1990-02-09 | 1998-02-10 | Toranaga Technologies | Multilayer printed circuit |
US5948533A (en) * | 1990-02-09 | 1999-09-07 | Ormet Corporation | Vertically interconnected electronic assemblies and compositions useful therefor |
US6476487B2 (en) * | 1992-10-30 | 2002-11-05 | Showa Denko K.K. | Solder circuit |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
JP2677161B2 (ja) * | 1993-07-08 | 1997-11-17 | 双葉電子工業株式会社 | 蛍光表示管 |
US5652042A (en) | 1993-10-29 | 1997-07-29 | Matsushita Electric Industrial Co., Ltd. | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste |
TW349320B (en) * | 1993-12-09 | 1999-01-01 | Methode Electronics Inc | Printed plastic circuits and contracts and method for making same |
DE4406418C1 (de) * | 1994-02-28 | 1995-07-13 | Bosch Gmbh Robert | Anisotrop elektrisch leitender Kleber |
FR2726001B1 (fr) * | 1994-10-19 | 1996-11-29 | Solaic Sa | Encre conductrice comprenant des grains metalliques ayant des points de fusion differents |
TW340132B (en) * | 1994-10-20 | 1998-09-11 | Ibm | Structure for use as an electrical interconnection means and process for preparing the same |
TW301843B (en) | 1994-11-15 | 1997-04-01 | Ibm | Electrically conductive paste and composite and their use as an electrically conductive connector |
US5736624A (en) * | 1994-12-02 | 1998-04-07 | Abbott Laboratories | Phosphatase activated crosslinking, conjugating and reducing agents; methods of using such agents; and reagents comprising phosphatase activated crosslinking and conjugating agents |
EP0804865A1 (en) * | 1995-01-18 | 1997-11-05 | Coates Brothers PLC | Production of electrical circuit boards |
DE19511553C2 (de) * | 1995-03-29 | 1997-02-20 | Litton Precision Prod Int | Verfahren zur Erzeugung elektrisch leitfähiger Strukturen, eine nach dem Verfahren erhaltene elektrisch leitfähige Struktur sowie Kombination zur Erzeugung elektrisch leitfähiger Strukturen |
JP3498427B2 (ja) * | 1995-06-19 | 2004-02-16 | ソニー株式会社 | 成形はんだ用フラックス |
US7041771B1 (en) * | 1995-08-11 | 2006-05-09 | Kac Holdings, Inc. | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
JP2001517153A (ja) * | 1995-08-11 | 2001-10-02 | カーストン・ケネス・ジェイ | エポキシ樹脂を主成分とするはんだペースト |
KR0155877B1 (ko) * | 1995-09-12 | 1998-12-15 | 이대원 | 다층 회로기판 및 그 제조방법 |
US5699613A (en) * | 1995-09-25 | 1997-12-23 | International Business Machines Corporation | Fine dimension stacked vias for a multiple layer circuit board structure |
JP3689159B2 (ja) * | 1995-12-01 | 2005-08-31 | ナミックス株式会社 | 導電性接着剤およびそれを用いた回路 |
US5839188A (en) | 1996-01-05 | 1998-11-24 | Alliedsignal Inc. | Method of manufacturing a printed circuit assembly |
US6147870A (en) * | 1996-01-05 | 2000-11-14 | Honeywell International Inc. | Printed circuit assembly having locally enhanced wiring density |
CA2196024A1 (en) * | 1996-02-28 | 1997-08-28 | Craig N. Ernsberger | Multilayer electronic assembly utilizing a sinterable composition and related method of forming |
US5851311A (en) * | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
DE69710089T2 (de) * | 1996-08-16 | 2002-08-22 | Hugh P. Craig | Druckfähige zusammensetzungen und deren auftragung auf dielektrische oberflächen für die herstellung von gedruckten leiterplatten |
US7022266B1 (en) | 1996-08-16 | 2006-04-04 | Dow Corning Corporation | Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
US5759737A (en) * | 1996-09-06 | 1998-06-02 | International Business Machines Corporation | Method of making a component carrier |
US6074728A (en) * | 1996-09-11 | 2000-06-13 | Samsung Aerospace Industries, Ltd. | Multi-layered circuit substrate |
US5985043A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
DE19835613C2 (de) * | 1997-01-13 | 2002-12-12 | Aisin Seiki | Elektrisch leitfähige Harzzusammensetzung und deren Verwendung zur Herstellung von Harzformteilen |
US6180696B1 (en) | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
JPH1145616A (ja) * | 1997-05-28 | 1999-02-16 | Yazaki Corp | 導電性フィラー、導電性ペーストおよび回路体の形成方法 |
US5846459A (en) * | 1997-06-26 | 1998-12-08 | Ucar Carbon Technology Corporation | Method of forming a flexible graphite sheet with decreased anisotropy |
US6734368B1 (en) | 1997-07-09 | 2004-05-11 | International Business Machines Corporation | Metal backed printed circuit board assemblies |
US6335571B1 (en) | 1997-07-21 | 2002-01-01 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
US5985456A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits |
US6017634A (en) * | 1997-07-21 | 2000-01-25 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
US6367150B1 (en) | 1997-09-05 | 2002-04-09 | Northrop Grumman Corporation | Solder flux compatible with flip-chip underfill material |
US5980785A (en) * | 1997-10-02 | 1999-11-09 | Ormet Corporation | Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements |
US6160714A (en) | 1997-12-31 | 2000-12-12 | Elpac (Usa), Inc. | Molded electronic package and method of preparation |
JP2004506309A (ja) | 1997-12-31 | 2004-02-26 | エルパック(ユーエスエー)、インコーポレイテッド | モールドされた電子パッケージ、製作方法およびシールディング方法 |
US6165309A (en) * | 1998-02-04 | 2000-12-26 | General Electric Co. | Method for improving the adhesion of metal films to polyphenylene ether resins |
US6971163B1 (en) * | 1998-04-22 | 2005-12-06 | Dow Corning Corporation | Adhesive and encapsulating material with fluxing properties |
US6399426B1 (en) | 1998-07-21 | 2002-06-04 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
US6274070B1 (en) | 1998-08-07 | 2001-08-14 | Aisin Seiki Kabushiki Kaisha | Methods of producing resin moldings |
US6116494A (en) * | 1998-09-01 | 2000-09-12 | Hewlett-Packard Company | Method for re-attachment of a SMT component using a heated air jet |
KR100629923B1 (ko) * | 1998-09-30 | 2006-09-29 | 돗빤호무즈가부시기가이샤 | 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체 |
US6054761A (en) * | 1998-12-01 | 2000-04-25 | Fujitsu Limited | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
US6592943B2 (en) | 1998-12-01 | 2003-07-15 | Fujitsu Limited | Stencil and method for depositing solder |
US6344157B1 (en) | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
US6326555B1 (en) | 1999-02-26 | 2001-12-04 | Fujitsu Limited | Method and structure of z-connected laminated substrate for high density electronic packaging |
FR2793949B1 (fr) * | 1999-05-21 | 2001-08-10 | Thomson Plasma | Melange pour realiser des electrodes et procede de formation d'electrodes |
US6352881B1 (en) | 1999-07-22 | 2002-03-05 | National Semiconductor Corporation | Method and apparatus for forming an underfill adhesive layer |
US6475555B2 (en) | 1999-10-29 | 2002-11-05 | International Business Machines Corporation | Process for screening features on an electronic substrate with a low viscosity paste |
DE60032627T2 (de) | 1999-11-03 | 2007-10-04 | Nexicor, LLC, Cincinnati | Induktionshandgerät |
US6402013B2 (en) * | 1999-12-03 | 2002-06-11 | Senju Metal Industry Co., Ltd | Thermosetting soldering flux and soldering process |
US6528169B2 (en) | 2000-07-06 | 2003-03-04 | 3M Innovative Properties Company | No-flow flux adhesive compositions |
GB2365816B (en) * | 2000-08-09 | 2002-11-13 | Murata Manufacturing Co | Method of bonding conductive adhesive and electrode,and bonded structure |
US6524721B2 (en) | 2000-08-31 | 2003-02-25 | Matsushita Electric Industrial Co., Ltd. | Conductive adhesive and packaging structure using the same |
DE60142119D1 (de) * | 2000-10-02 | 2010-06-24 | Asahi Kasei Emd Corp | Teilchen einer funktionellen metalllegierung. |
US6884313B2 (en) * | 2001-01-08 | 2005-04-26 | Fujitsu Limited | Method and system for joining and an ultra-high density interconnect |
US6866741B2 (en) * | 2001-01-08 | 2005-03-15 | Fujitsu Limited | Method for joining large substrates |
US6800169B2 (en) * | 2001-01-08 | 2004-10-05 | Fujitsu Limited | Method for joining conductive structures and an electrical conductive article |
US6534179B2 (en) | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
US6583201B2 (en) | 2001-04-25 | 2003-06-24 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
US6802446B2 (en) * | 2002-02-01 | 2004-10-12 | Delphi Technologies, Inc. | Conductive adhesive material with metallurgically-bonded conductive particles |
JP2003275895A (ja) * | 2002-03-22 | 2003-09-30 | Toyo Aluminium Kk | ろう付け用ペースト状組成物とそれを用いたろう付け方法 |
US6791839B2 (en) * | 2002-06-25 | 2004-09-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
US7423337B1 (en) | 2002-08-19 | 2008-09-09 | National Semiconductor Corporation | Integrated circuit device package having a support coating for improved reliability during temperature cycling |
JPWO2004053901A1 (ja) * | 2002-12-09 | 2006-04-13 | 松下電器産業株式会社 | 外部電極を備えた電子部品 |
US7211205B2 (en) * | 2003-01-29 | 2007-05-01 | Parelec, Inc. | High conductivity inks with improved adhesion |
US20040178391A1 (en) * | 2003-01-29 | 2004-09-16 | Conaghan Brian F. | High conductivity inks with low minimum curing temperatures |
US7141185B2 (en) * | 2003-01-29 | 2006-11-28 | Parelec, Inc. | High conductivity inks with low minimum curing temperatures |
US7301222B1 (en) | 2003-02-12 | 2007-11-27 | National Semiconductor Corporation | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages |
US6821878B2 (en) * | 2003-02-27 | 2004-11-23 | Freescale Semiconductor, Inc. | Area-array device assembly with pre-applied underfill layers on printed wiring board |
AU2003276905A1 (en) * | 2003-03-18 | 2004-10-11 | Dow Corning Corporation | A conductive composition and method of using the same |
KR20050109977A (ko) * | 2003-03-18 | 2005-11-22 | 다우 코닝 코포레이션 | 전도성 접착제 조성물 |
EP1608699A2 (en) * | 2003-04-01 | 2005-12-28 | Aguila Technologies, Inc. | Thermally conductive adhesive composition and process for device attachment |
DE10319888A1 (de) | 2003-04-25 | 2004-11-25 | Siemens Ag | Lotmaterial auf SnAgCu-Basis |
US7166491B2 (en) * | 2003-06-11 | 2007-01-23 | Fry's Metals, Inc. | Thermoplastic fluxing underfill composition and method |
TWI329534B (en) * | 2003-07-09 | 2010-09-01 | Fry Metals Inc | Coating metal particles |
WO2005033352A2 (en) * | 2003-07-09 | 2005-04-14 | Fry's Metals, Inc. | Deposition and patterning process |
US20050056365A1 (en) * | 2003-09-15 | 2005-03-17 | Albert Chan | Thermal interface adhesive |
US7282375B1 (en) | 2004-04-14 | 2007-10-16 | National Semiconductor Corporation | Wafer level package design that facilitates trimming and testing |
US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
CN100594089C (zh) * | 2004-08-25 | 2010-03-17 | 松下电器产业株式会社 | 焊料组合物、利用焊接的连接方法和衬底的生产方法 |
WO2006022416A2 (en) * | 2004-08-25 | 2006-03-02 | Matsushita Electric Industrial Co., Ltd. | Solder composition, connecting process with soldering, and connection structure with soldering |
KR101313391B1 (ko) | 2004-11-03 | 2013-10-01 | 테세라, 인코포레이티드 | 적층형 패키징 |
WO2006064849A1 (ja) * | 2004-12-15 | 2006-06-22 | Tamurakaken Corporation | 導電性接着剤、これを用いた導電部及び電子部品モジュール |
US7452568B2 (en) * | 2005-02-04 | 2008-11-18 | International Business Machines Corporation | Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation |
US7413805B2 (en) * | 2005-02-25 | 2008-08-19 | Fry's Metals, Inc. | Preparation of metallic particles for electrokinetic or electrostatic deposition |
US7405246B2 (en) * | 2005-04-05 | 2008-07-29 | Momentive Performance Materials Inc. | Cure system, adhesive system, electronic device |
US7446136B2 (en) * | 2005-04-05 | 2008-11-04 | Momentive Performance Materials Inc. | Method for producing cure system, adhesive system, and electronic device |
US8058101B2 (en) | 2005-12-23 | 2011-11-15 | Tessera, Inc. | Microelectronic packages and methods therefor |
DE102006048513A1 (de) * | 2006-04-29 | 2007-11-08 | Michael Metzke | Wärmeleitschicht und Verfahren zu deren Herstellung |
WO2008004287A1 (fr) * | 2006-07-05 | 2008-01-10 | Ablestik (Japan) Co., Ltd. | Adhésif conducteur |
US7780801B2 (en) | 2006-07-26 | 2010-08-24 | International Business Machines Corporation | Flux composition and process for use thereof |
EP2058822A4 (en) * | 2006-08-28 | 2011-01-05 | Murata Manufacturing Co | CONDUCTIVE BINDER AND ELECTRONIC DEVICE |
JP4432949B2 (ja) * | 2006-09-15 | 2010-03-17 | パナソニック株式会社 | 電気部品の接続方法 |
US7758916B2 (en) * | 2006-11-13 | 2010-07-20 | Sulzer Metco (Us), Inc. | Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity |
US20080217589A1 (en) * | 2007-03-08 | 2008-09-11 | Tsung-Chih Tsai | Terminal composition for an electrical component |
EP2139629B1 (en) * | 2007-03-26 | 2018-09-05 | LORD Corporation | Method for producing heterogeneous composites |
JP5277564B2 (ja) * | 2007-05-29 | 2013-08-28 | 住友ベークライト株式会社 | 半導体ウエハーの接合方法および半導体装置の製造方法 |
US20090226701A1 (en) * | 2007-08-24 | 2009-09-10 | Mark Charles Carbone | Boiling Enhancement Coating Produced Using Viscous Bulking Agent to Create Voids |
CN101803009B (zh) * | 2007-09-11 | 2012-07-04 | 陶氏康宁公司 | 组合物,包括这种组合物的热界面材料,及其制备方法和用途 |
DE102008023882A1 (de) * | 2008-05-16 | 2009-11-19 | Bayer Materialscience Ag | Druckbare Zusammensetzung auf Basis von Silberpartikeln zur Erzeugung elektrisch leitfähiger Beschichtungen |
EP2334728B1 (en) * | 2008-09-26 | 2018-03-21 | Alpha Assembly Solutions Inc. | Lead-free conductive compositions and methods of using them |
KR100929136B1 (ko) * | 2009-02-16 | 2009-12-01 | (주)덕산테코피아 | 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치 |
KR100977163B1 (ko) * | 2009-03-23 | 2010-08-20 | 덕산하이메탈(주) | 솔더 접착제와 그 제조 방법 및 이를 포함하는 전자 장치 |
WO2010114874A2 (en) * | 2009-04-02 | 2010-10-07 | Ormet Circuits Inc. | Conductive compositions containing blended alloy fillers |
CN102803406B (zh) * | 2009-06-12 | 2015-10-14 | 洛德公司 | 防止基底被雷击的方法 |
KR101225497B1 (ko) * | 2009-11-05 | 2013-01-23 | (주)덕산테코피아 | 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치 |
JP6203493B2 (ja) * | 2009-11-05 | 2017-09-27 | オーメット サーキッツ インク | 冶金ネットワーク組成物の調製およびその使用方法 |
CN101781541B (zh) * | 2010-02-02 | 2012-12-05 | 华南理工大学 | 一种纳米银/环氧导电胶的原位制备方法 |
KR101061048B1 (ko) * | 2010-02-17 | 2011-09-01 | (주)덕산테코피아 | 솔더 잉크 및 이를 이용한 전자소자 패키지 |
US8896986B2 (en) * | 2010-05-26 | 2014-11-25 | Kemet Electronics Corporation | Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors |
US9748043B2 (en) | 2010-05-26 | 2017-08-29 | Kemet Electronics Corporation | Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors |
US8482111B2 (en) | 2010-07-19 | 2013-07-09 | Tessera, Inc. | Stackable molded microelectronic packages |
US9682447B2 (en) * | 2010-08-20 | 2017-06-20 | Henkel IP & Holding GmbH | Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes |
TW201210733A (en) | 2010-08-26 | 2012-03-16 | Dynajoin Corp | Variable melting point solders |
JP5886300B2 (ja) * | 2010-10-05 | 2016-03-16 | ヘレウス プレシャス メタルズ ノース アメリカ コンショホーケン エルエルシー | 一液型低温硬化性ポリマー組成物および関連方法 |
JP4795488B1 (ja) * | 2011-01-18 | 2011-10-19 | パナソニック株式会社 | 配線基板、配線基板の製造方法、及びビアペースト |
US9815149B2 (en) | 2011-02-25 | 2017-11-14 | International Business Machines Corporation | Flux composition and techniques for use thereof |
US9579738B2 (en) | 2011-02-25 | 2017-02-28 | International Business Machines Corporation | Flux composition and techniques for use thereof |
KR101128063B1 (ko) | 2011-05-03 | 2012-04-23 | 테세라, 인코포레이티드 | 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리 |
US20120286218A1 (en) * | 2011-05-11 | 2012-11-15 | Nanosolar, Inc. | Low cost alternatives to conductive silver-based inks |
US9117811B2 (en) | 2011-06-13 | 2015-08-25 | Tessera, Inc. | Flip chip assembly and process with sintering material on metal bumps |
US8404520B1 (en) | 2011-10-17 | 2013-03-26 | Invensas Corporation | Package-on-package assembly with wire bond vias |
CN104321883A (zh) * | 2011-12-13 | 2015-01-28 | 道康宁公司 | 光伏电池及其形成方法 |
KR20130066929A (ko) * | 2011-12-13 | 2013-06-21 | 한국전자통신연구원 | 패턴 형성 조성물 및 이를 이용한 패턴 형성 방법 |
CN103170757A (zh) * | 2011-12-23 | 2013-06-26 | 富泰华工业(深圳)有限公司 | 锡膏及其制备方法 |
US8946757B2 (en) | 2012-02-17 | 2015-02-03 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
US8372741B1 (en) | 2012-02-24 | 2013-02-12 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
US9056438B2 (en) | 2012-05-02 | 2015-06-16 | 3M Innovative Properties Company | Curable composition, articles comprising the curable composition, and method of making the same |
US8835228B2 (en) | 2012-05-22 | 2014-09-16 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US9583453B2 (en) | 2012-05-30 | 2017-02-28 | Ormet Circuits, Inc. | Semiconductor packaging containing sintering die-attach material |
US9391008B2 (en) | 2012-07-31 | 2016-07-12 | Invensas Corporation | Reconstituted wafer-level package DRAM |
US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
US9005330B2 (en) | 2012-08-09 | 2015-04-14 | Ormet Circuits, Inc. | Electrically conductive compositions comprising non-eutectic solder alloys |
WO2014082100A1 (en) | 2012-11-16 | 2014-05-30 | Ormet Circuits Inc. | Alternative compositions for high temperature soldering applications |
US8878353B2 (en) | 2012-12-20 | 2014-11-04 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
US9136254B2 (en) | 2013-02-01 | 2015-09-15 | Invensas Corporation | Microelectronic package having wire bond vias and stiffening layer |
DE102013102725A1 (de) * | 2013-03-18 | 2014-09-18 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Reaktionsharzsystem |
US9167710B2 (en) | 2013-08-07 | 2015-10-20 | Invensas Corporation | Embedded packaging with preformed vias |
US9685365B2 (en) | 2013-08-08 | 2017-06-20 | Invensas Corporation | Method of forming a wire bond having a free end |
US20150076714A1 (en) | 2013-09-16 | 2015-03-19 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
US9583456B2 (en) | 2013-11-22 | 2017-02-28 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9263394B2 (en) | 2013-11-22 | 2016-02-16 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9379074B2 (en) | 2013-11-22 | 2016-06-28 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US10381326B2 (en) | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
US10161835B1 (en) | 2014-11-20 | 2018-12-25 | National Technology & Engineering Solutions Of Sandia, Llc | Microsampler and method of making the same |
US9735084B2 (en) | 2014-12-11 | 2017-08-15 | Invensas Corporation | Bond via array for thermal conductivity |
JP5944979B1 (ja) * | 2014-12-26 | 2016-07-05 | 千住金属工業株式会社 | はんだ転写シート、はんだバンプ及びはんだ転写シートを用いたはんだプリコート方法 |
US9888579B2 (en) | 2015-03-05 | 2018-02-06 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
US9502372B1 (en) | 2015-04-30 | 2016-11-22 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
US9490222B1 (en) | 2015-10-12 | 2016-11-08 | Invensas Corporation | Wire bond wires for interference shielding |
US9515044B1 (en) * | 2015-10-14 | 2016-12-06 | Napra Co., Ltd. | Electronic device, method of manufacturing the same, metal particle, and electroconductive paste |
US10332854B2 (en) | 2015-10-23 | 2019-06-25 | Invensas Corporation | Anchoring structure of fine pitch bva |
US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
US9911718B2 (en) | 2015-11-17 | 2018-03-06 | Invensas Corporation | ‘RDL-First’ packaged microelectronic device for a package-on-package device |
US9659848B1 (en) | 2015-11-18 | 2017-05-23 | Invensas Corporation | Stiffened wires for offset BVA |
US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
EP3495089A4 (en) * | 2016-08-03 | 2020-01-08 | Furukawa Electric Co., Ltd. | COMPOSITION CONTAINING METAL PARTICLES |
US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
KR102604506B1 (ko) | 2017-06-12 | 2023-11-21 | 오르멧 서키츠 인코퍼레이티드 | 양호한 사용가능 시간 및 열전도성을 갖는 금속성 접착제 조성물, 이의 제조 방법 및 이의 용도 |
IL277107B1 (en) | 2018-03-15 | 2024-05-01 | Printcb Ltd | A conductive two-component preparation for printing |
JP6617847B1 (ja) * | 2019-05-27 | 2019-12-11 | 千住金属工業株式会社 | フラックス |
JP6617848B1 (ja) * | 2019-05-27 | 2019-12-11 | 千住金属工業株式会社 | フラックス |
CN113924187A (zh) * | 2019-05-27 | 2022-01-11 | 千住金属工业株式会社 | 助焊剂 |
JP2023514988A (ja) * | 2020-02-26 | 2023-04-12 | ティコナ・エルエルシー | 電子デバイス用ポリマー組成物 |
CN111548194A (zh) * | 2020-05-29 | 2020-08-18 | 南京凯泰化学科技有限公司 | 一种印制电路板的制备方法 |
Family Cites Families (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE237840C (es) * | ||||
US2993815A (en) * | 1959-05-25 | 1961-07-25 | Bell Telephone Labor Inc | Metallizing refractory substrates |
SU134737A1 (ru) | 1960-03-24 | 1960-11-30 | Л.И. Бродолин | Токопровод ща паста |
US3256109A (en) * | 1962-12-20 | 1966-06-14 | Berger Carl | Metal formation within a substrate |
US3324081A (en) * | 1963-12-31 | 1967-06-06 | Gulf Research Development Co | Polyepoxy resin-biaryl anhydride composition |
US3410714A (en) * | 1965-10-18 | 1968-11-12 | Gen Electric | Metallizing and bonding non-metallic bodies |
US3681135A (en) * | 1970-06-24 | 1972-08-01 | Lucas Industries Ltd | Printed circuits and method of making same |
US3714709A (en) * | 1970-07-06 | 1973-02-06 | Rca Corp | Method of manufacturing thick-film hybrid integrated circuits |
US3801364A (en) * | 1971-02-03 | 1974-04-02 | Matsushita Electric Ind Co Ltd | Method for making printed circuits which include printed resistors |
US3679439A (en) * | 1971-03-23 | 1972-07-25 | Du Pont | Lead-containing metallizations |
GB1378520A (en) * | 1971-05-10 | 1974-12-27 | Atomic Energy Authority Uk | Metallising pastes |
US3791027A (en) * | 1971-06-30 | 1974-02-12 | Ibm | Soldering method |
GB1387267A (en) * | 1971-07-27 | 1975-03-12 | Lucas Industries Ltd | Thick film circuits |
US3800020A (en) * | 1972-03-23 | 1974-03-26 | Cramer P Co | Method of making a circuit board |
US3904555A (en) * | 1972-10-05 | 1975-09-09 | Nippon Steel Corp | Weldable paint composition |
JPS4997846A (es) * | 1972-12-29 | 1974-09-17 | ||
NL7401687A (es) | 1973-02-12 | 1974-08-14 | ||
JPS50100596A (es) * | 1974-01-09 | 1975-08-09 | ||
US3983075A (en) * | 1974-06-21 | 1976-09-28 | Kennecott Copper Corporation | Copper filled conductive epoxy |
US4000016A (en) * | 1974-11-29 | 1976-12-28 | International Business Machines Corporation | Water soluble fluxes |
US4001146A (en) * | 1975-02-26 | 1977-01-04 | E. I. Du Pont De Nemours And Company | Novel silver compositions |
US3960777A (en) * | 1975-06-23 | 1976-06-01 | E. I. Du Pont De Nemours And Company | Gold compositions |
CA1097495A (en) * | 1976-05-24 | 1981-03-17 | James H. Aumiller | Electrically conductive adhesive |
JPS5933924B2 (ja) * | 1976-09-09 | 1984-08-18 | ジェイエスアール株式会社 | 感圧抵抗体 |
US4147669A (en) * | 1977-03-28 | 1979-04-03 | Rockwell International Corporation | Conductive adhesive for providing electrical and thermal conductivity |
JPS53133799A (en) * | 1977-04-27 | 1978-11-21 | Idearisaachi Yuugen | Electroconductive paint |
JPS6034615B2 (ja) * | 1977-07-27 | 1985-08-09 | 日立電線株式会社 | 半導体機器のリ−ド用銅合金 |
US4293451A (en) * | 1978-06-08 | 1981-10-06 | Bernd Ross | Screenable contact structure and method for semiconductor devices |
US4327124A (en) * | 1978-07-28 | 1982-04-27 | Desmarais Jr Raymond C | Method for manufacturing printed circuits comprising printing conductive ink on dielectric surface |
US4186036A (en) * | 1978-08-25 | 1980-01-29 | The Dow Chemical Company | Weldable coating compositions |
US4233103A (en) * | 1978-12-20 | 1980-11-11 | The United States Of America As Represented By The Secretary Of The Air Force | High temperature-resistant conductive adhesive and method employing same |
JPS55160072A (en) * | 1979-05-31 | 1980-12-12 | Matsushita Electric Ind Co Ltd | Electrically conductive adhesive |
US4273593A (en) * | 1979-06-25 | 1981-06-16 | Scm Corporation | Metal-joining paste and vehicle therefor |
JPS565840A (en) | 1979-06-28 | 1981-01-21 | Shin Etsu Polymer Co Ltd | Anisotropic pressure electrically-conductive elastomer molded article |
JPS5632605A (en) * | 1979-08-28 | 1981-04-02 | Kogyo Gijutsuin | Group iiivi metal compound semiconductor electrode material in periodic table |
US4278702A (en) * | 1979-09-25 | 1981-07-14 | Anthony J. Casella | Method of making printed circuit board by induction heating of the conductive metal particles on a plastic substrate |
US4429657A (en) * | 1979-12-13 | 1984-02-07 | Additive Technology Corporation | Method, materials and apparatus for manufacturing printed circuits |
US4457861A (en) * | 1979-12-13 | 1984-07-03 | Additive Technology Corporation | Method, materials and apparatus for manufacturing printed circuits |
JPS56103260A (en) * | 1980-01-22 | 1981-08-18 | Asahi Kagaku Kenkyusho:Kk | Conductive paint containing copper powder |
US4352899A (en) * | 1980-04-05 | 1982-10-05 | Sakai Chemical Industry Co., Ltd. | Coating composition for metal-substrate |
US4496475A (en) * | 1980-09-15 | 1985-01-29 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
JPS57111034A (en) * | 1980-12-10 | 1982-07-10 | Hitachi Ltd | Semiconductor device and its manufacture |
JPS57113505A (en) * | 1981-01-07 | 1982-07-15 | Matsushita Electric Ind Co Ltd | Conductive composition |
JPS57185316A (en) * | 1981-05-11 | 1982-11-15 | Sumitomo Metal Mining Co Ltd | Electrically conductive resin paste |
IE53277B1 (en) * | 1981-06-03 | 1988-09-28 | Du Pont | Conductive composition comprising copper,and flash bar produced therewith |
GB2102026B (en) * | 1981-06-05 | 1985-07-10 | Matsushita Electric Ind Co Ltd | Conductive pastes |
NL8102809A (nl) * | 1981-06-11 | 1983-01-03 | Philips Nv | Weerstandspasta voor een weerstandslichaam. |
JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
JPS5842651A (ja) * | 1981-09-07 | 1983-03-12 | Toshiba Corp | 導電性ペ−スト |
JPS5861144A (ja) * | 1981-10-06 | 1983-04-12 | Matsushita Electric Ind Co Ltd | 導電性組成物 |
US4396666A (en) * | 1981-11-02 | 1983-08-02 | Cts Corporation | Solderable conductive employing an organic binder |
FR2516739A1 (fr) * | 1981-11-17 | 1983-05-20 | Rhone Poulenc Spec Chim | Procede de fabrication de circuits electroniques de type hybride a couches epaisses, des moyens destines a la mise en oeuvre de ce procede et les circuits obtenus selon ce procede |
JPS58104969A (ja) * | 1981-12-17 | 1983-06-22 | Matsushita Electric Ind Co Ltd | 導電性ペイント |
JPS58127742A (ja) * | 1982-01-26 | 1983-07-29 | Sanko Kagaku Kk | 導電性樹脂配合組成物 |
US4459166A (en) * | 1982-03-08 | 1984-07-10 | Johnson Matthey Inc. | Method of bonding an electronic device to a ceramic substrate |
JPS5949272A (ja) * | 1982-09-14 | 1984-03-21 | Toshiba Corp | 導電性塗料 |
JPS59100176A (ja) * | 1982-11-30 | 1984-06-09 | Nec Corp | 接着剤 |
US4503090A (en) * | 1983-02-23 | 1985-03-05 | At&T Bell Laboratories | Thick film resistor circuits |
JPS59210966A (ja) * | 1983-05-16 | 1984-11-29 | Daicel Chem Ind Ltd | 高導電性スチレン系樹脂組成物 |
US4533685A (en) * | 1983-07-26 | 1985-08-06 | Hudgin Donald E | Polymer-metal blend |
US4535012A (en) * | 1983-09-30 | 1985-08-13 | Electro Materials Corp. Of America | Fast curing solderable conductor |
US4564563A (en) * | 1983-09-30 | 1986-01-14 | Electro Materials Corp. Of America | Solderable conductor |
GB2152060B (en) * | 1983-12-02 | 1987-05-13 | Osaka Soda Co Ltd | Electrically conductive adhesive composition |
US4557857A (en) * | 1984-05-30 | 1985-12-10 | Allied Corporation | High conducting polymer-metal alloy blends |
US4592861A (en) * | 1984-06-08 | 1986-06-03 | Uniroyal Chemical Company, Inc. | Antistatic thermoplastic composition comprising a graft polymer, halogenated thermoplastic polymer and conductive carbon black |
US4575432A (en) * | 1984-07-09 | 1986-03-11 | W. R. Grace & Co. | Conductive thermosetting compositions and process for using same |
US4639396A (en) * | 1984-07-19 | 1987-01-27 | Princeton Polymer Laboratories | Thermoplastics-metal fiber threads |
US4663079A (en) * | 1984-07-31 | 1987-05-05 | Mitsubishi Petrochemical Co., Ltd. | Copper-type conductive coating composition |
JPS6167702A (ja) * | 1984-09-07 | 1986-04-07 | Mitsui Mining & Smelting Co Ltd | 導電性粉末及びこれを用いた導電性組成物 |
US4581158A (en) * | 1984-09-26 | 1986-04-08 | W. R. Grace & Co. | Conductive thermosetting compositions and process for using same |
JPS61123665A (ja) * | 1984-11-19 | 1986-06-11 | Matsushita Electric Ind Co Ltd | 導電性樹脂組成物の製造方法 |
US4680141A (en) * | 1984-11-29 | 1987-07-14 | Mcdonnell Douglas Corporation | Solder composition |
JPS61159793A (ja) * | 1984-12-31 | 1986-07-19 | 株式会社 アサヒ化学研究所 | 基板に導電回路を形成する方法 |
US4578425A (en) * | 1985-02-13 | 1986-03-25 | Schenectady Chemicals, Inc. | Phenolic resins, carboxylic resins and the elastomers containing adhesive |
US4786437A (en) * | 1985-03-27 | 1988-11-22 | Ercon, Inc. | One-component, particle-filled compositions |
US4716081A (en) * | 1985-07-19 | 1987-12-29 | Ercon, Inc. | Conductive compositions and conductive powders for use therein |
US4652398A (en) * | 1985-09-12 | 1987-03-24 | Stauffer Chemical Company | Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker |
US4673532A (en) * | 1986-01-22 | 1987-06-16 | Mcdonnell Douglas Corporation | Rosin-free solder composition |
JPS62179889A (ja) * | 1986-01-31 | 1987-08-07 | Senjiyu Kinzoku Kogyo Kk | クリ−ムはんだ |
US4732702A (en) * | 1986-02-13 | 1988-03-22 | Hitachi Chemical Company, Ltd. | Electroconductive resin paste |
US4859268A (en) * | 1986-02-24 | 1989-08-22 | International Business Machines Corporation | Method of using electrically conductive composition |
US4780371A (en) * | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
US4880570A (en) * | 1986-03-31 | 1989-11-14 | Harris Corporation | Electroconductive adhesive |
EP0239901B1 (en) * | 1986-03-31 | 1992-11-11 | Tatsuta Electric Wire & Cable Co., Ltd | Conductive copper paste composition |
JPS6355807A (ja) * | 1986-08-27 | 1988-03-10 | 古河電気工業株式会社 | 導電性ペ−スト |
US4765929A (en) * | 1986-08-29 | 1988-08-23 | Gte Products Corporation | Silk-screenable circuit paste |
US4733018A (en) * | 1986-10-02 | 1988-03-22 | Rca Corporation | Thick film copper conductor inks |
FR2606784B1 (fr) * | 1986-11-14 | 1989-03-03 | Rhone Poulenc Multi Tech | Composition potentiellement adhesive electriquement conductrice |
JPS63165457A (ja) * | 1986-12-27 | 1988-07-08 | Lion Corp | 導電性樹脂組成物 |
US4816184A (en) * | 1987-02-20 | 1989-03-28 | General Electric Company | Electrically conductive material for molding |
KR880011821A (ko) * | 1987-03-09 | 1988-10-31 | 오오자와 히데오 | 도전성 수지 조성물 및 그 성형품 |
US4731130A (en) * | 1987-05-27 | 1988-03-15 | Gte Government Systems Corporation | Soldering composition |
CA1249064A (en) * | 1987-07-06 | 1989-01-17 | Reginald B.P. Bennett | Process for application of overlay conductors to surface of printed circuit board assemblies |
JPH0749560B2 (ja) * | 1987-08-07 | 1995-05-31 | ポリプラスチックス株式会社 | プラスチックス塗装用導電性プライマーまたは導電性塗料 |
JPS6481866A (en) * | 1987-09-22 | 1989-03-28 | Sumitomo Metal Mining Co | Composition for forming electrically conductive coating film |
JPH0759660B2 (ja) * | 1987-09-25 | 1995-06-28 | アルプス電気株式会社 | 導電性組成物 |
US4874548A (en) * | 1988-03-14 | 1989-10-17 | Ameron, Inc. | Conductive adhesive |
US4872928A (en) * | 1988-06-07 | 1989-10-10 | Johnson Matthey Inc. | Solder paste |
US5045141A (en) * | 1988-07-01 | 1991-09-03 | Amoco Corporation | Method of making solderable printed circuits formed without plating |
US4940498A (en) * | 1989-08-14 | 1990-07-10 | Multicore Solders Limited | Flux composition |
US5064481A (en) * | 1990-05-17 | 1991-11-12 | Motorola, Inc. | Use or organic acids in low residue solder pastes |
US5128746A (en) * | 1990-09-27 | 1992-07-07 | Motorola, Inc. | Adhesive and encapsulant material with fluxing properties |
US5116433A (en) * | 1990-10-31 | 1992-05-26 | Motorola, Inc. | Solder paste having solder alloy/formate complexes as oxide scavengers, and method for preparing same |
-
1991
- 1991-10-01 US US07/769,892 patent/US5376403A/en not_active Expired - Lifetime
-
1992
- 1992-10-01 CA CA002120523A patent/CA2120523C/en not_active Expired - Lifetime
- 1992-10-01 WO PCT/US1992/008333 patent/WO1993006943A1/en active IP Right Grant
- 1992-10-01 EP EP92921540A patent/EP0646048B1/en not_active Expired - Lifetime
- 1992-10-01 AU AU27678/92A patent/AU663342B2/en not_active Expired
- 1992-10-01 JP JP5507034A patent/JP2972338B2/ja not_active Expired - Lifetime
- 1992-10-01 DE DE69233595T patent/DE69233595T2/de not_active Expired - Lifetime
- 1992-10-01 MX MX9205644A patent/MX9205644A/es active IP Right Grant
- 1992-10-01 AT AT92921540T patent/ATE315963T1/de not_active IP Right Cessation
-
1994
- 1994-03-29 KR KR94701007A patent/KR970010170B1/ko active
- 1994-10-17 US US08/324,060 patent/US5830389A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH07502369A (ja) | 1995-03-09 |
KR970010170B1 (en) | 1997-06-21 |
US5830389A (en) | 1998-11-03 |
AU663342B2 (en) | 1995-10-05 |
US5376403A (en) | 1994-12-27 |
ATE315963T1 (de) | 2006-02-15 |
CA2120523A1 (en) | 1993-04-15 |
AU2767892A (en) | 1993-05-03 |
EP0646048A4 (en) | 1994-08-10 |
CA2120523C (en) | 2004-09-14 |
EP0646048B1 (en) | 2006-01-18 |
EP0646048A1 (en) | 1995-04-05 |
DE69233595D1 (de) | 2006-04-06 |
WO1993006943A1 (en) | 1993-04-15 |
JP2972338B2 (ja) | 1999-11-08 |
DE69233595T2 (de) | 2006-09-14 |
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